Test board for chip

Abstract

The utility model relates to a test board for a chip, which comprises a test base, the test base is of a hollow structure, one side of the test base is provided with a placing groove, the placing groove is internally provided with a plurality of probe holes, probes are connected in the probe holes in a penetrating manner, and the lower parts of the probes penetrate through the probe holes and are electrically connected with a PCB (Printed Circuit Board) with a flat cable seat. A PCB of the flat cable seat is connected with a test mainboard, a guide bottom plate is connected in a placement groove, a product placement groove is formed in the guide bottom plate, a plurality of through holes are formed in the product placement groove, a guide plate is connected to the side edge of the guide bottom plate, a guide groove is formed in the test base, a spring is connected in the guide groove, a vertical plate is connected to the test base, and the vertical plate is connected to the test base. A top plate is connected to the top end of the vertical plate, a pressing air cylinder is connected to the top plate, a driving shaft of the pressing air cylinder penetrates through the top plate to be connected with a pressing rod, and the pressing rod is connected with a pressing block used for pressing a product. According to the utility model, the working efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to a test board for a chip. Background Art

[0002] With the development of microelectronic device technology, various electronic devices have been widely used in various fields such as aerospace, military, scientific research, and general electronics. Whether it is daily electronic products or large equipment, chips are required to achieve the purpose of automatic control and intelligence. Therefore, chips are the most important part of electronic products.

[0003] After being manufactured, chips generally need to be tested before being installed and used. Most of the existing chips are directly welded to the test board for chip testing. After testing, disassembly and assembly are required, which not only results in low test efficiency but also causes damage to the chips during the disassembly and assembly process.

[0004] After retrieval, the patent: A Chip Test Board (CN202021485515.2) includes a substrate, a test socket, a pressing component, and a PCB board. The test socket and the PCB board are respectively connected to the substrate. The test socket is provided with a placement groove for placing the chip to be tested. The pressing component is located above the placement groove. The placement groove is provided with thimble holes, and thimbles are placed in the thimble holes. The thimbles are electrically connected to the PCB board. The PCB board is provided with a cable socket, and the cable socket is connected to a detection core board. Although the above structure can achieve testing without welding, it cannot ensure stable contact between the product and the probe, and at the same time, it is inconvenient to take the product, which affects work efficiency.

[0005] In view of the above defects, the designer actively conducts research and innovation in order to create a test board for a chip with a new structure, making it more valuable in industry. Summary of the Utility Model

[0006] To solve the above technical problems, the purpose of the utility model is to provide a test board for a chip.

[0007] To achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A test board for a chip, comprising a test base, a PCB board and a test main board. The test base is of a hollow structure. One side of the test base with the hollow structure is provided with a placement groove for placing a product. A plurality of probe holes are opened in the placement groove. Probes are inserted through the probe holes. The lower part of the probes passes through the probe holes and is electrically connected to the PCB board with a cable socket. The PCB board with the cable socket is connected to the test main board. A guiding bottom plate is connected in the placement groove. A product placement groove is opened on the guiding bottom plate. A plurality of through holes are opened in the product placement groove. Each through hole corresponds to each probe hole one by one. A guiding plate is connected to the side of the guiding bottom plate. A guiding groove for guiding the guiding plate is opened on the test base at the side of the placement groove. A spring is connected in the guiding groove. The top end of the spring abuts against the guiding plate, and its bottom end abuts against the bottom of the guiding groove. A vertical plate is connected to the test base. A top plate is connected to the top end of the vertical plate. A pressing cylinder is connected to the top plate. The driving shaft of the pressing cylinder passes through the top plate and is connected to a pressing rod. The pressing rod is connected to a pressing block for pressing the product.

[0009] Preferably, for the test board for a chip, spring columns for connecting the positioning springs are connected to both the guiding plate and the guiding groove.

[0010] Preferably, for the test board for a chip, a guiding strip is connected in the guiding groove, and a guiding groove matching with the guiding strip is opened on the guiding plate.

[0011] Preferably, for the test board for a chip, a buffer pad is connected to the pressing block.

[0012] Preferably, for the test board for a chip, the depth of the product placement groove is less than the thickness of the product.

[0013] Preferably, for the test board for a chip, the depth of the product placement groove is 2 / 3 of the thickness of the product.

[0014] By means of the above solution, the utility model has at least the following advantages:

[0015] The utility model can realize quickly pressing the product while ensuring stable contact between the product and the probes, improving the quality of the test. The utility model can also quickly take and place the product, improving the work efficiency.

[0016] The above description is only an overview of the technical solution of the utility model. In order to be able to understand the technical means of the utility model more clearly and implement it according to the content of the specification, the following takes the preferred embodiment of the utility model and combines with the drawings to describe in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0018] Figure 1 is a schematic structural view of the present utility model;

[0019] Figure 2 is a top view of the present utility model. Detailed implementation manners

[0020] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0021] Therefore, the detailed description of the embodiments of the present application provided in the drawings below is not intended to limit the scope of the present application claimed, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0022] Embodiment

[0023] Such as Figure 1 and Figure 2As shown in the figure, a test board for a chip includes a test base 1, a PCB board, and a test main board. The test base 1 has a hollow structure. On one side of the test base 1 with the hollow structure, there is a placement groove 2 for placing a product. A number of probe holes 3 are provided in the placement groove 2. Probes 4 are inserted through the probe holes 3. Below the probes 4, they pass through the probe holes and are electrically connected to the PCB board with a cable socket. The PCB board with the cable socket is connected to the test main board. A guiding bottom plate 5 is connected in the placement groove 2. A product placement groove 6 is provided on the guiding bottom plate 5. A number of through holes 7 are provided in the product placement groove 6. Each through hole 7 corresponds to each probe hole 3 one by one. A guiding plate 8 is connected to the side of the guiding bottom plate 5. On the test base 1 on the side of the placement groove, there is a guiding groove 9 for guiding the guiding plate 8. A spring 10 is connected in the guiding groove 9. The top end of the spring 10 abuts against the guiding plate 8, and its bottom end abuts against the bottom of the guiding groove. A vertical plate 13 is connected to the test base 1. A top plate 14 is connected to the top end of the vertical plate 13. A pressing cylinder 15 is connected to the top plate 14. The driving shaft of the pressing cylinder 15 passes through the top plate and is connected to a pressing rod 16. The pressing rod 16 is connected to a pressing block 17 for pressing the product.

[0024] In the present utility model, spring columns 11 for positioning and connecting springs are connected to both the guiding plate 8 and the guiding groove 9. A guiding strip is connected in the guiding groove 9. A guiding groove 12 matching the guiding strip is provided on the guiding plate 8, which can improve stability.

[0025] In the present utility model, a buffer pad 18 is connected to the pressing block 17.

[0026] In the present utility model, the depth of the product placement groove 6 is less than the thickness of the product. Among them, the depth of the product placement groove 6 is 2 / 3 of the thickness of the product, which is convenient for taking and placing the product and improves work efficiency.

[0027] The working principle of the present utility model is as follows:

[0028] During specific work, the product is placed in the product placement groove of the guiding bottom plate. At this time, due to the weight of the product, it will be pressed down a little to ensure that the product can be stably placed in the product placement groove. Then, by starting the pressing cylinder, the pressing block is pressed down and contacts the product, and then continues to be pressed down until the bottom of the product contacts the probe. At this time, the guiding bottom plate contacts the groove. Then, the product is tested through the test main board. After the test is completed, the pressing cylinder is lifted. At this time, the guiding bottom plate is lifted under the action of the spring until the guiding bottom plate is flush with the plane of the test base. The operator removes the tested product and then repeats the above test.

[0029] It should be noted that like reference numerals and letters refer to like items in the following figures. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. In addition, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance.

[0031] In addition, the terms "horizontal", "vertical", etc. do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0032] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "arranged", "installed", "connected", "joined" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0033] The above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. A chip test board, comprising a test base (1), a PCB board and a test main board, characterized in that: The test base (1) is a hollow structure. A placement groove (2) for placing a product is provided on one side of the hollow test base (1). A plurality of probe holes (3) are provided in the placement groove (2). A probe (4) is inserted into the probe hole (3). The lower part of the probe (4) passes through the probe hole and is electrically connected to a PCB board with a cable tray. The PCB board of the cable tray is connected to a test main board. A guide bottom plate (5) is connected to the placement groove (2). A product placement groove (6) is provided on the guide bottom plate (5). A plurality of through holes (7) are provided in the product placement groove (6). Each through hole (7) corresponds to each probe hole (3). A guide plate (8) is connected to the side of the guide bottom plate (5); a guide groove (9) for guiding the guide plate (8) is provided on the test base (1) on the side of the placement groove; a spring (10) is connected in the guide groove (9); the top end of the spring (10) contacts the guide plate (8) and the bottom end of the spring (10) contacts the bottom of the guide groove; a vertical plate (13) is connected to the test base (1); the top end of the vertical plate (13) is connected to a top plate (14); a clamping cylinder (15) is connected to the top plate (14); a driving shaft of the clamping cylinder (15) passes through the top plate and is connected to a clamping rod (16); the clamping rod (16) is connected to a clamping block (17) for clamping a product.

2. A chip test board according to claim 1, characterized in that: The guide plate (8) and the guide groove (9) are both connected with a spring column (11) which is connected to a positioning spring.

3. A chip test board according to claim 1, characterized in that: A guide strip is connected to the guide groove (9), and a guide groove (12) matching the guide strip is provided on the guide plate (8).

4. A chip test board according to claim 1, characterized in that: The pressing block (17) is connected to a buffer pad (18).

5. The chip test board according to claim 1, characterized in that: The depth of the product placement groove (6) is less than the thickness of the product.

6. A chip test board according to claim 5, characterized in that: The depth of the product placement groove (6) is 2 / 3 of the thickness of the product.

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