Wafer unloading device and wafer packaging equipment

Abstract

The utility model provides a wafer unloading device and wafer packaging equipment, which are applied to the field of semiconductors, and the wafer unloading device comprises a pressing disc and a holding part, the pressing disc comprises a first disc surface and a second disc surface which are opposite to each other; the edge of the first disc face is provided with a positioning wall extending in the direction away from the first disc face. And the holding part is arranged on the second disc surface. The wafer packaging equipment comprises the wafer unloading device and a metal fixing ring. When an operator unloads the metal fixing ring, the blue film pasted on the wafer is fixed through the positioning wall, then the holding part is held to press the wafer unloading device on the blue film, and then the metal fixing ring on the blue film is pulled down. According to the device, the quality problems of edge breakage or particle falling and the like of the cut wafer caused by improper cooperation of left and right hand operations in operation can be reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductors, and more particularly, to a wafer unloading device and a wafer packaging device. Background Art

[0002] As an important basic material in the field of semiconductors, wafers play an important role in promoting scientific and technological progress and industrial development. After all processes of semiconductor wafers are completed, the wafers need to be tested. After passing the wafer test (Circuit Probing, CP), the wafers need to be cut into die and then packaged. Before wafer cutting, the back side of the wafer needs to be pasted on an electronic-grade plastic film (commonly known as blue film) with a metal fixing ring on the edge, and then a high-speed rotating blade is used to cut along the designed cutting channels of the wafer. After the cut wafers are inspected for appearance quality, in order to save logistics freight costs, the blue film and the wafers are torn off from the metal fixing ring together, and then packaged and transported.

[0003] The process of tearing the blue film off the metal fixing ring requires an operator to hold the blue film with one hand and grab one end of the metal fixing ring and lift it up with the other hand. Poor cooperation between the two hands may cause quality problems such as chipping or die loss of the cut wafers, and direct contact with the blue film by hand may cause secondary contamination, resulting in very low production efficiency. Summary of the Utility Model

[0004] In order to overcome the above deficiencies in the prior art, the present application provides a wafer unloading device, which is characterized by including a pressing plate and a holding member.

[0005] The pressing plate includes a first plate surface and a second plate surface opposite to each other; a positioning wall extending in a direction away from the first plate surface is provided at the edge of the first plate surface.

[0006] The holding member is disposed on the second plate surface.

[0007] In a possible implementation manner, the holding member includes a fastening handle.

[0008] In a possible implementation manner, the fastening handle includes two connecting portions, and the two connecting portions are located at positions close to the edge of the second plate surface.

[0009] In a possible implementation manner, the shapes of the first plate surface and the second plate surface are circular.

[0010] In a possible implementation manner, a soft rubber pad fitting the positioning wall is further provided at the end of the positioning wall away from the first plate surface.

[0011] In a possible implementation manner, the soft rubber pad further includes at least two intermittently arranged sub-soft rubber pads that are attached to the positioning wall.

[0012] In a possible implementation manner, in a direction parallel to the first disk surface, the thickness of the positioning wall is less than or equal to the thickness of the soft rubber pad.

[0013] In a possible implementation manner, the soft rubber pad is detachably connected to the positioning wall.

[0014] On the other hand, the present application further provides a wafer packaging device, including a metal fixing ring and the aforementioned wafer unloading device; the diameter of the first disk surface is a first diameter, the inner diameter of the metal fixing ring is a second diameter, and the first diameter is less than the second diameter.

[0015] In a possible implementation manner, the wafer packaging device includes at least two metal fixing rings with different inner diameter sizes.

[0016] Compared with the prior art, the present application has the following beneficial effects:

[0017] A wafer unloading device provided by the present application includes a pressing disk and a holding member. When an operator unloads the fixing ring, the blue film pasted on the wafer is fixed through the positioning wall, then the holding member is held and the wafer unloading device is pressed on the blue film, and then the metal fixing ring on the blue film is torn off, reducing quality problems such as chipping or particle dropping of the cut wafer caused by improper cooperation of the left and right hand operations during the operation, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 It is one of the three-dimensional structure diagrams of the wafer unloading device provided in this embodiment;

[0020] Figure 2 It is the second three-dimensional structure diagram of the wafer unloading device provided in this embodiment;

[0021] Figure 3 It is the top view of the wafer after cutting provided in this embodiment;

[0022] Figure 4 It is the top view when using the wafer unloading device provided in this embodiment;

[0023] Figure 5 The front view when using the wafer unloading device provided in this embodiment;

[0024] Figure 6 The third perspective structure diagram of the wafer unloading device provided in this embodiment;

[0025] Figure 7 The fourth perspective structure diagram of the wafer unloading device provided in this embodiment;

[0026] Figure 8 The fifth perspective structure diagram of the wafer unloading device provided in this embodiment.

[0027] Icons: 10 - wafer unloading device, 100 - pressing plate, 110 - first plate surface, 120 - second plate surface, 130 - positioning wall, 200 - holding member, 210 - fastening handle, 220 - connecting portion, 140 - soft rubber pad, 141 - sub - soft rubber pad, 300 - metal fixing ring, 400 - blue film, 500 - wafer. Detailed implementation manners

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. The components of the embodiments of the present application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts fall within the scope of protection of the present application.

[0030] It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0031] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is customarily placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present application. In addition, terms such as "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0032] In addition, terms such as "horizontal", "vertical", "overhanging", etc. do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0033] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0034] The following will describe in detail the specific embodiments of the present application with reference to the drawings.

[0035] A wafer unloading device 10 provided by the present application, please refer to Figure 1 and Figure 2 , the wafer unloading device 10 includes a pressing plate 100 and a holding member 200.

[0036] The pressing plate 100 includes opposite first and second plate surfaces 110 and 120; a positioning wall 130 extending in a direction away from the first plate surface 110 is provided at the edge of the first plate surface 110.

[0037] The holding member 200 is disposed on the second plate surface 120.

[0038] Please refer to Figure 3, before wafer dicing, the back side of the wafer 500 needs to be pasted on a blue film 400 with a metal fixing ring 300 at the edge, and then a high-speed rotating blade is used to cut along the designed dicing channels of the wafer 500. After the appearance quality of the diced wafer 500 is inspected, in order to save the logistics freight cost, the blue film 400 and the wafer 500 are torn off together from the metal fixing ring 300, and then packaged and transported.

[0039] In order to reduce quality problems such as chipping or grain dropping of the diced wafer 500 caused by improper cooperation between the left and right hands during the operation process, this embodiment provides a wafer unloading device 10. The positioning wall 130 is used to fix the blue film 400 to prevent damage to the wafer 500 caused by the movement of the blue film 400 during the wafer unloading process; the holding member 200 can evenly distribute the force of the hand on the edge of the wafer unloading device 10, facilitating subsequent wafer unloading operations.

[0040] For example, please refer to Figure 4 , when using the wafer unloading device 10 provided in this embodiment to tear the metal fixing ring 300, one hand covers the wafer with the wafer unloading device 10 and tightly holds the holding member 200, and the other hand grabs the metal fixing ring 300 and lifts it vertically to peel the blue film 400 from the metal fixing ring 300, completing the overall wafer unloading process.

[0041] In some possible implementation manners, the holding member 200 includes a fastening handle 210.

[0042] In some possible implementation manners, the fastening handle 210 includes two connecting portions 220, and the two connecting portions 220 are located at positions near the edge of the second disk surface 120.

[0043] In this embodiment, please refer to Figure 5 , the holding member 200 includes a fastening handle 210, the fastening handle 210 is provided with two connecting portions 220 and a holding portion, the holding portion is used to hold the wafer unloading device 10 by hand, and the connecting portion 220 is used to connect the fastening handle 210 to the pressing disk 100. In order to evenly distribute the force of the hand on the edge of the wafer unloading device 10 when the pressing disk 100 is pressed, the connecting portion 220 is located at a position near the edge of the second disk surface 120.

[0044] In some possible implementation manners, the shapes of the first disk surface 110 and the second disk surface 120 are circular.

[0045] Since the inner circles of the wafer and the metal fixing ring 300 are circular, in order to facilitate tearing the metal fixing ring 300, in this embodiment, please refer to again Figure 1, the first disk surface 110 and the second disk surface 120 are arranged to be circular.

[0046] In some possible implementation manners, a soft rubber pad 140 that fits with the positioning wall 130 is further provided at the end of the positioning wall 130 away from the first disk surface 110.

[0047] In this embodiment, in order to further reduce the possibility of the blue film 400 shifting during the film unloading process and prevent the positioning wall 130 from damaging the blue film 400 and the wafer 500, please refer to Figure 6 , a soft rubber pad 140 is further provided at the position where the positioning wall 130 fits with the blue film 400.

[0048] Please refer to Figure 7 , to prevent the soft rubber pad 140 from not fitting firmly with the positioning wall 130, this embodiment further provides a soft rubber pad 140 having a groove that fits with the positioning wall 130. For example, when using the wafer unloading device 10 provided in this embodiment, first fit the soft rubber pad 140 with the positioning wall 130, and then perform the film unloading operation.

[0049] In some possible implementation manners, the soft rubber pad 140 further includes at least two intermittently arranged sub-soft rubber pads 141 that fit with the positioning wall 130.

[0050] In this embodiment, for the convenience of installation and disassembly of the soft rubber pad 140, please refer to Figure 8 , the soft rubber pad further includes at least two intermittently arranged sub-soft rubber pads 141.

[0051] In some possible implementation manners, in the direction parallel to the first disk surface 110, the thickness of the positioning wall 130 is less than or equal to the thickness of the soft rubber pad 140.

[0052] In this embodiment, in order to enable the positioning wall 130 to be accurately positioned during use, in the direction parallel to the first disk surface 110, the thickness of the positioning wall 130 is less than or equal to the thickness of the soft rubber pad 140, and the orthographic projection of the positioning wall 130 on the first disk surface 110 should be covered by the orthographic projection of the soft rubber pad 140 on the first disk surface 110.

[0053] In some possible implementation manners, the soft rubber pad 140 is detachably connected to the positioning wall 130.

[0054] In this embodiment, since the soft rubber pad 140 will be worn after multiple uses and the soft rubber pad 140 needs to be replaced regularly, the soft rubber pad 140 is detachably connected to the positioning wall 130.

[0055] On the other hand, the present application also provides a wafer packaging device, which includes a metal fixing ring 300 and the aforementioned wafer unloading device 10; the diameter of the first disk surface 110 is a first diameter, the inner diameter of the metal fixing ring 300 is a second diameter, and the first diameter is smaller than the second diameter.

[0056] In this embodiment, please refer to again Figure 4 , in order to smoothly disassemble the metal fixing ring 300, the inner diameter of the metal fixing ring 300 should be greater than the diameter of the first disk surface 110. After the wafer 500 is cut and the metal fixing ring 300 is disassembled, the blue film 400 and the wafer 500 are packaged and transported.

[0057] In some possible implementation manners, the wafer packaging device includes at least two metal fixing rings 300 with different inner diameter sizes.

[0058] To meet the requirements of cutting and packaging wafers of different sizes, the wafer packaging device includes a variety of metal fixing rings 300 with different inner diameter sizes.

[0059] In summary, a wafer unloading device 10 and a wafer packaging device provided by the present application are applied to the semiconductor field. The wafer unloading device 10 includes a pressing disk 100 and a holding member 200; the pressing disk 100 includes opposite first disk surfaces 110; a positioning wall 130 extending in a direction away from the first disk surface 110 is provided at the edge of the first disk surface 110; the holding member 200 is disposed on the second disk surface 120. The wafer packaging device includes the aforementioned wafer unloading device 10 and a metal fixing ring 300. When an operator unloads the metal fixing ring 300, the blue film 400 pasted on the wafer 500 is fixed through the positioning wall 130, then the holding member 200 is held to press the wafer unloading device 10 on the blue film 400, and then the metal fixing ring 300 on the blue film 400 is torn off, reducing quality problems such as chipping or grain dropping of the cut wafer 500 caused by improper cooperation of left and right hand operations during operation, and improving production efficiency.

[0060] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer unloading device, characterized in that: The wafer unloading device comprises a pressing plate and a holding component; The pressing plate comprises a first plate surface and a second plate surface opposite to each other; a positioning wall extending in a direction away from the first plate surface is provided at an edge of the first plate surface; The holding component is arranged on the second disk surface.

2. The wafer unloading device according to claim 1, characterized in that: The holding member includes a fastening handle.

3. The wafer unloading device according to claim 1, characterized in that: The fastening handle includes two connecting parts, and the two connecting parts are located at positions of the second disk surface close to the edge thereof.

4. The wafer unloading device according to claim 1, characterized in that: The first disk surface and the second disk surface are circular in shape.

5. The wafer unloading device according to claim 1, characterized in that: The positioning wall is also provided with a soft rubber pad on the end away from the first disk surface and is in contact with the positioning wall.

6. The wafer unloading device according to claim 5, characterized in that: The soft rubber pad also includes at least two intermittently arranged sub-soft rubber pads that are in contact with the positioning wall.

7. The wafer unloading device according to claim 5, characterized in that: In a direction parallel to the first disk surface, the thickness of the positioning wall is less than or equal to the thickness of the soft rubber pad.

8. The wafer unloading device according to claim 5, characterized in that: The soft rubber pad is detachably connected to the positioning wall.

9. A wafer packaging device, characterized in that: It comprises a metal fixing ring and a wafer unloading device as claimed in claims 1 to 8; The diameter of the first disk surface is a first diameter, the inner diameter of the metal fixing ring is a second diameter, and the first diameter is smaller than the second diameter.

10. The wafer packaging equipment according to claim 9, characterized in that: The wafer packaging equipment comprises at least two metal fixing rings with different inner diameters.

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