MOS (Metal Oxide Semiconductor) tube radiating seat

Abstract

The utility model discloses an MOS (Metal Oxide Semiconductor) tube radiating seat, which comprises a radiating fin body, a bulge is integrally formed at one end of the front surface of the radiating fin body, and a C-shaped clamping groove for clamping an MOS tube is arranged at one end of the bulge; cooling fins are integrally formed on the back face of the cooling fin body. According to the utility model, the structure arrangement is reasonable, through the arrangement of the projections and the C-shaped clamping grooves, card insertion positioning of the MOS tube can be rapidly and effectively realized, dismounting operation of the MOS tube can be rapidly realized, the contact area with the MOS tube can be increased, the heat dissipation effectiveness and the heat dissipation efficiency can be improved, the service life of the MOS tube can be prolonged, and the service life of the MOS tube can be prolonged. And the applicability and the practicability are high.

Description

Technical Field

[0001] The utility model belongs to the technical field of MOS transistor installation, and particularly relates to a MOS transistor heat dissipation seat. Background Art

[0002] The MOS transistor is a common heat-generating electronic component. In order to improve the use stability and service life of the MOS transistor, a corresponding heat dissipation base is generally provided. The MOS transistor heat dissipation base in the prior art is connected to the MOS transistor by screws. Although it can meet the use requirements in general cases, it is not only inconvenient to disassemble and assemble, but also has a limited heat dissipation contact area, and is also prone to damage the MOS transistor. Therefore, its applicability and practicability are limited. Summary of the Utility Model

[0003] The purpose of the utility model is to provide a MOS transistor heat dissipation seat with reasonable structure and capable of quickly realizing the disassembly and assembly of the MOS transistor.

[0004] The technical solution for realizing the purpose of the utility model is a MOS transistor heat dissipation seat, including a heat dissipation fin body. One end of the front surface of the heat dissipation fin body is integrally formed with a protrusion, and a C-shaped card slot for clamping the MOS transistor is arranged at one end of the protrusion.

[0005] The back surface of the heat dissipation fin body is integrally formed with heat dissipation fins.

[0006] Further preferably: the heat dissipation fin body is a metal structure body.

[0007] Further preferably: the heat dissipation fin body is an aluminum structure body.

[0008] Further preferably: the height of the C-shaped card slot is matched with the thickness of the MOS transistor.

[0009] Further preferably: the length of the C-shaped card slot is greater than the length of the MOS transistor.

[0010] Further preferably: an insertion inclined guiding portion is arranged on the protrusion, and the insertion inclined guiding portion is located at the opening of the C-shaped card slot.

[0011] The utility model has positive effects: the structure of the utility model is reasonably arranged. By arranging the protrusion and the C-shaped card slot, the insertion and positioning of the MOS transistor can be quickly and effectively realized, the disassembly and assembly operation of the MOS transistor can be quickly realized, and at the same time, it is beneficial to increase the contact area with the MOS transistor, thereby being beneficial to improving the effectiveness and efficiency of heat dissipation, being beneficial to improving the service life of the MOS transistor, and having strong applicability and good practicability. Brief Description of the Drawings

[0012] In order to make the content of the present utility model easier to understand clearly, the following further describes the present utility model in detail according to specific embodiments in conjunction with the accompanying drawings, where:

[0013] Figure 1 is a schematic structural view of the present utility model;

[0014] Figure 2 is a schematic structural view of another perspective of the present utility model;

[0015] Figure 3 is a schematic structural view when the present utility model is combined with a MOS transistor.

[0016] Reference numerals: heat sink body 1, protrusion 2, C-shaped card slot 3, heat dissipation fins 4, insertion inclined guiding portion 5, MOS transistor 6. Specific embodiments

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0018] Embodiment

[0019] See Figures 1 to 3 As shown, a MOS transistor heat dissipation seat includes a heat sink body 1. One end of the front surface of the heat sink body is integrally formed with a protrusion 2, and one end of the protrusion is provided with a C-shaped card slot 3 for clamping the MOS transistor 6; the back surface of the heat sink body is integrally formed with heat dissipation fins 4. In this embodiment, the heat sink body is a metal structure. Specifically, in the actual application process, the heat sink body is an aluminum structure. The C-shaped card slot can improve the disassembly and assembly convenience of the MOS transistor, and is also beneficial to increasing the heat dissipation contact area of the MOS transistor, improving the heat dissipation effectiveness and heat dissipation stability.

[0020] In the actual application process, the height of the C-shaped card slot is matched with the thickness of the MOS transistor. The length of the C-shaped card slot is greater than the length of the MOS transistor. Through the above structure, the effectiveness and reliability of the installation can be ensured, and the situation of displacement or shaking can be prevented.

[0021] In this embodiment, an insertion inclined guiding portion 5 is provided on the protrusion, and the insertion inclined guiding portion is located at the opening of the C-shaped card slot. The insertion inclined guiding portion can guide during the insertion of the MOS transistor, improving the smoothness and effectiveness of the insertion.

[0022] The utility model has positive effects: the structure of the utility model is reasonably arranged. By providing protrusions and C-shaped card slots, the plug-in positioning of the MOS tube can be quickly and effectively achieved, the disassembly and assembly operations of the MOS tube can be quickly realized, and at the same time, it is beneficial to increase the contact area with the MOS tube, thereby being beneficial to improving the effectiveness and efficiency of heat dissipation, being beneficial to extending the service life of the MOS tube, and having strong applicability and good practicability.

[0023] The standard parts used in this embodiment can be directly purchased from the market. For the non-standard structural components described in the specification, they can also be directly processed without any doubt according to the existing technical knowledge. At the same time, the connection methods of each component adopt the mature conventional means in the existing technology, and the machines, parts and equipment all adopt the conventional models in the existing technology, so no specific description will be made here.

[0024] Obviously, the above-mentioned embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limiting the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or variations can be made on the basis of the above description. It is not necessary and impossible to enumerate all the implementation manners here. And these obvious changes or variations derived from the essential spirit of the present utility model still fall within the protection scope of the present utility model.

Claims

1. A MOS tube heat sink, comprising a heat sink body, characterized in that: A protrusion is integrally formed at one end of the front side of the heat sink body, and a C-shaped slot for inserting the MOS tube is provided at one end of the protrusion; The back side of the heat sink body is integrally formed with heat sink fins.

2. A MOS tube heat sink according to claim 1, characterized in that: The heat sink body is a metal structure.

3. A MOS tube heat sink according to claim 2, characterized in that: The heat sink body is an aluminum structure.

4. The MOS tube heat sink according to claim 1, characterized in that: The height of the C-shaped slot matches the thickness of the MOS tube.

5. The MOS tube heat sink according to claim 1, characterized in that: The length of the C-shaped slot is greater than the length of the MOS tube.

6. The MOS tube heat sink according to claim 1, characterized in that: The protrusion is provided with an inclined insertion guide portion, and the inclined insertion guide portion is located at the opening of the C-shaped slot.

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