Chip high and low temperature testing machine

Abstract

The utility model discloses a high and low temperature testing machine for a chip, and aims to solve the problems that in the prior art, as chips are troublesome to place, only fewer chips can be detected at a time when high and low temperature testing is carried out on the chips to be detected, the detection efficiency is influenced, and if more chips are placed, the structure of a placing frame is more complex, the cost is high, and the like. And the placing rack is inconvenient to take out, so that the working efficiency of workers is influenced. The high and low temperature testing machine comprises a high and low temperature testing machine body and an intelligent controller, a machine door is installed at a workpiece placing inlet of the high and low temperature testing machine body, and a sliding groove is formed in the inner wall of the high and low temperature testing machine body. The high and low temperature testing machine increases the detection effect, and the device can ensure the circulation of hot air in the equipment, so that a plurality of groups of placed workpieces are all at the same temperature, thereby ensuring the accuracy of workpiece testing, and the workpiece placing assembly of the scheme is convenient to install and simple to disassemble, and workers can easily place the workpieces on the side plates.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip detection, and particularly relates to a chip high and low temperature tester. Background Art

[0002] High and low temperature testers are used to test the performance indicators of components and materials of related products such as electronic and electrical engineering, automotive and motorcycle, aerospace, rubber, plastic, metal, ship and weaponry, institutions of higher learning, and scientific research units under the condition of high temperature constant temperature change. A chip high and low temperature tester is a device used to test the high and low temperature of chips.

[0003] For example, a chip high and low temperature tester with patent number CN116106722A. A chip high and low temperature tester, characterized in that: a high and low temperature tester is provided in a high and low temperature box, a frame is arranged in the high and low temperature box, a reflux tray storage box is arranged on one side of the middle of the frame, a reflux tray area A and a reflux tray area B are arranged in the reflux tray storage box, a tray receiving mechanism is arranged on one side of the top of the reflux tray area A, one end of a reflux tray taking-out mechanism is arranged on the top of the reflux tray area B, and a test pressing device and a test transplanting mechanism are arranged at the other end of the reflux tray taking-out mechanism.

[0004] During the use of the existing high and low temperature testers, the following problems exist: Since the placement of chips is relatively troublesome, only a small number of chips can be detected at a time when performing high and low temperature tests on the chips to be detected, which affects the detection efficiency. When placing a large number of chips, the structure of the placement rack is relatively complex, and it is not convenient to take out the placement rack, which affects the work efficiency of workers. Content of the Utility Model

[0005] (1) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the existing technology, the purpose of the utility model is to provide a chip high and low temperature tester, which aims to solve the technical problems that due to the relatively troublesome placement of chips in the existing technology, only a small number of chips can be detected at a time when performing high and low temperature tests on the chips to be detected, which affects the detection efficiency. When placing a large number of chips, the structure of the placement rack is relatively complex, and it is not convenient to take out the placement rack, which affects the work efficiency of workers.

[0007] (2) Technical Solutions

[0008] To solve the above technical problems, the utility model provides such a chip high and low temperature tester, which includes a high and low temperature tester body and an intelligent controller. A machine door is installed at the workpiece placement entrance of the high and low temperature tester body, an intelligent controller is assembled on one side of the high and low temperature tester body, a chute is opened at the inner wall of the high and low temperature tester body, a slide rail is fitted inside the chute, and the slide rail is installed at the bottom of the workpiece placement component.

[0009] When using the high and low temperature testing machine of this technical solution, the operation of the high and low temperature testing machine body equipment is controlled by an intelligent controller. After opening the machine door, the workpiece to be detected is placed on the workpiece placement component. Then, the workpiece placement component is moved along the slide rail, and the slide rail slides into the interior of the high and low temperature testing machine body through the chute. After that, the machine door is closed, and then the workpiece inside the high and low temperature testing machine body is detected.

[0010] Preferably, the slide rail is of a "T" - shaped structure, and a sliding connection structure is formed between the slide rail and the high and low temperature testing machine body through the chute, and the slide rail can slide into the interior of the high and low temperature testing machine body through the chute.

[0011] Furthermore, the workpiece placement component includes support columns, fixed plates, fitting blocks, side plates, partition plates, and limit blocks. A fixed plate is fixedly connected to the surface of the support column. A fitting block is fixedly connected to one side of the fixed plate. The fitting block is fitted inside the side plate. A partition plate is fixedly connected to the surface of the side plate. With the workpiece placement component, it is more convenient to place chips, improving the work efficiency of workers. And the workpiece placement component is simply assembled and easy to use.

[0012] Even further, the bottom of the support column is fixedly connected to the top of the slide rail. After the slide rail slides into the interior of the chute, the slide rail can be assembled inside the high and low temperature testing machine body.

[0013] Even further, fitting grooves are opened on both sides of the side plate. When the fitting block is inserted into the fitting groove, a riveting connection structure is formed between the fitting block and the side plate, so that the fitting grooves on both sides of the side plate are riveted and installed on the fitting block, thereby assembling the side plate.

[0014] Even further, a limit block is provided at the end of the fitting groove. The limit block is fixedly connected to the surface of the side plate. After the side plate is pushed into the interior of the fixed plate, the limit block can limit the side plate.

[0015] Even further, the fixed plates are evenly distributed on the surface of the support column, and the distribution direction of the fixed plates is perpendicular to the direction of the slide rail, making the side plates placed on the fixed plates more stable when pushed into the interior of the slide rail.

[0016] Even further, a set of heat - conducting holes are opened on the surface of the side plate, and partition plates are distributed on both sides of the heat - conducting holes, facilitating the temperature of each chip placed on the side plate to be kept as consistent as possible.

[0017] (3) Beneficial effects

[0018] Compared with the prior art, the beneficial effects of the present utility model are as follows: Through the mutual cooperation among the slide rail, support column, fixed plate, fitting block, side plate, and partition plate, after placing the workpiece to be detected on the side plate and between the two partition plates, by controlling the intelligent controller, the high and low temperature test of the workpiece placed on the side plate can be carried out. This solution can simultaneously detect multiple groups of workpieces, thereby enhancing the detection effect. Moreover, the device can ensure the circulation of hot air inside the equipment, enabling all the multiple groups of workpieces placed to be at the same temperature, thus guaranteeing the accuracy of workpiece testing. Additionally, the workpiece placement component of this solution is convenient to install and simple to disassemble, and workers can easily place the workpiece on the side plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view three-dimensional structural schematic diagram of a specific embodiment of the device of the present utility model;

[0020] Figure 2 It is a side view three-dimensional structural schematic diagram of a specific embodiment of the device of the present utility model;

[0021] Figure 3 It is a three-dimensional structural schematic diagram of the side plate of a specific embodiment of the device of the present utility model;

[0022] Figure 4 It is a side view structural schematic diagram of the side plate of a specific embodiment of the device of the present utility model;

[0023] Figure 5 It is a rear view structural schematic diagram of the side plate of a specific embodiment of the device of the present utility model.

[0024] The reference signs in the drawings are: 1, high and low temperature test machine body; 2, machine door; 3, intelligent controller; 4, chute; 5, slide rail; 6, support column; 7, fixed plate; 8, fitting block; 9, side plate; 10, partition plate; 11, limit block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] This specific embodiment is a chip high and low temperature test machine, and its structural schematic diagram is as Figures 1-5 shown. This high and low temperature test machine includes a high and low temperature test machine body 1 and an intelligent controller 3. A machine door 2 is installed at the workpiece placement entrance of the high and low temperature test machine body 1. An intelligent controller 3 is assembled on one side of the high and low temperature test machine body 1. A chute 4 is provided on the inner wall of the high and low temperature test machine body 1, and a slide rail 5 is fitted inside the chute 4. The slide rail 5 is installed at the bottom of the workpiece placement component.

[0026] Among them, the slide rail 5 has a "T" - shaped structure, and the slide rail 5 forms a sliding connection structure with the high and low temperature test machine body 1 through the chute 4.

[0027] In addition, the workpiece placement component includes support columns 6, fixed plates 7, fitting blocks 8, side plates 9, partition plates 10, and limit blocks 11. A fixed plate 7 is fixedly connected to the surface of the support column 6. A fitting block 8 is fixedly connected to one side of the fixed plate 7. The fitting block 8 is fitted inside the side plate 9. A partition plate 10 is fixedly connected to the surface of the side plate 9. The bottom of the support column 6 is fixedly connected to the top of the slide rail 5. Fitting grooves are provided on both sides of the side plate 9. A riveting connection structure is formed between the fitting block 8 inserted into the fitting groove and the side plate 9. A limit block 11 is provided at the end of the fitting groove. The limit block 11 is fixedly connected to the surface of the side plate 9.

[0028] Among them, the fixed plates 7 are evenly distributed on the surface of the support column 6. The distribution direction of the fixed plates 7 is perpendicular to the direction of the slide rail 5. A set of heat dissipation holes are provided on the surface of the side plate 9. The partition plates 10 are distributed on both sides of the heat dissipation holes.

[0029] Working principle: When using the device of this technical solution, place the chip to be detected on the bottom side plate 9. Then, dock and rivet the fitting grooves on both sides of the side plate 9 with the fitting blocks 8 until the fitting blocks 8 abut against the limit blocks 11, so that the limit blocks 11 limit the moving distance of the side plate 9. Then, place the chip to be detected on another side plate 9. Then, place this side plate 9 on top of the previously installed side plate 9. Then, install the side plates 9 layer by layer on the fixed plate 7. Then, fit and install the slide rail 5 at the bottom of the support column 6 into the chute 4. Then, close the machine door 2. Then, through the intelligent controller 3, the high and low temperature testing machine body 1 detects the chips on the side plate 9. When the high and low temperature testing machine body 1 adjusts the temperature inside the device, all the chips will be kept at approximately the same temperature through the heat dissipation holes on the side plate 9 inside the device.

[0030] All the technical features in this embodiment can be freely combined according to actual needs.

[0031] The above embodiment is a preferred implementation scheme of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of this technical solution is within the protection scope of the present invention.

Claims

1. A chip high and low temperature tester, comprising a high and low temperature tester body (1) and an intelligent controller (3), characterized in that: A machine door (2) is installed at the workpiece placement entrance of the high and low temperature testing machine body (1), an intelligent controller (3) is installed on one side of the high and low temperature testing machine body (1), a slide groove (4) is opened on the inner wall of the high and low temperature testing machine body (1), a slide rail (5) is embedded in the interior of the slide groove (4), and the slide rail (5) is installed at the bottom of the workpiece placement component.

2. A chip high and low temperature tester according to claim 1, characterized in that: The slide rail (5) is a "T"-shaped structure, and the slide rail (5) forms a sliding connection structure with the high and low temperature testing machine body (1) through the slide groove (4).

3. A chip high and low temperature tester according to claim 1, characterized in that: The workpiece placement assembly comprises a support column (6), a fixed plate (7), a chimeric block (8), a side plate (9), a partition plate (10), and a limit block (11); the surface of the support column (6) is fixedly connected to the fixed plate (7), and one side of the fixed plate (7) is fixedly connected to the chimeric block (8).

4. A chip high and low temperature tester according to claim 3, characterized in that: The engaging block (8) is engaged with the inside of the side plate (9), the surface of the side plate (9) is fixedly connected with a partition plate (10), and the bottom of the support column (6) is fixedly connected with the top of the slide rail (5).

5. A chip high and low temperature tester according to claim 4, characterized in that: Both sides of the side plate (9) are provided with engaging grooves, and the engaging blocks (8) are inserted into the engaging grooves to form a riveted connection structure with the side plate (9).

6. A chip high and low temperature tester according to claim 5, characterized in that: A limiting block (11) is provided at the rear end of the engaging groove, and the limiting block (11) is fixedly connected to the surface of the side plate (9).

7. A chip high and low temperature tester according to claim 3, characterized in that: The fixing plates (7) are distributed at equal intervals on the surface of the support column (6), and the distribution direction of the fixing plates (7) is perpendicular to the direction of the slide rail (5).

8. The chip high and low temperature tester according to claim 3, characterized in that: The surface of the side plate (9) is provided with heat-through holes distributed in groups, and partition plates (10) are distributed on both sides of the heat-through holes.

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