Heat dissipation device and electronic equipment

Abstract

The utility model provides a heat dissipation device and electronic equipment. Relates to the technical field of heat dissipation. The heat dissipation device comprises a circuit board which is provided with a first surface and a second surface which are arranged in a back-to-back manner; the shell is provided with a containing space, the circuit board and the shell are connected and arranged in the containing space, the first face of the circuit board is arranged towards the shell to form the closed containing space used for containing components arranged on the first face, and the second face is arranged away from the shell.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular, to a heat dissipation device and an electronic device. Background Art

[0002] Currently, the usage environment of a server is very likely not in a professional computer room, and it may be in a dusty environment. This can cause the circuit board to be corroded by dust, resulting in malfunctions, especially easily occurring at the circuit board position of the fan assembly. The dust entering through the opening of the fan housing causes the circuit board to corrode.

[0003] Therefore, how to provide a structure to avoid the corrosion of the circuit board of the fan assembly has become an urgent problem to be solved. Summary of the Utility Model

[0004] The purpose of the embodiments of this application is to provide a heat dissipation device and an electronic device.

[0005] To solve the above technical problems, the embodiments of this application provide the following technical solutions:

[0006] The first aspect of this application provides a heat dissipation device, including:

[0007] A circuit board, which has a first surface and a second surface arranged opposite to each other;

[0008] A housing, which has an accommodation space. The circuit board is connected to the housing and arranged in the accommodation space. The first surface of the circuit board faces the housing to form a closed accommodation space for accommodating the components arranged on the first surface, and the second surface faces away from the housing.

[0009] In some modified embodiments of the first aspect of this application, a connection port is provided on the side wall of the housing located at the second surface, and the connection wire of the circuit board is used to pass through the connection port.

[0010] In some modified embodiments of the first aspect of this application, the circuit board is provided with a connection hole penetrating through the first surface and the second surface. The connection wire passes through the connection hole and is connected to the first surface of the circuit board, and the connection part of the connection wire and the circuit board is located in the closed accommodation space.

[0011] In some modified embodiments of the first aspect of this application, the connection wire is connected to the second surface of the circuit board, and the connection part of the connection wire and the circuit board is located at the second surface facing away from the housing to form an unclosed accommodation space.

[0012] In some modified embodiments of the first aspect of this application, it further includes:

[0013] A fan assembly, the fan assembly being disposed opposite to the second surface of the circuit board, the fan assembly including a driving device and a fan blade assembly, the fan blade assembly being disposed on the outer periphery of the driving device, the driving device being electrically connected to the circuit board to drive the fan blade assembly to rotate.

[0014] In some modified embodiments of the first aspect of the present application, it further includes:

[0015] An outer frame middle cylinder, the outer frame middle cylinder being fixedly connected to the housing;

[0016] Through holes adapted to the outer frame middle cylinder are provided on the first surface and the second surface of the circuit board, and the outer frame middle cylinder passes through the through holes to be connected to the fan assembly.

[0017] In some modified embodiments of the first aspect of the present application, the driving device includes a motor rotor and a motor stator, the motor stator is connected to the circuit board, the motor rotor is sleeved outside the motor stator, the fan blade assembly is disposed outside the motor rotor, and the motor stator drives the motor rotor to rotate to drive the fan blade assembly to rotate.

[0018] In some modified embodiments of the first aspect of the present application, the motor stator includes a stator middle cylinder and windings, the windings are fixedly disposed on the outer periphery of the stator middle cylinder, the stator middle cylinder is coaxially disposed with the outer frame middle cylinder, and the windings are electrically connected to the circuit board through a plurality of connection pins.

[0019] In some modified embodiments of the first aspect of the present application, a stepped structure is provided at a position of the outer frame middle cylinder corresponding to the circuit board, the stator middle cylinder is snapped into the space between the circuit board and the stepped structure, the stator middle cylinder has an opening, and the outer frame middle cylinder passes through the opening of the stator middle cylinder to be connected to the fan blade assembly.

[0020] The second aspect of the present application provides an electronic device, including:

[0021] A heat generating component and a heat dissipation device, the heat dissipation device being used for dissipating heat from the heat generating component;

[0022] The heat dissipation device includes:

[0023] A circuit board, the circuit board having a first surface and a second surface disposed opposite to each other;

[0024] A housing, the housing having an accommodation space, the circuit board being connected to the housing and disposed in the accommodation space, the first surface of the circuit board facing the housing to form a closed accommodation space for accommodating components disposed on the first surface, and the second surface facing away from the housing. Description of the Drawings

[0025] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present application will become readily understood. In the drawings, several embodiments of the present application are shown in an exemplary rather than restrictive manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0026] Figure 1 A schematic structural diagram of a heat dissipation device provided by the present application is schematically shown;

[0027] Figure 2 A side view of a heat dissipation device provided by the present application is schematically shown;

[0028] Figure 3 A cross-sectional view of a partial heat dissipation device provided by the present application is schematically shown;

[0029] Description of reference numerals in the drawings:

[0030] Heat dissipation device 1, circuit board 11, first surface 111, second surface 112, housing 12, connection port 121, fan assembly 13, driving device 131, motor rotor 1311, motor stator 1312, stator middle cylinder 1313, winding 1314, fan blade assembly 132, outer frame middle cylinder 14, stepped structure 141, connection line 2. Detailed implementation manners

[0031] The exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present application can be more thoroughly understood and the scope of the present application can be completely conveyed to those skilled in the art.

[0032] As Figure 1 shown, the present application provides a heat dissipation device 1, including:

[0033] A circuit board 11, the circuit board 11 having a first surface 111 and a second surface 112 arranged opposite to each other;

[0034] A housing 12, the housing 12 having an accommodation space, the circuit board 11 being connected to the housing 12 and arranged in the accommodation space, the first surface 111 of the circuit board 11 facing the housing 12 to form a closed accommodation space for accommodating the components arranged on the first surface 111, and the second surface 112 facing away from the housing 12.

[0035] A heat dissipation device 1 provided in an embodiment of the present application includes a circuit board 11 and a shell 12. The circuit board 11 has a first surface 111 and a second surface 112 arranged opposite to each other. The first surface 111 can be the first surface of the circuit board, and the second surface 112 can be the second surface of the circuit board. Components are arranged on the first surface. The shell 12 has a accommodating space. The circuit board 11 is arranged in the accommodating space of the shell 12, and the circuit board 11 is connected to the shell 12. The first surface 111 of the circuit board 11 is located in the sealed accommodating space formed by the circuit board 11 and the shell 12, and the second surface 112 of the circuit board 11 is arranged away from the unsealed accommodating space formed by the shell 12 and the circuit board 11. Therefore, the circuit board 11 has a first surface 111 of components, which is arranged in the sealed accommodating space, thereby reducing the entry of dust, avoiding corrosion of components on the first surface 111 of the circuit board 11 due to dust, reducing the possibility of failure of components on the first surface 111 of the circuit board 11, and extending the life of the circuit board 11 and the heat dissipation device 1 having the circuit board 11.

[0036] like Figure 1 As shown, in the embodiment of the present application, a connection port 121 is provided on the side wall of the housing 12 located on the second surface 112 , and the connection wire 2 of the circuit board 11 is used to pass through the connection port 121 .

[0037] In this embodiment, the circuit board 11 has a first surface 111 and a second surface 112, and the shell 12 has a side wall arranged opposite to the second surface 112 of the circuit board 11, that is, the side wall is located on the second surface 112 of the shell 12, and a connection port 121 is arranged on the side wall. The connection port 121 can be a groove opened in the side wall arranged opposite to the second surface 112 of the shell 12, or it can be a through hole opened in the side wall. The connecting wire 2 on the circuit board 11 passes through the connecting port 121 to be connected to the server arranged outside the heat dissipation device 1, so that the setting of the connecting wire 2 does not require the formation of an opening between the first surface 111 of the circuit board 11 and the shell 12, so that a sealed accommodating space can be formed between the first surface 111 of the circuit board 11 and the shell 12, thereby avoiding dust accumulation on the first surface 111 of the circuit board 11 having components, avoiding corrosion of the components on the first surface 111 of the circuit board 11 due to dust accumulation, reducing the possibility of failure of the components on the first surface 111 of the circuit board 11, and extending the life of the circuit board 11 and the heat dissipation device 1 having the circuit board 11.

[0038] like Figure 1 As shown, in the embodiment of the present application, the circuit board 11 is provided with a connecting hole penetrating the first surface 111 and the second surface 112, the connecting wire 2 is passed through the connecting hole and connected to the first surface 111 of the circuit board 11, and the connection between the connecting wire 2 and the circuit board 11 is located in a closed accommodating space.

[0039] In this embodiment, the circuit board 11 is connected to an external server through a connection line 2. The connection point of the circuit board 11 and the connection line 2 can be set on the first surface 111 of the circuit board 11. The housing 12 and the first surface 111 of the circuit board 11 can form a closed accommodation space. The second surface 112 of the circuit board 11 and the side wall of the housing 12 can also form an unclosed accommodation space. There is a connection port 121 in the unclosed accommodation space. When the circuit board 11 is connected to an external server through the connection line 2, the connection line 2 passes through the connection port 121 and enters the housing 12. The circuit board 11 is also provided with a connection hole penetrating the first surface 111 and the second surface 112. Therefore, after the connection line 2 passes through the connection port 121 on the side wall of the housing 12, it will pass through the connection hole on the circuit board 11 to be connected to the first surface 111 of the circuit board 11. Thus, the connection point between the circuit board 11 and the connection line 2 is located in the closed accommodation space. The size of the connection hole is adapted to the diameter of the connection line 2. Therefore, the setting of the connection hole will not allow dust to enter the sealed space formed by the housing 12 and the circuit board 11, avoiding the accumulation of dust on the first surface 111 of the circuit board 11 and preventing the corrosion of the first surface 111 of the circuit board 11 with components.

[0040] In this embodiment, the unclosed accommodation space is an accommodation space with an opening or a connection port 121 on the outer wall of the housing. The unclosed accommodation space can conduct air flow with the outside through the opening or the connection port 121.

[0041] As Figure 1 shown, in the embodiment of the present application, the connection line 2 is connected to the second surface 112 of the circuit board 11, and the connection point between the connection line 2 and the circuit board 11 is located on the second surface 112 away from the housing 12 to form an unclosed accommodation space.

[0042] In this embodiment, the circuit board 11 is connected to an external server through a connection line 2. The connection point of the circuit board 11 and the connection line 2 can be set on the second surface 112 of the circuit board 11. The second surface 112 of the electronic device is located in the unclosed accommodation space away from the closed accommodation space formed with the housing 12. Since the second surface 112 of the electronic device is located in the unclosed accommodation space, there is no need to additionally set an opening on the side wall of the housing 12 opposite to the second surface 112. The connection line 2 can be led out from the second surface 112 of the circuit board 11 only through the connection port 121 in the open space of the second surface 112 of the circuit board 11 to be connected to a server outside the heat dissipation device 1.

[0043] As Figure 2 shown, in the embodiment of the present application, it further includes:

[0044] A fan assembly 13, the fan assembly 13 is disposed opposite to the second surface 112 of the circuit board 11 of the housing 12. The fan assembly 13 includes a driving device 131 and a fan blade assembly 132. The fan blade assembly 132 is disposed on the outer periphery of the driving device 131. The driving device 131 is electrically connected to the circuit board 11 to drive the fan blade assembly 132 to rotate.

[0045] In this embodiment, the heat dissipation device 1 includes a circuit board 11, a housing 12, and a fan assembly 13. The circuit board 11 is disposed inside the housing 12, and the circuit board 11 and the housing 12 enclose a closed accommodation space to place the first surface 111 of the circuit board 11 in the closed accommodation space. The second surface 112 of the electronic device faces away from the closed accommodation space and forms an unclosed accommodation space with the housing 12. The fan assembly 13 is disposed opposite to the second surface 112 of the electronic device. The fan assembly 13 includes a driving device 131 and a fan blade assembly 132. The driving device 131 is electrically connected to the circuit board 11 to receive the control of the circuit board 11. A fan blade assembly 132 is disposed on the outer periphery of the driving device 131. Thus, under the control of the circuit board 11, the driving device 131 can drive the fan blade assembly 132 to rotate to achieve the heat dissipation of the heat dissipation device 1, thereby dissipating heat from the heat-generating components of the server.

[0046] As Figure 2 shown, in the embodiment of the present application, the housing 12 further includes an outer frame middle cylinder 14, and the outer frame middle cylinder 14 is fixedly connected to the housing 12;

[0047] Through holes adapted to the outer frame middle cylinder 14 are provided on the first surface 111 and the second surface 112 of the circuit board 11, and the outer frame middle cylinder 14 passes through the through holes to be connected to the fan assembly 13.

[0048] In this embodiment, the heat dissipation device 1 includes a housing 12, a circuit board 11, an outer frame middle cylinder 14, and a fan assembly 13. An outer shell middle cylinder is fixedly connected to the central position of the housing 12. Through holes adapted to the outer frame middle cylinder 14 are provided on the circuit board 11, and the through holes penetrate through the first surface 111 and the second surface 112 of the circuit board 11. The outer frame middle cylinder 14 passes through the through holes from one side of the first surface 111 of the circuit board 11 to the other side of the second surface 112 of the circuit board 11 to be connected to the fan assembly 13, thereby connecting the fan assembly 13, the circuit board 11, and the housing 12 to integrally connect the structure of the heat dissipation device 1, making the heat dissipation device 1 an integral structure, facilitating movement, and avoiding damage.

[0049] As Figure 2As shown, in the embodiment of the present application, the driving device 131 includes a motor rotor 1311 and a motor stator 1312. The motor stator 1312 is connected to the circuit board 11. The motor rotor 1311 is sleeved outside the motor stator 1312. A fan blade assembly 132 is arranged outside the rotor of the motor stator 1312. The motor stator 1312 drives the motor rotor 1311 to rotate, so as to drive the fan blade assembly 132 to rotate.

[0050] In this embodiment, the driving device 131 includes a motor rotor 1311 and a motor stator 1312. The motor rotor 1311 is arranged on the outer periphery of the motor stator 1312, that is, the motor rotor 1311 is sleeved outside the motor stator 1312. The motor stator 1312 is electrically connected and fixedly connected to the circuit board 11 through a plurality of connection pins, so as to fix the motor stator 1312 to the circuit board 11. And the motor stator 1312 can receive signals from the circuit board 11. The circuit board 11 controls the motor stator 1312 to drive the motor rotor 1311 to rotate. A fan blade assembly 132 is arranged outside the motor rotation. The rotation of the motor rotor 1311 drives the fan blade assembly 132 to rotate. Thus, under the control of the circuit board 11, the motor stator 1312 can drive the fan blade assembly 132 to rotate, so as to realize the heat dissipation of the heat dissipation device 1, and thus dissipate heat for the heat generating components of the server.

[0051] As Figure 2 shown, in the embodiment of the present application, the motor stator 1312 includes a stator middle cylinder 1313 and a winding 1314. The winding 1314 is fixedly arranged on the outer periphery of the stator middle cylinder 1313. The stator middle cylinder 1313 is coaxially arranged with the outer frame middle cylinder 14. The winding 1314 is electrically connected to the circuit board 11 through a plurality of connection pins.

[0052] In this embodiment, the connection pins are PIN pins. In this embodiment, the driving device 131 includes a motor stator 1312 and a motor rotor 1311. The motor rotor 1311 is sleeved outside the motor stator 1312. The motor stator 1312 includes a stator middle cylinder 1313 and windings 1314. A plurality of windings 1314 are arranged on the outer periphery of the stator middle cylinder 1313, and a plurality of connection pins are arranged at intervals in the circumferential direction on the plurality of windings 1314 to electrically connect and fixedly connect the motor stator 1312 to the circuit board 11. Thus, the circuit board 11 can be used to control the motor stator 1312 to drive the motor rotor 1311 to rotate. The rotation of the motor rotor 1311 will drive the fan blade assembly 132 to rotate to achieve heat dissipation of the heat dissipation device 1, thereby dissipating heat from the heat-generating components of the server. The stator middle cylinder 1313 is arranged coaxially with the outer frame. After the outer frame middle cylinder 14 passes through the circuit board 11 and enters the side of the second surface 112 of the circuit board 11, it will pass through the stator middle cylinder 1313 and be connected to the fan blade assembly 132. As Figure 3 shown, in the embodiment of the present application, a stepped structure 141 is provided at the position corresponding to the circuit board 11 on the outer frame middle cylinder 14. The stator middle cylinder 1313 is snapped into the space between the circuit board 11 and the stepped structure 141. The stator middle cylinder 1313 has an opening, and the outer frame middle cylinder 14 passes through the opening of the stator middle cylinder 1313 and is connected to the fan blade assembly 132.

[0053] In this embodiment, the heat dissipation device 1 includes a housing 12, an outer frame middle cylinder 14, a circuit board 11, and a fan assembly 13. A circuit board 11 is fixedly arranged inside the housing 12. The circuit board 11 and the housing 12 enclose a closed accommodation space. The first surface 111 of the circuit board 11 is located inside the closed accommodation space. The second surface 112 of the circuit board 11 is arranged opposite to the first surface 111 and is located in an unclosed accommodation space outside the closed accommodation space. The second surface 112 of the circuit board 11 is arranged opposite to the fan assembly 13. An outer frame middle cylinder 14 is also arranged at the center of the housing 12. The outer frame middle cylinder 14 is fixedly connected to the housing 12 and passes through a through hole on the circuit board 11, so as to extend from one side of the first surface 111 of the circuit board 11 to one side of the second surface 112 of the circuit board 11. There is a fan assembly 13 on one side of the second surface 112 of the circuit board 11. The fan assembly 13 includes a stator middle cylinder 1313, windings 1314, a motor rotor 1311, and a fan blade assembly 132. A plurality of windings 1314 are arranged outside the stator middle cylinder 1313. The windings 1314 are connected to the second surface 112 of the circuit board 11 through connection pins. A motor rotor 1311 is arranged outside the windings 1314. The motor rotor 1311 rotates under the drive of a motor stator 1312. A fan blade assembly 132 is arranged outside the motor rotor 1311. Thus, the fan blade assembly 132 rotates under the drive of the motor rotor 1311. And a stator middle cylinder 1313 is also arranged at the center of the motor stator 1312. The outer frame middle cylinder 14 is fixedly connected to the housing 12 and passes through the through hole of the circuit board 11 to extend to one side of the second surface of the circuit board 11. During the process of extending into the through hole of the circuit board, it is fixedly connected to the circuit board. And the outer frame middle cylinder 14 is provided with a stepped structure 141 at a position corresponding to the circuit board 11. The stator middle cylinder 1313 is clamped between the circuit board 11 and the stepped structure 141, so as to fix the stator middle cylinder 1313 and the circuit board 11. The stator middle cylinder 1313 is provided with an opening along the axial direction. After the outer frame middle cylinder 14 passes through the through hole on the circuit board 11 and extends from one side of the first surface 111 of the circuit board 11 to one side of the second surface 112 of the circuit board 11, it will extend into the opening of the stator middle cylinder 1313 and be connected to the connection shell of the fan blade assembly 132, so as to connect the fan blade assembly 132 and the housing 12.

[0054] In this embodiment, it further includes an outer shell, which surrounds the housing 12, the outer frame middle cylinder 14, the circuit board 11, and the fan assembly 13 and is fixedly connected to the housing 12. And the outer shell is also provided with a hollowed-out area to conduct air flow transmission between the fan assembly 13 and the outside, so that the heat dissipation device 1 can dissipate heat from the heat-generating components of the electronic device.

[0055] In a second aspect, the present application further provides an electronic device, including a heat-generating component and a heat dissipation device 1, and the heat dissipation device 1 is used for dissipating heat from the heat-generating component;

[0056] The heat dissipation device 1 includes:

[0057] A circuit board 11, the circuit board 11 having a first surface 111 and a second surface 112 disposed opposite to each other;

[0058] A housing 12, the housing 12 having a receiving space, the circuit board 11 being connected to the housing 12 and disposed in the receiving space, the first surface 111 of the circuit board 11 facing the housing 12 to form a closed receiving space for receiving components disposed on the first surface 111, and the second surface 112 facing away from the housing 12.

[0059] On the other hand, the present application also provides an electronic device, including:

[0060] A heating component and a heat dissipation device 1, the heat dissipation device 1 being used to dissipate heat from the heating component;

[0061] The heat dissipation device 1 includes:

[0062] A circuit board 11, the circuit board 11 having a first surface 111 and a second surface 112 disposed opposite to each other;

[0063] A housing 12, the housing 12 having a receiving space, the circuit board 11 being connected to the housing 12 and disposed in the receiving space, the first surface 111 of the circuit board 11 facing the housing 12 to form a closed receiving space for receiving components disposed on the first surface 111, and the second surface 112 facing away from the housing 12.

[0064] An electronic device provided by an embodiment of the present application includes a heat dissipation device 1 and a heating component, including a circuit board 11 and a housing 12. The circuit board 11 has a first surface and a second surface disposed opposite to each other. Components are disposed on the first surface. The housing 12 has a receiving space. The circuit board 11 is disposed in the receiving space of the housing 12 and is also connected to the housing 12. The first surface 111 of the circuit board 11 is located in a sealed receiving space formed by the circuit board 11 and the housing 12, while the second surface 112 of the circuit board 11 faces away from the sealed receiving space formed by the circuit board 11 and the housing 12. Thus, the first surface 111 of the circuit board 11 with components is disposed in the sealed receiving space, so that the entry of dust can be reduced, the corrosion of the components on the first surface 111 of the circuit board 11 caused by dust can be avoided, the possibility of failure of the components on the first surface 111 of the circuit board 11 can be reduced, and the service life of the circuit board 11 and the heat dissipation device 1 having the circuit board 11 can be extended.

[0065] It can be understood that the relevant features in the above devices can be referred to each other. In addition, the "first", "second", etc. in the above embodiments are used to distinguish each embodiment, and do not represent the advantages and disadvantages of each embodiment.

[0066] In the specification provided herein, a large number of specific details are described. However, it can be understood that embodiments of the present utility model can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0067] As described above, the above is only a specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A heat dissipation device, characterized in that: include: A circuit board, the circuit board having a first surface and a second surface disposed opposite to each other; The shell has a storage space, the circuit board is connected to the shell and arranged in the storage space, the first surface of the circuit board is arranged toward the shell to form a closed storage space for accommodating components arranged on the first surface, and the second surface is arranged away from the shell.

2. The heat dissipation device according to claim 1, characterized in that: A connection port is formed on the side wall of the housing located on the second surface, and the connection wire of the circuit board is used to pass through the connection port.

3. The heat dissipation device according to claim 2, characterized in that: The circuit board is provided with a connection hole penetrating the first surface and the second surface, the connection wire is passed through the connection hole and connected with the first surface of the circuit board, and the connection between the connection wire and the circuit board is located in a closed accommodation space.

4. The heat dissipation device according to claim 2, characterized in that: The connecting wire is connected to the second surface of the circuit board, and the connection point between the connecting wire and the circuit board is located on the second surface away from the housing to form an unclosed accommodation space.

5. The heat dissipation device according to claim 1, characterized in that: Also includes: A fan assembly, wherein the fan assembly is arranged opposite to the second surface of the circuit board, and the fan assembly includes a driving device and a fan blade assembly, wherein the fan blade assembly is arranged on the periphery of the driving device, and the driving device is electrically connected to the circuit board to drive the fan blade assembly to rotate.

6. The heat dissipation device according to claim 5, characterized in that: Also includes: An outer frame inner cylinder, wherein the outer frame inner cylinder is fixedly connected to the shell; The first surface and the second surface of the circuit board are provided with through holes matched with the inner tube of the outer frame, and the inner tube of the outer frame is connected with the fan assembly through the through holes.

7. The heat dissipation device according to claim 6, characterized in that: The driving device includes a motor rotor and a motor stator, the motor stator is connected to the circuit board, the motor rotor is sleeved outside the motor stator, the fan blade assembly is arranged outside the motor rotor, and the motor stator drives the motor rotor to rotate, thereby driving the fan blade assembly to rotate.

8. The heat dissipation device according to claim 7, characterized in that: The motor stator comprises a stator middle cylinder and a winding, wherein the winding is fixedly arranged on the outer periphery of the stator middle cylinder, the stator middle cylinder and the outer frame middle cylinder are arranged coaxially, and the winding is electrically connected to the circuit board through a plurality of connecting pins.

9. The heat dissipation device according to claim 8, characterized in that: A step-like structure is provided at a position of the inner tube of the outer frame corresponding to the circuit board, the inner tube of the stator is clamped between the circuit board and the step-like structure, the inner tube of the stator has an opening, and the outer frame inner tube passes through the opening of the inner tube of the stator to be connected with the fan blade assembly.

10. An electronic device, characterized in that: include: A heat generating component and a heat dissipation device, wherein the heat dissipation device is used to dissipate heat from the heat generating component; The heat dissipation device comprises: A circuit board, the circuit board having a first surface and a second surface disposed opposite to each other; The shell has a storage space, the circuit board is connected to the shell and arranged in the storage space, the first surface of the circuit board is arranged toward the shell to form a closed storage space for accommodating components arranged on the first surface, and the second surface is arranged away from the shell.

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