Automatic wafer film expanding equipment
By designing an automatic wafer film expansion device with multiple automation mechanisms, the complex and cumbersome problems of existing equipment conversion and inverting film processes are solved, and the full automation of wafer operations is realized, and production efficiency and product stability are improved.
Patent Information
- Application Number
- CN202421921168.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-09
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-08-09
AI Technical Summary
The existing automatic wafer film expansion equipment is complex and cumbersome when converting the parent ring into standard iron ring and inverted film processes, and has a lot of artificial intervention to affect production efficiency.
An automatic wafer film expansion equipment is designed, including a equipment frame, an 8-inch wafer ring basket loading and unloading mechanism, a wafer ring pulling mechanism, a double-station transplanting mechanism, a 6-inch wafer ring loading mechanism, an automatic film expansion mechanism and a wafer ring pushing mechanism, to realize the full automatic operation of the wafer.
Through automated operations, the demand for manual operations is reduced, production efficiency is improved, the stability and consistency of wafers during film expansion is ensured, and the uncertainty of human factors about the production process is reduced.
Smart Images

Figure CN223023242U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer processing equipment, in particular to an automatic wafer film expanding device. Background Art
[0002] An automatic wafer film expanding device is a device that realizes the automatic wafer grain expanding process. It realizes the automatic feeding, film expanding, film cutting, and discharging of wafer iron rings, reduces manual operation, and has the characteristics of high versatility, high production speed, and high stability, which can greatly improve efficiency and productivity. At present, most of the automatic wafer film expanding devices in the prior art are for expanding the film of the mother and son rings. The mother and son crystal rings need to be rotated (the mother and son rings are circular rings and need to be converted into standard iron rings) and the film inversion process before they can be used in the next process. The process is relatively complex and cumbersome, and the human intervention factor is relatively large, which affects the production efficiency. Summary of the Utility Model
[0003] Technical Objective: Aiming at the defects in the existing automatic wafer film expanding device technology, the utility model discloses an automatic wafer film expanding device, which can solve various production problems caused by improper manual operation in the existing semiconductor wafer grain expanding production process, avoid the damage of grains caused by uncontrollable factors during manual placement, replace manual labor with automated equipment, realize the automatic expansion of wafer grains, and has the characteristics of high versatility, high production speed, and high stability, which can greatly improve efficiency and productivity.
[0004] Technical Solution: To achieve the above technical objective, the utility model adopts the following technical solutions.
[0005] An automatic wafer film expanding device includes: a device frame and an 8-inch crystal ring basket loading and unloading mechanism, a crystal ring pulling mechanism, a dual-axis displacement mechanism, a 6-inch crystal ring loading mechanism, an automatic film expanding mechanism, and a crystal ring pushing mechanism arranged in the device frame;
[0006] The 8-inch crystal ring basket loading and unloading mechanism is arranged on both sides of the 6-inch crystal ring loading mechanism and is symmetrically arranged with respect to the 6-inch crystal ring loading mechanism. The 8-inch crystal ring basket loading and unloading mechanism on one side is used to place the 8-inch crystal ring with the product film, and the 8-inch crystal ring basket loading and unloading mechanism on the other side is used to place the 8-inch blanking crystal ring;
[0007] The automatic film expanding mechanism and the 6-inch crystal ring loading mechanism are arranged on the same straight line. The crystal ring pulling mechanism and the crystal ring pushing mechanism are respectively located on both sides of the automatic film expanding mechanism and are symmetrically arranged with respect to the automatic film expanding mechanism. The crystal ring pulling mechanism is used to drive the 8-inch crystal ring with the product film, and the crystal ring pushing mechanism is used to drive the 8-inch unloading crystal ring. The duplex displacement mechanism is arranged inside the equipment frame and above the crystal ring pulling mechanism, the automatic film expanding mechanism and the crystal ring pushing mechanism, and can displace between the crystal ring pulling mechanism, the automatic film expanding mechanism and the crystal ring pushing mechanism.
[0008] Preferably, the equipment frame includes a frame base, an upper protective cover, an operation control interface, control buttons, a temperature controller, a three-color lamp and a cooling fan.
[0009] The upper protective cover is arranged on the top of the frame base, and the upper protective cover encloses a hollow cavity at the top of the frame base. The 8-inch crystal ring basket loading and unloading mechanism, the crystal ring pulling mechanism, the duplex displacement mechanism, the 6-inch crystal ring loading mechanism, the automatic film expanding mechanism and the crystal ring pushing mechanism are all arranged in the cavity enclosed by the frame base and the upper protective cover. The operation control interface, the temperature controller and the control buttons are arranged on the outer surface of the upper protective cover. The three-color lamp is fixedly installed on the top of the upper protective cover. A plurality of cooling fans are arranged inside the frame base.
[0010] Preferably, the 8-inch crystal ring basket loading and unloading mechanism includes a basket lifting platform, a flatness detection sensor I, a basket rod opening detection sensor, a flatness detection sensor II, a basket positioning component, a lifting shaft I and a base I.
[0011] The base I is arranged on the equipment frame. The lifting shaft I is arranged on the top of the base I. The basket lifting platform is arranged at the upper end of the lifting shaft I. The 8-inch crystal ring basket is placed on the upper end surface of the basket lifting platform. The basket positioning component for fixing the 8-inch crystal ring basket is arranged on the lower end surface of the basket lifting platform. The flatness detection sensor I, the basket rod opening detection sensor and the flatness detection sensor II are also arranged on the lower end surface of the basket lifting platform. The flatness sensor I and the flatness detection sensor II are symmetrically arranged on both sides of the lower end surface of the basket lifting platform.
[0012] Preferably, the crystal ring pulling mechanism includes a pulling component, a crystal ring flow channel component I and a positioning component I. The pulling component and the positioning component I are both arranged on the crystal ring flow channel component I.
[0013] The first crystal ring runner assembly includes a first sensor for detecting the presence or absence of material in the runner, a first side-pushing positioning structure, and a first runner. The first side-pushing positioning structure and the first runner are both fixed on the equipment frame. The first side-pushing positioning structure is located on both sides of the first runner, and the first sensor for detecting the presence or absence of material in the runner is located on the inner wall of the first side-pushing positioning structure close to the first runner; The material pulling assembly includes a first sensor for detecting the presence or absence of material in the basket and a crystal ring gripper. The crystal ring gripper is arranged on the first runner and can slide on the first runner. The first sensor for detecting the presence or absence of material in the basket is arranged at the front end of the crystal ring gripper; The first positioning assembly includes a first lifting structure and a first forward-pushing positioning structure. The first forward-pushing positioning structure is arranged on the equipment frame, and the first lifting structure is arranged above the first forward-pushing positioning structure. The first forward-pushing positioning structure can push the first lifting structure forward.
[0014] Preferably, the duplex displacement mechanism includes a displacement assembly and a lifting assembly. The displacement assembly is fixed on the equipment frame, and the lifting assembly is arranged on the displacement assembly and can slide on the displacement assembly;
[0015] The displacement assembly includes a displacement assembly bracket and a displacement slideway. The displacement assembly bracket is fixed on the equipment frame, and the displacement slideway is fixed on the displacement assembly bracket; The lifting assembly includes an 8-inch crystal ring lifting and sucking structure, a 6-inch crystal ring lifting and sucking structure, and a lifting assembly bracket. The lifting assembly bracket is arranged on the displacement slideway and can slide along the displacement slideway. The 8-inch crystal ring lifting and sucking structure and the 6-inch crystal ring lifting and sucking structure are both arranged on the lifting assembly bracket, and the 8-inch crystal ring lifting and sucking structure is located below the 6-inch crystal ring lifting and sucking structure.
[0016] Preferably, the 6-inch crystal ring loading mechanism includes a 6-inch crystal ring platform, a second lifting shaft, and a second base. The second base is fixedly arranged on the equipment frame, the second lifting shaft is arranged on the top of the second base, and the 6-inch crystal ring platform is fixed on the second lifting shaft. The 6-inch wafer platform includes a third flatness detection sensor, a sensor for detecting the presence or absence of material, and a fourth flatness detection sensor. The third flatness detection sensor, the sensor for detecting the presence or absence of material, and the fourth flatness detection sensor are all installed on the lower bottom surface of the 6-inch crystal ring platform, and the third flatness detection sensor and the fourth flatness detection sensor are symmetrically arranged.
[0017] Preferably, the automatic film expanding mechanism includes a film pressing assembly, a film expanding assembly, and a cover plate assembly. The film pressing assembly, the film expanding assembly, and the cover plate assembly are all arranged inside the equipment frame and are on the same straight line;
[0018] The film pressing mechanism includes a rotary film cutting structure, a lifting structure, a suction structure, a cutting tool structure, a transplanting structure and a film pressing support frame. The transplanting structure is fixed on the equipment frame. The film pressing support frame is arranged on the transplanting structure and can slide on the transplanting structure. The lifting structure is arranged on the film pressing support frame, and the output shaft of the lifting structure penetrates through the film pressing support frame. The suction structure is installed on the output shaft of the lifting structure. The rotary film cutting structure is installed above the suction structure and is connected to the output shaft of the lifting structure. The transplanting structure includes a moving slide rail and an electric lead screw. The slide rail is installed on the equipment frame. The electric lead screw and the film pressing support frame are both installed on the slide rail, and the film pressing support frame can slide on the slide rail in the direction of approaching and departing from the film expanding assembly under the control of the electric lead screw.
[0019] The film expanding assembly includes a crystal ring positioning structure, a heating plate, a downward pressing structure, a second lifting structure, a product presence / absence detection sensor at the film expanding position and a crystal ring platform. The crystal ring platform is fixed on the equipment frame. The crystal ring positioning structure and the downward pressing structure are respectively arranged on the side surface of the crystal ring platform. The second lifting structure is fixed on the equipment frame and passes through the middle of the crystal ring platform, and can lift in the direction perpendicular to the crystal ring platform. The product presence / absence detection sensor at the film expanding position is fixed on the crystal ring platform.
[0020] The cover plate assembly includes a telescopic structure and a cover plate. The telescopic structure is arranged on the equipment frame, and the cover plate is arranged on the telescopic structure. The telescopic structure includes an electric telescopic rod, and the cover plate is installed on the electric telescopic rod and can move in the direction of approaching or departing from the crystal ring platform.
[0021] Preferably, the crystal ring pushing mechanism includes a pushing jaw assembly, a second crystal ring flow channel assembly and a second positioning assembly. The pushing jaw assembly and the second positioning assembly are both arranged on the second crystal ring flow channel assembly. The pushing jaw mechanism includes a transplanting pushing jaw and a basket presence / absence detection sensor II. The basket presence / absence detection sensor II is arranged on the transplanting pushing jaw. The second crystal ring flow channel assembly includes a second side pushing and positioning structure, a flow channel presence / absence detection sensor II and a second flow channel. The second flow channel is arranged on the equipment frame. The second side pushing and positioning structure is arranged on the equipment frame and is located on both sides of the second flow channel. The flow channel presence / absence detection sensor II is located on the side wall of the second side pushing and positioning structure close to the second flow channel. The second positioning assembly includes a second front pushing and positioning structure, a second lifting structure and a pin structure. The second front pushing and positioning structure and the second lifting structure are fixed together and then arranged on the side surface of the front end of the first flow channel. The pin structure is fixed on the second side pushing and positioning structure and is located above the second flow channel.
[0022] Beneficial effects: The automatic wafer film expanding equipment provided by the present utility model has the following beneficial effects:
[0023] The automatic wafer film expanding device of the present utility model realizes automatic operation through the equipment frame 1 and multiple mechanisms arranged inside the equipment frame. These mechanisms include the 8-inch crystal ring basket loading and unloading mechanism 2, the crystal ring pulling mechanism 3, the dual-axis displacement transfer mechanism 4, the 6-inch crystal ring loading mechanism 5, the automatic film expanding mechanism 6, and the crystal ring pushing mechanism 7. The coordinated operation of each mechanism realizes the full-automatic operation of wafer loading, film expanding, film cutting, and unloading, reduces the need for manual operation, and significantly improves production efficiency.
[0024] By using the dual-axis displacement transfer mechanism 4 and the automatic film expanding mechanism 6, the present utility model can ensure the stability and consistency of the wafer during the film expanding process. The dual-axis displacement transfer mechanism 4 can displace between the crystal ring pulling mechanism 3, the automatic film expanding mechanism 6, and the crystal ring pushing mechanism 7 to realize precise wafer transmission and positioning. The precise control and stable operation of the automatic equipment reduce the uncertainty of the production process caused by human factors and improve the consistency and stability of the production process. Moreover, the 8-inch crystal ring with the product film, the 6-inch crystal ring, and the unloading 8-inch crystal ring are placed separately and operated sequentially. The process is simple and does not require human intervention, and the production efficiency is relatively high. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 is a schematic structural diagram of the present utility model;
[0026] Figure 2 is a schematic structural diagram of the equipment frame of the present utility model;
[0027] Figure 3 is a schematic structural diagram of the 8-inch crystal ring basket loading mechanism of the present utility model;
[0028] Figure 4 is a schematic structural diagram of the crystal ring pulling mechanism of the present utility model;
[0029] Figure 5 is a schematic structural diagram of the dual-axis displacement transfer mechanism of the present utility model;
[0030] Figure 6 is a schematic structural diagram of the 6-inch crystal ring loading mechanism of the present utility model;
[0031] Figure 7 is a schematic structural diagram of the automatic film expanding mechanism of the present utility model;
[0032] Figure 8 is a schematic structural diagram of the crystal ring pushing mechanism of the present utility model;
[0033] Figure 9 is a schematic structural diagram of the 8-inch crystal ring basket of the present utility model;
[0034] Figure 10This is a schematic structural diagram of the assembly of an 8-inch blanking crystal ring and a 6-inch crystal ring of the present utility model;
[0035] Figure 11 This is a schematic working process diagram of an automatic wafer film expanding device of the present utility model.
[0036] In the figure: 1. Equipment frame; 11. Upper protective cover; 111. Operation control interface; 112. Temperature controller; 113. Control button; 12. Three-color lamp; 13. Cooling fan; 2. 8-inch crystal ring basket loading mechanism; 21. Basket lifting platform; 22. Flatness detection sensor 1; 23. Basket rod opening detection sensor; 24. Flatness detection sensor 2; 25. Basket positioning component; 26. Lifting shaft 1; 27. Base 1; 3. Crystal ring pulling mechanism; 31. Pulling component; 311. Basket material presence / absence detection sensor 1; 312. Crystal ring clamping jaw; 32. Crystal ring runner component 1; 321. Runner material presence / absence detection sensor 1; 322. Side push positioning structure 1; 323. Runner 1; 33. Positioning component; 331. Jacking structure 1; 332. Front push positioning structure 1; 4. Dual-axis transfer mechanism; 41. Transfer component; 411. Transfer component bracket; 412. Transfer slideway; 42. Lifting component; 421. 8-inch crystal ring lifting and sucking structure; 422. 6-inch crystal ring lifting and sucking structure; 423. Lifting component bracket; 5. 6-inch crystal ring loading mechanism; 51. 6-inch crystal ring platform; 511. Flatness detection sensor 3; 512. Material presence / absence detection sensor; 513. Flatness detection sensor 4; 52. Lifting shaft 2; 53. Base 2; 6. Automatic film expanding mechanism; 61. Film pressing component; 611. Rotary film cutting structure; 612. Lifting structure; 613. Sucking structure; 614. Cutting knife structure; 615. Transfer structure; 6151. Moving slide rail; 6152. Electric lead screw; 616. Film pressing support frame; 62. Film expanding component; 621. Crystal ring positioning structure; 622. Heating plate; 623. Pressing down structure; 624. Jacking structure 2; 625. Product presence / absence detection sensor at film expanding position; 626. Crystal ring platform; 63. Cover plate component; 631. Telescopic structure; 6311. Electric telescopic rod; 632. Cover plate; 7. Crystal ring pushing mechanism; 71. Pushing claw component; 711. Transfer pushing claw; 712. Basket material presence / absence detection sensor 2; 72. Crystal ring runner component 2; 721. Side push positioning structure 2; 722. Runner material presence / absence detection sensor 2; 723. Runner 2; 73. Positioning component 2; 731. Front push positioning structure 2; 732. Jacking structure 3; 733. Pin structure. Detailed implementation manners
[0037] The following further describes and explains an automatic wafer film expanding device of the present utility model in conjunction with the accompanying drawings and embodiments.
[0038] As shown in the appendix Figure 1 As shown in the figure, an automatic wafer film expanding device is provided in this embodiment, including: a device frame 1, an 8-inch crystal ring basket loading and unloading mechanism 2, a crystal ring pulling mechanism 3, a duplex displacement mechanism 4, a 6-inch crystal ring loading mechanism 5, an automatic film expanding mechanism 6, a crystal ring pushing mechanism 7, and a motion control system;
[0039] As shown in the appendix Figure 2 As shown in the figure, the device frame 1 includes a frame base 14, an upper protective cover 11, an operation control interface 111, control buttons 113, a temperature controller 112, a three-color lamp 12, and a cooling fan 13;
[0040] The upper protective cover 11 is arranged on the top of the frame base 14, and the upper protective cover 11 encloses a hollow cavity at the top of the frame base 14. The 8-inch crystal ring basket loading and unloading mechanism 2, the crystal ring pulling mechanism 3, the duplex displacement mechanism 4, the 6-inch crystal ring loading mechanism 5, the automatic film expanding mechanism 6, and the crystal ring pushing mechanism 7 are all arranged in the cavity enclosed by the frame base 14 and the upper protective cover 11; the outer surface of the upper protective cover 11 is provided with an operation control interface 111, a temperature controller 112, and control buttons 113; the operation control interface 111 is used to realize human-computer interaction; the temperature controller 112 is used to set the temperature and duration of heating of the heating plate 622 in the self-film expanding mechanism 6, and the control buttons 113 are used to control the start and stop of the automatic wafer film expanding device;
[0041] The three-color lamp 12 is fixedly installed on the top of the upper protective cover 11. The three-color lamp 12 is used to display three different colors, and the three colors respectively correspond to three working states. When the green light is on, it means that the automatic wafer film expanding device is in the running state. When the yellow light is on, it means that the automatic wafer film expanding device is in the standby state. When the red light is on, it means that the automatic wafer film expanding device is in the fault state; several cooling fans 13 are arranged in the frame base 14, and the cooling fans 13 are used to blow air and dissipate heat to the mechanisms in the cavity enclosed by the upper protective cover 11;
[0042] In some embodiments of the present invention, the upper protective cover 11 is arranged in a double-door structure. By operating the operation control interface 111, the temperature controller 112, and the control buttons 113 on the outer surface of the upper protective cover 11, it is convenient to observe the operation of the device in real time and to open the door to check the operation of the device.
[0043] The 8-inch crystal ring basket loading mechanism 2, crystal ring pulling mechanism 3, dual-station transfer mechanism 4, 6-inch crystal ring loading mechanism 5, automatic film expanding mechanism 6, and crystal ring pushing mechanism 7 are arranged on the frame base 14 from left to right; the 8-inch crystal ring basket loading and unloading mechanism 2 is arranged on both sides of the 6-inch crystal ring loading mechanism 5 and is symmetrically arranged with respect to the 6-inch crystal ring loading mechanism 5. All three are located at the front end of the frame base 14. The 6-inch crystal ring loading mechanism 5 is used for manual loading of 6-inch crystal rings. One side of the 8-inch crystal ring basket loading and unloading mechanism 2 is used to place 8-inch crystal rings with product films, and the 8-inch crystal ring basket loading and unloading mechanism 2 on the other side is used to place 8-inch unloaded crystal rings.
[0044] The automatic film expanding mechanism 6 and the 6-inch crystal ring loading mechanism 5 are arranged on the same straight line. The automatic film expanding mechanism 6 is located behind the 6-inch crystal ring loading mechanism 5. The crystal ring pulling mechanism 3 and the crystal ring pushing mechanism 7 are respectively arranged on both sides of the automatic film expanding mechanism 6 and are symmetrically arranged with respect to the automatic film expanding mechanism 6. Among them, the crystal ring pulling mechanism 3 is on the same side as the 8-inch crystal ring basket loading mechanism 2 with the product film, and is used to drive the 8-inch crystal ring with the product film. The crystal ring pushing mechanism 7 is on the same side as the 8-inch crystal ring basket loading mechanism 2 with the 8-inch unloaded crystal ring, and is used to drive the 8-inch crystal ring basket loading and unloading mechanism 2 of the 8-inch unloaded crystal ring; the dual-station transfer mechanism 4 is arranged inside the frame base 14 and above the crystal ring pulling mechanism 3, automatic film expanding mechanism 6, and crystal ring pushing mechanism 7, and can displace between the crystal ring pulling mechanism 3, automatic film expanding mechanism 6, and crystal ring pushing mechanism 7, transporting the 8-inch crystal ring with the product film from the crystal ring pulling mechanism 3 to the automatic film expanding mechanism 6 to complete film expansion and then transporting it back to the crystal ring pulling mechanism 3, and transporting the 6-inch crystal ring after film expansion to the crystal ring pushing mechanism 7.
[0045] On the equipment rack 1, there is also a motion control system for controlling the movement of each mechanism. The motion control system mainly includes a signal processing module, a main control module, a display module, and an alarm module. The signal processing module, the main control module, the display module, and the alarm module are all electrically connected through a communication bus. The signal processing module is specifically a signal acquisition card, which is electrically connected to the 8-inch crystal ring basket loading and unloading mechanism 2, the crystal ring pulling mechanism 3, the duplex displacement mechanism 4, the 6-inch crystal ring loading mechanism 5, the automatic film expanding mechanism 6, and the crystal ring pushing mechanism 7, and is used to collect vacuum values, motor values, and sensing signals, and transmit them to the main control module for processing. The main control module is used to judge the motion states of the various mechanisms of the automatic wafer film expanding equipment according to the vacuum values, motor values, and sensing signals collected by the signal acquisition card, determine the current states and actions of the various mechanisms of the automatic wafer film expanding equipment, control the actions of the various mechanisms, and determine and control the abnormality of the automatic wafer film expanding equipment. The display module is used to display the action process of each mechanism in real time, provide a system operation entry, and display other information. The alarm module is used to perform abnormal alarm according to the corresponding detection results of the abnormality detection.
[0046] As shown in the Figure 3 attached figure, the 8-inch crystal ring basket loading and unloading mechanism 2 includes a basket lifting platform 21, a flatness detection sensor 22, a basket rod opening detection sensor 23, a flatness detection sensor 24, a basket positioning component 25, a lifting shaft 26, and a base 27, and is used to automatically place and take out an 8-inch crystal ring with a product film or an 8-inch blanking crystal ring.
[0047] A square hole is opened at the front end of the rack base 14. The base 27 passes through the square hole and is arranged inside the rack base 14. A lifting shaft 26 is arranged on the base 27. The upper end of the lifting shaft 26 is provided with a basket lifting platform 21. An 8-inch crystal ring basket is placed on the upper end surface of the basket lifting platform 21. A basket positioning component 25 for fixing the 8-inch crystal ring basket is arranged on the side of the lower end surface of the basket lifting platform 21. A flatness detection sensor 22, a basket rod opening detection sensor 23, and a flatness detection sensor 24 are also arranged on the lower end surface of the basket lifting platform 21. The flatness sensor 22 and the flatness detection sensor 24 are symmetrically arranged on both sides of the lower end surface of the basket lifting platform 21.
[0048] There are two 8-inch crystal ring basket loading and unloading mechanisms 2, which are respectively located on both sides of the rack base 14. One 8-inch crystal ring basket loading and unloading mechanism 2 on one side is used to place an 8-inch crystal ring with a product film. The 8-inch crystal ring basket loading and unloading mechanism 2 on this side is on the same side as the crystal ring pulling mechanism 3. The 8-inch crystal ring basket loading and unloading mechanism 2 on the other side is used to place an 8-inch blanking crystal ring. The 8-inch crystal ring basket loading and unloading mechanism 2 on this side is on the same side as the crystal ring pushing mechanism 7.
[0049] In use, first, manually open the lever of the 8-inch crystal ring basket containing the 8-inch crystal ring with the product film and place it on the basket lifting platform 21. The 8-inch crystal ring basket contains multiple layers, and each layer is placed with an 8-inch crystal ring with the product film. The basket lever opening detection sensor 23 detects whether the basket lever is opened. When the basket lever is normally opened, the flatness detection sensor one 22 and the flatness detection sensor two 24 detect whether the 8-inch crystal ring basket is placed flat. When it is placed flat, the basket positioning mechanism 25 positions the basket, and the basket lifting platform 21 moves to lift the basket to the loading station for the next process. After each picking and placing of an 8-inch crystal ring with the product film is completed, the lifting platform 21 descends one level to facilitate the picking and placing of subsequent 8-inch crystal rings with the product film.
[0050] As shown in the Figure 4 attachment, the crystal ring pulling mechanism 3 includes: a pulling component 31, a crystal ring flow channel component one 32, and a positioning component one 33. The pulling component 31 and the positioning component one 33 are both arranged on the crystal ring flow channel component one 32 and are used to automatically drive and transport 8-inch crystal rings;
[0051] The crystal ring flow channel component one 32 includes a flow channel presence / absence detection sensor one 321, a side push positioning structure one 322, and a flow channel one 323. The side push positioning structure one 322 and the flow channel one 323 are both fixed on the frame base 14. The side push positioning structure one 322 is located on both sides of the flow channel one 323, and its upper end is provided with a groove body. The two sides of the 8-inch crystal ring can be clamped into the groove body. The flow channel presence / absence detection sensor one 321 is located on the inner wall of the side push positioning structure one 322 close to the flow channel one 323 and can detect whether there is an 8-inch crystal ring in the flow channel one 323. The pulling component 31 includes a basket presence / absence detection sensor one 311 and a crystal ring gripper 312. The crystal ring gripper 312 is arranged on the flow channel one 323 and can slide on the flow channel one 323. The basket presence / absence detection sensor one 311 is arranged at the front end of the crystal ring gripper 312. The positioning component one 33 includes a jacking structure one 331 and a front push positioning structure one 332. The front push positioning structure one 331 is arranged on the frame base 14, and the jacking structure one 331 is arranged on the front push positioning structure one 332. The front push positioning structure one 332 can push the jacking structure one 331 forward, and the two are located at a position close to the front end of the flow channel one 323, that is, close to the 8-inch crystal ring basket loading and unloading mechanism 2;
[0052] The crystal ring gripper 312 moves along the first runner 323 to the front of the loading position of the 8-inch crystal ring basket of the 8-inch crystal ring basket loading and unloading mechanism 2. The no-load detection sensor 311 at the front end of the crystal ring gripper 312 detects whether there is an 8-inch crystal ring in the basket. If there is an 8-inch crystal ring, the crystal ring gripper 312 moves into the 8-inch crystal ring basket, the crystal ring gripper 312 clamps the 8-inch crystal ring, and then retreats to the runner loading position of the crystal ring pulling mechanism 3. The no-load detection sensor 321 of the runner detects whether there is an 8-inch crystal ring in the first runner 323. If there is an 8-inch crystal ring, the first side-pushing and positioning structure 322 acts to side-push and position the 8-inch crystal ring, the first lifting structure 311 lifts, and the first forward-pushing and positioning structure 332 forward-pushes the first lifting structure 311 to position the 8-inch crystal ring. After the positioning of the 8-inch crystal ring is completed, the next process is carried out.
[0053] As shown in the Figure 5 accompanying drawings, the duplex transfer mechanism 4 includes: a transfer assembly 41 and a lifting assembly 42. The transfer assembly 41 is fixed on the frame base 14, and the lifting assembly 42 is arranged on the transfer assembly 41 and can slide on the transfer assembly 41, responsible for moving the crystal ring between each workstation.
[0054] The transfer assembly 41 includes a transfer assembly bracket 411 and a transfer slideway 412. The transfer assembly bracket 411 is fixed on the frame base 14 and is located between the first runner 323 of the crystal ring pulling mechanism 3 and the second runner 723 of the crystal ring pushing mechanism 7. The transfer slideway 412 is fixed on the transfer assembly bracket 411, and the transfer slideway 412 is located above the first side-pushing and positioning structure 322 of the crystal ring pulling mechanism 3, the crystal ring platform 626 of the automatic film expanding mechanism 6, and the second side-pushing and positioning structure 721 of the crystal ring pushing mechanism 7. The lifting assembly 42 includes an 8-inch crystal ring lifting and sucking structure 421, a 6-inch crystal ring lifting and sucking structure 422, and a lifting assembly bracket 423. The lifting assembly bracket 423 is arranged on the transfer slideway 412 and can slide along the transfer slideway 412. The 8-inch crystal ring lifting and sucking structure 421 and the 6-inch crystal ring lifting and sucking structure 422 are both arranged on the lifting assembly bracket 423, and the 8-inch crystal ring lifting and sucking structure 421 is located below the 6-inch crystal ring lifting and sucking structure 422.
[0055] The lifting assembly bracket 423 of the duplex transfer mechanism 4 moves to the runner loading position of the crystal ring pulling mechanism 3, and then the lifting assembly bracket 423 controls the 8-inch crystal ring lifting and sucking structure 421 to descend. The 8-inch crystal ring lifting and sucking mechanism 421 descends to suck the 8-inch crystal ring with the product film, and vacuum detection is carried out. The lifting assembly bracket 423 controls the 8-inch crystal ring lifting and sucking mechanism 421 to rise, and then the lifting assembly bracket 423 slides on the transfer slideway 412 to place the 8-inch crystal ring on the automatic film expanding mechanism 6 for the next process.
[0056] As shown in the Figure 7As shown, the automatic film expansion mechanism 6 includes a film pressing assembly 61, a film expansion assembly 62 and a cover assembly 63, which are all arranged on the frame base 14 and are located in the same straight line, the film pressing assembly 61 is located at the rear, the film expansion assembly 62 is located in the middle, and the cover assembly 63 is located at the front to perform the core film expansion operation;
[0057] The film pressing mechanism 61 includes a rotary film cutting structure 611, a lifting structure 612, a suction structure 613, a cutter structure 614, a transplanting structure 615 and a film pressing support frame 616. The transplanting structure 615 is fixed on the frame base 14. The transplanting structure 615 includes a movable slide rail 6151 and an electric lead screw 6152. The slide rail 6151 is installed on the frame base 14. The electric lead screw 6152 and the film pressing support frame 616 are both installed on the slide rail 6151. The film pressing support frame 616 can be moved by the electric lead screw 6152. Under the control of the movable lead screw 6152, it slides on the slide rail 6151 in the direction of approaching and moving away from the film expansion assembly 62; a lifting structure 612 is provided on the film pressing support frame 616, and the output shaft of the lifting structure 612 passes through the film pressing support frame 612, and the suction structure 613 is installed on the output shaft of the lifting structure 612, and the rotary film cutting structure 611 is installed above the suction structure 613 and connected to the output shaft of the lifting structure 612, and is located between the rotary film cutting structure 611 and the film pressing support frame 616;
[0058] The film expansion assembly 62 includes a wafer ring positioning structure 621, a heating plate 622, a downward pressure structure 623, a second lifting structure 624, a product detection sensor 625 for film expansion position, and a wafer ring platform 626. The wafer ring platform 626 is fixed on the frame base 14. The wafer ring positioning structure 621 and the downward pressure structure 623 are respectively arranged at different positions on the side of the wafer ring platform 626. The middle part of the wafer ring platform 626 is a hollow structure. The second lifting structure 624 is fixed on the frame base 14 and passes through the middle part of the wafer ring platform 626. The second lifting structure 624 can be lifted and lowered in a direction perpendicular to the wafer ring platform 626 for expanding the product film. The product detection sensor 625 for film expansion position is fixed on the wafer ring platform 626 for detecting whether there is an 8-inch wafer ring with a product film on the wafer ring platform 626.
[0059] The cover plate assembly 63 includes a telescopic structure 631 and a cover plate 632, the telescopic structure 631 is arranged on the frame base 14, and the cover plate 632 is arranged on the telescopic structure 631; the telescopic structure includes an electric telescopic rod 6311, the electric telescopic rod 6311 is located below the film pressing support frame 616, and the cover plate 632 is installed on the electric telescopic rod 6311 and can move towards or away from the wafer ring platform 626.
[0060] The duplex displacement mechanism 4 moves the 8-inch wafer ring to the wafer ring platform 626 of the self-expanding film mechanism 6, and the product detection sensor 625 at the film expansion position detects whether there is a wafer ring. If there is a wafer ring, the wafer ring positioning structure 621 acts to position the wafer ring, and the electric telescopic rod 6311 acts to move the cover plate 632 to the top of the film expansion mechanism 62, and the pressing structure 623 acts to contact the cover plate 632 and pull the cover plate 632 down to the wafer ring platform 626 to press the 8-inch wafer ring. The lifting structure 624 lifts upward to lift the product film in the 8-inch wafer ring upward to achieve film expansion. After the lifting action stops, the heating plate 622 is heated to a specified temperature. The purpose of heating here is to increase the viscosity of the film. The temperature setting is related to the product film, and then the next step is entered to absorb the 6-inch wafer ring from the 6-inch wafer ring loading mechanism 5.
[0061] As attached Figure 6 As shown, the 6-inch wafer ring loading mechanism 5 includes: a 6-inch wafer ring platform 51, a lifting shaft 52 and a base 53. The base 53 is fixedly arranged in the frame base 14, the lifting shaft 52 is arranged on the top of the base 53, and the 6-inch wafer ring platform 51 is fixed on the lifting shaft 52. The 6-inch wafer platform 51 includes a flatness detection sensor 3 511, a material presence detection sensor 512 and a flatness detection sensor 4 513. The flatness detection sensor 3 511, the material presence detection sensor 512 and the flatness detection sensor 4 513 are all installed on the lower bottom surface of the 6-inch wafer ring platform 51, and the flatness detection sensor 3 511 and the flatness detection sensor 4 513 are symmetrically arranged.
[0062] During use, an operator manually places a 6-inch crystal ring on the 6-inch wafer platform 51. The flatness detection sensor III 511 and the flatness detection sensor IV 513 detect whether the 6-inch crystal ring is placed flatly, and the presence / absence material detection sensor 512 detects the presence of material. The lifting shaft II 52 rises to the material taking position and waits for the film pressing mechanism 61 to suck the 6-inch crystal ring. The film pressing assembly 61 moves above the 6-inch crystal ring loading mechanism 5. The cutting knife structure 614 extends, the lifting structure 612 descends, the suction structure 613 turns on the vacuum to suck the 6-inch crystal ring. After the vacuum detection is completed, the lifting structure 612 rises. The transplanting structure 615 moves above the film expanding mechanism 62. The lifting structure 612 descends, the cutting knife structure 614 retracts, the rotary film cutting structure 611 rotates 365 degrees to cut the film. After the film cutting is completed, the cutting knife structure 614 extends, the suction structure 613 releases the vacuum, the lifting structure 612 rises, and the transplanting structure 615 moves above the 6-inch crystal ring loading mechanism 5 to wait for the next material taking. The duplex displacement transplanting mechanism 4 moves above the film expanding mechanism 62. The lifting assembly 42 descends, and the 6-inch crystal ring lifting suction structure 422 descends to suck the product. After the vacuum detection, the lifting assembly 42 rises to drive the 6-inch crystal ring lifting suction mechanism 422 to rise. The heating plate 622 stops heating, the jacking structure II 624 descends and retracts, the pressing structure 623 rises, the telescopic structure 631 operates to retract the cover plate 632 to the waiting position. The duplex displacement transplanting mechanism 4 moves the 6-inch crystal ring and places it above the crystal ring pushing mechanism 7 for the next process step.
[0063] As shown in the Figure 8 accompanying figure, the crystal ring pushing mechanism 7 includes: a pushing jaw assembly 71, a crystal ring runner assembly II 72, and a positioning assembly II 73. The pushing jaw assembly 71 and the positioning assembly II 73 are both arranged on the crystal ring runner assembly II 72 and are used to push the processed crystal ring to a specified position;
[0064] The pusher jaw assembly 71 includes a transplant pusher jaw 711 and a second sensor 712 for detecting the presence or absence of a basket material. The second sensor 712 for detecting the presence or absence of a basket material is arranged on the transplant pusher jaw 711. The second crystal ring flow path assembly 72 includes a second side-pushing positioning structure 721, a second flow path presence / absence sensor 722, and a second flow path 723. The second flow path 723 is arranged on the frame base 14. The second side-pushing positioning structure 721 is arranged on the frame base 14 and located on both sides of the second flow path 723. The second flow path presence / absence sensor 722 is located on the side wall of the second side-pushing positioning structure 721 close to the second flow path 723. The second positioning assembly 73 includes a second front-pushing positioning structure 731, a third lifting structure 732, and a pin structure 733. The second front-pushing positioning structure 731 is located on the frame base 14. The third lifting structure 732 is arranged on the second front-pushing positioning structure 731 and can push the third lifting mechanism 732 forward. The pin structure 733 is fixed on the second side-pushing positioning structure 721 through a cross beam and located above the second flow path 723.
[0065] The pusher jaw assembly 71 moves to the front of the loading position of the 8-inch crystal ring basket of the 8-inch crystal ring basket loading and unloading mechanism 2 with an 8-inch blanking crystal ring. The second sensor 712 for detecting the presence or absence of a basket material detects whether there is an 8-inch blanking crystal ring in the basket. The transplant pusher jaw 711 moves into the 8-inch crystal ring basket. The transplant pusher jaw 711 clamps the 8-inch blanking crystal ring. The pusher jaw mechanism 71 retracts to the flow path loading position of the crystal ring pusher mechanism 7. The transplant pusher jaw 711 releases the 8-inch blanking crystal ring. The second flow path presence / absence sensor 722 detects whether there is an 8-inch blanking crystal ring on the second flow path. If there is, the pin structure 733 descends and inserts into the positioning and clamping mechanism in the 8-inch blanking crystal ring as shown in Figure 10 the figure. The second side-pushing positioning structure 721 acts to side-push and position the 8-inch blanking crystal ring. The third lifting structure 732 lifts. The second front-pushing positioning mechanism 731 front-pushes and positions the 8-inch blanking crystal ring, and the positioning of the 8-inch blanking crystal ring is completed. The dual-axis transplant mechanism 4 moves the 6-inch crystal ring after film expansion to above the crystal ring pusher mechanism 7. The lifting assembly 42 descends to drive the 6-inch crystal ring lifting and sucking structure 422 to descend. The vacuum is released to place the 6-inch crystal ring after film expansion as shown in Figure 10As shown in the figure, the 8-inch blanking crystal ring is lifted. The 6-inch crystal ring lifting and sucking structure 422 rises, the lifting component 42 rises, the pin structure 733 rises, and the positioning and clamping mechanism in the 8-inch blanking crystal ring clamps the product. In a specific embodiment, the positioning and clamping mechanism uses a spring mechanism for clamping. The side pushing and positioning structure II 721 retracts, the lifting structure III 732 lifts and the front pushing and positioning structure II 731 retracts in sequence. The pushing gripper assembly 71 moves to the clamping position of the runner crystal ring. The transplanting pushing gripper 711 clamps the assembled crystal ring. The pushing gripper assembly 71 pushes the product back into the 8-inch crystal ring basket. The transplanting pushing gripper 711 releases the crystal ring. The pushing gripper assembly 71 retracts to the safe position and waits for the next cycle.
[0066] The duplex displacement and transplanting mechanism 4 moves above the film expanding mechanism 62. The lifting component 42 descends. The 8-inch crystal ring lifting and sucking structure 421 descends to suck the 8-inch crystal ring after film expansion. The lifting component 42 rises, driving the 8-inch crystal ring lifting and sucking structure 421 to rise. The duplex displacement and transplanting mechanism 4 moves back to the runner loading position of the crystal ring pulling mechanism 3. Then, the lifting component bracket 423 controls the 8-inch crystal ring lifting and sucking structure 421 to descend, placing the 8-inch crystal ring after film expansion on the runner of the crystal ring pulling mechanism 3. It is sent back into the 8-inch crystal ring basket by the crystal ring gripper 312. Then, the lifting platform 21 descends one level to prepare for the next cycle. After the above operations, when the 8-inch crystal ring basket is full, the equipment alarms to remind the operator to load and unload materials.
[0067] As Figure 11 shown, the operation process of the automatic wafer film expanding equipment is as follows: The operator places the 8-inch crystal ring basket and the 6-inch crystal ring as shown in Figure 9 the figure on the 8-inch crystal ring loading and unloading mechanism 2 and the 6-inch crystal ring loading mechanism 5 respectively. The 8-inch crystal ring loading and unloading mechanism lifts the crystal ring basket to the first-level loading position. The crystal ring pulling mechanism 3 clamps the 8-inch crystal ring with the product film and pulls it to the loading position. The duplex displacement and transplanting mechanism 4 sucks the 8-inch crystal ring with the product film and transplants it to the automatic film expanding mechanism 6. The automatic film expanding mechanism 6 expands the film of the crystal ring. The automatic film expanding mechanism 6 sucks the 6-inch crystal ring to the film expanding position and the automatic film expanding mechanism 6 cuts the film. The automatic film expanding mechanism 6 retracts to the 6-inch crystal ring loading position. The duplex displacement and transplanting mechanism 4 sucks the 6-inch crystal ring after film expansion and transplants it to the crystal ring pushing mechanism 7. The crystal ring pushing mechanism 7 clamps the 8-inch blanking crystal ring from the 8-inch crystal ring basket on its same side, completes the positioning and clamping assembly with the 6-inch crystal ring after film expansion, and then pushes the assembled crystal ring back into the basket to complete the blanking.
[0068] The above are only the preferred embodiments of the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims
1. An automatic wafer expansion device, characterized in that: include: An equipment frame (1) and an 8-inch wafer ring basket loading and unloading mechanism (2), a wafer ring pulling mechanism (3), a duplex displacement mechanism (4), a 6-inch wafer ring loading mechanism (5), an automatic film expansion mechanism (6) and a wafer ring pushing mechanism (7) arranged in the equipment frame (1); The 8-inch wafer ring lifting basket loading and unloading mechanisms (2) are arranged on both sides of the 6-inch wafer ring loading mechanism (5), and are symmetrically arranged with respect to the 6-inch wafer ring loading mechanism (5); the 8-inch wafer ring lifting basket loading and unloading mechanisms (2) on one side are used to place the 8-inch wafer ring with the product film, and the 8-inch wafer ring lifting basket loading and unloading mechanisms (2) on the other side are used to place the 8-inch unloading wafer ring; The automatic film expansion mechanism (6) and the 6-inch wafer ring loading mechanism (5) are arranged on the same straight line; the wafer ring pulling mechanism (3) and the wafer ring pushing mechanism (7) are respectively located on both sides of the automatic film expansion mechanism (6) and are symmetrically arranged with respect to the automatic film expansion mechanism (6); the wafer ring pulling mechanism (3) is used to drive the 8-inch wafer ring with the product film, and the wafer ring pushing mechanism (7) is used to drive the 8-inch unloading wafer ring; the duplex displacement mechanism (4) is arranged in the equipment frame (1) and is located above the wafer ring pulling mechanism (3), the automatic film expansion mechanism (6) and the wafer ring pushing mechanism (7), and is capable of displacement between the wafer ring pulling mechanism (3), the automatic film expansion mechanism (6) and the wafer ring pushing mechanism (7).
2. The automatic wafer expansion device according to claim 1, characterized in that: The equipment rack (1) comprises a rack base (14), an upper protective cover (11), an operation control interface (111), control buttons (113), a temperature controller (112), a three-color light (12) and a cooling fan (13); An upper protective cover (11) is arranged on the top of the rack base (14), and the upper protective cover (11) surrounds the top of the rack base (14) to form a hollow cavity. An 8-inch wafer ring basket loading and unloading mechanism (2), a wafer ring pulling mechanism (3), a duplex displacement mechanism (4), a 6-inch wafer ring loading mechanism (5), an automatic film expansion mechanism (6) and a wafer ring pushing mechanism (7) are all arranged on the rack base (14) and in the cavity surrounded by the upper protective cover (11); an operation control interface (111), a temperature controller (112) and a control button (113) are arranged on the outer surface of the upper protective cover (11); a three-color lamp (12) is fixedly installed on the top of the upper protective cover (11); and a plurality of cooling fans (13) are arranged in the rack base (14).
3. The automatic wafer expansion device according to claim 1, characterized in that: The 8-inch wafer ring basket loading and unloading mechanism (2) comprises a basket lifting platform (21), a flatness detection sensor 1 (22), a basket lever opening detection sensor (23), a flatness detection sensor 2 (24), a basket positioning assembly (25), a lifting shaft 1 (26) and a base 1 (27); A base 1 (27) is arranged on an equipment frame (1); a lifting shaft 1 (26) is arranged on the top of the base 1 (27); a basket lifting platform (21) is arranged on the upper end of the lifting shaft 1 (26); an 8-inch wafer ring basket is placed on the upper end surface of the basket lifting platform (21); a basket positioning assembly (25) for fixing the 8-inch wafer ring basket is arranged on the lower end surface of the basket lifting platform (21); a flatness detection sensor 1 (22), a basket gear lever opening detection sensor (23) and a flatness detection sensor 2 (24) are also arranged on the lower end surface of the basket lifting platform (21); the flatness detection sensor 1 (22) and the flatness detection sensor 2 (24) are symmetrically arranged on both sides of the lower end surface of the basket lifting platform (21).
4. The automatic wafer expansion device according to claim 1, characterized in that: The wafer ring pulling mechanism (3) comprises a pulling component (31), a wafer ring flow channel component 1 (32) and a positioning component 1 (33), wherein the pulling component (31) and the positioning component 1 (33) are both arranged on the wafer ring flow channel component 1 (32); The wafer ring flow channel component (32) includes a flow channel material detection sensor (321), a side push positioning structure (322) and a flow channel (323). The side push positioning structure (322) and the flow channel (323) are both fixed on the equipment frame. The side push positioning structure (322) is located on both sides of the flow channel (323). The flow channel material detection sensor (321) is located on the inner wall of the side push positioning structure (322) close to the flow channel (323). The material pulling component (31) includes a basket material detection sensor (311) and a wafer ring clamp ( 312), a wafer ring clamp (312) is arranged on a flow channel (323) and can slide on the flow channel (323), a basket material detection sensor (311) is arranged at the front end of the wafer ring clamp (312); a positioning component (33) includes a lifting structure (331) and a forward pushing positioning structure (332), the forward pushing positioning structure (332) is arranged on the equipment frame (1), the lifting structure (331) is arranged above the forward pushing positioning structure (332), and the forward pushing positioning structure (332) can push the lifting structure (331) forward.
5. The automatic wafer expansion device according to claim 1, characterized in that: The duplex transplanting mechanism (4) comprises a transplanting assembly (41) and a lifting assembly (42), wherein the transplanting assembly (41) is fixed on the equipment frame (1), and the lifting assembly (42) is arranged on the transplanting assembly (41) and is capable of sliding on the transplanting assembly (41); The transplanting assembly (41) comprises a transplanting assembly support (411) and a transplanting slide (412); the transplanting assembly support (411) is fixed on the equipment frame (1); and the transplanting slide (412) is fixed on the transplanting assembly support (411); the lifting assembly (42) comprises an 8-inch wafer ring lifting and absorbing structure (421), a 6-inch wafer ring lifting and absorbing structure (422), and a lifting assembly support (423); the lifting assembly support (423) is arranged on the transplanting slide (412) and can slide along the transplanting slide (412); the 8-inch wafer ring lifting and absorbing structure (421) and the 6-inch wafer ring lifting and absorbing structure (422) are both arranged on the lifting assembly support (423), and the 8-inch wafer ring lifting and absorbing structure (421) is located below the 6-inch wafer ring lifting and absorbing structure (422).
6. The automatic wafer expansion device according to claim 1, characterized in that: The 6-inch wafer ring loading mechanism (5) comprises a 6-inch wafer ring platform (51), a lifting shaft (52) and a base (53), wherein the base (53) is fixedly arranged on the equipment frame (1), the lifting shaft (52) is arranged on the top of the base (53), and the 6-inch wafer ring platform (51) is fixed on the lifting shaft (52). The 6-inch wafer ring platform (51) comprises a flatness detection sensor (511), a material presence detection sensor (512) and a flatness detection sensor (513), wherein the flatness detection sensor (511), the material presence detection sensor (512) and the flatness detection sensor (513) are all installed on the lower bottom surface of the 6-inch wafer ring platform (51), and the flatness detection sensor (511) and the flatness detection sensor (513) are symmetrically arranged.
7. The automatic wafer expansion device according to claim 1, characterized in that: The automatic film expansion mechanism (6) comprises a film pressing component (61), a film expansion component (62) and a cover plate component (63), wherein the film pressing component (61), the film expansion component (62) and the cover plate component (63) are all arranged in the equipment frame (1) and are located on the same straight line; The film pressing assembly (61) comprises a rotary film cutting structure (611), a lifting structure (612), a suction structure (613), a cutter structure (614), a transplanting structure (615) and a film pressing support frame (616), wherein the transplanting structure (615) is fixed on the equipment frame (1), the film pressing support frame (616) is arranged on the transplanting structure (615) and can slide on the transplanting structure (615), the film pressing support frame (616) is provided with a lifting structure (612), the output shaft of the lifting structure (612) passes through the film pressing support frame (616), and the suction structure (613) is installed on the lifting structure ( The rotary film cutting structure (611) is installed on the output shaft of the suction structure (613) and is connected to the output shaft of the lifting structure (612); the transplanting structure (615) comprises a movable slide rail (6151) and an electric lead screw (6152); the slide rail (6151) is installed on the equipment frame (1); the electric lead screw (6152) and the film pressing support frame (616) are both installed on the slide rail (6151); and the film pressing support frame (616) can slide on the slide rail (6151) in a direction close to and away from the film expanding assembly (62) under the control of the electric lead screw (6152); The film expansion assembly (62) comprises a wafer ring positioning structure (621), a heating plate (622), a downward pressure structure (623), a second lifting structure (624), a product detection sensor (625) for film expansion, and a wafer ring platform (626); the wafer ring platform (626) is fixed on the equipment frame (1); the wafer ring positioning structure (621) and the downward pressure structure (623) are respectively arranged on the side of the wafer ring platform (626); the second lifting structure (624) is fixed on the equipment frame (1) and passes through the middle of the wafer ring platform (626) and can be raised and lowered in a direction perpendicular to the wafer ring platform (626); the product detection sensor (625) for film expansion is fixed on the wafer ring platform (626); The cover plate assembly (63) comprises a telescopic structure (631) and a cover plate (632); the telescopic structure (631) is arranged on the equipment frame (1), and the cover plate (632) is arranged on the telescopic structure (631); the telescopic structure comprises an electric telescopic rod (6311), and the cover plate (632) is installed on the electric telescopic rod (6311) and can move in a direction close to or away from the wafer ring platform (626).
8. The automatic wafer expansion device according to claim 1, characterized in that: The wafer ring pushing mechanism (7) comprises a pushing clamping claw assembly (71), a second wafer ring flow channel assembly (72) and a second positioning assembly (73), wherein the pushing clamping claw assembly (71) and the second positioning assembly (73) are both arranged on the second wafer ring flow channel assembly (72), wherein the pushing clamping claw assembly (71) comprises a transfer pushing clamping claw (711) and a second basket material detection sensor (712), wherein the second basket material detection sensor (712) is arranged on the transfer pushing clamping claw (711); wherein the second wafer ring flow channel assembly (72) comprises a second side pushing positioning structure (721), a second flow channel material detection sensor (722) and a second flow channel (723), wherein the second flow channel (723) is arranged on the second wafer ring flow channel assembly (721). The second side push positioning structure (721) is arranged on the equipment frame (1) and is located on both sides of the second flow channel (723). The second flow channel material detection sensor (722) is located on the side wall of the second side push positioning structure (721) close to the second flow channel (723). The second positioning component (73) includes a second front push positioning structure (731), a second lifting structure (732) and a latch structure (733). The second front push positioning structure (731) and the second lifting structure (732) are fixed as a whole and then arranged on the side of the front end of the first flow channel (723). The latch structure (733) is fixed on the second side push positioning structure (721) and is located above the second flow channel (723).
Citation Information
Cited By
Automatic film expansion patch assembly for semiconductor packaging
CN122206216A