Cover opening device of wafer box
By using multiple sensors and push modules in the open cover device of the wafer box, the position of the wafer is detected and corrected, and the prominent problems of wafers in the transport and door cover opening and closing process are solved, ensuring the correct position of the wafer in the wafer box and ensuring process continuity.
Patent Information
- Application Number
- CN202422178149.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-09-05
AI Technical Summary
During the transport process of wafer box and the opening and closing of door covers, how to ensure that the wafer does not protrude and maintain process continuity in the conveying process.
A cover opening device including a main frame, a lifting module, a moving seat, a cover opening module, a sensor and a pushing module are designed. The sensing regions of the first, second and third sensors detect whether the wafer is in position and protruding, and push the protruding wafer back to its proper position by using the chip push module.
Effectively detect and correct the position of the wafer to ensure that the wafer in the wafer box is always in the correct position during the opening and transportation process, avoid problems such as chipping caused by protrusion of the wafer, and ensure process continuity.
Smart Images
Figure CN223023246U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to an opening device, in particular to an opening device for a wafer cassette. Background Art
[0002] In the semiconductor manufacturing process, in order to keep the wafers isolated from the external environment to prevent contamination, the wafers are usually loaded into a wafer cassette for transportation. At the same time, in cooperation with factory automation equipment, it is also necessary to ensure that the wafer cassette can be placed in a fixed position and the wafers in the cassette are also kept in the correct positions, which is beneficial to realizing the above-mentioned transfer process and process continuity.
[0003] In other words, how to ensure that the wafers do not protrude during the transportation of the wafer cassette and the opening and closing of the door cover is actually an issue that relevant technicians need to consider. Summary of the Utility Model
[0004] The utility model provides an opening device for a wafer cassette, which can sequentially detect whether the wafers in the wafer cassette protrude and return the protruding wafers to their original positions accordingly.
[0005] An opening device for a wafer cassette of the utility model includes a main frame, a lifting module, a moving seat, an opening module, a first sensor, a second sensor, a third sensor, a pushing plate module and a control module. The main frame has a top frame. The lifting module is arranged on the main frame. The moving seat is movably assembled to the main frame and connected to the lifting module. The lifting module drives the moving seat to lift in the main frame to move towards or away from the top frame. The opening module is arranged on the moving seat to unlock the outer shell and the door cover of the wafer cassette. After unlocking, the door cover rises and falls with the moving seat, and the unlocked outer shell leans against the top frame. The first sensor, the second sensor and the third sensor are respectively arranged below the top frame. At least one wafer is received in the wafer cassette. After unlocking, the wafer rises and falls with the door cover and the moving seat. The moving path of the wafer passes through the sensing area of the first sensor, and the moving path of the wafer passes through the sensing area of the second sensor or the third sensor. The pushing plate module is arranged below the top frame. The control module is electrically connected to the first sensor, the second sensor, the third sensor, the lifting module, the opening module and the pushing plate module.
[0006] In an embodiment of the utility model, the above-mentioned first sensor is a photoelectric sensor, and the generated sensing beam is parallel to the wafer and passes through the center of the wafer cassette.
[0007] In an embodiment of the utility model, the above-mentioned second sensor is a fiber optic sensor, and the generated sensing beam is parallel to the wafer and passes through the edge of the wafer.
[0008] In an embodiment of the utility model, the above-mentioned third sensor is a fiber optic sensor, and the generated sensing beam is parallel to the wafer and passes through the edge of the wafer.
[0009] In an embodiment of the present utility model, the above-mentioned second sensor and third sensor are respectively fiber optic sensors, and the relative distance between the sensing area of the second sensor and the center of the wafer cassette is greater than the relative distance between the sensing area of the third sensor and the center of the wafer cassette.
[0010] In an embodiment of the present utility model, the above-mentioned second sensor and third sensor are respectively fiber optic sensors, and the sensing beams of the second sensor are parallel to the sensing beams of the third sensor.
[0011] In an embodiment of the present utility model, the above-mentioned first sensor is a laser retroreflective sensor.
[0012] In an embodiment of the present utility model, the above-mentioned third sensor and second sensor are respectively fiber optic contrast sensors.
[0013] In an embodiment of the present utility model, the above-mentioned wafer pushing module includes a motor and a push rod. The push rod is rotatably arranged on the lower surface of the top frame and is connected to the motor.
[0014] In an embodiment of the present utility model, the sensing areas of the above-mentioned first, second, and third sensors are located below the push rod.
[0015] Based on the above, since the opening device is provided with a first sensor, a second sensor, and a third sensor at relevant positions on the main frame, and the wafer moves past the sensing areas of the above-mentioned sensors respectively as it moves with the door cover and the moving seat. Accordingly, the control module can sequentially learn from these sensors whether the wafer is in place and whether the wafer protrudes. Here, the control module first confirms whether there is a wafer by the first sensor, and the second sensor or the third sensor confirms whether the wafer protrudes when closing the cover upward.
[0016] Next, if it is sensed that the wafer has indeed protruded, the opening device of this case further includes a wafer pushing module. Whether it is the situation of the wafer protruding sensed by the second sensor or the situation of the wafer protruding sensed by the third sensor, the control module can drive the wafer pushing module to push the wafer back to the appropriate position. Accordingly, after the wafers in the wafer cassette are processed by the opening device, it can be effectively confirmed that both the wafer cassette and the wafers therein are in the correct positions.
[0017] To make the above features and advantages of the present utility model more obvious and understandable, specific embodiments are hereinafter given and described in detail in conjunction with the accompanying drawings as follows. Description of the Drawings
[0018] Figure 1 It is a schematic diagram of the loading relationship between the opening device and the wafer cassette according to an embodiment of the present utility model;
[0019] Figure 2It is an exploded view of the lid opening device;
[0020] Figure 3 It is a schematic view of the main frame at the top frame;
[0021] Figure 4 It is Figure 1 The electrical connection diagram of some components of the lid opening device;
[0022] Figure 5 It is a schematic view of the state after the lid opening device has unlocked the wafer cassette;
[0023] Figure 6 And Figure 7 Respectively show the bottom views of the partial structures of the lid opening device. Detailed implementation manners
[0024] Figure 1 It is a schematic view of the loading relationship between the lid opening device and the wafer cassette according to an embodiment of the present invention. Figure 2 It is an exploded view of the lid opening device. Figure 3 It is a schematic view of the main frame at the top frame. The rectangular coordinate X - Y - Z is provided here for facilitating the description of components. Please also refer to Figures 1 to 3 , in this embodiment, the lid opening device 100 of the wafer cassette (hereinafter referred to as the lid opening device 100) includes a main frame 110, a lifting module 120, a moving seat 160, a lid opening module 170, a first sensor SN1, a second sensor SN2, a third sensor SN3, and a pusher module 180. The main frame 110 has a top frame 111, a pair of side plates 113, 114 and a bottom plate 112, thereby forming a lifting space. The lifting module 120 is disposed on the side plates 113, 114 of the main frame 110. The moving seat 160 is movably assembled to the side plates 113, 114 of the main frame 110 and connected to the lifting module 120, so that the lifting module 120 drives the moving seat 160 to rise or fall in the lifting space to move to or away from the top frame 111. The lid opening module 170 is disposed on the moving seat 160 to unlock the wafer cassette 200, and the first sensor SN1, the second sensor SN2, and the third sensor SN3 are respectively disposed below the top frame 111.
[0025] As Figure 2As shown, the lifting module 120 of this embodiment includes a motor M1 and a driving mechanism 121. The driving mechanism 121 includes a track, a screw, a conveyor belt, and a moving member. The side plate body of the moving seat 160 is assembled to the moving member. Similarly, the driving mechanism 121 also has similar components at the side plate 114, which for example includes a track and a conveyor belt, and is linked to the driving mechanism 121 at the side plate 113 through a transmission rod 121a to achieve the effect of synchronous movement, so that the moving seat 160 can also be combined with the driving mechanism 121 on this side, and thus complete the movement mode that allows the moving seat 160 to rise or fall along the Z-axis. The wafer cassette 200 of this embodiment is, for example, a wafer cassette that conforms to the Standard Mechanical Interface (SMIF). Therefore, the lid opening module 170 provided at the center of the moving seat 160 also meets the conditions for unlocking the above-mentioned specification wafer cassette 200, which is already known in the prior art and will not be elaborated here. Furthermore, the wafer pushing module 180 includes a motor M2 and a push rod 181. The push rod 181 is rotatably provided on the lower surface of the top frame 111 and is electrically connected to the motor M2, so that the push rod 181 can swing along a plane (X-Y plane) in the lifting space under the drive of the motor M2, and its operation will be further described later.
[0026] As Figure 3 shown, the first sensor SN1 is a photoelectric sensor, and particularly a laser retroreflective sensor, which includes a light emitting / sensing unit SN11 and a reflection unit SN12. The area through which the light beam passes is the sensing area, used to determine whether an object passes through. The second sensor SN2 and the third sensor SN3 are respectively fiber optic sensors, and particularly fiber optic contrast sensors, which are composed of a light emitting unit SN21 (or SN31) and a sensing unit SN22 (or SN32), used to detect the edge of the passing object, that is, by utilizing the difference in the configured positions, the second sensor SN2 and the third sensor SN3 can provide identification for objects of different sizes.
[0027] Figure 4 is Figure 1 the electrical connection relationship diagram of some components of the lid opening device. Figure 5 is a schematic diagram of the state after the lid opening device has unlocked the wafer cassette. Please refer to Figure 1 、 Figure 4 and Figure 5, in this embodiment, the lid opening device 100 further includes a control module CM, which is electrically connected to the aforementioned first sensor SN1, second sensor SN2, third sensor SN3, lifting module 120 (motor M1 thereof), lid opening module 170 (motor thereof), and pusher module 180 (motor M2 thereof). Here, the control module CM unlocks the door cover 240 and the outer shell 210 of the wafer cassette 200 through the lid opening module 170. After unlocking, the door cover 240 will lift with the moving seat 160, and the unlocked outer shell 210 will rest on the top frame 111, as Figure 5 shown. Here, the wafer cassette 200 is provided with a storage cassette 220 to accommodate at least one wafer 230. After unlocking, the storage cassette 220 and the wafer 230 will separate from the door cover 240 and the outer shell 210 and lift with the moving seat 160. Comparing Figure 1 with Figure 5 it can be known that it actually lifts along the Z-axis.
[0028] Accordingly, combined with Figure 3 the configuration of the sensors shown, it can be clearly known that the sensing area of the first sensor SN1 is located below the push rod 181, the sensing area of the second sensor SN2 is in the same plane as the push rod 181 (the plane is the same as or parallel to the X-Y plane), and the sensing area of the third sensor SN3 is in the same plane as the push rod 181 (the plane is the same as or parallel to the X-Y plane). In this way, the moving path (along the Z-axis) of the wafer 230 will pass through the sensing area of the first sensor SN1, and the moving path of the wafer 230 will also pass through the sensing area of the second sensor SN2 or the third sensor SN3. According to the setting of the aforementioned pusher module 180, as Figure 3 shown, when the wafer 230 passes through the sensing area of the second sensor SN2 or the third sensor SN3, and especially when it passes through the sensing area of the second sensor SN2 or the third sensor SN3 as the moving seat 160 rises, the control module can determine whether the wafer 230 protrudes, and accordingly drive the pusher module 180 to reset the protruding wafer 230.
[0029] Figure 6 and Figure 7 respectively show the bottom views of the partial structures of the lid opening device. It should be noted here that Figure 6 and Figure 7 show the partial schematic diagrams of the lid opening device 100 of this embodiment when detecting wafers 230, 230A of different sizes. Among them, the wafer 230 is, for example, a 6-inch wafer, and the wafer 230A is, for example, an 8-inch wafer.
[0030] Please also refer to Figure 3 , Figure 6 and Figure 7, in this embodiment, when the moving base 160 moves in the positive Z-axis direction, the wafer 230 in the accommodation cassette 220 will first pass through the sensing area of the first sensor SN1, that is, the position where the sensing beam L1 is located. Since the beam L1 generated by the light-emitting / sensing unit SN11 of the first sensor SN1 is parallel to the wafer 230 (that is, the sensing beam L1 is substantially parallel to the X-Y plane) and passes through the center of the wafer cassette 200 (it can also be regarded as the sensing beam L1 passing through the center of the wafer 230). Therefore, when the accommodation cassette 220 and the wafer 230 therein rise along the Z-axis with the door cover 240 and the moving base 160, it means that the wafer 230 will pass through the sensing beam L1, and the control module CM can check whether the wafers 230 in the accommodation cassette 220 exist (in position) one by one through the first sensor SN1.
[0031] Next, the wafer 230 will pass through the plane where the second sensor SN2, the third sensor SN3 and the push rod 181 are simultaneously arranged. As Figure 6 shown, although the sensing beam L2 generated by the second sensor SN2 is parallel to the wafer 230, and the sensing beam L3 generated by the third sensor SN3 is also parallel to the wafer 230, and the sensing beam L2 of the second sensor SN2 is parallel to the sensing beam L3 of the third sensor SN3 (both are parallel to the X-axis). However, the relative distance d1 between the sensing area (the area where the sensing beam L2 passes) of the second sensor SN2 and the center of the wafer cassette 200 is greater than the relative distance d2 between the sensing area (the area where the sensing beam L3 passes) of the third sensor SN3 and the center of the wafer cassette 200. Therefore, when the wafer 230 is a 6-inch wafer as described above, only the sensing beam L3 will pass through the edge of the wafer 230. In other words, at this time, no wafer 230 passes through the sensing beam L2 of the second sensor SN2, so the second sensor SN2 does not provide a sensing function temporarily.
[0032] Furthermore, as Figure 6 shown, the wafer 230 is shown in three different line types to represent its position. The wafer 230 shown by the dashed line represents that it is in a protruding position. Therefore, when the third sensor SN3 senses the wafer 230 shown by the dashed line, the control module CM will further drive the push rod 181 to push the wafer 230 back to the position shown by the dotted chain line, otherwise not. Here, the wafer 230 shown by the solid line represents its ideal position in the accommodation cassette 220, that is, through parameter setting, the push rod 181 can be set to push the protruding wafer 230 to the ideal position.
[0033] Next, please refer to Figure 7, similarly, the lid opening device 100 also first senses the wafer 230A in the accommodation cassette 220 with the first sensor SN1 to confirm whether the wafer 230A exists. Then, since the shown wafer 230A is an 8-inch wafer, at this time, the second sensor SN2 is used as the sensing tool to detect whether there is a protruding situation of the wafer 230A, and accordingly drive the push rod 181 to reset the protruding wafer 230A. Figure 7 And Figure 6 The wafer 230A is also shown in three different line types to represent its location, so it will not be elaborated here.
[0034] From Figure 6 And Figure 7 It can be seen that the lid opening device 100 of this embodiment can detect wafers 230, 230A of different sizes through the settings of the second sensor SN2 and the third sensor SN3, so as to achieve the purpose of sharing.
[0035] To sum up, in the above embodiments of the present invention, the lid opening device is provided with a first sensor, a second sensor and a third sensor at relevant positions on the main frame, and when the wafer is lifted and lowered with the door cover and the moving seat, it respectively passes through the sensing areas of the above sensors. Among them, first, it is known whether the wafer is in place through the first sensor whose sensing area can pass through the center of the wafer. Then, when the moving seat rises or the lid is closed, the second sensor or the third sensor is used to sense the edge of the wafer to confirm whether the wafer protrudes. At the same time, the control module also drives the push rod to reset the protruding wafer.
[0036] Accordingly, the control module can detect the protrusion of the wafer in the wafer cassette and push the wafer to reset through the above, so that after the wafer in the wafer cassette is processed by the lid opening device, it can effectively confirm that the wafer cassette and the wafers therein are all in the correct positions, so as to prevent the wafer from interfering with the outer shell due to the protruding piece and causing the wafer to break when the lid is closed and raised.
[0037] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.
Claims
1. A wafer box cover opening device, characterized in that: include: A main frame having a top frame; A lifting module is arranged on the main frame; A movable seat is movably assembled to the main frame and connected to the lifting module, and the lifting module drives the movable seat to rise and fall in the main frame to move to or away from the top frame; An opening module is arranged on the moving seat to unlock the outer shell and the door cover of the wafer box. After the door cover is unlocked, it rises and falls with the moving seat, and the outer shell is supported on the top frame after being unlocked; The first sensor, the second sensor and the third sensor are respectively arranged below the top frame. The wafer box contains at least one wafer. After unlocking, the wafer moves up and down along with the door cover and the moving seat. The moving path of the wafer passes through the sensing area of the first sensor. The moving path of the wafer passes through the sensing area of the second sensor or the sensing area of the third sensor. A film pushing module is arranged below the top frame; as well as The control module is electrically connected to the first sensor, the second sensor, the third sensor, the lifting module, the cover opening module and the sheet pushing module.
2. The wafer box cover opening device according to claim 1, characterized in that: The first sensor is a photoelectric sensor, and the generated sensing light beam is parallel to the wafer and passes through the center of the wafer box.
3. The wafer box cover opening device according to claim 1, characterized in that: The second sensor is a fiber optic sensor, and the sensing light beam generated by the second sensor is parallel to the wafer and passes through the edge of the wafer.
4. The wafer box cover opening device according to claim 1, characterized in that: The third sensor is a fiber optic sensor, and the sensing light beam generated by the third sensor is parallel to the wafer and passes through the edge of the wafer.
5. The wafer box cover opening device according to claim 1, characterized in that: The second sensor and the third sensor are optical fiber sensors respectively, and the relative distance between the sensing area of the second sensor and the center of the wafer box is greater than the relative distance between the sensing area of the third sensor and the center of the wafer box.
6. The wafer box cover opening device according to claim 1, characterized in that: The second sensor and the third sensor are optical fiber sensors respectively, and a sensing light beam of the second sensor is parallel to a sensing light beam of the third sensor.
7. The wafer box cover opening device according to claim 1, characterized in that: The first sensor is a laser retro-reflective sensor.
8. The wafer box cover opening device according to claim 1, characterized in that: The second sensor and the third sensor are optical fiber contrast type sensors respectively.
9. The wafer box cover opening device according to claim 1, characterized in that: The film pushing module includes a motor and a push rod. The push rod is rotatably arranged on the lower surface of the top frame and connected to the motor.
10. The wafer box cover opening device according to claim 9, characterized in that: The sensing area of the first sensor, the sensing area of the second sensor and the sensing area of the third sensor are located below the push rod.