Wafer warping prevention processing transfer device

Abstract

The utility model belongs to the technical field of wafer processing and transferring devices, and particularly relates to a wafer warping prevention processing and transferring device which comprises a supporting seat, the inner end of the supporting seat is provided with a first vacuum chuck, and the periphery of the first vacuum chuck is detachably connected with a first elastic ring; the push-pull rod enables the first vacuum chuck to be close to or far away from the second vacuum chuck, so that the effect that the first vacuum chuck grabs and places the wafer is achieved, and the effect that the second vacuum chuck attracts and firmly clamps the wafer is achieved; the transfer frame achieves the effect of transferring the wafer from one second vacuum chuck to the other second vacuum chuck, can stably clamp the wafer, can transfer the wafer, effectively prevents the wafer from warping in the clamping and transferring process, provides convenient conditions for the wafer machining process, and improves the machining efficiency. Therefore, the wafer can be conveniently transferred from the previous process to the next process for processing, and the problem that the clamped wafer is warped by the existing wafer processing and transferring device is solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing transfer devices, and particularly relates to a warping-preventing processing transfer device for wafers. Background Art

[0002] A wafer refers to a silicon wafer used for fabricating silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystalline silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer. The domestic wafer production lines are mainly 8 inches and 12 inches. When processing wafers, it is necessary to move a wafer from one place to another, and a transfer device is required to move the wafer for subsequent processing from the previous process to the next process.

[0003] Before processing the wafer, the traditional method is to use a fixture to fix the wafer. The position where the fixture holds the wafer will apply force to the wafer. Due to uneven force on the wafer, when the fixture adsorbs on the surface of the wafer, the wafer will be squeezed and knocked by the fixture, resulting in deformation. The clamped part of the wafer will warp. Then, after processing is completed, another fixture is required to remove the wafer from the original fixture. The wafer is subject to secondary clamping, and the force application situation during the secondary clamping process is the same as that during the original clamping in sequence, causing the wafer to be damaged again and reducing the yield rate of the wafer. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art and solve the problem that the existing wafer processing transfer device will cause warping of the clamped wafer.

[0005] The technical solution adopted by the utility model to solve its technical problem is: a warping-preventing processing transfer device for wafers, including a support base: first vacuum suckers are arranged at the inner ends of the support base, a first elastic ring is detachably connected around the first vacuum suckers, a second vacuum sucker is arranged below the first vacuum suckers, a second elastic ring is detachably connected around the second vacuum suckers, and at least three elastic support brackets distributed in a surrounding manner are fixed at the lower end of the second vacuum sucker;

[0006] A pair of support bases are provided and are symmetrically distributed left and right. A pair of first guide rails distributed front and back are arranged between the support bases. A transfer frame is slidably connected to the inner sides between the front and rear first guide rails. A third elastic ring is detachably connected to the upper end of the periphery of the transfer frame, and a support ring is fixed to the inner wall of the transfer frame.

[0007] In a preferred technical solution of the present utility model, at least three springs are fixed to the lower end of the elastic support tray. A support block is fixed to the lower ends among multiple springs on the same side. At least three grooves matching the outer shape of the elastic support tray are formed in the upper ends of the support blocks.

[0008] In a preferred technical solution of the present utility model, a support column is inserted between the upper end of the support block and the lower end of the adjacent second vacuum suction cup. Reinforcement columns are fixed to the lower ends of the support trays. The reinforcement columns are arranged around the periphery of the adjacent support columns.

[0009] In a preferred technical solution of the present utility model, a base is fixed between the support column and the reinforcement column.

[0010] In a preferred technical solution of the present utility model, connecting bars are fixed to both the left and right ends between the front and rear first guide rails. The inner ends are all slidably connected to the second guide rails fixed to the outer ends of the adjacent support seats. Hydraulic push rods are installed between the first guide rails and the lower ends of the adjacent support seats.

[0011] In a preferred technical solution of the present utility model, sensors are fixed to both the front and rear sides of the upper end of the transfer frame. Electric wheels are installed at the four corners of the transfer frame and are rollingly connected to the inner ends of the adjacent first guide rails.

[0012] In a preferred technical solution of the present utility model, push-pull rods are fixed to the upper ends of the first vacuum suction cups. The middle parts of the push-pull rods are all slidably connected to the reference blocks fixed to the inner ends of the support seats. The upper ends of the push-pull rods are all drivingly connected to the linear motors installed at the upper ends of the adjacent support seats.

[0013] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0014] The linear motor drives the push-pull rod to move up and down back and forth along the adjacent reference block. The reference block takes the support seat as the guiding stress point to bear the acting force of the push-pull rod sliding up and down back and forth. The push-pull rod makes the first vacuum suction cup approach or move away from the second vacuum suction cup, achieving the effect of the first vacuum suction cup grasping and placing the wafer, and achieving the effect of the second vacuum suction cup firmly attracting and clamping the wafer. The electric wheels facilitate the transfer frame to slide left and right back and forth between the front and rear first guide rails. The transfer frame realizes the effect of transferring the wafer from one second vacuum suction cup to another second vacuum suction cup. It can not only firmly clamp the wafer but also transfer the wafer, effectively preventing the wafer from warping during the clamping and transfer processes, providing convenient conditions for the wafer processing process, and facilitating the transfer of the wafer from the previous process to the next process for processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 Alignment effect diagram of the transfer frame and the second vacuum suction cup of the present utility model;

[0017] Figure 3 Bottom view effect diagram of the overall structure of the present utility model;

[0018] Figure 4 Surrounding effect diagram of the elastic support bracket of the present utility model.

[0019] In the figure: 1, support base; 2, reference block; 3, first vacuum suction cup; 4, first elastic ring; 5, push rod; 6, linear motor; 7, second vacuum suction cup; 8, second elastic ring; 9, transfer frame; 10, third elastic ring; 11, support ring; 12, sensor; 13, first guide rail; 14, connecting bar; 15, second guide rail; 16, hydraulic push rod; 17, electric wheel; 18, elastic support bracket; 19, support block; 20, support column; 21, reinforcement column; 22, spring; 23, groove; 24, base. Specific implementation manner

[0020] Example 1, please refer to Figures 1-4 , the present utility model provides a technical solution: a transfer device for preventing wafer warping during processing, including a support base 1: first vacuum suction cups 3 are arranged at the inner ends of the support base 1, a first elastic ring 4 is detachably connected around the first vacuum suction cup 3, a second vacuum suction cup 7 is arranged below the first vacuum suction cup 3, a second elastic ring 8 is detachably connected around the second vacuum suction cup 7, and at least three elastic support brackets 18 distributed in a surrounding manner are fixed at the lower end of the second vacuum suction cup 7; a pair of support bases 1 are arranged and distributed symmetrically left and right, a pair of first guide rails 13 distributed front and back are arranged between the support bases 1, a transfer frame 9 is slidably connected to the inner side between the front and rear first guide rails 13, a third elastic ring 10 is detachably connected to the upper end of the periphery of the transfer frame 9, and a support ring 11 is fixed to the inner wall of the transfer frame 9; the first vacuum suction cup 3 and the second vacuum suction cup 7 are externally connected to a vacuum pump through a pipeline to generate suction force. Starting the vacuum pump can generate vacuum suction force on the first vacuum suction cup 3 and the second vacuum suction cup 7, and closing the vacuum pump can cause the first vacuum suction cup 3 and the second vacuum suction cup 7 to lose vacuum suction force. Place the wafer on the upper end of the support ring 11 and embed it into the inner wall of the third elastic ring 10 so that the wafer is stably placed in the transfer frame 9. The third elastic ring 10 forms a surrounding and limiting structure around the wafer. The periphery of the wafer squeezes the inner wall of the third elastic ring 10, and the third elastic ring 10 undergoes elastic deformation under the extrusion of the periphery of the wafer. After the third elastic ring 10 undergoes elastic deformation, it will form a reaction force of elastic rebound on the periphery of the wafer, so that the third elastic ring 10 tightly wraps around the periphery of the wafer. The third elastic ring 10 plays a buffering role for the wafer placed in the transfer frame 9, and the wafer is stably placed in the transfer frame 9.

[0021] Embodiment 2, further illustrated according to the above embodiment: Push rods 5 are fixedly installed at the upper ends of the first vacuum suction cups 3. Reference blocks 2 fixed to the inner ends of the support seats 1 are slidably connected to the middle portions of the push rods 5. Linear motors 6 installed at the upper ends of the adjacent support seats 1 are drivingly connected to the upper ends of the push rods 5. The upper ends of the push rods 5 are connected to the movers inside the linear motors 6. Starting the linear motors 6 causes the movers to move up and down along the stators. The linear motors 6 drive the push rods 5 to move back and forth up and down along the adjacent reference blocks 2. The reference blocks 2 use the support seats 1 as the guiding force application points to bear the acting force of the push rods 5 sliding back and forth up and down. The reference blocks 2 play a guiding role for the adjacent push rods 5. When the push rods 5 move up and down, they remain on the same vertical line. The reference blocks 2 keep the push rods 5 moving smoothly back and forth up and down. The first vacuum suction cups 3 move back and forth up and down as the push rods 5 move back and forth up and down. The push rods 5 move the first vacuum suction cups 3 closer to or farther away from the second vacuum suction cups 7.

[0022] Embodiment 3, further illustrated according to the above embodiment: Electric wheels 17 that are rotatably connected to the inner ends of the adjacent first guide rails 13 are installed at the four corners of the transfer frame 9. Electric motors are installed at the shaft ends of the electric wheels 17 to provide rotational driving force for the electric wheels 17. The electric wheels 17 are driven by electricity. The electric wheels 17 rotate along the inner ends of the first guide rails 13, causing the electric wheels 17 to drive the transfer frame 9 to move back and forth left and right between the front and rear two first guide rails 13. The transfer frame 9 moves back and forth left and right between the two second suction cups on the left and right.

[0023] Embodiment 4, further illustrated according to the above embodiments: Connecting bars 14 are fixed at both the left and right ends between the front and rear first guide rails 13. The inner ends are slidably connected to the second guide rails 15 fixed to the outer ends of the adjacent support seats 1. The connecting bars 14 connect the front and rear first guide rails 13 into one body. The connecting bars 14 form a rectangle with the first guide rails 13 to surround and enclose the two support seats 1. The distance between the front and rear first guide rails 13 is equal to the diameter between the front and rear ends of the transfer frame 9. The front and rear ends of the transfer frame 9 are respectively in contact with the inner ends of the adjacent first guide rails 13. Hydraulic push rods 16 are installed between the first guide rails 13 and the lower ends of the adjacent support seats 1. At the same time, the four hydraulic push rods 16 drive the left and right ends of the two first guide rails 13 to move up and down. The inner ends of the connecting bars 14 slide up and down along the outer surfaces of the adjacent second guide rails 15. The second guide rails 15 keep the connecting bars 14 in a smooth moving state during the up and down movement. The hydraulic push rods 16 change the heights of the first guide rails 13 and the connecting bars 14. The front and rear first guide rails 13 drive the transfer frame 9 to move up and down to adjust the height of the transfer frame 9. The transfer frame 9 moves up and down between the two second suction cups. The transfer frame 9 approaches or moves away from between the left and right first vacuum suction cups 3. The electric wheels 17 facilitate the transfer frame 9 to slide left and right along between the front and rear first guide rails 13, so as to lift the transfer frame 9 to the horizontal line position between the first vacuum suction cup 3 and the second vacuum suction cup 7.

[0024] Embodiment 5, further described according to the above embodiments: The electric wheel 17 moves the transfer frame 9 to any one of the left and right sides of the device, and the transfer frame 9 loads the wafer between the first vacuum chuck 3 and the second vacuum chuck 7 at this position. Sensors 12 are fixed on both the front and rear sides of the upper end of the transfer frame 9. The sensors 12 rely on laser ranging technology to sense whether the transfer frame 9 has moved to the corresponding position. After the transfer frame 9 moves to the corresponding position, the sensors 12 start the linear motor 6 on this side to drive the push-pull rod 5 to move downward. The push-pull rod 5 drives the first vacuum chuck 3 to move downward. The first vacuum chuck 3 approaches the upper surface of the wafer loaded on the transfer tray. The first elastic ring 4 forms a surrounding and airtight annular sealing area around the first vacuum chuck 3. The first elastic ring 4 prevents air from entering the first vacuum chuck 3 from around it. The first elastic ring 4 ensures that there is sufficient negative pressure inside the first vacuum chuck 3 to form a suction force for attracting the wafer. The wafer is sucked by the first vacuum chuck 3. The linear motor 6 pulls up the push-pull rod 5 to move the first vacuum chuck 3 upward. The first vacuum chuck 3 takes out the wafer from inside the transfer frame 9. The electric wheel 17 drives the transfer tray to move to the middle position between the front and rear first guide rails 13. The transfer tray is located below the two first vacuum chucks 3 and above the two second vacuum chucks 7. The transfer frame 9 is offset from the first vacuum chuck 3 and the second vacuum chuck 7, and the first vacuum chuck 3 and the second vacuum chuck 7 on the same side are aligned. The linear motor 6 drives the push-pull rod 5 to move downward. The push-pull rod 5 drives the first vacuum chuck 3 to move downward to the upper end of the adjacent second vacuum chuck 7 below it. The first vacuum chuck 3 releases the wafer. Correspondingly, the push-pull rod 5 drives the first vacuum chuck 3 to move upward and separate from the wafer. The second elastic ring 8 around the second vacuum chuck 7 around the wafer is elastically deformed by the extrusion of the wafer. The second elastic ring 8 generates a rebounding force to fully contact the surface of the wafer. The second elastic ring 8 forms a surrounding and airtight annular sealing area around the second vacuum chuck 7. The second elastic ring 8 prevents air from entering the second vacuum chuck 7 along the periphery of the second vacuum chuck 7. The second elastic ring 8 allows sufficient negative pressure to be formed inside the second vacuum chuck 7 to form a suction force for attracting the wafer, achieving the effect of firmly clamping the wafer by the second vacuum chuck 7, achieving the effect of grasping and placing the wafer by the first vacuum chuck 3, and achieving the effect of transferring the wafer from one second vacuum chuck 7 to another second vacuum chuck 7 by the transfer frame 9.

[0025] Embodiment Six, further described according to the above embodiments: In the later stage, the wafer clamped by the second vacuum chuck 7 can be processed. After the wafer processing is completed, the corresponding push rod 5 needs to move the corresponding first vacuum chuck 3 downward onto the wafer again. The first vacuum chuck 3 sucks the wafer, and the corresponding push rod 5 lifts the first vacuum chuck 3 and the wafer, so that the wafer is separated from the second vacuum chuck 7 below it. The electric wheel 17 moves the transfer frame 9 again to the position below the wafer clamped by the first vacuum chuck 3, and drives the transfer frame 9 to be located above the corresponding second vacuum chuck 7 below the wafer. The push rod 5 moves downward to make the first vacuum chuck 3 move the wafer downward and place it inside the transfer frame 9, so that the wafer is placed inside the third elastic ring 10 and on the support ring 11. The support ring 11 holds the wafer in the transfer frame 9, and the third elastic ring 10 forms a surrounding annular sealing area around the wafer. The third elastic ring 10 restricts the wafer from separating from the transfer frame 9. The first vacuum chuck 3 on the other side moves away from the second vacuum chuck 7 (the movement process is the same as the above process). The electric wheel 17 drives the transfer frame 9 to move along the gap between two adjacent front and rear first guide rails 13 to the gap between the first vacuum chuck 3 and the second vacuum chuck 7 on the other side of the device, so that the wafer is moved to the other side of the device for loading. The working principles of the first vacuum chuck 3 and the second vacuum chuck 7 on the other side are the same as those described in the above steps. Since the first elastic ring 4, the second elastic ring 8, and the third elastic ring 10 have an elastic buffering effect on the wafer, the surface of the wafer will not be damaged by bumps and warped or deformed.

[0026] Embodiment Seven. Further illustration based on the above embodiments: At least three springs 22 are fixed to the lower end of the elastic support tray 18. A support block 19 is fixed to the lower ends between multiple springs 22 on the same side. At least three grooves 23 matching the shape of the elastic support tray 18 are formed in the upper ends of the support blocks 19. The elastic support tray 18 distributed in a surrounding manner provides stable support for the wafer. When the wafer is placed on the second vacuum chuck 7, the gravity is respectively transmitted to multiple elastic support trays 18. The multiple elastic support trays 18 disperse the gravity of the wafer. The elastic support tray 18 decomposes the gravity of the wafer. When the elastic support tray 18 undergoes elastic deformation, a restoring force will be generated. The elastic support tray 18 plays a buffering role for the second vacuum chuck 7. The gravity borne by each elastic support tray 18 is transmitted to the surface of the corresponding spring 22. The spring 22 can buffer the impact force received by the wafer. When the spring 22 is stressed, a restoring elastic force will be generated to support the corresponding elastic support tray 18 upward. The groove 23 provides a moving space for the elastic support tray 18. The elastic support tray 18 slides along the corresponding groove 23. The elastic support tray 18 reduces the shaking of the wafer in the vertical direction. The groove 23 on the support block 19 matches the shape of the elastic support tray 18. A support column 20 is interspersed between the upper end of the support block 19 and the lower end of the adjacent second vacuum chuck 7. Reinforcing columns 21 are fixed to the lower ends of the support trays. The reinforcing columns 21 are arranged around the adjacent support columns 20. The reinforcing columns 21 arranged around the support columns 20 enhance the stability of the support block 19. A base 24 is fixed between the support column 20 and the reinforcing column 21. The base 24 keeps the support column 20 and the reinforcing column 21 separated and limits them. The base 24 further improves the firmness of the entire device and makes the placement of the wafer more stable.

[0027] Embodiment Eight. It can be known from the above step analysis that the device can not only firmly clamp the wafer but also transfer the wafer, effectively preventing the wafer from warping during the clamping and transfer processes, providing convenient conditions for the wafer processing process, facilitating the transfer of the wafer from the previous process to the next process for processing, and facilitating the transfer operation of the wafer. This design enhances the operation flexibility of the device, making the positioning and movement of the wafer more accurate, thereby improving the processing efficiency.

Claims

1. A wafer warping prevention processing and loading device, comprising a support seat (1), characterized in that: The inner end of each support seat (1) is provided with a first vacuum suction cup (3), a first elastic ring (4) is detachably connected to the periphery of the first vacuum suction cup (3), a second vacuum suction cup (7) is provided below the first vacuum suction cup (3), a second elastic ring (8) is detachably connected to the periphery of the second vacuum suction cup (7), and at least three elastic support brackets (18) distributed in a surrounding manner are fixed to the lower end of the second vacuum suction cup (7); The support seat (1) is provided with a pair of first guide rails (13) which are symmetrically distributed in the left and right directions. A pair of first guide rails (13) which are distributed in the front and rear directions are provided between the support seats (1). A transfer frame (9) is slidably connected inside the two first guide rails (13) in the front and rear directions. The upper end of the outer periphery of the transfer frame (9) is detachably connected to a third elastic ring (10). A support ring (11) is fixed to the inner wall of the transfer frame (9).

2. The wafer warping prevention processing and loading device according to claim 1, characterized in that: At least three springs (22) are fixed at the lower end of the elastic support bracket (18), a support block (19) is fixed at the lower end between the multiple springs (22) on the same side, and at least three grooves (23) matching the shape of the elastic support bracket (18) are formed at the upper end of each support block (19).

3. The wafer warping prevention processing and loading device according to claim 2, characterized in that: A support column (20) is interspersed between the upper end of the support block (19) and the lower end of the adjacent second vacuum suction cup (7), and a reinforcement column (21) is fixed to the lower end of each support bracket, and the reinforcement column (21) is arranged around the periphery of the adjacent support column (20).

4. The wafer warpage prevention processing and loading device according to claim 3, characterized in that: A base (24) is fixed between the support column (20) and the reinforcement column (21).

5. The wafer warpage prevention processing and loading device according to claim 1, characterized in that: Connecting bars (14) are fixed at both left and right ends between the two front and rear first guide rails (13), the inner ends are slidably connected to second guide rails (15) fixed at the outer ends of the adjacent support seats (1), and hydraulic push rods (16) are installed between the first guide rails (13) and the lower ends of the adjacent support seats (1).

6. The wafer warpage prevention processing and transfer device according to claim 1, characterized in that: Sensors (12) are fixed on both the front and rear sides of the upper end of the transfer frame (9), and electric wheels (17) are installed at the four corners of the transfer frame (9) and are rollingly connected to the inner ends of the adjacent first guide rails (13).

7. The wafer warpage prevention processing and loading device according to claim 1, characterized in that: A push-pull rod (5) is fixed to the upper end of the first vacuum suction cup (3), the middle end of the push-pull rod (5) is slidably connected to a reference block (2) fixed to the inner end of the support seat (1), and the upper end of the push-pull rod (5) is transmission-connected to a linear motor (6) installed at the upper end of an adjacent support seat (1).

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