Thinning rotary table device of wafer thinning machine

Abstract

The utility model discloses a thinning rotary table device of a wafer thinning machine. The thinning rotary table device comprises a rotation driving mechanism, a mechanical rotary table, a vacuum suction plate and a ceramic disc, the mechanical rotary table is connected with a rotation driving mechanism, and the top of the mechanical rotary table is further connected with a mounting flange. The vacuum suction plate is mounted on the mounting flange; the ceramic disc is arranged on the vacuum suction plate, and the top of the ceramic disc is used for bearing a product to be thinned. The water-proof rotary table is reasonable in design, compact in structure, large in overall rigidity, suitable for machining products with high hardness and high precision requirements, good in overall water-proof performance, capable of preventing grinding water from entering the rotary table and further avoiding affecting normal work of the rotary table, and high in practicability.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer thinning machines, in particular to a thinning turntable device of a wafer thinning machine. Background Technique

[0002] In the silicon wafer manufacturing process, a grinding machine is used to thin the wafers cut from a silicon ingot. As semiconductor chips become thinner and more functional, the flatness accuracy in the thinning process becomes increasingly important. At the same time, for the packaging and testing (back-end) - back thinning process, a back grinding machine is used to grind the back of the wafer to make it thinner, which is suitable for precision grinding of hard and brittle materials such as silicon wafers, silicon carbide, sapphire, ceramics, and optical glass.

[0003] At present, domestic thinning machines started relatively late, while foreign ones started earlier and are relatively more mature in technology. Foreign wafer thinning machines adopt a processing and thinning method with mature air-floating accessories, and their core technology is still in the hands of foreign countries. Moreover, the equipment is relatively expensive and has a high cost. At the same time, foreign thinning machines are more targeted at easily machinable materials such as silicon wafers. However, for products with relatively high hardness such as sapphire and silicon carbide wafers, foreign equipment is not very applicable. Therefore, for wafer epitaxial products based on sapphire and silicon carbide, there is currently a huge market capacity, and there is an urgent need for a domestic device to replace foreign devices. Content of the Utility Model

[0004] The purpose of the utility model is to provide a thinning turntable device of a wafer thinning machine. The device is reasonably designed, structurally compact, and has a relatively large overall rigidity, suitable for processing products with high hardness and high precision requirements. At the same time, the overall waterproof performance is good, which can prevent grinding water from entering the inside of the turntable, thereby avoiding affecting the normal operation of the turntable, and has strong practicability.

[0005] To achieve the above purpose, the following technical solutions are adopted:

[0006] A thinning turntable device of a wafer thinning machine includes a rotation driving mechanism, a mechanical turntable, a vacuum suction plate, and a ceramic disc; the mechanical turntable is connected to the rotation driving mechanism, and an installation flange is further connected to the top of the mechanical turntable; the vacuum suction plate is installed on the installation flange; the ceramic disc is arranged on the vacuum suction plate, and the top of the ceramic disc is used to carry the product to be thinned; the inside of the mechanical turntable is axially hollow, and a rotary joint that can rotate with the mechanical turntable and is used to connect to an external air source is further installed at the bottom of the mechanical turntable; a first positioning column for limiting and fixing the ceramic disc is further installed on the top of the vacuum suction plate, and a first waterproof cover that wraps the installation flange inside is further connected to the bottom of the vacuum suction plate.

[0007] Furthermore, a first limiting groove is formed in the middle of the top of the mounting flange, and a first positioning platform is also connected in the first limiting groove; a first through hole communicating with the inside of the mechanical turntable is formed in the top of the first positioning platform, and a second positioning post is also installed in the first through hole; the second positioning post has an axially hollow structure, and the upper part of the second positioning post passes through the first through hole and extends outwards; a first positioning hole is also formed at the bottom of the vacuum suction plate corresponding to the second positioning post.

[0008] Furthermore, an annular first clamping groove is formed between the outer wall of the first positioning platform and the inner wall of the first limiting groove; a first sealing ring is also embedded in the first clamping groove.

[0009] Furthermore, a first waterproof pad in an annular structure is installed at the bottom of the vacuum suction plate, and a first waterproof cover is connected to the bottom of the first waterproof pad.

[0010] Furthermore, the rotation driving mechanism includes a first fixed bracket, a first reduction gear installed on the first fixed bracket, a driving wheel installed on the output shaft of the first reduction gear, a driven wheel installed on the mechanical turntable, a first synchronous belt wound between the driving wheel and the driven wheel, and a first rotating motor connected to the first reduction gear.

[0011] Furthermore, the rotation driving mechanism further includes a U-shaped photoelectric sensor arranged close to the driven wheel, and an induction piece cooperating with the U-shaped photoelectric sensor is also installed at the bottom edge of the driven wheel.

[0012] Furthermore, a first mounting bracket is also included; the mechanical turntable is installed on the first mounting bracket; a first vertical bracket is also connected to the top of the first mounting bracket, and a cooling and temperature reduction component is also installed on the first vertical bracket.

[0013] Furthermore, the cooling and temperature reduction component includes a cooling water joint installed on the first vertical bracket, and a cooling water pipe installed on the cooling water joint and arranged close to the ceramic disc; a cooling water spray head is also installed at one end of the cooling water pipe for discharging water.

[0014] Adopting the above scheme, the beneficial effects of the utility model are as follows:

[0015] The utility model is reasonably designed and has a compact structure. By adopting the mechanical turntable method, it can be adapted to the grinding and thinning of products with higher hardness. At the same time, the overall waterproof performance is good, which can prevent grinding water from entering the inside of the turntable, thereby avoiding affecting the normal operation of the turntable, and has strong practicability. Description of the Drawings

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2Schematic structural diagram of the present utility model omitting the first mounting bracket;

[0018] Figure 3 Exploded view of a part of the mechanism of the present utility model;

[0019] Among them, the description of the attached drawing signs:

[0020] 1. Rotating drive mechanism; 2. Mechanical turntable; 3. Vacuum suction plate; 4. Ceramic disc; 5. Mounting flange; 6. Rotary joint; 7. First mounting bracket; 11. First fixing bracket; 12. First reduction gear; 13. Driving wheel; 14. Driven wheel; 15. First synchronous belt; 16. First rotating motor; 17. U-shaped photoelectric sensor; 18. Inductive sheet; 31. First positioning post; 32. First waterproof cover; 33. First waterproof pad; 51. First positioning table; 52. Second positioning post; 53. First sealing ring; 71. First vertical frame; 72. Cooling water joint; 73. Cooling water pipe; 74. Cooling water spray head. Specific embodiments

[0021] The present utility model will be described in detail below with reference to the attached drawings and specific embodiments.

[0022] Refer to Figures 1 to 3 As shown, the present utility model provides a thinning turntable device for a wafer thinning machine. In one embodiment, it includes a rotating drive mechanism 1, a mechanical turntable 2, a vacuum suction plate 3, and a ceramic disc 4; the mechanical turntable 2 is connected to the rotating drive mechanism 1, and a mounting flange 5 is further connected to the top of the mechanical turntable 2; the vacuum suction plate 3 is installed on the mounting flange 5; the ceramic disc 4 is arranged on the vacuum suction plate 3, and the top of the ceramic disc 4 is used to carry the product to be thinned; the interior of the mechanical turntable 2 is axially hollow, and a rotary joint 6 that can rotate with the mechanical turntable 2 and is used to connect to an external air source is further installed at the bottom of the mechanical turntable 2; a first positioning post 31 for limiting and fixing the ceramic disc 4 is further installed on the top of the vacuum suction plate 3, and a first waterproof cover 32 that wraps the mounting flange 5 is further connected to the bottom of the vacuum suction plate 3.

[0023] In this embodiment, the mechanical turntable 2 includes a turntable housing and a rotating main shaft installed inside the turntable housing; the rotating main shaft is axially hollow inside and is connected to the rotating drive mechanism 1, the mounting flange 5 is installed on the rotating main shaft, and the rotating drive mechanism 1 can drive the rotating main shaft to drive the mounting flange 5 to rotate; the vacuum suction plate 3 is installed on the mounting flange 5 and can rotate synchronously with the mounting flange 5; the rotary joint 6 is communicated with the vacuum suction plate 3 through an air pipe or a hollow channel inside the rotating main shaft, and a number of vacuum adsorption holes are formed on the vacuum suction plate 3. The rotary joint 6 can access an external negative pressure air source to adsorb and fix the ceramic disc 4 through the vacuum adsorption holes on the vacuum suction plate 3 (the product to be thinned is pre-bonded on the ceramic disc 4). When the vacuum suction plate 3 rotates with the mounting flange 5, it can drive the ceramic disc 4 and the product to rotate synchronously, so that the grinding mechanism of the thinning turntable device can grind the product.

[0024] Meanwhile, in this embodiment, a first mounting bracket 7 is further included; the mechanical turntable 2 is installed on the first mounting bracket 7; a first vertical bracket 71 is further connected to the top of the first mounting bracket 7, and a cooling and temperature reduction component is further installed on the first vertical bracket 71; the cooling and temperature reduction component includes a cooling water joint 72 installed on the first vertical bracket 71 and a cooling water pipe 73 installed on the cooling water joint 72 and arranged close to the ceramic disc 4; a cooling water spray head 74 is further installed at the end of the cooling water pipe 73 for discharging water.

[0025] The cooling water joint 72 can access an external water source. When the ceramic disc 4 drives the product to rotate for grinding, the cooling water can be sprayed to the product through the cooling water spray head 74 for cooling and grinding. At the same time, a first waterproof cover 32 is also provided to prevent the grinding water from entering the turntable interior, thereby avoiding affecting the normal operation of the turntable. In addition, a plurality of first positioning columns 31 are provided on the circumferential edge of the top of the vacuum suction plate 3 to limit and fix the ceramic disc 4 and ensure the stability of its placement.

[0026] In one embodiment, a first limiting groove is formed in the middle of the top of the mounting flange 5, and a first positioning table 51 is further connected in the first limiting groove; a first through hole communicating with the inside of the mechanical turntable 2 is further formed in the top of the first positioning table 51, and a second positioning column 52 is further installed in the first through hole; the second positioning column 52 has an axially hollow structure, and the upper part of the second positioning column 52 passes through the first through hole and extends outward; a first positioning hole is further formed at the corresponding position of the bottom of the vacuum suction plate 3 and the second positioning column 52. Through the second positioning column 52 and the first positioning hole, it is convenient to install the vacuum suction plate 3. At the same time, an annular first clamping groove is formed between the outer wall of the first positioning table 51 and the inner wall of the first limiting groove; a first sealing ring 53 is further embedded in the first clamping groove.

[0027] In order to further improve the waterproof performance, in one embodiment, a first waterproof pad 33 with an annular structure is further installed at the bottom of the vacuum suction plate 3, and the first waterproof cover 32 is connected to the bottom of the first waterproof pad 33. The first waterproof cover 32 has an axially hollow cylindrical structure and can wrap the mounting flange 5 and a part of the upper part of the turntable housing therein to prevent grinding water from flowing into the turntable.

[0028] In one embodiment, the rotation driving mechanism 1 includes a first fixed bracket 11, a first reduction gear 12 mounted on the first fixed bracket 11, a driving pulley 13 mounted on the output shaft of the first reduction gear 12, a driven pulley 14 mounted on the mechanical turntable 2, a first synchronous belt 15 wound between the driving pulley 13 and the driven pulley 14, and a first rotating motor 16 connected to the first reduction gear 12. The first fixed bracket 11 is fixedly connected to the frame of the thinning machine, and the first rotating motor 16 is a servo motor. It can drive the mechanical turntable 2 to rotate through the first reduction gear 12, the driving pulley 13, the first synchronous belt 15, and the driven pulley 14. At the same time, the rotation driving mechanism 1 further includes a U-shaped photoelectric sensor 17 arranged close to the driven pulley 14, and an induction piece 18 cooperating with the U-shaped photoelectric sensor 17 is further installed at the bottom edge of the driven pulley 14. The U-shaped photoelectric sensor 17 can detect the position of the induction piece 18 on the driven pulley 14, so as to determine the rotation position of the mechanical turntable 2 for positioning and closed-loop control.

[0029] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer thinning turntable device for a wafer thinning machine, characterized in that: It includes a rotating drive mechanism, a mechanical turntable, a vacuum suction plate, and a ceramic disk; the mechanical turntable is connected to the rotating drive mechanism, and the top of the mechanical turntable is also connected to a mounting flange; the vacuum suction plate is installed on the mounting flange; the ceramic disk is arranged on the vacuum suction plate, and the top of the ceramic disk is used to carry the product to be thinned; the interior of the mechanical turntable is an axially hollow structure, and the bottom of the mechanical turntable is also equipped with a rotating joint that can rotate with the mechanical turntable and is used to connect to an external air source; the top of the vacuum suction plate is also equipped with a first positioning column for limiting and fixing the ceramic disk, and the bottom of the vacuum suction plate is also connected to a first waterproof cover that wraps the mounting flange therein.

2. The wafer thinning turntable device of the wafer thinning machine according to claim 1, characterized in that: A first limiting groove is provided in the middle of the top of the mounting flange, and a first positioning platform is connected to the first limiting groove; a first through hole communicating with the interior of the mechanical turntable is provided on the top of the first positioning platform, and a second positioning column is installed in the first through hole; the second positioning column is an axially hollow structure, and the upper part of the second positioning column passes through the first through hole and extends outward; a first positioning hole is provided at the bottom of the vacuum suction plate corresponding to the second positioning column.

3. The wafer thinning turntable device of the wafer thinning machine according to claim 2, characterized in that: A first clamping groove with an annular structure is formed between the outer wall of the first positioning platform and the inner wall of the first limiting groove; a first sealing ring is also embedded in the first clamping groove.

4. The wafer thinning turntable device of the wafer thinning machine according to claim 1, characterized in that: A first waterproof pad in an annular structure is also installed at the bottom of the vacuum suction plate, and a first waterproof cover is connected to the bottom of the first waterproof pad.

5. The wafer thinning turntable device of the wafer thinning machine according to claim 1, characterized in that: The rotation drive mechanism includes a first fixed bracket, a first reducer mounted on the first fixed bracket, a driving wheel mounted on the output shaft of the first reducer, a driven wheel mounted on the mechanical turntable, a first synchronous belt wound between the driving wheel and the driven wheel, and a first rotating motor connected to the first reducer.

6. The wafer thinning turntable device of the wafer thinning machine according to claim 5, characterized in that: The rotation drive mechanism also includes a U-shaped photoelectric sensor arranged close to the driven wheel, and a sensing sheet used in conjunction with the U-shaped photoelectric sensor is also installed on the bottom edge of the driven wheel.

7. The wafer thinning turntable device of any one of claims 1 to 6, characterized in that: It also includes a first mounting frame; the mechanical turntable is installed on the first mounting frame; the top of the first mounting frame is also connected to a first vertical frame, and a cooling component is also installed on the first vertical frame.

8. The wafer thinning turntable device of claim 7, characterized in that: The cooling and temperature reduction component includes a cooling water joint installed on the first stand, and a cooling water pipe installed on the cooling water joint and arranged close to the ceramic disk; a cooling water nozzle is also installed at one end of the cooling water pipe for water outlet.

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