Semiconductor cleaning device

Abstract

The utility model discloses a semiconductor cleaning device, and relates to the technical field of cleaning, the semiconductor cleaning device comprises a semiconductor cleaning box, one side of the semiconductor cleaning box is fixedly provided with a support frame, the inside of the support frame is rotatably connected with a threaded rod, the top of the support frame is fixedly provided with a first motor, and the top of the first motor is fixedly provided with a second motor. The output end of the first motor rotationally penetrates through the supporting frame and extends into the supporting frame, the output end of the first motor is fixedly connected with a threaded rod, the surface of the threaded rod is in threaded connection with a sliding hanging rod, and a second rotating shaft is driven to rotate through a chain and the other chain wheel, so that the first rotating shaft and the second rotating shaft rotate; the two blocking rings are driven to rotate, the semiconductor wafer is driven to rotate in the semiconductor cleaning box, multi-angle cleaning of the semiconductor wafer is achieved, automatic cleaning of the wafer is achieved through rotation of the wafer, the cleaning effect is improved to the maximum extent, and impurities on the wafer are reduced to the maximum extent.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning, in particular to a semiconductor cleaning device. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The domestic wafer production lines are mainly 8 inches and 12 inches, and the main processing methods of wafers are single-wafer processing and batch processing, that is, processing 1 wafer or multiple wafers simultaneously. As the semiconductor feature size becomes smaller and the processing and measurement equipment becomes more advanced, new data characteristics have emerged in wafer processing. At the same time, with the reduction of the feature size, the influence of the number of particles in the air on the quality and reliability of wafers after processing increases during wafer processing, and with the improvement of cleanliness, new data characteristics of the number of particles have also emerged.

[0003] When cleaning semiconductor wafers, a cleaning device is required. However, when some existing cleaning devices are used, the wafers are usually directly immersed in the cleaning liquid, and thus the wafers cannot be rotated and cleaned well, resulting in incomplete cleaning and the inability to wash off the impurities on the wafers well.

[0004] In view of the above problems, a semiconductor cleaning device is proposed. Summary of the Utility Model

[0005] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a semiconductor cleaning device that can solve the problems in the background art.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor cleaning device includes a semiconductor cleaning box. One side of the semiconductor cleaning box is fixedly installed with a support frame. A threaded rod is rotatably connected inside the support frame. The top of the support frame is fixedly installed with a first motor. The output end of the first motor rotates through the support frame and extends into the support frame. The output end of the first motor is fixedly connected to the threaded rod. A sliding suspension rod is threadedly connected to the surface of the threaded rod. The sliding suspension rod is slidably connected inside the support frame. The bottom of the sliding suspension rod is fixedly installed with a lower frame. A first rotating shaft and a second rotating shaft are rotatably connected inside the lower frame. Blocking rings are fixedly sleeved on both the first rotating shaft and the second rotating shaft. Four sliding guide rods are slidably connected inside the lower frame. The upper ends of the four sliding guide rods are fixedly installed with an upper frame. Two third rotating shafts are rotatably connected inside the upper frame. Blocking rings are also fixedly sleeved on both the two third rotating shafts.

[0007] Preferably, a transmission box is fixedly installed on one side of the lower frame. A second motor is fixedly installed inside the transmission box. One end of the first rotating shaft rotatably penetrates through the lower frame and the transmission box and extends into the transmission box. The output end of the second motor is fixedly connected to the first rotating shaft. One end of the second rotating shaft rotatably penetrates through the lower frame and the transmission box and extends into the transmission box.

[0008] Preferably, sprockets are fixedly sleeved on both the second rotating shaft and the first rotating shaft, and a chain is connected between the two sprockets.

[0009] Preferably, a fixing plate is fixedly installed on the lower frame, and the surface of the fixing plate is slidably connected to the inside of the upper frame.

[0010] Preferably, a transmission rod is rotatably connected inside the fixing plate. Two pulling ropes are wound around the surface of the transmission rod. Two sliding blocks are slidably connected inside the fixing plate.

[0011] Preferably, both of the two sliding blocks slidably penetrate through the fixing plate and extend to both sides of the fixing plate. The opposite ends of the two pulling ropes are respectively fixedly connected to the two sliding blocks.

[0012] Preferably, a fixed guide rod is fixedly installed inside the fixing plate. The surface of the fixed guide rod is slidably connected to the inside of the two sliding blocks. A return spring is movably sleeved on the surface of the fixed guide rod. The two ends of the return spring are respectively fixedly connected to the two sliding blocks.

[0013] Preferably, a conical thorn is fixedly installed on each of the opposite sides of the two sliding blocks.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] (1). For this semiconductor cleaning device, the second rotating shaft is driven to rotate through the chain and another sprocket, so that the first rotating shaft and the second rotating shaft rotate, and then the two blocking rings rotate, driving the semiconductor wafer to rotate inside the semiconductor cleaning box, thereby realizing multi-angle cleaning of the semiconductor wafer. Then, by using the rotation of the wafer, automatic cleaning of the wafer is realized, thereby maximizing the cleaning effect and reducing impurities on the wafer.

[0016] (2). For this semiconductor cleaning device, multiple conical thorns are brought into contact with the inner wall of the upper frame, thereby realizing the fixation of the upper frame, facilitating the adjustment of the height of the upper frame, facilitating the downward movement of the two upper blocking rings, and facilitating the fixation of the wafer by the four blocking rings, thereby realizing the fixation of the wafer and improving the convenience of fixing the wafer. Description of the Drawings

[0017] The following further describes the present utility model in conjunction with the drawings and embodiments:

[0018] Figure 1 This is a schematic structural diagram of a semiconductor cleaning device of the present utility model;

[0019] Figure 2 For the present utility model Figure 1 An enlarged schematic view of part A in it;

[0020] Figure 3 This is an internal schematic view of the transmission box of the present utility model;

[0021] Figure 4 This is an internal schematic view of the fixing plate of the present utility model.

[0022] Reference numerals: 1, semiconductor cleaning box; 2, support frame; 3, threaded rod; 4, first motor; 5, sliding suspension rod; 6, lower frame; 7, transmission box; 8, first rotating shaft; 9, blocking ring; 10, second rotating shaft; 11, fixing plate; 12, upper frame; 13, third rotating shaft; 14, transmission rod; 15, sliding block; 16, conical spike; 17, second motor; 18, chain; 19, sprocket; 20, pull rope; 21, return spring; 22, fixed guide rod; 23, sliding guide rod. Specific embodiments

[0023] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0024] To further understand the content of the present utility model, the present utility model will be described in detail in conjunction with the accompanying drawings.

[0025] Please refer to Figures 1-4, the present utility model provides a technical solution: a semiconductor cleaning device, including a semiconductor cleaning tank 1, a support frame 2 is fixedly installed on one side of the semiconductor cleaning tank 1, a threaded rod 3 is rotatably connected inside the support frame 2, a first motor 4 is fixedly installed on the top of the support frame 2, the output end of the first motor 4 rotatably penetrates the support frame 2 and extends to the inside of the support frame 2, the output end of the first motor 4 is fixedly connected to the threaded rod 3, a sliding suspension rod 5 is threadedly connected to the surface of the threaded rod 3, the sliding suspension rod 5 is slidably connected inside the support frame 2, a lower frame 6 is fixedly installed at the bottom of the sliding suspension rod 5, a first rotating shaft 8 and a second rotating shaft 10 are rotatably connected inside the lower frame 6, blocking rings 9 are fixedly sleeved on both the first rotating shaft 8 and the second rotating shaft 10, four sliding guide rods 23 are slidably connected inside the lower frame 6, an upper frame 12 is fixedly installed at the upper ends of the four sliding guide rods 23, and two third rotating shafts 13 are rotatably connected inside the upper frame 12, and blocking rings 9 are also fixedly sleeved on the two third rotating shafts 13.

[0026] Place the semiconductor wafer on the four blocking rings 9, and then start the first motor 4, so that the first motor 4 drives the threaded rod 3 to rotate, and then the sliding suspension rod 5 slides downward inside the support frame 2, and then the upper frame 12 and the lower frame 6 gradually enter the inside of the semiconductor cleaning tank 1, and then inside the semiconductor cleaning tank 1, clean the wafer through the wafer cleaning liquid inside the semiconductor cleaning tank 1, and then realize the cleaning of the semiconductor wafer.

[0027] Through the setting of the blocking rings 9, it is convenient to place the wafer inside the blocking rings 9, and then limit the wafer, and then prevent the wafer from shaking.

[0028] A transmission box 7 is fixedly installed on one side of the lower frame 6, a second motor 17 is fixedly installed inside the transmission box 7, one end of the first rotating shaft 8 rotatably penetrates the lower frame 6 and the transmission box 7 and extends to the inside of the transmission box 7, the output end of the second motor 17 is fixedly connected to the first rotating shaft 8, one end of the second rotating shaft 10 rotatably penetrates the lower frame 6 and the transmission box 7 and extends to the inside of the transmission box 7, and sprockets 19 are fixedly sleeved on both the second rotating shaft 10 and the first rotating shaft 8, and a chain 18 is connected to drive on the two sprockets 19.

[0029] Start the second motor 17, so that the second motor 17 drives the first rotating shaft 8 to rotate, and then drives the sprocket 19 on the first rotating shaft 8 to rotate, and then drives the second rotating shaft 10 to rotate through the chain 18 and another sprocket 19, and then the first rotating shaft 8 and the second rotating shaft 10 rotate, and then the two blocking rings 9 rotate, and then drive the semiconductor wafer to rotate inside the semiconductor cleaning tank 1, and then realize the multi-angle cleaning of the semiconductor wafer, and then utilize the rotation of the wafer to realize the automatic cleaning of the wafer, and then maximize the cleaning effect and reduce the impurities on the wafer.

[0030] A fixed plate 11 is fixedly installed on the lower frame 6. The surface of the fixed plate 11 is slidably connected to the inside of the upper frame 12. A transmission rod 14 is rotatably connected to the inside of the fixed plate 11. Two pull ropes 20 are wound around the surface of the transmission rod 14. Two sliding blocks 15 are slidably connected to the inside of the fixed plate 11. Both of the two sliding blocks 15 slide through the fixed plate 11 and extend to both sides of the fixed plate 11. The opposite ends of the two pull ropes 20 are respectively fixedly connected to the two sliding blocks 15. A fixed guide rod 22 is fixedly installed inside the fixed plate 11. The surface of the fixed guide rod 22 is slidably connected to the inside of the two sliding blocks 15. A return spring 21 is movably sleeved on the surface of the fixed guide rod 22. Both ends of the return spring 21 are fixedly connected to the two sliding blocks 15. A conical thorn 16 is fixedly installed on one side of each of the two sliding blocks 15 facing away from each other.

[0031] Rotate the transmission rod 14, and then wind the two pull ropes 20 around the transmission rod 14, and then pull the two sliding blocks 15 to move relatively, so that the two sliding blocks 15 slide inside the fixed plate 11 and on the fixed guide rod 22, and squeeze the return spring 21, and then retract the two sliding blocks 15 into the inside of the fixed plate 11. At the same time, the multiple conical thorns 16 are no longer in contact with the upper frame 12, so that the upper frame 12 slides on the fixed plate 11, so that the upper frame 12 moves downward, so as to adjust the height of the upper frame 12. After adjusting the height of the upper frame 12, stop rotating the transmission rod 14, and then the two sliding blocks 15 are reset by the elastic force of the return spring 21, so that the multiple conical thorns 16 are in contact with the inner wall of the upper frame 12, so as to realize the fixation of the upper frame 12, which is convenient for adjusting the height of the upper frame 12, convenient for the two blocking rings 9 on the upper side to move downward, convenient for fixing the semiconductor wafer by the four blocking rings 9, so as to realize the fixation of the semiconductor wafer, and thus improve the convenience of fixing the semiconductor wafer.

[0032] Working principle:

[0033] Place the semiconductor wafer on the four blocking rings 9, and then start the first motor 4 to drive the threaded rod 3 to rotate by the first motor 4, so that the sliding suspension rod 5 slides downward inside the support frame 2, so that the upper frame 12 and the lower frame 6 gradually enter the inside of the semiconductor cleaning tank 1, so as to enter the inside of the semiconductor cleaning tank 1.

[0034] Start the second motor 17 to drive the first rotating shaft 8 to rotate by the second motor 17, so as to drive the sprocket 19 on the first rotating shaft 8 to rotate, and then drive the second rotating shaft 10 to rotate through the chain 18 and another sprocket 19, so that the first rotating shaft 8 and the second rotating shaft 10 rotate, so that the two blocking rings 9 rotate, so as to drive the semiconductor wafer to rotate inside the semiconductor cleaning tank 1.

[0035] Rotate the transmission rod 14, and then wind the two pull ropes 20 around the transmission rod 14, and then pull the two sliding blocks 15 to move relatively, so that the two sliding blocks 15 slide inside the fixed plate 11 and on the fixed guide rod 22, and squeeze the return spring 21, and then contract the two sliding blocks 15 into the inside of the fixed plate 11. At the same time, make the multiple conical spikes 16 no longer contact the upper frame 12, so that the upper frame 12 slides on the fixed plate 11, so that the upper frame 12 moves downward, so as to adjust the height of the upper frame 12. After adjusting the height of the upper frame 12, stop rotating the transmission rod 14, and then make the two sliding blocks 15 reset by the elastic force of the return spring 21, so that the multiple conical spikes 16 contact the inner wall of the upper frame 12, so as to realize the fixation of the upper frame 12.

[0036] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor cleaning device, comprising a semiconductor cleaning box (1), characterized in that: A support frame (2) is fixedly installed on one side of the semiconductor cleaning box (1), a threaded rod (3) is rotatably connected inside the support frame (2), a first motor (4) is fixedly installed on the top of the support frame (2), an output end of the first motor (4) rotates through the support frame (2) and extends to the inside of the support frame (2), the output end of the first motor (4) is fixedly connected to the threaded rod (3), a sliding suspension rod (5) is threadedly connected on the surface of the threaded rod (3), the sliding suspension rod (5) is slidably connected inside the support frame (2), and the bottom of the sliding suspension rod (5) is fixedly connected to the support frame (2). A lower frame (6) is fixedly installed on the lower part, and a first rotating shaft (8) and a second rotating shaft (10) are rotatably connected inside the lower frame (6), and blocking rings (9) are fixedly sleeved on the first rotating shaft (8) and the second rotating shaft (10). Four sliding guide rods (23) are slidably connected inside the lower frame (6), and an upper frame (12) is fixedly installed on the upper ends of the four sliding guide rods (23). Two third rotating shafts (13) are rotatably connected inside the upper frame (12), and blocking rings (9) are also fixedly sleeved on the two third rotating shafts (13).

2. A semiconductor cleaning device according to claim 1, characterized in that: A transmission box (7) is fixedly mounted on one side of the lower frame (6), a second motor (17) is fixedly mounted inside the transmission box (7), one end of the first rotating shaft (8) rotates through the lower frame (6) and the transmission box (7) and extends to the inside of the transmission box (7), an output end of the second motor (17) is fixedly connected to the first rotating shaft (8), and one end of the second rotating shaft (10) rotates through the lower frame (6) and the transmission box (7) and extends to the inside of the transmission box (7).

3. A semiconductor cleaning device according to claim 2, characterized in that: The second rotating shaft (10) and the first rotating shaft (8) are both fixedly sleeved with sprockets (19), and the two sprockets (19) are transmission-connected with chains (18).

4. A semiconductor cleaning device according to claim 3, characterized in that: A fixing plate (11) is fixedly mounted on the lower frame (6), and a surface of the fixing plate (11) is slidably connected to the interior of the upper frame (12).

5. A semiconductor cleaning device according to claim 4, characterized in that: The interior of the fixed plate (11) is rotatably connected to a transmission rod (14), two pull ropes (20) are wound around the surface of the transmission rod (14), and the interior of the fixed plate (11) is slidably connected to two sliding blocks (15).

6. A semiconductor cleaning device according to claim 5, characterized in that: The two sliding blocks (15) are slidably penetrated through the fixed plate (11) and extend to both sides of the fixed plate (11), and the two pull ropes (20) are fixedly connected to the two sliding blocks (15) at their opposite ends.

7. A semiconductor cleaning device according to claim 6, characterized in that: A fixed guide rod (22) is fixedly installed inside the fixed plate (11), and the surface of the fixed guide rod (22) is slidably connected to the inside of the two sliding blocks (15). A return spring (21) is movably sleeved on the surface of the fixed guide rod (22), and the two ends of the return spring (21) are respectively fixedly connected to the two sliding blocks (15).

8. A semiconductor cleaning device according to claim 7, characterized in that: Cone spikes (16) are fixedly mounted on opposite sides of the two sliding blocks (15).

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