Chip vertical immersion device

Abstract

The utility model relates to the technical field of chip manufacturing, in particular to a chip vertical immersion device which comprises a frame body, a sliding groove is formed in the inner wall of the frame body, a sliding block is connected to the surface of the sliding groove in a sliding mode, a limiting frame is fixedly connected to the side surface of the sliding block, a baffle is installed on the inner wall of the limiting frame, and an installation groove is formed in the side face of the limiting frame. A telescopic column is fixedly connected to the inner bottom wall of the mounting groove, a spring is arranged on the surface of the telescopic column, a limiting rod is fixedly connected to the upper surface of the telescopic column, and a clamping block is fixedly connected to the side face of the limiting rod. According to the chip vertical immersion device, through mutual cooperation of the limiting frame and the baffle, a plurality of wafers can be fixed, cleaning in pure water is facilitated, through cooperation of the limiting rods and the clamping blocks, one sides of the wafers can be limited, it is guaranteed that the stability of the wafers is improved when the wafers are cleaned, and the structure can place the plurality of wafers for cleaning, so that the wafer cleaning efficiency is improved. The working efficiency is improved, and damage caused by waggling of the wafer is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a chip vertical immersion device. Background Technique

[0002] Integrated circuit, abbreviated as IC; or microcircuit, microchip, wafer, and chip in electronics is a way to miniaturize a circuit (mainly including semiconductor devices, also including passive components, etc.), and is often manufactured on the surface of a semiconductor wafer. In the prior art, when manufacturing a chip, it is necessary to clean the wafer to ensure that there are no organic and inorganic substances on the surface.

[0003] In the existing chip vertical immersion device, the function of clamping and limiting the wafer is weak. When in use, the wafer plays an important role in the environment of manufacturing the chip, and it is necessary to use pure water to clean the wafer. In the prior art, when cleaning the wafer, the wafer is placed by relying on the slotted setting. Usually, there is a certain width between the slots to facilitate the placement of the wafer, which is likely to cause unstable installation of the wafer and is easily shaken by the pure water during cleaning, resulting in left and right swinging and unstable fixation. If the slots are close to each other, it is likely to cause the situation that the wafer cannot be taken out. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a chip vertical immersion device to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A chip vertical immersion device includes a frame body. A chute is opened on the inner wall of the frame body. A slider is slidably connected to the surface of the chute. A limiting frame is fixedly connected to the side surface of the slider. A baffle is installed on the inner wall of the limiting frame. An installation groove is opened on the side surface of the limiting frame. A telescopic column is fixedly connected to the inner bottom wall of the installation groove. A spring is arranged on the surface of the telescopic column. A limiting rod is fixedly connected to the upper surface of the telescopic column. A clamping block is fixedly connected to the side surface of the limiting rod.

[0006] Optionally, a pump is fixedly connected to the side surface of the frame body. A transmission pipe is arranged at the output end of the pump. By connecting the pump to an external power source, the pure water in the frame body can be sucked into the transmission pipe, which is convenient for sucking and pumping the pure water back and forth, so that the flowing pure water can enhance the flushing effect.

[0007] Optionally, the baffles are symmetrically distributed on the inner wall of the limiting frame.

[0008] Optionally, the clamping blocks are arranged at equal intervals on the side surface of the limiting rod.

[0009] Optionally, a fixing block is fixedly connected to the side of the frame body. A threaded rod is rotatably connected to the inner bottom wall of the fixing block. An installation plate is arranged on the surface of the threaded rod. A limiting post is slidably connected to the side of the installation plate. A connecting block is fixedly connected to the bottom end of the limiting post. The top end of the threaded rod is equipped with a motor. The threaded rod is fixed by the fixing block, and the threaded rod is connected to the motor. The motor can drive the threaded rod to rotate and drive the installation plate to move up and down for vertical immersion. The connecting block fixes the limiting post. When the installation plate moves up and down, the limiting post is used to limit the up and down movement of the installation plate.

[0010] Optionally, the limiting frame is located directly above the frame body.

[0011] Optionally, a water outlet pipe is fixedly connected to the side of the frame body where it is located at the pump. A lid is arranged on the surface of the water outlet pipe. Hold the lid and take it out. The pure water inside the frame body can be discharged from the water outlet pipe after cleaning the wafer, which is convenient for replacing the pure water again. Placing the lid on the surface of the water outlet pipe can seal the pure water inside to prevent it from flowing out.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. Through the mutual cooperation of the limiting frame and the baffle, multiple wafers can be fixed, which is convenient for cleaning in pure water. Then, through the cooperation of the limiting rod and the clamping block, one side of the wafer can be limited, ensuring the stability of the wafer during cleaning. Moreover, this structure can place multiple wafers for cleaning, improving the working efficiency and reducing the damage caused by the shaking of the wafer.

[0014] 2. By adjusting the limiting frame up and down, it is convenient to clean and take out the wafer, without the need for staff to manually contact the pure water, thus avoiding the situation of pure water pollution. Moreover, this structure moves relatively stably when moving up and down, ensuring the stable transmission and vertical movement of the wafer up and down. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the overall external view schematic diagram of the present utility model;

[0016] Figure 2 is the schematic diagram of the disassembled limiting frame of the present utility model;

[0017] Figure 3 is the schematic diagram of the disassembled threaded rod of the present utility model;

[0018] Figure 4 is the enlarged schematic diagram of the details at A of the present utility model.

[0019] In the figure: 1. Frame body; 2. Slide groove; 3. Slide block; 4. Limit frame; 5. Baffle plate; 6. Telescopic column; 7. Spring; 8. Limit rod; 9. Clamping block; 10. Pump; 11. Transmission pipe; 12. Fixed block; 13. Threaded rod; 14. Motor; 15. Mounting plate; 16. Limit column; 17. Connecting block; 18. Outlet pipe; 19. Lid. Detailed implementation mode

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] Embodiment 1

[0022] Please refer to Figure 1 As shown, a technical solution provided by the present invention: a chip vertical immersion device includes a frame body 1, a pump 10 is fixedly connected to the side surface of the frame body 1, and a transmission pipe 11 is arranged at the output end of the pump 10. By connecting the pump 10 to an external power source, pure water in the frame body 1 can be sucked into the transmission pipe 11, which is convenient for sucking and pumping pure water back and forth, and the flowing of pure water can enhance the flushing effect;

[0023] Please refer to Figure 1 、 Figure 2 and Figure 4 As shown, a slide groove 2 is opened on the inner wall of the frame body 1, a slide block 3 is slidably connected to the surface of the slide groove 2, a limit frame 4 is fixedly connected to the side surface of the slide block 3. The slide block 3 is connected to the slide groove 2. When the limit frame 4 moves up and down, the slide block 3 can stably limit the limit frame 4 from shaking, avoiding damage caused by the shaking of the wafer. A baffle plate 5 is installed on the inner wall of the limit frame 4. The baffle plate 5 is used to separate multiple wafers, and multiple wafers can be immersed and cleaned simultaneously. An installation groove is opened on the side surface of the limit frame 4, a telescopic column 6 is fixedly connected to the bottom wall of the installation groove, a spring 7 is arranged on the surface of the telescopic column 6, a limit rod 8 is fixedly connected to the upper surface of the telescopic column 6. Hold the limit rod 8 and press it downward, the limit rod 8 squeezes the spring 7, and the spring 7 drives the telescopic column 6 to contract, which is convenient for placing the wafer inside the baffle plate 5. The spring 7 has the function of rebounding and resetting. After manually releasing the limit rod 8, the spring 7 can push the telescopic column 6 to drive the limit rod 8 upward and limit the wafer. A clamping block 9 is fixedly connected to the side surface of the limit rod 8. The installation of the clamping block 9 can fix the wafer to prevent shaking.

[0024] Embodiment 2

[0025] Please refer to Figure 1As shown, a water outlet pipe 18 is fixedly connected to the side of the frame body 1 of the pump 10. A cover 19 is provided on the surface of the water outlet pipe 18. Hold the cover 19 and take it out. The pure water inside the frame body 1 can be discharged from the water outlet pipe 18 after cleaning the wafer, which is convenient for replacing the pure water again. Placing the cover 19 on the surface of the water outlet pipe 18 can seal the pure water inside to prevent it from flowing out.

[0026] Please refer to Figure 1 and Figure 3 As shown, a fixed block 12 is fixedly connected to the side of the frame body 1. A threaded rod 13 is rotatably connected to the inner bottom wall of the fixed block 12. An installation plate 15 is provided on the surface of the threaded rod 13. The threaded rod 13 is fixed by the fixed block 12. The threaded rod 13 is connected to a motor 14. The motor 14 can drive the threaded rod 13 to rotate and drive the installation plate 15 to move up and down for vertical immersion. A limiting column 16 is slidably connected to the side of the installation plate 15. The bottom end of the limiting column 16 is fixedly connected to a connecting block 17. The connecting block 17 fixes the limiting column 16. When the installation plate 15 moves up and down, the limiting column 16 is used to limit the up and down movement of the installation plate 15. The motor 14 is installed at the top end of the threaded rod 13.

[0027] Working principle: The motor 14 is externally powered to drive the threaded rod 13 to rotate. When the threaded rod 13 rotates, it drives the installation plate 15 on its surface to move up and down for vertical immersion. The fixed block 12 is used to limit the threaded rod 13. The limiting column 16 connected to the other side of the installation plate 15 is used to stabilize the installation plate 15 moving up and down. The connecting block 17 fixed to the limiting column 16 is used to fix the limiting column 16. At the same time, when the installation plate 15 moves vertically, it can drive the limiting frame 4 to move up and down. When the slider 3 connected to the limiting frame 4 moves vertically, it can move up and down in the chute 2 opened in the frame body 1, which is convenient to stabilize the limiting frame 4. Then, hold the limiting rod 8 and press it downwards. The limiting rod 8 squeezes the spring 7, and the spring 7 drives the telescopic column 6 to contract, which is convenient to place the wafer inside the baffle 5. The spring 7 has the function of rebounding and resetting. After manually releasing the limiting rod 8, the spring 7 pushes the telescopic column 6 to drive the limiting rod 8 upwards and limit the wafer. The multiple installations of the baffle 5 are convenient for cleaning multiple wafers at the same time. The clamping block 9 fixed to the limiting rod 8 can fix the wafer to prevent the wafer from shaking.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only the preferred examples of the present invention and do not limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip vertical immersion device, comprising a frame (1), characterized in that: The inner wall of the frame (1) is provided with a slide groove (2), the surface of the slide groove (2) is slidably connected with a slider (3), the side surface of the slider (3) is fixedly connected with a limit frame (4), the inner wall of the limit frame (4) is provided with a baffle (5), the side of the limit frame (4) is provided with a mounting groove, the bottom wall of the mounting groove is fixedly connected with a telescopic column (6), the surface of the telescopic column (6) is provided with a spring (7), the upper surface of the telescopic column (6) is fixedly connected with a limit rod (8), and the side of the limit rod (8) is fixedly connected with a clamping block (9).

2. A chip vertical immersion device according to claim 1, characterized in that: A pump (10) is fixedly connected to the side of the frame (1), and a transmission pipe (11) is provided at the output end of the pump (10).

3. The vertical chip immersion device according to claim 1, characterized in that: The baffles (5) are symmetrically distributed on the inner wall of the limiting frame (4).

4. The chip vertical immersion device according to claim 1, characterized in that: The clamping blocks (9) are arranged at equal distances on the side of the limiting rod (8).

5. The vertical chip immersion device according to claim 1, characterized in that: A fixing block (12) is fixedly connected to the side of the frame (1), a threaded rod (13) is rotatably connected to the inner bottom wall of the fixing block (12), a mounting plate (15) is provided on the surface of the threaded rod (13), a limiting column (16) is slidably connected to the side of the mounting plate (15), a connecting block (17) is fixedly connected to the bottom end of the limiting column (16), and a motor (14) is mounted on the top end of the threaded rod (13).

6. The chip vertical immersion device according to claim 1, characterized in that: The limiting frame (4) is located directly above the frame body (1).

7. The chip vertical immersion device according to claim 1, characterized in that: The frame (1) is located on the side of the pump (10) and is fixedly connected to a water outlet pipe (18), and a cover (19) is provided on the surface of the water outlet pipe (18).

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