Vacuum vapor chamber for heat dissipation

Abstract

The utility model discloses a vacuum vapor chamber for heat dissipation, which relates to the technical field of vapor chambers and comprises a shell A and a shell B. The shell A and the shell B are welded together through laser, and heat dissipation protrusions which are distributed in a dense array are fixedly printed on the side face, away from the shell B, of the shell A. A concave cavity is formed in the side face, welded with the shell body B, of the shell body A, and capillary wall plates manufactured in a solid-phase printing mode are arranged on the side, surrounding the cavity, of the shell body A and the side, surrounding the cavity, of the shell body B correspondingly. According to the utility model, the heat dissipation bulges which are densely arrayed are arranged on the shell A, so that the temperature distribution of the uniform-temperature plate is more uniform, the capillary wall plates are generated on the shell A and the shell B in a solid-phase printing manner, a traditional foam plate adopting a sintering process is replaced, the processing is faster and more efficient, the production cost is lower, the capillary wall plates surrounding the cavity are formed, and the heat dissipation efficiency is improved. And the heat exchange surface and the heat flow density are further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat pipes, in particular to a vacuum heat pipe for heat dissipation. Background Art

[0002] With the rapid development of industries such as electronics, IT, communication, LED, and solar energy, the heat generation power of electronic components used therein is also continuously increasing, and the heat flux density has increased significantly. It has become very difficult to solve related heat transfer problems well using traditional heat dissipation components.

[0003] Traditional heat dissipation mostly uses a heat source plus a heat sink or transfers the heat of the heat source to a remote end through heat transfer elements such as heat pipes, and discharges the heat to the outside of the system through heat exchange. However, due to limitations such as its structural space, material heat transfer characteristics, and the weight, structural strength, and reliability of the heat dissipation module, when encountering high power and high heat flux density, the traditional heat dissipation mode cannot meet the heat dissipation requirements. A kind of aluminum heat pipe disclosed in Chinese Patent Publication No. CN202354019U sets heat dissipation fins on the lower aluminum shell, making the temperature distribution of the heat pipe more uniform, and the heat exchange efficiency of the heat dissipation fins is high; sintered aluminum foam is sintered on the upper and lower aluminum shells to form a capillary structure layer of the aluminum sintered heat pipe, and its heat exchange surface and heat flux density are improved. However, the upper and lower aluminum foams formed between the upper and lower shells of the device by the sintering process have room for improvement in terms of usage effect, and the heat dissipation effect of the existing technology can be further improved. Therefore, a vacuum heat pipe for heat dissipation is proposed here. Summary of the Utility Model

[0004] Technical Problems to be Solved

[0005] The purpose of the utility model is to make up for the deficiencies of the existing technology and provide a vacuum heat pipe for heat dissipation.

[0006] Technical Solutions

[0007] To achieve the above purpose, the utility model provides the following technical solutions: A vacuum heat pipe for heat dissipation includes a shell A and a shell B, the shell A and the shell B are laser welded together, the side of the shell A away from the shell B is fixedly printed with heat dissipation protrusions arranged in a dense array, a concave cavity is arranged on the side of the shell A welded to the shell B, and capillary wall plates made by solid-phase printing are arranged on both sides of the shell A and the shell B around the cavity. The utility model arranges heat dissipation protrusions in a dense array on the shell A, making the temperature distribution of the heat pipe more uniform, and generating capillary wall plates on the shell A and the shell B by solid-phase printing, replacing the foam board of the traditional sintering process, with faster and more efficient processing and lower production cost, so as to form capillary wall plates around the cavity, further improving its heat exchange surface and heat flux density.

[0008] Preferably, the capillary wall plate is made of a material mixed with aluminum powder and alumina.

[0009] Preferably, the thickness of the capillary wall plate is 1-3 mm.

[0010] Preferably, a vacuum pumping hole is provided in the cavity of the A housing.

[0011] Preferably, the edges of the A housing and the B housing are provided with fastener through holes corresponding in position, and fasteners are provided in the fastener through holes, and the A housing and the B housing are fixed together by the fasteners.

[0012] Preferably, the cavity is evacuated.

[0013] Beneficial effects:

[0014] Compared with the prior art, the vacuum isothermal plate for heat dissipation has the following beneficial effects:

[0015] In the present utility model, heat dissipation protrusions are arranged in a dense array on the A housing, so that the temperature distribution of the isothermal plate is more uniform. The capillary wall plate is formed on the A and B housings by a solid-phase printing method, replacing the foam plate of the traditional sintering process, with faster and more efficient processing and lower production costs, so as to form a capillary wall plate surrounding the cavity, and its heat exchange surface and heat flux density are further improved. Description of the drawings

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0017] Figure 1 It is a schematic structural diagram of the present utility model;

[0018] Figure 2 It is a schematic structural diagram of the A housing of the present utility model;

[0019] Figure 3 It is a schematic structural diagram of the B housing of the present utility model;

[0020] Figure 4 It is a schematic structural diagram of the capillary wall plate of the present utility model.

[0021] In the figure:

[0022] 1. A housing; 2. B housing; 3. Capillary wall plate; 4. Fastener through hole; 101. Heat dissipation protrusion; 102. Cavity; 103. Vacuum pumping hole. Detailed implementation mode

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figures 1 to 4 As shown, the present invention provides a technical solution: a vacuum heat pipe for heat dissipation, including a housing A 1 and a housing B 2. The housing A 1 and the housing B 2 are welded together by laser. On the side of the housing A 1 away from the housing B 2, heat dissipation protrusions 101 are fixedly printed in a dense array. On one side of the housing A where it is welded to the housing B, there is a recessed cavity 102. On one side of the housing A 1 and the housing B 2 around the cavity 102, capillary wall plates 3 are provided by solid-phase printing. The present invention sets heat dissipation protrusions in a dense array on the housing A, making the temperature distribution of the heat pipe more uniform. The capillary wall plates are generated on the housing A and the housing B by solid-phase printing, replacing the foam plates of the traditional sintering process, with faster and more efficient processing and lower production costs, so as to form capillary wall plates around the cavity, further improving its heat transfer surface and heat flux density.

[0025] The capillary wall plate 3 in this application is made of a material mixed with aluminum powder and alumina, and the thickness of the capillary wall plate 3 is 1-3 mm.

[0026] Please refer specifically to Figure 1 and Figure 2 and Figure 3 , through holes 4 for fasteners are provided at corresponding positions on the edges of the housing A 1 and the housing B 2. Fasteners are provided in the through holes 4 for fasteners, and the housing A 1 and the housing B 2 are fixed together by fasteners. A vacuum hole 103 is provided in the cavity 102 on the housing A 1. The cavity in this application is evacuated.

[0027] The difference between this application and existing products lies in that laser welding is used for sealing; the capillary structure is made by solid-phase printing; and the material of the capillary structure is a mixture of aluminum powder and alumina.

[0028] Working principle: Heat dissipation protrusions are arranged in a dense array on the housing A, making the temperature distribution of the heat pipe more uniform. The capillary wall plates are generated on the housing A and the housing B by solid-phase printing, replacing the foam plates of the traditional sintering process, with faster and more efficient processing and lower production costs, so as to form capillary wall plates around the cavity, further improving its heat transfer surface and heat flux density.

[0029] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0030] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A vacuum temperature plate for heat dissipation, characterized in that: The invention comprises an A shell (1) and a B shell (2), wherein the A shell (1) and the B shell (2) are welded together by laser, and a side of the A shell (1) away from the B shell (2) is fixedly printed with heat dissipation protrusions (101) arranged in a dense array, and a side surface where the A shell and the B shell are welded is provided with a concave cavity (102), and the A shell (1) and the B shell (2) are both provided with a capillary wall plate (3) made by solid phase printing on one side surrounding the cavity (102).

2. The vacuum temperature plate for heat dissipation according to claim 1, characterized in that: The capillary wall plate (3) is made of a material mixed with aluminum powder and aluminum oxide.

3. The vacuum temperature plate for heat dissipation according to claim 1, characterized in that: The capillary wall plate (3) has a thickness of 1-3 mm.

4. The vacuum temperature homogenizing plate for heat dissipation according to claim 1, characterized in that: A vacuum hole (103) is provided in the cavity (102) of the A shell (1).

5. The vacuum temperature plate for heat dissipation according to claim 1, characterized in that: The edges of the A shell (1) and the B shell (2) are provided with fastener through holes (4) at corresponding positions, and fasteners are provided in the fastener through holes (4), and the A shell (1) and the B shell (2) are fixed together by the fasteners.

6. The vacuum temperature plate for heat dissipation according to claim 1, characterized in that: The cavity is evacuated.

Images