Heat conduction structure and electronic equipment
By designing a thermally conductive structure in the radiator assembly, and using locking members and limiting members to control the fixing and range of movement of the shrapnel, the problem of excessive elasticity and small deformation of the shrapnel in the prior art is solved, and the heat dissipation effect is improved.
Patent Information
- Application Number
- CN202421769088.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-24
- Publication Date
- 2025-06-24
- Estimated Expiration
- 2034-07-24
AI Technical Summary
In the existing radiator components, the elastic force of the shrapnel is too large, resulting in small deformation, which is not conducive to controlling the pressure synthesis force and thus affecting the heat dissipation effect.
A thermally conductive structure is adopted, including a heat-dissipating shell, a thermally conductive copper block, a shrapnel, a locking member and a restrictor. Part of the shrapnel is fixed to the heat dissipation shell by a partial locking member, and the remaining locking member limits the movement of the shrapnel to the heat dissipation shell, so that the shrapnel has a certain range of movement when heated and deformed, increasing the deformation space.
It effectively avoids the problems of large elastic force and small deformation caused by the shrapnel, improves the ability of the thermally conductive copper block to control the pressure synergy, and improves the heat dissipation effect.
Smart Images
Figure CN223024805U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation, and particularly relates to a heat conduction structure and an electronic device. Background Art
[0002] During the use of an electronic device, it is necessary to conduct the heat generated by the device through a radiator assembly to ensure the normal use of the electronic device. In the existing radiator assembly, the elastic piece and the heat dissipation housing are directly locked by screws. In this way, when the elastic force generated by the overall elastic piece of the radiator assembly is too large, the deformation of the elastic piece is small, which is not conducive to controlling the pressing force and results in an unsatisfactory heat dissipation effect. Summary of the Utility Model
[0003] The main purpose of the utility model is to propose a heat conduction structure and an electronic device, aiming to solve the problem of unsatisfactory heat dissipation effect in the existing radiator assembly.
[0004] To achieve the above purpose, the heat conduction structure proposed by the utility model is applied to an electronic device, and the electronic device has a heating element. The heat conduction structure includes:
[0005] A heat dissipation housing;
[0006] A heat conduction assembly, including a heat conduction copper block and n elastic pieces fixedly arranged, where n is greater than or equal to 3. The heat conduction copper block is arranged corresponding to the heating element and is in contact with it to dissipate heat for the heating element;
[0007] A locking member for fixing part of the elastic pieces to the heat dissipation housing; and
[0008] A limiting member for movably limiting the remaining elastic pieces to the heat dissipation housing.
[0009] In an embodiment, when n is equal to four, both the locking member and the limiting member are configured as two; and / or
[0010] Both the locking member and the limiting member are configured as screws.
[0011] In an embodiment, the locking member for fixing two of the elastic pieces to the heat dissipation housing is arranged on one side of the heat conduction copper block, and the two limiting members are arranged on the other side of the heat conduction copper block.
[0012] In an embodiment, the heat conduction assembly further includes a first heat conduction layer, and the first heat conduction layer is arranged between the heat conduction copper block and the heating element.
[0013] In an embodiment, the first heat conduction layer is configured as a heat conduction silicone grease layer.
[0014] In one embodiment, the heat conducting component includes a heat pipe, the heat pipe is connected to the heat conducting copper block, and the heat pipe is fixed to the heat dissipation housing.
[0015] In one embodiment, the heat pipe is fixed to the heat dissipation housing through a heat pipe pressing piece, and the heat pipe pressing piece and the heat dissipation housing are fixed by screwing.
[0016] In one embodiment, a second heat conducting layer is provided between the heat pipe and the heat dissipation housing.
[0017] In one embodiment, the second heat conducting layer is configured as a heat conducting silicone grease layer.
[0018] The present utility model further provides an electronic device, a heat generating component and a heat conducting structure. The heat conducting structure is the heat conducting structure as described in any one of the above, and the heat conducting copper block in the heat conducting structure is arranged corresponding to the heat generating component.
[0019] The technical solution of the present utility model is to use some of the locking pieces to fix some of the elastic pieces to the heat dissipation housing, and the remaining locking pieces are used to restrict the movement of the remaining elastic pieces to the heat dissipation housing, so that all the elastic pieces in the heat conducting structure will not be fully locked during installation. At this time, when the heat conducting copper block absorbs heat and transfers the heat to the elastic pieces, the elastic pieces are deformed by heat. At this time, the elastic pieces restricted to move to the heat dissipation housing have a certain range of movement when deformed by heat, so that the elastic pieces can have more deformation space, which is convenient for the heat conducting copper block to control the pressing force, ensuring the heat dissipation effect, and avoiding the situation where the elastic force generated by the elastic pieces is large, the deformation is small, and it is not conducive to controlling the pressing force. Furthermore, the technical problems existing in the prior art can be solved. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0021] Figure 1 FIG. is an exploded structural schematic diagram of an embodiment of the heat conducting structure and the electronic device provided by the present utility model;
[0022] Figure 2 For Figure 1 the schematic diagram of the heat conducting structure in;
[0023] Figure 3 For Figure 2 the side view schematic diagram of;
[0024] Figure 4 ForFigure 3 Partial enlarged view at position A in the [device];
[0025] Figure 5 Schematic structural diagram of another embodiment of the heat conduction structure and the electronic device provided by the present utility model;
[0026] Figure 6 Schematic structural diagram of another embodiment of the heat conduction structure and the electronic device provided by the present utility model.
[0027] Explanation of the reference numerals in the drawings:
[0028] 100, heat dissipation housing;
[0029] 200, heat conduction component; 210, heat conduction copper block; 220, elastic sheet; 230, heat pipe; 240, heat pipe pressing piece; 250, first heat conduction layer; 260, second heat conduction layer;
[0030] 300, locking member;
[0031] 400, restricting member;
[0032] 500, main board; 510, heat generating component.
[0033] The realization, functional features and advantages of the object of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Specific embodiments
[0034] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.
[0035] It should be noted that if there are directional indications (such as up, down, left, right, front, back,...) involved in the embodiments of the present utility model, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0036] In addition, if the embodiments of the present utility model involve descriptions such as "first", "second", etc., the descriptions of "first", "second", etc. are only for descriptive purposes and should not be construed as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel scenarios. Taking "A and / or B" as an example, it includes Scenario A, or Scenario B, or the scenario where both A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0037] The present utility model provides a heat conduction structure, referring to Figure 1 , which is applied to an electronic device having a heat generating component, where the heat generating component can be a CPU.
[0038] Please refer to Figures 1 to 4 , in an embodiment of the present utility model, the heat conduction structure includes:
[0039] A heat dissipation housing 100, where the heat dissipation housing 100 has heat dissipation fins;
[0040] A heat conduction component 200, including a heat conduction copper block 210 and n elastic pieces 220 fixedly arranged together, where n is greater than or equal to 3. The heat conduction copper block 210 is arranged corresponding to the heat generating component 510 and is in contact with it for dissipating heat from the heat generating component 510. Further, when the electronic device is in use, the heat generated by its heat generating component 510 can be absorbed by the heat conduction copper block 210, so that the heat conduction copper block 210 has a heat dissipation effect on the heat generating component 510. Specifically, when the heat generating component 510 is a CPU, the heat generated by the CPU at this time can be absorbed by the heat conduction copper block 210, so that the heat conduction copper block 210 has a heat dissipation effect on the CPU.
[0041] n locking members 300 are provided in one-to-one correspondence with the n elastic pieces 220. Some of the locking members 300 are used to fix some of the elastic pieces 220 to the heat dissipation housing 100, and the remaining locking members 300 are used to restrict the movement of the remaining elastic pieces 220 to the heat dissipation housing 100. Further, the heat-conducting copper block 210 and the elastic piece 220 are installed at one end of the heat dissipation housing 100 facing away from the heat dissipation fins. In this embodiment, some of the elastic pieces 220 are fixed to the heat dissipation housing by some of the locking members 300, and the remaining locking members 300 restrict the movement of the remaining elastic pieces 220 to the heat dissipation housing. At this time, when the heat-conducting copper block 210 absorbs heat and transfers the heat to the elastic piece 220, it is deformed by heat. At this time, the elastic piece 220 restricted to move in the heat dissipation housing 100 has a certain range of movement when deformed by heat, so that the elastic piece 220 can have more deformation space, avoiding the situation where the elastic force generated by the elastic piece 220 is large, the deformation is small, and it is not conducive to controlling the pressing force, and thus can solve the technical problems existing in the prior art. In this embodiment, for the range of movement a (see Figure 4 ) of the elastic piece 220 restricted to move in the heat dissipation housing 100 is 0.2 mm - 0.3 mm. Further, when the range of movement is too small, it will cause the problem of small deformation of the elastic piece 220. When the range of movement is too large, there will be a problem that the space occupied by the locking member 300 is relatively large. At the same time, in this embodiment, some of the locking members 300 fix some of the elastic pieces 220 to the heat dissipation housing 100. At this time, during the impact and vibration process of the heat conduction structure, under the action of this part of the locking members 300, the situation of the heat-conducting copper block 210 sliding can be avoided, preventing the side-sliding of the heat-conducting copper block 210 from affecting the heat dissipation performance during the impact and vibration experiment; it can enable the electronic device to apply this heat conduction structure and ensure its heat dissipation effect when used in a vibration environment, avoiding the problem that the existing heat dissipation structure cannot dissipate heat well in a vibration environment.
[0042] The technical solution of the present utility model adopts some of the locking members 300 to fix some of the elastic pieces 220 to the heat dissipation housing 100, and the remaining locking members 300 are used to restrict the movement of the remaining elastic pieces 220 to the heat dissipation housing 100, so that all the elastic pieces 220 in the heat conduction structure are not all locked during installation. At this time, when the heat-conducting copper block 210 absorbs heat and transfers the heat to the elastic piece 220, it is deformed by heat. At this time, the elastic piece 220 restricted to move in the heat dissipation housing 100 has a certain range of movement when deformed by heat, so that the elastic piece 220 can have more deformation space, facilitating the heat-conducting copper block 210 to control the pressing force, ensuring the heat dissipation effect, avoiding the situation where the elastic force generated by the elastic piece 220 is large, the deformation is small, and it is not conducive to controlling the pressing force, and thus can solve the technical problems existing in the prior art.
[0043] In one embodiment, referring to Figure 2When n is equal to four, both the locking member 300 and the restricting member 400 are configured to be two.
[0044] In one embodiment, referring to Figure 2 、 Figure 5 In one embodiment, both the locking member 300 and the restricting member 400 are configured as screws. Wherein, when the locking member 300 is used to fix the elastic piece 220 to the heat dissipation housing 100, at this time, the screw penetrates through the elastic piece 220 and is connected to the heat dissipation housing 100. At this time, the elastic piece 220 cannot move between the screw and the heat dissipation housing 100. When the restricting member 400 is used to restrict the movement of the elastic piece 220 to the heat dissipation housing 100, at this time, the screw penetrates through the elastic piece 220 and is connected to the heat dissipation housing 100. At this time, the elastic piece 220 can move between the screw and the heat dissipation housing 100.
[0045] However, the present design is not limited to this. In other embodiments, n can also be equal to three. When n is equal to three, the locking member 300 is configured as one, and at this time, the restricting member 400 is configured as two; or the locking member 300 is configured as two, and the restricting member 400 is configured as one.
[0046] Furthermore, referring to Figure 2 In this embodiment, the locking member 300 for fixing the two elastic pieces 220 to the heat dissipation housing 100 is provided on one side of the heat-conducting copper block 210. Specifically, the two restricting members 400 are provided on the other side of the heat-conducting copper block 210. In this way, when the heat-conducting component 200 is heated, when all the elastic pieces 220 connected to the heat-conducting copper block 210 deform, since the two elastic pieces 220 provided on the same side of the heat-conducting copper block 210 are both restricted in movement to the heat dissipation housing 100, at this time, the two elastic pieces 220 can be unrestricted from each other during deformation, thereby ensuring their deformation range, and thus facilitating the control of the pressing force of the heat-conducting copper block 210.
[0047] In one embodiment, referring to Figure 6 The heat-conducting component 200 further includes a first heat-conducting layer 250. The first heat-conducting layer 250 is provided between the heat-conducting copper block 210 and the heating element 510. Under the action of the first heat-conducting layer 250, the heat of the heating element 510 can be conducted to the heat-conducting copper block 210. In this way, the installation accuracy of the heat-conducting copper block 210 during installation can be reduced. Specifically, there can be a certain gap between the heat-conducting copper block 210 and the heating element 510, and the first heat-conducting layer 250 can be filled in this gap, and the heat of the heating element 510 is transferred to the heat-conducting copper block 210 through the first heat-conducting layer 250.
[0048] In one embodiment, the first heat-conducting layer 250 is configured as a heat-conducting silicone grease layer. The heat-conducting silicone grease can improve the heat conduction efficiency, reduce the heat accumulation at the interface, further lower the temperature of the heat-generating component 510, and improve the stability of the electronic device. At the same time, under the action of the heat-conducting silicone grease, the problem of reduced heat conduction caused by insufficient surface accuracy of the heat-conducting copper block 210 and the heat-generating component 510 can also be compensated for.
[0049] In one embodiment, referring to Figure 2 , the heat-conducting component 200 includes a heat pipe 230. The heat pipe 230 is connected to the heat-conducting copper block 210, and the heat pipe 230 is fixed to the heat dissipation housing 100. In this embodiment, the heat pipe 230 is used to transfer the heat of the heat-conducting copper block 210 to the heat dissipation housing 100. That is to say, the heat absorbed by the heat-conducting copper block 210 can be transferred to the heat dissipation housing 100 through the heat pipe 230. Under the action of the heat pipe 230, it is convenient for the heat-conducting copper block 210 to dissipate heat better.
[0050] In one embodiment, referring to Figure 2 , the heat pipe 230 is fixed to the heat dissipation housing 100 through a heat pipe pressing piece 240. The heat pipe pressing piece 240 and the heat dissipation housing 100 are fixed together by screwing. Specifically, the heat pipe 230 is installed on the heat dissipation housing 100, and then the heat pipe pressing piece 240 is fixed to the heat dissipation housing 100 by screwing. After the pressing piece is fixed, the pressing piece fixes the heat pipe 230 to the heat dissipation housing 100.
[0051] In one embodiment, referring to Figure 6 , in order to improve the heat conduction efficiency between the heat pipe 230 and the heat dissipation housing 100, a second heat-conducting layer 260 is provided between the heat pipe 230 and the heat dissipation housing 100. Under the action of the second heat-conducting layer 260, it is convenient for the heat in the heat pipe 230 to be transferred to the heat dissipation housing 100 better.
[0052] In one embodiment, the second heat-conducting layer 260 is configured as a heat-conducting silicone grease layer. The heat-conducting silicone grease can improve the heat conduction efficiency between the heat pipe 230 and the heat dissipation housing 100, reduce the heat accumulation at the interface, further lower the temperature of the heat-generating component 510, and improve the stability of the electronic device. At the same time, under the action of the heat-conducting silicone grease, the problem of reduced heat conduction caused by insufficient surface accuracy of the heat pipe 230 and the heat dissipation housing 100 can also be compensated for.
[0053] The present utility model also proposes an electronic device, referring to Figure 1 、 Figure 5 、 Figure 6, the electronic device includes a heating element 510 and a heat conduction structure. For the specific structure of the heat conduction structure, refer to the above embodiments. Since this electronic device adopts all the technical solutions of the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be elaborated here one by one. Among them, the heat conduction copper block 210 in the heat conduction structure is arranged corresponding to the heating element 510. The heating element 510 is installed on the main board 500, and the main board 500 is fixedly arranged in the heat dissipation housing 100 by means of screw fastening.
[0054] Further, in this embodiment, the electronic device can be a mobile device, an in-vehicle electronic device, a medical device, or other devices used in a vibrating environment.
[0055] The above is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied to other related technical fields, is included in the patent protection scope of the present invention.
Claims
1. A heat-conducting structure, characterized in that: Applied to electronic equipment, the electronic equipment has a heating element, and the heat-conducting structure includes: Heat dissipation housing; A heat-conducting component, comprising a heat-conducting copper block and n springs, n being greater than or equal to 3, the heat-conducting copper block being arranged corresponding to the heating element and in contact with the heating element for heat dissipation of the heating element; A locking member, used to fix part of the spring sheet to the heat dissipation housing; and The limiting member is used to limit the movement of the remaining spring pieces to the heat dissipation housing.
2. The heat conducting structure according to claim 1, characterized in that: When n is equal to four, the number of the locking member and the number of the limiting member are both two; and / or The locking member and the limiting member are both configured as screws.
3. The heat-conducting structure according to claim 2, characterized in that: A locking member for fixing the two spring sheets on the heat dissipation housing is arranged on one side of the heat-conducting copper block, and two limiting members are arranged on the other side of the heat-conducting copper block.
4. The heat conducting structure according to claim 1, characterized in that: The heat-conducting assembly further includes a first heat-conducting layer, which is arranged between the heat-conducting copper block and the heat-generating element.
5. The heat-conducting structure according to claim 4, characterized in that: The first heat-conducting layer is configured as a heat-conducting silicone grease layer.
6. The heat conducting structure according to claim 1, characterized in that: The heat-conducting component comprises a heat pipe, the heat pipe is connected to the heat-conducting copper block, and the heat pipe is fixed to the heat-dissipating housing.
7. The heat-conducting structure according to claim 6, characterized in that: The heat pipe is fixed to the heat dissipation housing through a heat pipe pressing plate, and the heat pipe pressing plate and the heat dissipation housing are fixed to each other by screw locking.
8. The heat conducting structure according to claim 6, characterized in that: A second heat conducting layer is arranged between the heat pipe and the heat dissipation housing.
9. The heat-conducting structure according to claim 8, characterized in that: The second heat-conducting layer is configured as a heat-conducting silicone grease layer.
10. An electronic device, characterized in that: A heating element and a heat-conducting structure, wherein the heat-conducting structure is the heat-conducting structure according to any one of claims 1 to 9, and the heat-conducting copper block in the heat-conducting structure is arranged corresponding to the heating element.