Endoscope

Abstract

The utility model discloses an endoscope. The endoscope comprises an optical lens for collecting light; the beam splitter prism splits the light into a plurality of light beams; each CMOS element receives the light beam split by the beam splitter prism and generates an image signal according to the light beam, the other end of each CMOS element is connected with a signal conversion device through a transmission channel, and each CMOS element outputs the image signal to the signal conversion device connected with the transmission channel; one end of each signal conversion device is connected with at least one CMOS element through at least one transmission channel, each signal conversion device receives an image signal output by at least one CMOS element through at least one transmission channel and converts the image signal into a high-speed signal, and the other end of each signal conversion device is connected with the connecting part; one end of the connecting part is connected with the plurality of signal conversion devices, and the other end of the connecting part outputs the high-speed signals received from the plurality of signal conversion devices.

Description

Technical Field

[0001] This application belongs to the field of medical devices, and particularly relates to an endoscope. Background Art

[0002] Currently, for CMOS (Complementary Metal Oxide Semiconductor), two-CMOS or multi-CMOS endoscopes, the CMOSs are all connected to a single processor. After being processed by the processor, high-speed electrical signals are output, and then transmitted to the superior device through an electrical connector, a cable, and a connector. The processor needs to perform complex processing on the image signals input by the CMOSs before outputting.

[0003] However, when using the current endoscope for surgery, due to the high power consumption of the processor chip inside the endoscope, the handle of the endoscope gets severely heated, which poses a problem affecting surgical operations. Summary of the Utility Model

[0004] The embodiments of this application provide an endoscope, which can solve the problem that the high power consumption of the processor chip inside the endoscope causes the handle of the endoscope to get severely heated and affects surgical operations.

[0005] The embodiments of this application provide an endoscope, which includes: an optical lens, multiple CMOS elements, multiple signal conversion devices, and a connection part; the optical lens collects light; the optical lens includes a beam splitter prism, which divides the light into multiple light beams; each CMOS element receives the light beam after being split by the beam splitter prism and generates an image signal according to the light beam. The other end of each CMOS element is connected to a signal conversion device through a transmission channel, and each CMOS element outputs the image signal to the signal conversion device connected to the transmission channel; one end of each signal conversion device is connected to at least one CMOS element through at least one transmission channel. Each signal conversion device receives the image signals output by at least one CMOS element through the at least one transmission channel and converts the image signals into high-speed signals. The other end of each signal conversion device is connected to the connection part; one end of the connection part is connected to multiple signal conversion devices, and the other end of the connection part outputs the high-speed signals received from multiple signal conversion devices.

[0006] In an embodiment of the present application, the endoscope includes: an optical lens that collects light; the optical lens includes a beam splitter prism that splits the light into multiple light beams; each CMOS element receives the light beams after being split by the beam splitter prism and generates an image signal based on the light beams. The other end of each CMOS element is connected to a signal conversion device through a transmission channel. Each CMOS element outputs the image signal to the signal conversion device connected to the transmission channel; one end of each signal conversion device is connected to at least one CMOS element through at least one transmission channel. Each signal conversion device receives the image signal output by at least one CMOS element through at least one transmission channel and converts the image signal into a high-speed signal. The other end of each signal conversion device is connected to a connection part; one end of the connection part is connected to multiple signal conversion devices, and the other end of the connection part outputs the high-speed signals received from the multiple signal conversion devices. The endoscope handle includes multiple CMOS elements and multiple signal conversion devices. Each signal conversion device corresponds to at least one CMOS element, and each CMOS element corresponds to one signal conversion device. By processing the signals output by the multiple CMOS elements through the multiple signal conversion devices, the power consumption of the signal conversion devices is reduced, thereby reducing the heat generation of the endoscope handle, solving the problem that the processor chip inside the endoscope has a large power consumption, resulting in serious heat generation of the endoscope handle and seriously affecting the surgical operation, and improving the working stability of the endoscope. Description of the Drawings

[0007] Figure 1 is a schematic structural diagram of a common endoscope provided by an embodiment of the present application;

[0008] Figure 2 is a schematic structural diagram of an endoscope provided by an embodiment of the present application;

[0009] Figure 3 is a schematic structural diagram of another endoscope provided by an embodiment of the present application;

[0010] Figure 4 is a schematic structural diagram of another endoscope provided by an embodiment of the present application;

[0011] Figure 5 is a schematic structural diagram of another endoscope provided by an embodiment of the present application;

[0012] Figure 6 is a schematic structural diagram of another endoscope provided by an embodiment of the present application;

[0013] Figure 7 is a schematic structural diagram of another endoscope provided by an embodiment of the present application;

[0014] Figure 8 is a schematic diagram of the signal processing flow of an endoscope provided by an embodiment of the present application.

[0015] Description of reference numerals:

[0016] Optical mirror-1, CMOS element-2, signal conversion device-3, connecting part-4, internal hardware logic circuit-31, electrical connector-41, cable-42, connector-43, optoelectronic hybrid connector-44, optoelectronic hybrid cable-45, optical fiber-46, beam splitter-5, control circuit module-6. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0019] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0020] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0021] Figure 1 shows a common endoscope, such as Figure 1 shown. The endoscope has a single CMOS, two CMOSs or multiple CMOS endoscopes, all of which connect the CMOSs to a processor uniformly. After being processed by the processor, a high-speed electrical signal is output, and then transmitted to the upper-level device through the electrical connector 41, the cable 42 and the connector 43. The processor needs to perform complex processing on the image signal input by the CMOS image sensor and then output it. The power consumption of the processor is very large, and the handle generates serious heat, which may seriously affect the surgical operation. In addition, the high-speed image signal is transmitted through the cable 42, and the high-speed electrical signal is easily interfered, resulting in signal transmission and image abnormalities. To solve the above problems, an embodiment of the present application provides an endoscope.

[0022] The following will combine the accompanying drawings to describe in detail an endoscope provided by an embodiment of the present application through specific embodiments and their application scenarios.

[0023] Figure 2 is a schematic structural diagram of an endoscope provided by an embodiment of the application. As Figure 2 shown, the endoscope includes: an optical mirror 1, a plurality of CMOS elements 2, a plurality of signal conversion devices 3 and a connection part 4; the optical mirror 1 collects light; the optical mirror 1 includes a beam splitting prism 5, and the beam splitting prism 5 splits the light into a plurality of light beams; one end of each CMOS element 2 is connected to the optical mirror 1, and each CMOS element 2 receives the light beam split by the beam splitting prism 5 and generates an image signal according to the light beam. The other end of each CMOS element 2 is connected to a signal conversion device 3 through a transmission channel, and each CMOS element 2 outputs the image signal to the signal conversion device 3 connected to the transmission channel; one end of each signal conversion device 3 is connected to at least one CMOS element 2 through at least one transmission channel, and each signal conversion device 3 receives the image signal output by at least one CMOS element 2 through the at least one transmission channel and converts the image signal into a high-speed signal. The other end of each signal conversion device 3 is connected to the connection part 4; one end of the connection part 4 is connected to a plurality of signal conversion devices 3, and the other end of the connection part 4 outputs the high-speed signal received from the plurality of signal conversion devices 3.

[0024] Specifically, as Figure 2As shown, the optical lens 1 is disposed on the endoscope handle of the endoscope. The endoscope handle is an important part of the endoscope and supports the operation of the endoscope (the doctor holds the handle to perform endoscope surgical operations). The endoscope handle includes a plurality of CMOS elements 2, a plurality of signal conversion devices 3, and a connection part 4. In this way, the endoscope handle can perform image acquisition, conversion, and signal processing, etc. In the embodiment of the present application, the optical lens 1 is the optical lens head of the endoscope. The optical lens 1 is an optical lens head with a special design suitable for the medical endoscope diagnosis and treatment scenario, which can achieve imaging and usually has a special structural form. Light can be collected through the optical lens 1. The optical lens 1 includes a beam splitting prism 5. The beam splitting prism 5 can split the collected light into multiple light beams. Each CMOS element 2 can receive the light beam after being split by the beam splitting prism 5 and generate an image signal according to the light beam.

[0025] The CMOS element 2 refers to a technology for manufacturing large-scale integrated circuits or an element manufactured by this technology. In the embodiment of the present application, it is used as a CMOS image sensor. In the embodiment of the present application, the plurality of CMOS elements 2 and the plurality of signal conversion devices 3 are connected through a transmission channel. Specifically, the other end of each CMOS element 2 is connected to a signal conversion device 3 through a transmission channel. Each CMOS element 2 outputs the image signal to the signal conversion device 3 connected to the transmission channel. One end of each signal conversion device 3 is connected to at least one CMOS element 2 through at least one transmission channel. Each signal conversion device 3 receives the image signal output by at least one CMOS element 2 through at least one transmission channel and converts the image signal into a high-speed signal. For example Figure 2 As shown, the number of CMOS elements 2 can be n, and the number of signal conversion devices 3 can be m. Among them, m can be less than or equal to n, m can also be equal to n. In necessary cases, m can be greater than n. The m signal conversion devices 3 can be connected to the n CMOS elements 2 through n transmission channels. The other end of each signal conversion device 3 is connected to the connection part 4. In this way, the plurality of signal conversion devices 3 can transmit the high-speed signal to the connection part 4. One end of the connection part 4 is connected to the plurality of signal conversion devices 3, and the other end of the connection part 4 can output the high-speed signal received from the plurality of signal conversion devices 3.

[0026] In one embodiment, one end of each signal conversion device 3 can be connected to a plurality of CMOS elements 2 through a plurality of transmission channels, that is, one signal conversion device 3 processes the image signals transmitted by a plurality of CMOS elements 2. Each signal conversion device 3 receives the image signals output by a plurality of CMOS elements 2 through a plurality of transmission channels and converts the received image signals into high-speed signals for output.

[0027] In one embodiment, each signal conversion device 3 can be connected to a CMOS component 2 through a transmission channel, that is, one signal conversion device 3 processes the high-speed signal of one CMOS. At this time, the signal conversion devices 3 and the CMOS components 2 are in one-to-one correspondence. An image signal is transmitted from a CMOS component 2 to a signal conversion device 3 through the transmission channel, and each signal conversion device 3 receives the image signal output by a CMOS component 2 through a transmission channel respectively.

[0028] Using multiple signal conversion devices 3 to process the image signals of multiple CMOS components 2 not only increases the processing efficiency compared with using one processor to process the image signals of multiple CMOS components 2, but also can reduce the heat generation and loss of the signal conversion devices 3 and maintain the stability of the signal conversion devices 3. When necessary, it is also possible to have a situation where one CMOS component 2 corresponds to multiple signal conversion devices 3. For example, the CMOS component 2 outputs image signals in a time-sharing manner, transmits the image signal to one corresponding signal conversion device 3 during time period A, and transmits the image signal to another corresponding signal conversion device 3 during time period B. Especially in the scenarios of high-density optical signal acquisition or extreme environments, in order to maintain the signal processing efficiency, it is possible to have a situation where multiple signal conversion devices 3 correspond to one CMOS component 2.

[0029] The endoscope provided by the embodiment of the present application includes: an optical lens 1, a plurality of CMOS elements 2, a plurality of signal conversion devices 3, and a connection part 4; the optical lens 1 collects light; the optical lens 1 includes a beam splitting prism 5, and the beam splitting prism 5 splits the light into a plurality of light beams; one end of each CMOS element 2 is connected to the optical lens 1, each CMOS element 2 receives the light beam after being split by the beam splitting prism 5 and generates an image signal according to the light beam, and the other end of each CMOS element 2 is connected to a signal conversion device 3 through a transmission channel, and each CMOS element 2 outputs the image signal to the signal conversion device 3 connected to the transmission channel; one end of each signal conversion device 3 is connected to at least one CMOS element 2 through at least one transmission channel, each signal conversion device 3 receives the image signal output by at least one CMOS element 2 through at least one transmission channel and converts the image signal into a high-speed signal, and the other end of each signal conversion device 3 is connected to the connection part 4; one end of the connection part 4 is connected to a plurality of signal conversion devices 3, and the other end of the connection part 4 outputs the high-speed signals received from the plurality of signal conversion devices 3. The endoscope includes a plurality of CMOS elements 2 and a plurality of signal conversion devices 3. Each signal conversion device 3 corresponds to at least one CMOS element 2, and each CMOS element 2 corresponds to a signal conversion device 3. By processing the signals output by the plurality of CMOS elements 2 through the plurality of signal conversion devices 3, the power consumption of the signal conversion device 3 is reduced, thereby reducing the heat generation of the endoscope handle, solving the problem that the power consumption of the processor chip in the endoscope is very large, resulting in serious heat generation of the endoscope handle and seriously affecting the surgical operation, and improving the working stability of the endoscope.

[0030] In one implementation, the signal conversion device 3 includes: an internal hardware logic circuit 31, and the internal hardware logic circuit 31 converts the received image signal into the high-speed signal.

[0031] In the embodiment of the present application, an important feature of the signal conversion device 3 is that the power consumption is very low. The low power consumption makes the endoscope handle generate less heat, and the operator or doctor holding the endoscope handle will not feel hot or cause sweating in the palm, which affects the operation when holding the endoscope handle for a long time. The signal conversion device 3 in the embodiment of the present application can directly implement the conversion of the signal physical layer through the hardware logic method, such as Figure 3 shown, the conversion of the signal physical layer can be realized through the internal hardware logic circuit 31, and the image signal received from the plurality of CMOS elements 2 can be converted into a high-speed signal from the physical layer, without involving complex image signal processing. The signal conversion device 3 can convert the image signal received from the CMOS element 2 into a high-speed signal. Compared with the current output after processing complex image signals by the processor chip, the power consumption in the embodiment of the present application will be greatly reduced.

[0032] In one implementation, the high-speed signal includes a high-speed electrical signal, and the connection part 4 includes: an electrical connector 41, a cable 42, and a connector 43;

[0033] One end of the electrical connector 41 is connected to a plurality of the signal conversion devices 3, and the other end of the electrical connector 41 is connected to one end of the connector 43 through the cable 42; the electrical connector 41 transmits the high-speed electrical signal received from the plurality of signal conversion devices 3 to the connector 43 through the cable 42; the other end of the connector 43 transmits the received high-speed electrical signal.

[0034] The signal conversion device 3 provided by the embodiment of the present application has the ability to convert multiple signals into a single high-speed signal, and the endoscope can be compatible with both the electrical transmission mode and the optical transmission mode. That is, the above-mentioned signal conversion device 3 can not only convert the image signal received from the CMOS element 2 into a single high-speed electrical signal, but also convert the image signal received from the CMOS element 2 into a single high-speed optical signal. When the anti-interference requirement is not very high, it is possible to select to convert the image signal received from the CMOS element 2 into a high-speed electrical signal, which has lower implementation difficulty and cost. Figure 4 The structural schematic diagram of another endoscope provided by the embodiment of the present application is shown, as Figure 4 As shown, the connection part 4 of the endoscope may include an electrical connector 41, a cable 42, and a connector 43. One end of the electrical connector 41 is connected to a plurality of signal conversion devices 3, and the other end of the electrical connector 41 is connected to one end of the above-mentioned connector 43 through the cable 42. The plurality of signal conversion devices 3 convert the image signal received from the CMOS element 2 into a high-speed electrical signal, and the signal conversion device 3 transmits the high-speed electrical signal to the electrical connector 41. The high-speed electrical signal received from the plurality of signal conversion devices 3 can be transmitted to the connector 43 through the cable 42 by the electrical connector 41, and the other end of the connector 43 is connected to the upper-level device. In this way, the received high-speed electrical signal can be transmitted to the upper-level device through the other end of the connector 43.

[0035] In one implementation, the high-speed signal includes a high-speed optical signal, and the connection part 4 includes: an optical and electrical hybrid connector 44, an optical and electrical hybrid cable 45, and a connector 43; one end of the optical and electrical hybrid connector 44 is connected to a plurality of the signal conversion devices 3, and the other end of the optical and electrical hybrid connector 44 is connected to one end of the connector 43 through the optical and electrical hybrid cable 45; the optical and electrical hybrid connector 44 transmits the high-speed optical signal received from the plurality of signal conversion devices 3 to the connector 43 through the optical and electrical hybrid cable 45; the other end of the connector 43 outputs the received high-speed optical signal.

[0036] Specifically, in the case where the anti-interference requirement for signals is very high, the image signal received from the CMOS element 2 can be converted into an optical signal by the signal conversion device 3. Figure 5 Fig. shows a schematic structural diagram of another endoscope provided by an embodiment of the present application, as Figure 5 shown. The connection part 4 of the endoscope may include: an optoelectronic hybrid connector 44, an optoelectronic hybrid cable 45, and a connector 43; one end of the optoelectronic hybrid connector 44 is connected to a plurality of signal conversion devices 3, and the other end of the optoelectronic hybrid connector 44 is connected to one end of the above-mentioned connector 43 through the optoelectronic hybrid cable 45. The plurality of signal conversion devices 3 can convert the image signal received from the CMOS element 2 into a high-speed optical signal, and the signal conversion device 3 transmits the high-speed optical signal to the optoelectronic hybrid connector 44. The optoelectronic hybrid connector 44 can transmit the high-speed optical signal received from the plurality of signal conversion devices 3 to the connector 43 through the optoelectronic hybrid cable 45, and the other end of the connector 43 is connected to a superior device. In this way, the received high-speed optical signal can be output to the superior device through the other end of the connector 43, and the long-distance transmission of the optical signal will not be interfered by the external electromagnetic field, which can ensure more stable and reliable data transmission.

[0037] In one implementation, the high-speed signal includes a high-speed optical signal, and the connection part 4 includes: an optical fiber 46 and a connector 43; one end of the optical fiber 46 is connected to a plurality of the signal conversion devices 3, and the other end of the optical fiber 46 is connected to one end of the connector 43. The optical fiber 46 transmits the high-speed optical signal received from the plurality of signal conversion devices 3 to the connector 43; the other end of the connector 43 outputs the received high-speed optical signal.

[0038] Specifically, in the case of adopting the optical transmission mode, there are two solutions. One is to directly replace the cable 42 with an optoelectronic hybrid cable 45, and the other is to transmit the high-speed optical signal through the optical fiber 46. Figure 6 Fig. shows a schematic structural diagram of another endoscope provided by an embodiment of the present application, as Figure 6As shown in the figure, at this time, the connecting part 4 includes an optical fiber 46 and a connector 43. One end of the optical fiber 46 is connected to a plurality of signal conversion devices 3, and the other end of the optical fiber 46 is connected to one end of the connector 43. The signal conversion device 3 directly outputs an optical signal, and through the optical fiber 46 coupling process, the optical signal output by the signal conversion device 3 is directly transmitted through the optical fiber 46. The optical fiber 46 transmits the high-speed optical signals received from a plurality of signal conversion devices 3 to the connector 43; the other end of the connector 43 is connected to the superior device. In this way, the received high-speed optical signal can be output to the superior device through the other end of the connector 43. In addition, the low-speed signal line and the power line can be welded to the circuit board where the signal conversion device 3 is located. It should be noted that the use of the optical and electrical hybrid connector 44 and the optical and electrical hybrid cable 42 is because the high-speed signal is transmitted through the optical fiber 46, but the low-speed signal and the power supply still need to be transmitted through the cable 42. In the embodiment of the present application, the cable 42 or the optical and electrical hybrid cable 45 can be flexibly selected. The cable 42 has good product applicability and low implementation difficulty, and the optical and electrical hybrid cable 45 has good anti-interference ability.

[0039] In one implementation, the beam splitter prism 5 decomposes the collected light into three primary color light beams and projects the three primary color light beams onto a plurality of the CMOS elements 2 respectively; each of the CMOS elements receives the three primary color light beams projected by the beam splitter prism and generates the image signal according to the three primary color light beams; or the beam splitter prism 5 decomposes the collected light into the three primary color light beams and a near-infrared light beam and projects the three primary color light beams and the near-infrared light beam onto a plurality of the CMOS elements 2 respectively; each of the CMOS elements receives the three primary color light beams and the near-infrared light beam projected by the beam splitter prism and generates the image signal according to the three primary color light beams and the near-infrared light beam.

[0040] Specifically, as Figure 1 shown in the beam splitter prism 5, the beam splitter prism 5 can disperse the collected natural light into red, green, and blue three primary color light beams or disperse the natural light into red, green, and blue three primary color light beams and a near-infrared light beam. The beam splitter prism 5 can decompose the collected light into three primary color light beams and project the three primary color light beams onto a plurality of CMOS elements 2 respectively. Then each CMOS element 2 can receive the three primary color light beams projected by the beam splitter prism 5 and generate an image signal according to the three primary color light beams; or the beam splitter prism 5 can decompose the collected light into three primary color light beams and a near-infrared light beam and project the three primary color light beams and the near-infrared light beam onto a plurality of the CMOS elements 2. Then each CMOS element 2 receives the three primary color light beams and the near-infrared light beam projected by the beam splitter prism 5 and generates an image signal according to the three primary color light beams and the near-infrared light beam.

[0041] For example, when the endoscope handle includes three CMOS components 2, the beam splitter prism 5 can disperse natural light into red, green, and blue primary color light beams, which are respectively projected onto the three CMOS components 2, so as to finally be restored into a more realistic color image. When the endoscope handle includes four CMOS components 2, the beam splitter prism 5 can disperse natural light into red, green, and blue primary color light beams and a near-infrared light beam, which are respectively projected onto the four CMOS components 2. In addition to being able to restore a more realistic color image, it also has a near-infrared image to achieve more functions. When the endoscope handle includes more CMOS components 2, the beam splitter prism 5 can divide natural light into multiple primary color light beams and near-infrared light beams, which are respectively projected onto more CMOS components 2 to achieve more functions, such as 3D imaging, etc.

[0042] In one implementation, the endoscope further includes: a control circuit module 6, one end of the control circuit module 6 is connected to a plurality of the CMOS components 2, and the other end of the control circuit module 6 is connected to a plurality of the signal conversion devices 3. The control circuit module 6 transmits low-speed control signals for configuring the plurality of CMOS components 2 and the plurality of signal conversion devices 3 to the plurality of CMOS components 2 and the plurality of signal conversion devices 3.

[0043] Specifically, as Figure 7 shown, the endoscope further includes a control circuit module 6. One end of the control circuit module 6 is connected to a plurality of CMOS components 2, and the other end of the control circuit module 6 is connected to a plurality of signal conversion devices 3. The control circuit module 6 can transmit low-speed control signals to the plurality of CMOS components 2 and the plurality of signal conversion devices 3 to configure the CMOS components 2 and the signal conversion devices 3. In addition, the control circuit module 6 can also configure the communication between the endoscope and the superior device connected thereto. After the CMOS components 2 and the signal conversion devices 3 are configured through the low-speed control signals, the CMOS components 2 will output image signals (usually multiple MIPI / LVDS / parallel port signals) to the signal conversion devices 3, and the signal conversion devices 3 will convert the multiple signals into a single high-speed optical signal or high-speed electrical signal, and then transmit it to the superior device through the connection part 4.

[0044] Figure 8 The signal processing flow of an endoscope provided by an embodiment of the present application is shown. The signal processing flow can be executed by a plurality of signal conversion devices of the endoscope. The signal processing flow executed by each signal conversion device includes the following steps:

[0045] Step 802: The signal conversion device receives an image signal from the CMOS component.

[0046] In an embodiment of the present application, the endoscope includes an optical lens and a plurality of CMOS elements. The optical lens includes a beam splitting prism. The optical lens can collect light to achieve imaging. The beam splitting prism can split the collected light into a plurality of light beams. After the plurality of CMOS elements receive the light beams projected by the beam splitting prism, the plurality of CMOS elements can generate image signals according to the received light beams.

[0047] In an embodiment of the present application, since the plurality of CMOS elements are correspondingly arranged with a plurality of signal conversion devices. For example, the plurality of CMOS elements and the plurality of signal conversion devices are connected through a transmission channel. In this way, after the plurality of CMOS elements generate image signals according to the received light beams, the signal conversion devices can receive the image signals from the CMOS elements.

[0048] Step 804: The signal conversion device converts the image signal into a high-speed signal.

[0049] Specifically, after receiving the image signal, the signal conversion device can implement the conversion of the signal physical layer through the internal hardware logic circuit in the signal conversion device, convert the image signal received from the CMOS element into a high-speed signal, and does not involve complex image signal processing.

[0050] Step 806: The signal conversion device outputs the high-speed signal.

[0051] Specifically, after converting the image signal into a high-speed signal, the signal conversion device can output the high-speed signal.

[0052] In an embodiment of the present application, the signal conversion device receives the image signal from the CMOS element. The CMOS element receives the light beams after being split by the beam splitting prism and generates an image signal according to the light beams. Among them, the plurality of CMOS elements are correspondingly arranged with the plurality of signal conversion devices; the signal conversion device converts the image signal into a high-speed signal; the signal conversion device outputs the high-speed signal. By processing the signals output by the plurality of CMOS elements through the plurality of signal conversion devices, the power consumption of the signal conversion device is reduced, and further the heat generation of the endoscope handle is reduced, solving the problem that the processor chip in the endoscope has a large power consumption, resulting in serious heat generation of the endoscope handle, which seriously affects the surgical operation. Using a plurality of signal conversion devices to process the image signals of the plurality of CMOS elements not only increases the processing efficiency compared with using one processor to process the image signals of the plurality of CMOS elements, but also can reduce the heat generation and loss of the signal conversion device and maintain the stability of the signal conversion device.

[0053] In one implementation, the signal conversion device receives an image signal from a CMOS component, including: when the signal conversion device is arranged in one-to-one correspondence with any first target CMOS component among the multiple CMOS components, the signal conversion device receives the image signal from the first target CMOS component.

[0054] Specifically, an endoscope includes multiple CMOS components and multiple signal conversion devices. Among them, a signal conversion device can be connected to a first target CMOS component through a transmission channel, that is, a signal conversion device processes the high-speed signal of a first target CMOS. At this time, the signal conversion device and the first target CMOS component are in one-to-one correspondence. The first target CMOS component transmits the image signal to the signal conversion device through the transmission channel, and the signal conversion device receives the image signal output by the first target CMOS component through a transmission channel. Therefore, when the signal conversion device is arranged in one-to-one correspondence with any first target CMOS component among the multiple CMOS components, the image signal generated by the first target CMOS component can be transmitted to the connected signal conversion device for processing. In this way, multiple signal conversion devices process the signals output by multiple CMOS components, reducing the power consumption of the signal conversion device, solving the problem that the processor chip in the endoscope has a large power consumption, resulting in serious heating of the handle of the endoscope and seriously affecting the surgical operation, and improving the working stability of the endoscope.

[0055] In one implementation, the signal conversion device receives an image signal from a CMOS component, including: when the signal conversion device is arranged corresponding to multiple second target CMOS components among the multiple CMOS components, the signal conversion device receives the image signals from the multiple second target CMOS components.

[0056] Specifically, multiple second target CMOS components in the endoscope can be connected to the same signal conversion device, that is, a signal conversion device can be connected to multiple second target CMOS components through multiple transmission channels, that is, a signal conversion device processes the image signals transmitted by multiple second target CMOS components. Therefore, when the signal conversion device is arranged corresponding to multiple second target CMOS components among the multiple CMOS components, the image signals generated by the multiple second target CMOS components can be transmitted to the connected signal conversion device. The signal conversion device receives the image signals output by the multiple second target CMOS components through multiple transmission channels and converts the received image signals into high-speed signals for output. In this way, multiple signal conversion devices process the signals output by multiple CMOS components, reducing the power consumption of the signal conversion device, solving the problem that the processor chip in the endoscope has a large power consumption, resulting in serious heating of the handle of the endoscope and seriously affecting the surgical operation, and improving the working stability of the endoscope.

[0057] In one implementation, the signal conversion device receives an image signal from a CMOS component, including: when a plurality of the CMOS components include a third target CMOS component, a plurality of the signal conversion devices receive the image signal from the third target CMOS component, and a plurality of the signal conversion devices are correspondingly arranged for the third target CMOS component.

[0058] Specifically, when necessary, it is also possible to adopt the situation where one CMOS component corresponds to a plurality of signal conversion devices, that is, a plurality of the CMOS components include a third target CMOS component to which a plurality of signal conversion devices are correspondingly arranged. At this time, the image signal generated by the third target CMOS component can be transmitted to the connected plurality of signal conversion devices, and the plurality of signal conversion devices receive the image signal from the third target CMOS component. For example, the third target CMOS component can output the image signal in a time-sharing manner, transmit the image signal to a corresponding one signal conversion device in time period A, and transmit the image signal to another corresponding signal conversion device in time period B. Especially in the scenarios of high-density optical signal acquisition or extreme environments, in order to maintain the signal processing efficiency, it is possible to adopt the situation where a plurality of signal conversion devices correspond to one CMOS component.

[0059] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. An endoscope, characterized in that: include: An optical mirror, a plurality of CMOS elements, a plurality of signal conversion devices and a connection portion; The optical mirror collects light; The optical mirror includes a beam splitter prism, which splits light into multiple beams; Each of the CMOS elements receives the light beam split by the beam splitter prism and generates an image signal according to the light beam, the other end of each of the CMOS elements is connected to a signal conversion device via a transmission channel, and each of the CMOS elements outputs the image signal to the signal conversion device connected to the transmission channel; One end of each of the signal conversion devices is connected to at least one of the CMOS elements via at least one transmission channel, each of the signal conversion devices receives an image signal output by at least one of the CMOS elements via the at least one transmission channel and converts the image signal into a high-speed signal, and the other end of each of the signal conversion devices is connected to the connection portion; One end of the connection portion is connected to the plurality of signal conversion devices, and the other end of the connection portion outputs high-speed signals received from the plurality of signal conversion devices.

2. The endoscope according to claim 1, characterized in that The signal conversion device comprises: An internal hardware logic circuit converts the received image signal into the high-speed signal.

3. The endoscope according to claim 1, characterized in that The high-speed signal includes a high-speed electrical signal, and the connecting portion includes: an electrical connector, a cable, and a connector; One end of the electrical connector is connected to the plurality of signal conversion devices, and the other end of the electrical connector is connected to one end of the connector through the cable; The electrical connector transmits the high-speed electrical signals received from the plurality of signal conversion devices to the connector through the cable; The other end of the connector transmits the received high-speed electrical signal.

4. The endoscope according to claim 1, characterized in that The high-speed signal includes a high-speed optical signal, and the connecting part includes: an optoelectronic hybrid connector, an optoelectronic hybrid cable and a connector; One end of the optoelectronic hybrid connector is connected to a plurality of the signal conversion devices, and the other end of the optoelectronic hybrid connector is connected to one end of the connector through the optoelectronic hybrid cable; The optoelectronic hybrid connector transmits the high-speed optical signal received from the plurality of signal conversion devices to the connector through the optoelectronic hybrid cable; The other end of the connector outputs the received high-speed optical signal.

5. The endoscope according to claim 1, characterized in that The high-speed signal includes a high-speed optical signal, and the connecting part includes: an optical fiber and a connector; One end of the optical fiber is connected to the plurality of signal conversion devices, and the other end of the optical fiber is connected to one end of the connector, and the optical fiber transmits the high-speed optical signal received from the plurality of signal conversion devices to the connector; The other end of the connector outputs the received high-speed optical signal.

6. The endoscope according to claim 1, characterized in that The beam splitter prism decomposes the collected light into three primary color beams and projects the three primary color beams onto a plurality of CMOS elements respectively; each CMOS element receives the three primary color beams projected by the beam splitter prism and generates the image signal according to the three primary color beams; or The light collected by the dichroic prism is decomposed into the three primary color beams and the near infrared beam, and the three primary color beams and the near infrared beam are respectively projected onto a plurality of the CMOS elements; each of the CMOS elements receives the three primary color beams and the near infrared beam projected by the dichroic prism and generates the image signal according to the three primary color beams and the near infrared beam.

7. The endoscope according to claim 1, characterized in that: The endoscope further comprises: A control circuit module, one end of which is connected to the plurality of CMOS elements, and the other end of which is connected to the plurality of signal conversion devices, wherein the control circuit module transmits a low-speed control signal for configuring the plurality of CMOS elements and the plurality of signal conversion devices to the plurality of CMOS elements and the plurality of signal conversion devices.

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