Grinding device of wafer thinning machine

Abstract

The utility model discloses a grinding device of a wafer thinning machine, which comprises a grinding wheel mechanism, and the grinding wheel mechanism comprises a grinding wheel mounting rack, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting rack, a Z-axis lifting plate connected with the first Z-axis lifting mechanism, and a main shaft mounting seat connected to one side of the Z-axis lifting plate. The motorized spindle is mounted on the spindle mounting seat; the electric spindle is further in driving connection with a grinding wheel mounting seat, and a first grinding wheel is further mounted at the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in the vertical direction are arranged in the circumferential direction of the bottom of the first grinding wheel at intervals. Compared with equipment applying an air floating main shaft, a mechanical main shaft grinding mode is adopted, so that the rigidity is greatly improved, the grinding machine can adapt to grinding of high-hardness materials, and the application range is wider.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning machines, in particular to a grinding device of a wafer thinning machine. Background Technique

[0002] In the silicon wafer manufacturing process, a grinding machine is used to thin the wafers cut from a silicon ingot. As semiconductor chips become thinner and more functional, the flatness accuracy in the thinning process becomes increasingly important. At the same time, for the packaging and testing (post-process) - backside thinning process, a backside grinding machine is used to grind the backside of the wafer to make it thinner, and it is suitable for precision grinding of hard and brittle materials such as silicon wafers, silicon carbide, sapphire, ceramics, and optical glass.

[0003] At present, the domestic thinning machines started relatively late, while foreign ones started earlier and are relatively more mature in technology. The foreign wafer thinning machines adopt a processing and thinning method with mature air bearing components, and their core technology is still in the hands of foreign countries. Moreover, the equipment is relatively expensive and the cost is high. At the same time, foreign thinning machines are more targeted at easily machinable materials such as silicon wafers. However, for products with relatively high hardness such as sapphire and silicon carbide wafers, foreign equipment is not very applicable. Therefore, for wafer epitaxial products based on sapphire and silicon carbide, there is currently a huge market capacity, and there is an urgent need for a domestic device to replace foreign devices. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a grinding device of a wafer thinning machine. This grinding device adopts a mechanical spindle grinding method. Compared with the equipment using an air bearing spindle, the rigidity is greatly improved, it can adapt to the grinding of high-hardness materials, and the application range is wider. At the same time, adopting the mechanical spindle grinding method can reduce costs, and the overall design is reasonable, the structure is compact, it is convenient to use, and the practicability is strong.

[0005] To achieve the above purpose, the following technical solutions are adopted:

[0006] A grinding device of a wafer thinning machine, comprising

[0007] A grinding wheel mechanism, the grinding wheel mechanism includes a grinding wheel mounting frame, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting frame, a Z-axis lifting plate connected to the first Z-axis lifting mechanism, a spindle mounting seat connected to one side of the Z-axis lifting plate, and an electric spindle mounted on the spindle mounting seat; the electric spindle is also drivingly connected to a grinding wheel mounting seat, and a first grinding wheel is further mounted at the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged vertically are spaced at intervals in the circumferential direction at the bottom of the first grinding wheel;

[0008] A grinding wheel spraying assembly, the grinding wheel spraying assembly is mounted on the grinding wheel mechanism, and the grinding wheel spraying assembly is at least used to spray cooling water onto the tooth surfaces of the first grinding wheel teeth;

[0009] A balance component, which is installed on the grinding wheel mounting bracket and connected to the main shaft mounting seat.

[0010] Furthermore, the grinding wheel spraying component includes a spraying mounting seat, a spraying pipe, and a nozzle; the spraying mounting seat is installed on the upper part of the motorized spindle, one end of the spraying pipe is connected to the spraying mounting seat, and the other end of the spraying pipe passes through the motorized spindle; a first through hole is also formed in the middle of the bottom of the grinding wheel mounting seat, and one end of the spraying pipe passing through the motorized spindle is inserted into the first through hole; the nozzle is arranged in the first grinding wheel and installed at the end of the spraying pipe inserted into the first through hole; a plurality of nozzles are also installed at intervals on the circumferential wall of the nozzle, and the nozzles are arranged in the direction of the first grinding wheel teeth.

[0011] Furthermore, the grinding wheel spraying component further includes a first waterproof cover; the first waterproof cover is in a frustum shape, the first waterproof cover is installed at the bottom of the motorized spindle, and the smaller-diameter end of the first waterproof cover is inserted into the motorized spindle; the end of the spraying pipe with the nozzle is arranged through the first waterproof cover.

[0012] Furthermore, the grinding wheel spraying component further includes a waterproof cover; the waterproof cover is installed at the bottom of the grinding wheel mounting seat, and a second through hole is also formed in the waterproof cover corresponding to the first through hole; one end of the nozzle is located in the second through hole and connected to the spraying pipe; the other end of the nozzle passes out of the second through hole, and the nozzle is installed at the end of the nozzle passing out of the second through hole.

[0013] Furthermore, a first positioning ring is also installed at the bottom of the grinding wheel mounting seat; a first retaining ring is connected to the bottom of the first positioning ring, and a part of the first retaining ring protrudes outward from the first positioning ring; a third through hole penetrating from the top to the bottom is formed in the top of the first grinding wheel, and a first notch is also formed in the inner wall of the third through hole; the first notch is adapted to the part of the first retaining ring protruding outward from the first positioning ring.

[0014] Furthermore, the main shaft mounting seat includes a main shaft fixing plate installed on one side of the Z-axis lifting plate, and a main shaft fixing seat integrally connected to the middle of one side of the main shaft fixing plate; a fourth through hole is also formed in the main shaft fixing seat, and a horizontal adjustment ring is connected to the bottom of the main shaft fixing seat; the motorized spindle is arranged in the fourth through hole and installed on the horizontal adjustment ring.

[0015] Furthermore, the grinding wheel mechanism further includes a second waterproof cover; the second waterproof cover is coaxially installed on the outer wall of the horizontal adjustment ring, and the grinding wheel mounting seat is located below the second waterproof cover.

[0016] Furthermore, at both ends of one side of the main shaft fixing plate, there are also integrally connected with a first connecting block respectively; there are two sets of balance components, and the two balance components are respectively arranged on one side of a first connecting block; the balance component includes a first bracket, a first connecting frame, and a balance cylinder; the first bracket is installed on the top of the grinding wheel mounting frame, and the first connecting frame is connected to one end of the first bracket; a U-shaped notch is formed on the first connecting frame, and a first connecting shaft is also connected between the inner walls on both sides of the U-shaped notch; a second connecting block is also installed on the top of the balance cylinder, and the second connecting block is sleeved on the first connecting shaft; a second connecting shaft is also installed horizontally on one side of the first connecting block, the output shaft of the balance cylinder also drives and connects a first connecting rod, and one end of the first connecting rod is sleeved on the second connecting shaft.

[0017] Furthermore, it further includes an anti-falling component; the anti-falling component includes a first fixing rod, a second connecting rod, a limit screw, and a third connecting block; the first fixing rod is installed on the top of the grinding wheel mounting frame, and one end of the first fixing rod extends above the Z-axis lifting plate; the second connecting rod is arranged to pass through one end of the first fixing rod vertically; the third connecting block is installed on the top of the Z-axis lifting plate and is connected to the bottom of the second connecting rod; the limit screw is arranged above the first fixing rod and is installed on the second connecting rod.

[0018] Furthermore, a grating scale is also installed vertically on one side of the grinding wheel mounting frame, and a first grating used in cooperation with the grating scale is also installed at the corresponding position of one end of the Z-axis lifting plate.

[0019] Adopting the above scheme, the beneficial effects of the present utility model are as follows:

[0020] The present utility model adopts the mechanical main shaft grinding method. Compared with the equipment using the air floating main shaft, the rigidity is greatly improved, it can adapt to the grinding of high-hardness materials, and the application range is wider. At the same time, adopting the mechanical main shaft grinding method can reduce costs, and the overall design is reasonable, the structure is compact, it is convenient to use, and the practicability is strong. Description of the Drawings

[0021] Figure 1 It is a structural schematic diagram of the present utility model;

[0022] Figure 2 It is the first exploded view of the grinding wheel mechanism of the present utility model;

[0023] Figure 3 It is Figure 1 The structural schematic diagram of the grinding wheel mechanism with the grinding wheel omitted;

[0024] Figure 4 It is the structural schematic diagram of one perspective of the grinding wheel mechanism of the present utility model;

[0025] Figure 5 This is the second explosion diagram of the grinding wheel mechanism of the present utility model;

[0026] Figure 6 This is the sectional view of the grinding wheel mechanism of the present utility model;

[0027] Among them, the description of the attached drawing signs:

[0028] 1. Grinding wheel mechanism; 2. Grinding wheel spraying assembly; 3. Balancing assembly; 4. Anti-falling assembly; 11. Grinding wheel mounting bracket; 12. First Z-axis lifting mechanism; 13. Z-axis lifting plate; 14. Horizontal adjustment ring; 15. Electric main shaft; 16. Grinding wheel mounting seat; 17. First grinding wheel; 18. Spindle fixing plate; 19. Spindle fixing seat; 21. Spraying mounting seat; 22. Spraying pipe; 23. Nozzle; 24. Spray nozzle; 25. First waterproof cover; 26. Waterproof cover; 31. First bracket; 32. First connecting frame; 33. Balancing cylinder; 34. First connecting shaft; 35. Second connecting block; 36. Second connecting shaft; 37. First connecting rod; 41. First fixing rod; 42. Second connecting rod; 43. Limit screw; 44. Third connecting block; 111. Grating ruler; 112. First grating; 161. First positioning ring; 162. First retaining ring; 163. First notch; 171. First grinding wheel teeth; 191. Second waterproof cover; 192. First connecting block. Detailed implementation manners

[0029] The following will combine the attached drawings and specific embodiments to elaborate on the present utility model in detail.

[0030] Referring to Figures 1 to 6 as shown, the present utility model provides a grinding device for a wafer thinning machine. In one embodiment, it includes

[0031] a grinding wheel mechanism 1, where the grinding wheel mechanism 1 includes a grinding wheel mounting bracket 11, a first Z-axis lifting mechanism 12 installed on one side of the grinding wheel mounting bracket 11, a Z-axis lifting plate 13 connected to the first Z-axis lifting mechanism 12, a spindle mounting seat connected to one side of the Z-axis lifting plate 13, and an electric main shaft 15 installed on the spindle mounting seat; the electric main shaft 15 is also drivingly connected to a grinding wheel mounting seat 16, and a first grinding wheel 17 is further installed at the bottom of the grinding wheel mounting seat 16; a plurality of first grinding wheel teeth 171 arranged along the vertical direction are spaced at intervals in the circumferential direction at the bottom of the first grinding wheel 17;

[0032] a grinding wheel spraying assembly 2, where the grinding wheel spraying assembly 2 is installed on the grinding wheel mechanism 1, and the grinding wheel spraying assembly 2 is at least used to spray cooling water onto the tooth surfaces of the first grinding wheel teeth 171;

[0033] a balancing assembly 3, where the balancing assembly 3 is installed on the grinding wheel mounting bracket 11 and is connected to the spindle mounting seat.

[0034] Continue to refer to Figures 1 to 6 As shown, in this embodiment, the grinding wheel mounting bracket 11 is a marble column. Using the marble column as the base of the device can ensure the stability of the device operation. The first Z-axis lifting mechanism 12 includes two slide rails, a servo motor, a speed reducer, and a lead screw. The two slide rails are arranged in parallel at intervals on one side of the grinding wheel mounting bracket 11, and two sliders are connected to each slide rail. One side of the Z-axis lifting plate 13 is connected to the four sliders. The lead screw is arranged between the two slide rails. The nut on the lead screw is connected to the middle of one side of the Z-axis lifting plate 13. The servo motor is installed on one side of the top of the grinding wheel mounting bracket 11 and is connected to one end of the lead screw through the speed reducer. Driven by the servo motor, the Z-axis lifting plate 13 can be driven to lift by the lead screw, so that the grinding wheel mechanism 1 can grind the product. The electric spindle 15 provides the power to drive the first grinding wheel 17 to rotate, and then grinds the product through the first grinding wheel teeth 171 on the circumferential edge of the bottom of the first grinding wheel 17. At the same time, a grinding wheel spraying assembly 2 is also provided. During the grinding process, a large amount of heat will be generated by the friction between the first grinding wheel teeth 171 and the product. The grinding wheel spraying assembly 2 can connect to external cooling water and spray the cooling water onto the tooth surface of the first grinding wheel teeth 171, thus playing the role of cooling and chip removal. In addition, a balancing assembly 3 is also provided, which can offset the weight of the Z-axis components, thereby reducing the deformation of the mechanism and improving the operability of the power unit and the support unit.

[0035] In one embodiment, the grinding wheel spraying assembly 2 includes a spraying mounting seat 21, a spraying pipe 22, and a nozzle 23. The spraying mounting seat 21 is installed on the upper part of the electric spindle 15. One end of the spraying pipe 22 is connected to the spraying mounting seat 21, and the other end of the spraying pipe 22 passes through the electric spindle 15. A first through hole is also opened in the middle of the bottom of the grinding wheel mounting seat 16. One end of the spraying pipe 22 passing through the electric spindle 15 is inserted into the first through hole. The nozzle 23 is arranged inside the first grinding wheel 17 and is installed at the end of one end of the spraying pipe 22 inserted into the first through hole. A plurality of nozzles 24 are also installed at intervals on the circumferential wall of the nozzle 23, and the nozzles 24 are arranged in the direction towards the first grinding wheel teeth 171.

[0036] In this embodiment, the top of the spray pipe 22 is connected to an external cold water supply device. Four groups of nozzles 24 are provided, and the four nozzles 24 are equally spaced and installed on the outer wall of the spray head 23. The cold water supply device passes the cooling water into the spray pipe 22, and then sprays it onto the tooth surface of the first grinding wheel tooth 171 through the spray head 23 to cool it. At the same time, the grinding wheel spray assembly 2 further includes a first waterproof cover 25; the first waterproof cover 25 is of a frustum shape, the first waterproof cover 25 is installed at the bottom of the motorized spindle 15, and the smaller-diameter end of the first waterproof cover 25 is inserted into the motorized spindle 15; the end of the spray pipe 22 with the nozzles 24 installed passes through the first waterproof cover 25. The first waterproof cover 25 can prevent the cooling water from splashing into the motorized spindle 15, thereby avoiding damage to the motorized spindle 15 by the cooling water and ensuring the normal operation of the motorized spindle 15.

[0037] In addition, the grinding wheel spray assembly 2 further includes a waterproof cover 26; the waterproof cover 26 is installed at the bottom of the grinding wheel mounting seat 16, and a second through hole is also provided at the position corresponding to the first through hole on the waterproof cover 26; one end of the spray head 23 is located in the second through hole and is connected to the spray pipe 22; the other end of the spray head 23 passes out of the second through hole, and the nozzle 24 is installed on the end of the spray head 23 passing out of the second through hole. The waterproof cover 26 is composed of two semi-circular covers. The straight sides of the two covers are spliced together, and a semi-circular notch is provided in the middle of the straight sides of the two covers. The two notches enclose the second through hole, and the diameter of the second through hole is smaller than that of the first through hole; by providing the waterproof cover 26, the splashing of the cooling water into the motorized spindle 15 can be further blocked, and the waterproof performance can be further improved.

[0038] In one embodiment, a first positioning ring 161 is further installed at the bottom of the grinding wheel mounting seat 16; the bottom of the first positioning ring 161 is connected to a first retaining ring 162, and a part of the first retaining ring 162 protrudes outward from the first positioning ring 161; a third through hole penetrating from the top to the bottom is provided in the top of the first grinding wheel 17, and a first notch 163 is further provided on the inner wall of the third through hole; the first notch 163 is adapted to the part of the first retaining ring 162 protruding outward from the first positioning ring 161. In this embodiment, two first retaining rings 162 are provided, and the two first retaining rings 162 are arranged oppositely. When installing the first grinding wheel 17, the first notch 163 can be aligned with the first retaining ring 162, and then it is clamped on the first positioning ring 161 through the third through hole. Subsequently, the first grinding wheel 17 is rotated so that the first retaining ring 162 and the first notch 163 are misaligned, so as to block the first grinding wheel 17 by the first retaining ring 162 to prevent it from falling. Then, use screws to lock and fix the first grinding wheel 17 to the bottom of the grinding wheel mounting seat 16. The installation and disassembly are convenient, and it is also convenient to replace different types of first grinding wheels 17 according to actual use requirements.

[0039] In one embodiment, the spindle mounting seat includes a spindle fixing plate 18 mounted on one side of the Z-axis lifting plate 13, and a spindle fixing base 19 integrally connected to the middle of one side of the spindle fixing plate 18; a fourth through hole is further formed in the spindle fixing base 19, and a horizontal adjustment ring 14 is connected to the bottom of the spindle fixing base 19; the motorized spindle 15 is arranged in the fourth through hole and mounted on the horizontal adjustment ring 14; the grinding wheel mechanism 1 further includes a second waterproof cover 191; the second waterproof cover 191 is coaxially mounted on the outer wall of the horizontal adjustment ring 14, and the grinding wheel mounting seat 16 is located below the second waterproof cover 191. To improve the running stability of the motorized spindle 15, the spindle mounting seat is made of cast iron, thus avoiding the influence of material deformation on the movement stability of the motorized spindle 15. At the same time, the grinding wheel mounting seat 16 is made of an anti-rust material and undergoes heat treatment, which can avoid material deformation in the later stage, improve the mounting accuracy of the grinding wheel, and through the horizontal adjustment ring 14, the mounting angle of the motorized spindle 15 can be finely adjusted to ensure its mounting levelness. In addition, through the second waterproof cover 191, the cooling water for grinding can be prevented from splashing outside the device, thereby avoiding affecting the normal operation of other mechanisms.

[0040] In one embodiment, two first connection blocks 192 are integrally connected to both ends of one side of the spindle fixing plate 18; two sets of balance components 3 are provided, and the two balance components 3 are respectively arranged on one side of a first connection block 192; the balance component 3 includes a first bracket 31, a first connecting frame 32, and a balance cylinder 33; the first bracket 31 is mounted on the top of the grinding wheel mounting frame 11, and the first connecting frame 32 is connected to one end of the first bracket 31; a U-shaped notch is formed in the first connecting frame 32, and a first connecting shaft 34 is connected between the inner walls on both sides of the U-shaped notch; a second connection block 35 is further mounted on the top of the balance cylinder 33, and the second connection block 35 is sleeved on the first connecting shaft 34; a second connecting shaft 36 is horizontally mounted on one side of the first connection block 192, and the output shaft of the balance cylinder 33 is also drivingly connected to a first connecting rod 37, and one end of the first connecting rod 37 is sleeved on the second connecting shaft 36. The balance cylinder 33 can provide an upward pulling force to the Z-axis lifting plate 13 to offset the weight of the Z-axis component, thereby reducing the deformation of the mechanism and ensuring the stability and smoothness of the device operation.

[0041] Meanwhile, it further includes a fall prevention component 4; the fall prevention component 4 includes a first fixing rod 41, a second connecting rod 42, a limit screw 43, and a third connecting block 44; the first fixing rod 41 is installed at the top of the grinding wheel mounting frame 11, and one end of the first fixing rod 41 extends above the Z-axis lifting plate 13; the second connecting rod 42 is arranged to movably pass through one end of the first fixing rod 41 in the vertical direction; the third connecting block 44 is installed at the top of the Z-axis lifting plate 13 and is connected to the bottom of the second connecting rod 42; the limit screw 43 is arranged above the first fixing rod 41 and is installed on the second connecting rod 42. There are two groups of fall prevention components 4, which are respectively connected to one end of the top of the Z-axis lifting plate 13. The downward stroke of the Z-axis lifting plate 13 can be limited by the limit screw 43, which can prevent the Z-axis lifting plate 13 from suddenly falling when the device is abnormally powered off, thereby avoiding damage to the product and the device and improving the safety of the device operation. In addition, a grating scale 111 is further installed vertically on one side of the grinding wheel mounting frame 11, and a first grating 112 that cooperates with the grating scale 111 is also installed at the corresponding position of one end of the Z-axis lifting plate 13. Through the grating scale 111 and the first grating 112, the Z-axis position information can be fed back in real time, thereby reducing the transmission error in the mechanical aspect and improving the operation accuracy of the device.

[0042] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A grinding device for a wafer thinning machine, characterized in that: include A grinding wheel mechanism, the grinding wheel mechanism comprising a grinding wheel mounting frame, a first Z-axis lifting mechanism mounted on one side of the grinding wheel mounting frame, a Z-axis lifting plate connected to the first Z-axis lifting mechanism, a spindle mounting seat connected to one side of the Z-axis lifting plate, and an electric spindle mounted on the spindle mounting seat; the electric spindle is also driven and connected to the grinding wheel mounting seat, and a first grinding wheel is also mounted on the bottom of the grinding wheel mounting seat; a plurality of first grinding wheel teeth arranged in a vertical direction are spaced apart on the bottom circumference of the first grinding wheel; A grinding wheel spray assembly, wherein the grinding wheel spray assembly is installed on the grinding wheel mechanism and is used at least to spray cooling water onto the tooth surface of the first grinding wheel tooth; A balancing component is installed on the grinding wheel mounting frame and connected to the spindle mounting seat.

2. The grinding device of the wafer thinning machine according to claim 1, characterized in that: The grinding wheel spray assembly includes a spray mounting seat, a spray pipe, and a spray head; the spray mounting seat is installed on the upper part of the electric spindle, one end of the spray pipe is connected to the spray mounting seat, and the other end of the spray pipe is arranged through the electric spindle; a first through hole is also opened in the middle of the bottom of the grinding wheel mounting seat, and one end of the spray pipe passes through the electric spindle and is inserted into the first through hole; the spray head is arranged in the first grinding wheel and installed on one end of the spray pipe inserted in the first through hole; a plurality of nozzles are also installed at intervals on the circumference of the outer wall of the spray head, and the nozzles are arranged in the direction of the first grinding wheel teeth.

3. The grinding device of the wafer thinning machine according to claim 2, characterized in that: The grinding wheel spray assembly also includes a first waterproof cover; the first waterproof cover is a truncated cone structure, the first waterproof cover is installed at the bottom of the electric spindle, and the end of the first waterproof cover with a smaller diameter is inserted into the electric spindle; the end of the spray pipe equipped with a nozzle is arranged through the first waterproof cover.

4. The grinding device of the wafer thinning machine according to claim 3, characterized in that: The grinding wheel spray assembly also includes a waterproof cover; the waterproof cover is installed at the bottom of the grinding wheel mounting seat, and a second through hole is opened on the waterproof cover corresponding to the first through hole; one end of the nozzle is located in the second through hole and connected to the spray pipe; the other end of the nozzle is arranged to pass through the second through hole, and the nozzle is installed on the end of the nozzle passing through the second through hole.

5. The grinding device for a wafer thinning machine according to claim 1, characterized in that: A first positioning ring is also installed at the bottom of the grinding wheel mounting seat; a first retaining ring is connected to the bottom of the first positioning ring, and a part of the first retaining ring protrudes outward from the first positioning ring; a third through hole is opened on the top of the first grinding wheel and passes through to its bottom, and a first notch is also opened on the inner wall of the third through hole; the first notch is adapted to the part of the first retaining ring protruding outward from the first positioning ring.

6. The grinding device of the wafer thinning machine according to claim 1, characterized in that: The spindle mounting seat includes a spindle fixing plate installed on one side of the Z-axis lifting plate, and a spindle fixing seat integrally connected to the middle part of one side of the spindle fixing plate; a fourth through hole is also opened on the spindle fixing seat, and a horizontal adjustment ring is also connected to the bottom of the spindle fixing seat; the electric spindle is arranged in the fourth through hole and installed on the horizontal adjustment ring.

7. The grinding device of the wafer thinning machine according to claim 6, characterized in that: The grinding wheel mechanism also includes a second waterproof cover; the second waterproof cover is coaxially mounted on the outer wall of the horizontal adjustment ring, and the grinding wheel mounting seat is located below the second waterproof cover.

8. The grinding device of the wafer thinning machine according to claim 6, characterized in that: The two ends of one side of the spindle fixing plate are also integrally connected with a first connecting block; the balancing assembly is provided with two groups, and the two balancing assemblies are respectively arranged on one side of a first connecting block; the balancing assembly includes a first bracket, a first connecting frame, and a balancing cylinder; the first bracket is installed on the top of the grinding wheel mounting frame, and the first connecting frame is connected to one end of the first bracket; a U-shaped groove is opened on the first connecting frame, and a first connecting shaft is also connected between the inner walls on both sides of the U-shaped groove; a second connecting block is also installed on the top of the balancing cylinder, and the second connecting block is sleeved on the first connecting shaft; a second connecting shaft is also installed on one side of the first connecting block along the horizontal direction, and the output shaft of the balancing cylinder is also driven to connect a first connecting rod, and one end of the first connecting rod is sleeved on the second connecting shaft.

9. The grinding device of the wafer thinning machine according to claim 1, characterized in that: It also includes an anti-falling assembly; the anti-falling assembly includes a first fixed rod, a second connecting rod, a limit screw, and a third connecting block; the first fixed rod is installed on the top of the grinding wheel mounting frame, and one end of the first fixed rod extends to the top of the Z-axis lifting plate; the second connecting rod is arranged to pass through one end of the first fixed rod in a vertical direction; the third connecting block is installed on the top of the Z-axis lifting plate and connected to the bottom of the second connecting rod; the limit screw is arranged above the first fixed rod and installed on the second connecting rod.

10. The grinding device of the wafer thinning machine according to claim 1, characterized in that: A grating ruler is also installed on one side of the grinding wheel mounting frame along the vertical direction, and a first grating used in conjunction with the grating ruler is also installed at one end of the Z-axis lifting plate corresponding to the grating ruler.

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