Semiconductor equipment and gas supply pipeline and gas supply system thereof

Abstract

The embodiment of the utility model provides a semiconductor device and a gas supply pipeline and a gas supply system thereof, the gas supply pipeline comprises at least one gas supply branch, the gas supply branch comprises a gas supply pipeline with a gas inlet and a first gas outlet, and the gas inlet is communicated with a gas source; the first switching device is arranged on the gas supply pipeline and is used for gating a pipeline between the gas inlet and the first gas outlet; the first pressure regulating device is arranged on the gas supply pipeline and is positioned between the first switching device and the first gas outlet; and the second switching device is arranged on the air supply pipeline, is positioned between the first pressure regulator and the first air outlet, and is used for gating the pipeline between the first pressure regulator and the first air outlet. By adopting the technical scheme, the pressure intensity of the air source output to the wafer can be reduced, and the wafer processing quality is further improved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to the field of semiconductor manufacturing technologies, and in particular, to a semiconductor device, its gas supply pipeline, and gas supply system. Background Art

[0002] In semiconductor processes, multiple different processes usually need to be performed, among which processes involving treating wafers with gases are included.

[0003] Currently, when supplying gas to a wafer through a gas supply pipeline, the gas is generally directly transmitted to the wafer to perform corresponding processing operations. However, the pressure of the gas is generally relatively high, posing a risk of damaging the wafer.

[0004] Under this background, how to provide a technical solution to reduce the pressure of the gas source output to the wafer has become a technical problem that needs to be urgently solved by those skilled in the art. Summary of the Utility Model

[0005] In view of this, embodiments of the present disclosure provide a semiconductor device, its gas supply pipeline, and gas supply system, which can reduce the pressure of the gas source output to the wafer, thereby improving the wafer processing quality.

[0006] First, embodiments of the present disclosure provide a gas supply pipeline for a semiconductor device, including at least one gas supply branch, and the gas supply branch includes:

[0007] A gas supply pipeline having an air inlet and a first air outlet, wherein the air inlet is communicated with a gas source;

[0008] A first switching device disposed on the gas supply pipeline to selectively connect the pipeline between the air inlet and the first air outlet;

[0009] A first pressure regulating device disposed on the gas supply pipeline, between the first switching device and the first air outlet;

[0010] A second switching device disposed on the gas supply pipeline, between the first pressure regulating device and the first air outlet, to selectively connect the pipeline between the first pressure regulating device and the first air outlet.

[0011] Optionally, the first switching device includes:

[0012] A first pressure sensor disposed on one side of the air inlet of the gas supply pipeline to detect the pressure value of the gas source;

[0013] A first pneumatic valve disposed between the first pressure sensor and the first pressure regulating device.

[0014] Optionally, the first pressure regulating device includes a pressure regulating valve.

[0015] Optionally, the second switching device includes:

[0016] A second pressure sensor disposed on one side of the first air outlet of the air supply pipeline to detect the pressure value of the air source;

[0017] A second pneumatic valve disposed between the second pressure sensor and the first air outlet.

[0018] Optionally, at least one air supply branch includes a first air supply branch and a second air supply branch. Among them, the first air supply pipeline of the first air supply branch and the second air supply pipeline of the second air supply branch share one first air outlet, and the switching states of the second switching devices of the first air supply branch and the second air supply branch are different, while the switching states of the first switching devices of the first air supply branch and the second air supply branch are the same.

[0019] Optionally, the air supply pipeline further includes: an auxiliary air supply branch respectively communicating with the first air supply branch and the second air supply branch;

[0020] The auxiliary air supply branch includes: a first auxiliary air supply branch communicating with the first air supply branch, a second auxiliary air supply branch communicating with the second air supply branch, and a third auxiliary air supply branch communicating with both the first auxiliary air supply branch and the second auxiliary air supply branch, and the third auxiliary air supply branch shares one first air outlet with the first air supply branch and the second air supply branch.

[0021] Optionally, the first auxiliary air supply branch includes: a first sub-air supply pipeline communicating with the first air supply pipeline, and a third switching device disposed on the first sub-air supply pipeline, and the third switching device is in a normally closed state;

[0022] The second auxiliary air supply branch includes: a second sub-air supply pipeline communicating with the second air supply pipeline, and a fourth switching device disposed on the second sub-air supply pipeline, and the fourth switching device is in a normally closed state;

[0023] The third auxiliary air supply branch includes: a third sub-air supply pipeline communicating with both the first sub-air supply pipeline and the second sub-air supply pipeline; a second pressure regulating device disposed on the third sub-air supply pipeline, and a fifth switching device disposed on the third sub-air supply pipeline and located between the second pressure regulating device and the first air outlet.

[0024] Optionally, the air supply pipeline further includes: a first filter disposed on the air supply pipeline and located between the first switching device and the first pressure regulating device; and / or a second filter disposed on the air supply pipeline and located between the second switching device and the first pressure regulating device.

[0025] Optionally, the gas supply pipeline further includes a controller connected to the first switching device and the second switching device to change the switching states of the first switching device and the second switching device.

[0026] Optionally, the gas supply pipeline further includes a sixth switching device disposed on one side of the first air outlet of the gas supply pipeline to select the pipeline between the second switching device and the first air outlet.

[0027] Optionally, the gas supply branch further includes a standby pipeline communicating with the gas supply pipeline, and the standby pipeline has at least one second air outlet on the same side as the first air outlet, and a seventh switching device disposed on the standby pipeline to select the pipeline between the air inlet and the second air outlet.

[0028] The embodiment of the present disclosure further provides a gas supply system for a semiconductor device, including: the gas supply pipeline as described in any one of the foregoing embodiments;

[0029] A gas supply device communicating with the gas supply pipeline to provide a gas source.

[0030] Optionally, the gas supply system further includes:

[0031] A purge pipeline connected to the gas supply pipeline to purge the gas source in the gas supply pipeline of the gas supply pipeline; and / or, a suction pipeline connected to the gas supply pipeline to suck the gas source in the gas supply pipeline of the gas supply pipeline.

[0032] Optionally, when the gas supply system includes the purge pipeline, the purge pipeline includes:

[0033] A first purge branch and a second purge branch for the flow of the purge medium, and a third purge branch respectively communicating with the first purge branch, the second purge branch and the gas supply pipeline;

[0034] Wherein, the first purge branch includes: a first purge channel communicating with the third purge branch, and a first purge medium inlet on a side of the first purge channel away from the third purge branch; and an eighth switching device disposed on the first purge channel;

[0035] The second purge branch includes: a second purge channel communicating with the third purge branch, and a second purge medium inlet on a side of the second purge channel away from the third purge branch; and a ninth switching device disposed on the second purge channel;

[0036] The third purging branch includes: a third purging channel that communicates with the first purging branch, the second purging branch, and the gas supply pipeline, and a tenth switching device disposed on the third purging channel.

[0037] Optionally, the gas supply pipeline includes an air inlet and a first air outlet;

[0038] When the gas supply system includes the suction pipeline, the suction pipeline includes:

[0039] A negative pressure generating device that generates negative pressure;

[0040] A first suction branch that communicates with the negative pressure generating device respectively, a second suction branch that communicates with one side of the air inlet of the gas supply pipeline and the first suction branch respectively, and a third suction branch that communicates with one side of the first air outlet of the gas supply pipeline and the first suction branch respectively.

[0041] Optionally, the first suction branch includes: a first suction channel that communicates with the negative pressure generating device, the second suction branch, and the third suction branch respectively; and an eleventh switching device disposed on the first suction channel;

[0042] The second suction branch includes: a second suction channel that communicates with one side of the air inlet of the gas supply pipeline; and a twelfth switching device disposed on the second suction channel;

[0043] The third suction branch includes: a third suction channel that communicates with one side of the first outlet of the gas supply pipeline; and a thirteenth switching device disposed on the third suction channel.

[0044] Correspondingly, an embodiment of the present disclosure further provides a semiconductor device, including: a gas supply system of the semiconductor device as described in any of the foregoing embodiments;

[0045] A wafer processing device connected to the gas supply system.

[0046] By using the gas supply pipeline of the semiconductor device provided in the embodiment of the present disclosure, a first switching device and a second switching device are sequentially disposed on the gas supply pipeline. By controlling the gating timing of the first switching device and the second switching device, the flow rate of the gas source in the gas supply pipeline can be delayed, and the pressure of the gas source can be reduced; and by disposing a first pressure regulator between the first switching device and the second switching device, the pressure of the gas source can be further reduced. Therefore, by using the above gas supply pipeline, through at least three - stage step - down buffering, the pressure of the gas source output to the wafer can be reduced, the probability of wafer damage can be avoided or reduced, and thus the quality of wafer processing can be improved. Description of the Drawings

[0047] Figure 1Schematic diagram of the gas supply pipeline of a semiconductor device in an embodiment of the present disclosure;

[0048] Figure 2 Schematic diagram of the gas supply pipeline of another semiconductor device in an embodiment of the present disclosure;

[0049] Figure 3 Schematic diagram of the gas supply pipeline of yet another semiconductor device in an embodiment of the present disclosure;

[0050] Figure 4 Schematic diagram of the gas supply system of a semiconductor device in an embodiment of the present disclosure;

[0051] Figure 5 Schematic diagram of the gas supply system of another semiconductor device in an embodiment of the present disclosure;

[0052] Figure 6 Schematic diagram of the gas supply system of yet another semiconductor device in an embodiment of the present disclosure. Detailed implementation manners

[0053] As described in the background art, in the process of supplying gas to a wafer through a gas supply pipeline, when the gas source is released from the gas supply device, the relative pressure (or called relative pressure) of the gas source is relatively large. If directly supplied to the wafer, there is a risk of wafer breakage under the action of strong air pressure.

[0054] To solve the above technical problems, an embodiment of the present disclosure provides a gas supply pipeline of a semiconductor device, including at least one gas supply branch, and the gas supply branch includes: a gas supply pipeline having an air inlet and a first air outlet, wherein the air inlet is communicated with the gas source; a first switching device disposed on the gas supply pipeline for selectively connecting the pipeline between the air inlet and the first air outlet; a first pressure regulator disposed on the gas supply pipeline and located between the first switching device and the first air outlet; a second switching device disposed on the gas supply pipeline and located between the pressure regulator and the first air outlet for selectively connecting the pipeline between the pressure regulator and the first air outlet.

[0055] It can be seen from this that by sequentially arranging the first switching device and the second switching device on the gas supply pipeline, the selection timing of the first switching device and the second switching device can be controlled, the flow rate of the gas source in the gas supply pipeline can be delayed, and thus the pressure of the gas source can be reduced; and by arranging the first pressure regulator between the first switching device and the second switching device, the pressure of the gas source can be further reduced. Thus, by adopting at least three-stage step-down buffering measures, the pressure of the gas source output to the wafer can be reduced, the probability of wafer damage can be avoided or reduced, and the wafer processing quality can be improved.

[0056] To enable those skilled in the art to have a clearer understanding of the technical concepts, principles, advantages, etc. embodied in the embodiments of the present disclosure, the following will refer to the accompanying drawings, and through specific embodiments, combined with specific application scenarios, etc., will be introduced in detail.

[0057] See Figure 1 the schematic structural diagram of a gas supply pipeline of a semiconductor device in the embodiment of the present disclosure shown in Figure 1 As shown, the gas supply pipeline of the semiconductor device may include at least one gas supply branch (for example Figure 1 one of the gas supply branches shown).

[0058] See Figure 1 , the gas supply branch may include:

[0059] A gas supply pipeline GS1 (or referred to as the first gas supply pipeline GS1) having an air inlet IN1 and a first air outlet OUT1, wherein the air inlet IN1 is communicated with a gas source (not shown in the figure);

[0060] A first switching device SF1L provided on the gas supply pipeline GS1 and selectively communicating with the pipeline between the air inlet IN1 and the first air outlet OUT1;

[0061] A first voltage regulator device REGL provided on the gas supply pipeline GS1 and located between the first switching device SF1L and the first air outlet OUT1;

[0062] A second switching device SF2L provided on the gas supply pipeline GS1, located between the first voltage regulator device REGL and the first air outlet OUT1, and selectively communicating with the pipeline between the first voltage regulator device REGL and the first air outlet OUT1.

[0063] Specifically, when a gas source is provided to the air inlet IN1, as Figure 1 shown by the arrow in, the gas source can flow along the gas supply pipeline GS1 from the side of the air inlet IN1 to the side of the first air outlet OUT1 until it reaches the wafer surface.

[0064] During this process, by sequentially arranging the first switching device SF1L, the first voltage regulator device REGL, and the second switching device SF2L on the gas supply pipeline GS1, the flow time of the gas source in the gas supply pipeline GS1 can be controlled, and thus the pressure of the gas source can be gradually reduced step by step, so that the pressure of the gas source provided to the wafer can meet the production requirements.

[0065] For example, by setting the first switching device SF1L and the second switching device SF2L, when the first switching device SF1L and / or the second switching device SF2L are not turned on, the gas source is always in the gas supply pipeline GS1. In this way, by controlling the gating timing of the first switching device SF1L and the second switching device SF2L, the flow rate of the gas source in the gas supply pipeline GS1 can be delayed. The smaller the flow rate of the gas source, the smaller the pressure of the gas source.

[0066] Also for example, by setting the first pressure regulator REGL, the pressure of the gas source can be directly regulated to reduce the pressure of the gas source.

[0067] In some embodiments of the present disclosure, referring to Figure 1 , the first switching device SF1 may include: a first pressure sensor PT1L disposed on one side of the gas inlet IN1 of the gas supply pipeline GS1 for detecting the pressure value of the gas source; a first pneumatic valve AV1L disposed between the first pressure sensor PT1L and the first pressure regulator REG.

[0068] Specifically, for gas supply devices of different capacities, when supplying a gas source to the gas supply pipeline GS1, the pressure of the gas source is not the same. Among them, the more gas source stored in the gas supply device, the greater the corresponding pressure. In this way, based on the pressure value of the gas source detected by the first pressure sensor PT1L, it is possible to control when to open or close the first pneumatic valve AV1L, so that the relative pressure of the gas source after the first pressure regulation can be maintained within a certain range.

[0069] In some embodiments, the detected pressure value of the gas source can reflect the current gas source reserve of the gas supply device, and the gas source amounts required for wafers in different processing scenarios are different. When it is determined based on the pressure value of the gas source that the source reserve is difficult to meet the wafer processing requirements, the first pneumatic valve AV1L can be kept in the closed state. In this way, problems such as low processing quality caused by insufficient gas source during wafer processing can be avoided.

[0070] In some embodiments, the first pneumatic valve AV1L may include at least one of a solenoid valve, a pneumatic solenoid valve, or a hand valve.

[0071] In some embodiments of the present disclosure, the gas supply pipeline may further include a controller (not shown in the figure) connected to the first switching device SF1 to change the switching state of the first switching device SF1.

[0072] More specifically, the controller is electrically connected to the first pressure sensor PT1L and the first pneumatic valve AV1L respectively. Thus, the pressure value of the gas source detected by the first pressure sensor PT1L can be directly output to the controller, enabling the controller to output a control signal to the first pneumatic valve AV1L when it determines that the pressure value of the gas source meets the set requirements, so as to turn on the first pneumatic valve AV1L and allow the gas source to further flow in the gas supply pipeline GS1. In this way, precise control of the switching process of the first pneumatic valve AV1L can be achieved, improving the pressure reduction effect.

[0073] It should be noted that the controller can use a general computer device to perform data communication and data operation with the first pressure sensor and the first pneumatic valve. In the embodiments of the present disclosure, there is no improvement on the specific working method of the controller. The processes of the controller obtaining data and the control process can both be implemented by existing technologies or conventional technical means in the art.

[0074] In some embodiments of the present disclosure, the first pressure regulator REG1 may include a pressure regulating valve. Among them, the pressure regulating valve is a control valve used to reduce the high-pressure gas source to meet the requirements of downstream equipment or systems. It controls the flow rate by adjusting the opening degree of the pressure regulating valve, thereby reducing the pressure and enabling the gas source to have a stable pressure.

[0075] It can be understood that the opening degree of the first pressure regulator REG1 can be achieved through the controller, or can be controlled manually or by other means.

[0076] In some embodiments of the present disclosure, refer to Figure 1 , the second switching device SF2 may include: a second pressure sensor PT2L disposed on one side of the first air outlet OUT1 of the gas supply pipeline GS1 for detecting the pressure value of the gas source; a second pneumatic valve AV2L disposed between the second pressure sensor PT2L and the first air outlet OUT1.

[0077] Specifically, after being buffered and pressure-reduced by the first switching device SF1 and the first pressure regulator REGL, the pressure of the gas source decreases accordingly. By disposing the second pressure sensor PT2L on one side of the first air outlet OUT1, the timing of turning on the second pneumatic valve AV2L can be selected based on the detected pressure value of the gas source. In this way, the relative pressure of the gas source supplied to the wafer can meet the processing requirements of the wafer, improving the processing quality of the wafer.

[0078] In some embodiments, the second pneumatic valve AV2L may include at least one of a solenoid valve, a pneumatic solenoid valve, or a manual valve.

[0079] In some embodiments, considering that the pressures of the gas sources in the gas supply pipelines GS1 on both sides of the first pressure regulator REGL are different, and the pressure of the gas source between the first pressure regulator REGL and the gas inlet IN1 is greater than the pressure of the gas source between the first pressure regulator REGL and the first gas outlet OUT1, the required second pneumatic valve AV2L can be a low-pressure pneumatic valve, the first pneumatic valve AV1L can be a high-pressure pneumatic valve, the second pressure sensor PT2L can be a low-pressure pressure sensor, and the first pressure sensor PT1L can be a high-pressure pressure sensor, thereby reducing the implementation cost of the gas supply pipeline.

[0080] In some embodiments of the present disclosure, the gas supply pipeline may further include a controller (not shown in the figure) connected to the second switching device SF2 to change the switching state of the second switching device SF2.

[0081] More specifically, the controller is electrically connected to the second pressure sensor PT2L and the second pneumatic valve AV2L respectively. Thus, the pressure value of the gas source detected by the second pressure sensor PT2L can be directly output to the controller, so that when the controller determines that the pressure value of the gas source meets the requirements of wafer processing, it outputs a control signal to the second pneumatic valve AV2L to turn on the second pneumatic valve AV2L, enabling the gas source to be supplied to the wafer. In this way, precise control of the switching process of the second pneumatic valve AV2L can be achieved, so that the relative pressure of the gas source supplied to the wafer meets the requirements of wafer processing, thereby improving the processing quality of the wafer.

[0082] In the actual application process, high-purity gas is required during the wafer processing to avoid contamination of the wafer by impurities in the gas.

[0083] Based on this, referring to Figure 1 , the gas supply pipeline may further include a first filter F1L disposed on the gas supply pipeline GS1 and located between the first switching device SF1 and the first pressure regulator REGL. In this way, when the first pneumatic valve AV1L in the first switching device SF1 is opened, the gas source can flow through the first filter F1L. Then, the first filter F1L can filter out the impurities in the gas source, improve the purity of the gas, thereby reducing the contamination of the wafer and improving the processing quality.

[0084] In some implementations, if the flow rate of the gas source is too fast, there may be a situation where some of the gas source is not filtered, or the filtering effect is poor, and there are still many impurities in the gas source. If the gas source is directly supplied to the wafer, the probability of the wafer being contaminated increases.

[0085] In this case, the gas supply pipeline may further include a second filter F2L disposed on the gas supply pipe GS1 and located between the second switching device SF2 and the first pressure regulator REGL. In this way, when the gas source flows through the second filter F2L, the second filter F2L can filter out impurities in the gas source, improve the purity of the gas, thereby reducing the contamination of the wafer and further improving the processing quality.

[0086] It can be understood that during actual use, as Figure 1 shown, the gas supply pipeline may include both the first filter F1L and the second filter F2L at the same time.

[0087] In some other embodiments, the gas supply pipeline may include only one of the first filter F1L and the second filter F2L. For example, the gas supply pipeline includes the first filter F1L; or for another example, the gas supply pipeline includes the second filter F2L. The embodiments of the present disclosure do not impose any restrictions on the number of filters, as long as they can filter out impurities in the gas source. For example, in some embodiments, the gas supply pipeline may include three or more filters.

[0088] During actual application, when it is necessary to repair the gas supply pipeline, or when at least one of the first switching device, the first pressure regulator, and the second switching device has an abnormal situation, if gas supply is directly carried out, the gas source may not reach the wafer, or there is an abnormality on one side of the wafer and it is necessary to stop the current gas supply, the pipeline between the air inlet and the first air outlet needs to be blocked.

[0089] See Figure 1 , the gas supply pipeline may further include: a sixth switching device MV1L disposed on one side of the first air outlet OUT1 of the gas supply pipe GS1 and selecting the pipeline between the second switching device SF2L and the first air outlet OUT1.

[0090] In this way, when it is necessary to stop the gas supply, by closing the sixth switching device MV1L, the passage of the pipeline between the air inlet IN1 and the first air outlet OUT1 can be blocked, facilitating the repair of the gas supply pipe GS1 and the replacement operation of other components on the gas supply pipeline.

[0091] In some embodiments, the sixth switching device MV1L may be a manual valve. By using a manual valve, the probability of the sixth switching device MV1L being accidentally closed can be reduced or avoided, improving the use safety.

[0092] In some other embodiments, the sixth switching device may further include other electrically controlled valves such as a pneumatic valve and a solenoid valve.

[0093] During actual application, there may be a situation where multiple (e.g., 2) devices are processing simultaneously. To improve the processing efficiency, then see Figure 1, the gas supply branch may further include a standby pipeline GSA connected to the gas supply pipeline GS1, and the standby pipeline GSA has at least one second air outlet (such as the second air outlet OUT2) on the same side as the first air outlet OUT1.

[0094] In this way, at the same moment, the gas supply pipeline can supply gas sources to at least two processing devices, improving the utilization rate of the gas supply pipeline.

[0095] When the gas supply branch further includes the standby pipeline GSA, the gas supply branch may further include: a seventh switching device MV2 disposed on the standby pipeline GSA and selectively connecting the air inlet IN1 and the pipeline between the second air outlet OUT2.

[0096] By setting the seventh switching device MV2, the passage between the air inlet IN1 and the second air outlet OUT2 can be selectively connected or blocked in real time, thereby controlling the gas supply process of the second air outlet OUT2, so that the vast majority of the gas sources can be transmitted through the first air outlet OUT1. In this way, the problem of poor wafer processing quality caused by insufficient gas sources obtained by multiple devices can be avoided.

[0097] During the actual gas supply process, there may be a scenario where the current gas supply pipeline fails and cannot supply gas, or the gas source in the gas supply device is insufficient, and the wafer processing urgently needs gas. To achieve uninterrupted gas supply, in the embodiments of the present disclosure, at least one gas supply branch includes a first gas supply branch and a second gas supply branch. By switching the gas supply processes of the first gas supply branch and the second gas supply branch, uninterrupted gas supply to the wafer can be achieved to further improve the wafer processing quality.

[0098] In some embodiments, when at least one gas supply branch includes a first gas supply branch and a second gas supply branch, the structures of the first gas supply branch and the second gas supply branch may be the same, or there may be a common part between the first gas supply branch and the second gas supply branch.

[0099] For example, in some embodiments of the present disclosure, when at least one gas supply branch includes a first gas supply branch and a second gas supply branch, the first gas supply pipeline of the first gas supply branch and the second gas supply pipeline of the second gas supply branch share a first air outlet, and the switching states of the second switching devices of the first gas supply branch and the second gas supply branch are different, and the switching states of the first switching devices of the first gas supply branch and the second gas supply branch are the same.

[0100] For example, referring to Figure 2 the schematic structural diagram of another gas supply pipeline in the embodiments of the present disclosure shown in Figure 2As shown, the gas supply pipeline includes a first gas supply branch (not labeled in the figure) and a second gas supply branch (not labeled in the figure), and the first gas supply branch and the second gas supply branch share a first gas outlet OUT1, so that the overall volume of the gas supply pipeline can be reduced, and the implementation cost can be reduced.

[0101] Next, refer to Figure 2 , the switching states of the second switching device SF2L of the first gas supply branch and the second switching device SF2R of the second gas supply branch are different, and the switching states of the first switching device SF1L of the first gas supply branch and the first switching device SF1R of the second gas supply branch are the same.

[0102] For example, when the first gas supply branch is in the gas supply state and the second gas supply branch is in the standby state, the second switching device F2L is in the open state, the second switching device F2R of the second gas supply branch is in the closed state, and the first switching device F1L and the first switching device F1R are both in the open state.

[0103] Also for example, when the second gas supply branch is in the gas supply state and the first gas supply branch is in the standby state, the second switching device F2R is in the open state, the second switching device F2L of the first gas supply branch is in the closed state, and the first switching device F1L and the first switching device F1R are both in the open state.

[0104] In other words, when using the gas supply pipeline to supply gas, by controlling the switching states of the first switching device SF1L and the second switching device SF2L on the first gas supply branch, and the first switching device SF1R and the second switching device SF2R on the second gas supply branch, the gas supply branch can be flexibly switched to achieve uninterrupted gas supply.

[0105] It should be noted that, first, the second gas supply branch may further include: a first pressure regulator REGR, a first filter F1R, a second filter F2R, a sixth switching device MV1R; and the components in the second gas supply branch can be connected to the controller. That is: the second gas supply branch can have all the components in the gas supply branch described in the foregoing embodiment; second, the second gas supply branch and the first gas supply branch also share a second gas outlet OUT2.

[0106] During the actual gas supply process, when a component (such as the first pneumatic valve) or pipeline on one of the gas supply branches malfunctions, it will become single-branch gas supply, and the gas supply stability will be reduced. If there is a problem with the remaining single branch, there is a risk of gas supply interruption.

[0107] In this case, the gas supply pipeline may further include an auxiliary gas supply branch (not labeled in the figure) that is respectively connected to the first gas supply branch and the second gas supply branch. In this way, it is possible to always keep at least two gas supply branches supplying gas to the wafer to improve the stability of gas supply.

[0108] As an example, the auxiliary gas supply branch may include: a first auxiliary gas supply branch communicating with the first gas supply branch, a second auxiliary gas supply branch communicating with the second gas supply branch, and a third auxiliary gas supply branch communicating with both the first auxiliary gas supply branch and the second auxiliary gas supply branch, and the third auxiliary gas supply branch shares a first gas outlet with the first gas supply branch and the second gas supply branch.

[0109] In other words, the auxiliary gas supply branch has two gas inlets, where one gas inlet is the gas inlet of the first gas supply pipe and the other gas inlet is the gas inlet of the second gas supply pipe. Thus, when an abnormality occurs in the first gas supply pipe and / or the second gas supply pipe, it can be quickly switched to the auxiliary gas supply branch to achieve uninterrupted gas supply.

[0110] For example, when the first gas supply pipe is abnormal, gas can be supplied through the first auxiliary gas supply branch and the third auxiliary gas supply branch; also for example, when the second gas supply pipe is abnormal, gas can be supplied through the second auxiliary gas supply branch and the third auxiliary gas supply branch.

[0111] For ease of understanding, in combination with the accompanying drawings, the auxiliary gas supply branch in the embodiments of the present disclosure will be described exemplarily.

[0112] Combined with Figure 1 and Figure 2 , refer to Figure 3 the schematic structural diagram of another gas supply pipeline in the embodiments of the present disclosure shown in Figure 3 As shown, the first auxiliary gas supply branch (not marked in the figure) may include: a first sub-gas supply pipe GS31 communicating with the first gas supply pipe GS1, and a third switching device AV2L disposed on the first gas supply pipe GS1, and the third switching device AV2L is in a normally closed state.

[0113] Specifically, when the first gas supply pipe GS1 supplies gas normally, both the first pneumatic valve AV1L and the second pneumatic valve AV2L are in an open state, while the third switching device AV2L is in a normally closed state, and the gas source can be supplied to the wafer processing equipment through the first gas supply pipe GS1.

[0114] When the first gas supply pipe GS1 is abnormal, while closing the gas supply path of the first gas supply pipe GS1, the third switching device AV2L is switched from the normally closed state to the conducting state, so that the gas supply can be transitioned from the first gas supply pipe GS1 to the first sub-gas supply pipe GS31.

[0115] In some optional examples, the third switching device AV2L and the first pneumatic valve AV1L may share the first pressure sensor PT1L, so as to reduce the use of components, reduce the implementation cost and the structural complexity.

[0116] In some embodiments, the type of the third switching device AV2L.

[0117] The second auxiliary gas supply branch (not marked in the figure) includes: a second sub-gas supply pipe GS32 communicating with the second gas supply pipe GS2, and a fourth switching device AV2R disposed on the second sub-gas supply pipe GS32, and the fourth switching device AV2R is in a normally closed state.

[0118] Specifically, when the second gas supply pipe GS2 supplies gas normally, both the first pneumatic valve AV1R and the second pneumatic valve AV2R are in an open state, while the fourth switching device AV2R is in a normally closed state, and the gas source can be supplied to the wafer processing equipment through the second gas supply pipe GS2. When the second gas supply pipe GS2 is abnormal, while closing the gas supply path of the second gas supply pipe GS2, the fourth switching device AV2R is switched from the normally closed state to the conducting state, so that the gas supply can be transitioned from the second gas supply pipe GS2 to the second sub-gas supply pipe GS32.

[0119] In some alternative examples, the fourth switching device AV2R and the first pneumatic valve AV1R can share the first pressure sensor PT1R, thereby reducing the use of components and lowering the implementation cost and structural complexity.

[0120] In some embodiments, the fourth switching device AV2R can include at least one of a solenoid valve, a pneumatic solenoid valve, or a manual valve.

[0121] The third auxiliary gas supply branch can include: a third sub-gas supply pipe G33 communicating with both the first sub-gas supply pipe G31 and the second sub-gas supply pipe G32; a second pressure regulating device REG2 disposed on the third sub-gas supply pipe G33, and a fifth switching device SF3 disposed on the third sub-gas supply pipe G33 and located between the second pressure regulating device REG2 and the first gas outlet OUT1.

[0122] By setting the second pressure regulating device REG2, the pressure of the gas source flowing in the third sub-gas supply pipe GS33 can be reduced, and by setting the fifth switching device SF3, the pressure of the gas source supplied to the wafer can be controlled, so that the pressure of the gas source provided by the third sub-gas supply pipe GS33 to the wafer can meet the production requirements.

[0123] In some embodiments, the fifth switching device SF3 can include: a third pressure sensor PT3 disposed on one side of the first gas outlet OUT1 of the third sub-gas supply pipe GS33 for detecting the pressure value of the gas source; a third pneumatic valve AV3 disposed between the third pressure sensor PT3 and the first gas outlet OUT1.

[0124] Specifically, after being buffered and depressurized by the third switching device AV2L and the second voltage regulator REG2, or after being buffered and depressurized by the fourth switching device AV2R and the second voltage regulator REG2, the pressure of the gas source decreases accordingly. By setting a third pressure sensor PT3 on one side of the first air outlet OUT1, the opening timing of the third pneumatic valve AV3 can be selected based on the detected pressure value of the gas source. In this way, the relative pressure of the gas source supplied to the wafer can meet the processing requirements of the wafer, thereby improving the processing quality of the wafer.

[0125] In some embodiments, the third pneumatic valve AV3 may include at least one of a solenoid valve.

[0126] In some alternative examples, the gas supply pipeline may further include a third filter F3 disposed on the third sub-gas supply pipeline GS33 and between the third switching device AV2L and the second voltage regulator REG2. In this way, when the third switching device AV2L or the fourth switching device AV2R is turned on, the gas source can flow through the third filter F3. Furthermore, the third filter F3 can filter out impurities in the gas source, improve the purity of the gas, reduce the contamination of the wafer, and improve the processing quality.

[0127] In some implementations, if the flow rate of the gas source is too fast, there may be a situation where part of the gas source is not filtered, or the filtering effect is poor, and there are still many impurities in the gas source. If the gas source is directly supplied to the wafer, the probability of the wafer being contaminated increases.

[0128] In this case, the third auxiliary gas supply branch may further include a fourth filter F4 disposed on the third sub-gas supply pipeline GS33 and between the fourth switching device SF3 and the second voltage regulator REG2. In this way, when the gas source flows through the fourth filter F4, the fourth filter F4 can filter out impurities in the gas source to improve the purity of the gas, thereby reducing the contamination of the wafer and improving the processing quality.

[0129] In some alternative examples, when it is necessary to repair the auxiliary gas supply branch, or at least one of the third switching device, the second voltage regulator, and the fourth switching device has an abnormal situation, if gas supply is directly carried out, the gas source may not reach the wafer, or there may be an abnormality on one side of the wafer, and when it is necessary to stop the current gas supply, the pipeline between the air inlet and the first air outlet needs to be blocked.

[0130] See Figure 1 , the third auxiliary gas supply branch may further include: an auxiliary switching device MV3 disposed on one side of the first air outlet OUT2 of the third sub-gas supply pipeline GS33 and selecting and connecting the pipeline between the fourth switching device SF3 and the first air outlet OUT1.

[0131] In this way, when it is necessary to stop the gas supply, the auxiliary gas supply branch between the air inlet IN1 and the first air outlet OUT1 can be blocked through the auxiliary switch device MV3, which facilitates the maintenance of the auxiliary gas supply branch and the replacement operation of other components on the auxiliary gas supply branch.

[0132] In some embodiments, the auxiliary switch device MV3 can be a manual valve. By adopting a manual valve, the probability of accidental closing of the auxiliary switch device MV3 can be reduced or avoided, improving the safety of use.

[0133] In some other embodiments, the auxiliary switch device MV3 can also include other electrically controlled valves such as pneumatic valves and solenoid valves.

[0134] In some embodiments, the first gas supply branch, the second gas supply branch, and the auxiliary gas supply branch can be an integrally formed structure to increase the sealing performance of the gas supply pipeline and simplify the manufacturing process. In other embodiments, the first gas supply branch, the second gas supply branch, and the auxiliary gas supply branch can be manufactured separately and then form the gas supply pipeline through an installation method.

[0135] It should be noted that the above describes multiple embodiment solutions provided by the embodiments of the present disclosure. The various optional methods introduced in each embodiment solution can be combined and cross-referenced with each other without conflict, thereby extending multiple possible embodiment solutions, which can all be considered as the embodiment solutions disclosed and made public by the present disclosure.

[0136] The present disclosure also provides a gas supply system corresponding to the gas supply pipeline described in any of the above embodiments, which is introduced below. It should be noted that the content of the gas supply system described below can be correspondingly referred to the content of the gas supply pipeline described above.

[0137] Combined Figure 1 , see Figure 4 As shown in the structural schematic diagram of a gas supply system of a semiconductor device in an embodiment of the present disclosure shown in Figure 4 As shown in

[0138] The gas supply system of the semiconductor device may include: the gas supply pipeline 110 described in any of the foregoing embodiments and a gas supply device 120 that is in communication with the gas supply pipeline 110 and provides a gas source.

[0139] Specifically, the air inlet IN1 of the air supply pipeline 110 can be connected to the air source outlet of the air supply device 120, and the first air outlet OUT1 of the air supply pipeline 110 can be connected to the wafer processing device. Then, when the air source outlet of the air supply device 120 is in an open state and the pipeline between the air inlet IN1 and the first air outlet OUT1 of the air supply pipeline 110 is in a conducting state, it can provide an air source that meets the processing requirements for the wafer processing device. For example, the pressure of the air source meets the production requirements.

[0140] In some embodiments of the present disclosure, the air supply device is taken as an example of a gas cylinder for illustration. In some other embodiments, the air supply device can be a vaporizer. The present disclosure does not impose any restrictions on the type of the air supply device as long as it can supply gas to the wafer processing device.

[0141] During the actual gas supply process, some gases (such as CL2 and HCL) are corrosive. If they remain in the air supply pipeline for a long time, they will corrode the air supply pipeline, reduce the service life of the air supply pipeline, and there will be a problem of inability to supply gas due to abnormal air supply pipeline.

[0142] Based on this, the gas supply system in the embodiments of the present disclosure may further include: a purge pipeline connected to the air supply pipeline to purge the air source in the air supply pipeline; and / or, a suction pipeline connected to the air supply pipeline to suck the air source in the air supply pipeline.

[0143] By setting the purge pipeline and / or the air supply pipeline, when the air supply pipeline is in an idle period (such as replacing a new air supply device or overhauling the valve disc), the residual air source in the air supply pipeline can be cleaned in time. This can reduce or avoid the damage of the residual air source to the air supply pipeline, and while improving the air supply pipeline, the gas supply quality can be improved.

[0144] In some embodiments, the purge pipeline and the air supply pipeline are not used simultaneously.

[0145] In some embodiments of the present disclosure, refer to Figure 5 the structural schematic diagram of another gas supply system of a semiconductor device in the embodiments of the present disclosure shown in Figure 5 As shown, when the gas supply system includes a purge pipeline 130, the purge pipeline 130 includes: a first purge branch (not marked in the figure) and a second purge branch (not marked in the figure) for the purge medium to flow through, and a third purge branch (not marked in the figure) respectively communicating with the first purge branch, the second purge branch, and the air supply pipeline (such as the first gas supply channel GS1).

[0146] In this way, by selecting different combinations of purge branches (such as the first purge branch and the third purge branch, the second purge branch and the third purge branch), the first gas supply pipeline GS1 can be purged by providing a purge medium (such as nitrogen) to clean the residual gas source in the first gas supply pipeline GS1.

[0147] In some embodiments, the first purge branch and the second purge branch with different structures are adopted to adapt to different purge scenarios.

[0148] For example, when the first purge branch is used to provide the purge gas, the pressure of the purge gas is relatively high and the flow rate of the purge gas is relatively fast, which can improve the purge efficiency; also for example, when the second purge branch is used to provide the purge gas, the pressure of the purge gas is relatively low and the flow rate of the purge gas is relatively slow. In this way, the contact time between the purge gas and the first gas supply pipeline GS1 can be increased to improve the purge effect.

[0149] In other words, by selecting purge channels with different air pressures during a single purge process, the cleaning effect can be improved.

[0150] For example, when the purge gas is a high-pressure gas, the first purge branch is used; and when the purge gas is a low-pressure gas, the second purge branch is used.

[0151] Next, referring to Figure 5 , the first purge branch may include: a first purge channel GS4 communicating with the third purge branch, and a first purge medium inlet IN3 on the side of the first purge channel GS4 away from the third purge branch; and an eighth switching device provided on the first purge channel GS4.

[0152] Specifically, when it is necessary to purge the gas supply pipeline, nitrogen can be introduced through the first purge medium inlet IN3, and the eighth switching device is in a gated state, and nitrogen can purge the first gas supply pipeline GS1 to clean the residual gas source in the first gas supply pipeline GS1 of the gas supply pipeline.

[0153] In some embodiments, the eighth switching device may include: a first purge pneumatic valve V1.

[0154] Next, referring to Figure 5 , the second purge branch may include: a second purge channel GS42 communicating with the third purge branch, and a second purge medium inlet IN4 on the side of the second purge channel GS42 away from the third purge branch; and a ninth switching device provided on the second purge channel GS42.

[0155] Specifically, when purging the gas supply pipeline is required, nitrogen can be introduced through the second purging medium inlet IN4, and the ninth switching device is in a gated state. Nitrogen can purge the first gas supply pipeline GS1 to clean the residual gas source in the first gas supply pipeline GS1 of the gas supply pipeline.

[0156] In some embodiments, the ninth switching device may include: a second purging pneumatic valve V2, a first check valve CV1, and a third purging pneumatic valve V3 sequentially arranged on the second purging channel GS42.

[0157] Specifically, by setting the second purging pneumatic valve V2 and the third purging pneumatic valve V3, the pressure of the purging gas can be reduced, and by setting the first check valve CV1 between the second purging pneumatic valve V2 and the third purging pneumatic valve V3, the problem that the purging gas flows back to the second purging medium inlet IN4 due to the pressure difference can be prevented.

[0158] In some embodiments, the second purging pneumatic valve V2 is a micro-leak pneumatic valve. Even when it is in a normally closed state, the purging gas can flow through. In this way, when the third purging pneumatic valve V3 is opened, the gas will not fill the entire second purging branch.

[0159] Next, refer to Figure 5 , the second purging branch may include: a third purging channel GS43 that is connected to the first purging branch, the second purging branch, and the first gas supply pipeline GS1, and a tenth switching device arranged on the third purging channel GS43.

[0160] Specifically, after determining the selected purging channel (for example, if the eighth switching device is in a gated state, the first purging channel GS41 is used to provide the purging medium; also for example, if the ninth switching device is in a gated state, the second purging channel GS42 is used to provide the purging medium), the purging medium in the purging channel can be supplied to the first gas supply pipeline GS1 by gating the tenth switching device, so that the purging medium can flow from the inlet IN1 side to the outlet OUT1 side of the first gas supply pipeline GS1 to purge the residual gas source in the first gas supply pipeline GS1.

[0161] In some embodiments, the tenth switching device includes a third check valve CV2L and a fourth purging pneumatic valve AV3L sequentially arranged on the third purging channel GS43.

[0162] Refer to Figure 5, the air supply pipeline GS1 includes an air inlet IN1 and a first air outlet OUT1. When the air supply system includes a suction pipeline 140, the suction pipeline 140 may include: a negative pressure generating device (not shown in the figure) that generates negative pressure; a first suction branch (not shown in the figure) that is respectively communicated with the negative pressure generating device, a second suction branch (not shown in the figure) that is respectively communicated with the first suction branch and one side of the air inlet IN1 of the first air supply pipeline GS1, and a third suction branch (not shown in the figure) that is respectively communicated with the first suction branch and one side of the first air outlet OUT1 of the first air supply pipeline GS1.

[0163] Specifically, the negative pressure generating device can generate a negative pressure environment. In this way, when the eleventh switching device is in the gated state, under the action of the pressure difference, the gas source in the air supply pipeline GS1 can be sucked to the negative pressure generating device through the first suction branch and the second suction branch, or the first suction branch and the third suction branch, and then flow to the outside.

[0164] And by respectively arranging the second suction branch and the third suction branch, the gas source in the first air supply pipeline GS1 can be sucked in sections, so as to reduce the suction distance and reduce the pressure loss caused by too long suction distance, so as to improve the suction effect.

[0165] In some examples, if the pipeline flow path between the first suction branch and the second suction branch is gated, the gas in the pipeline on the outlet side can be sucked; if the pipeline flow path between the first suction branch and the second suction branch is gated, the gas in the pipeline on the air supply side can be sucked.

[0166] In some embodiments of the present disclosure, the negative pressure generating device can realize sucking the gas source based on the Venturi effect.

[0167] More specifically, referring to Figure 5 , the negative pressure generating device may include a negative pressure generating pipeline GS54. One end of the negative pressure generating pipeline GS54 has an inlet IN5, the other end has an outlet OUT3, and a third one-way valve CV3, a negative pressure generating valve V4 and a Venturi tube VE are sequentially arranged between the inlet IN5 and the outlet OUT3 of the negative pressure generating pipeline GS54, and the Venturi tube VE is communicated with the first suction branch.

[0168] Specifically, by setting the third one-way valve CV3, the negative pressure generating valve V4, and the Venturi tube VE, when the suction gas flows through the Venturi tube VE, the flow rate of the suction gas at the narrow part will increase, the static pressure will decrease, and the dynamic pressure will increase. When passing through the Venturi tube VE, the flow rate will slow down, the static pressure will increase, and the dynamic pressure will decrease. This pressure change will cause an instantaneous vacuum effect in the suction gas inside the Venturi tube VE, thereby generating a vacuum. The first suction branch includes: a first suction channel GS51 that is respectively connected to the negative pressure generating device, the second suction branch, and the third suction branch; and an eleventh switching device V5 provided on the first suction channel GS51.

[0169] Specifically, the eleventh switching device V5 is used to control the on-off between the first suction channel GS51 and the second suction branch and the third suction branch. By controlling the state of the eleventh switching device V5, the suction function can be achieved.

[0170] The eleventh switching device V5 may include a first suction valve. For example, the first suction valve may be a manual valve. In some other embodiments, the first suction valve may also be an electrically controlled valve such as a pneumatic valve or a solenoid valve.

[0171] The second suction branch may include: a second suction channel GS52 that is connected to one side of the gas inlet IN1 of the first gas supply pipeline GS1; and a twelfth switching device provided on the second suction channel GS52.

[0172] Specifically, the twelfth switching device selects and passes the path between the second suction channel GS52 and the first suction channel GS51, so that the gas in the gas supply side pipeline can be directly sucked.

[0173] In some embodiments, the twelfth switching device may include: a second suction valve AV4L provided on the second suction channel GS52.

[0174] Among them, the second suction valve AV4L may be at least one of electrically controlled valves such as a pneumatic valve or a solenoid valve.

[0175] The third suction branch may include: a third suction channel GS53 that is connected to one side of the first outlet OUT1 of the first gas supply pipeline GS1; and a thirteenth switching device provided on the third suction channel GS53.

[0176] Specifically, the thirteenth switching device can select and pass the path between the third suction channel GS53 and the first suction channel GS51, so that the gas in the gas outlet side pipeline can be directly sucked.

[0177] In some embodiments, the thirteenth switching device may include: a fourth one-way valve CV4L and a third suction valve V6L that are sequentially provided on the third suction channel GS53.

[0178] Among them, the third suction valve V6L can be at least one of electrically controlled valves such as pneumatic valves and solenoid valves.

[0179] It should be noted that Figure 5 only the structural schematic diagram when the air supply pipeline has one air supply branch is shown. When the air supply pipeline includes more air supply branches, the structures of the Figure 5 purge pipeline and / or the suction pipeline in it can be expanded respectively to perform purge or suction operations on more air supply branches.

[0180] For example, refer to Figure 6 the structural schematic diagram of another air supply system in the embodiment of the present disclosure shown in Figure 6 As shown, the air supply pipeline includes a first air supply branch, a second air supply branch, and an auxiliary air supply branch respectively communicating with the first air supply branch and the second air supply branch. Among them, the structures and working principles of the first air supply branch, the second air supply branch, and the auxiliary air supply branch can refer to the foregoing examples.

[0181] In this case, the purge pipeline can further include a fourth purge branch respectively communicating with the third purge branch and the second air supply branch (such as the second air supply pipeline GS2).

[0182] Among them, the fourth purge branch can include: a fourth purge channel GS44 respectively communicating with the third purge branch (such as the third purge channel GS43) and the second air supply branch (such as the second air supply pipeline GS2), and a fifth one-way valve CV2R and a fifth purge pneumatic valve AV3L sequentially arranged on the fourth purge channel GS44. The working principles and connection relationships of the fifth one-way valve CV2R and the fifth purge pneumatic valve AV3L can refer to the description of the tenth switching device, and the difference between the two is only the different air supply branches to be purged.

[0183] Thus, by adding the fourth purge branch, the purge range of the purge pipeline can be extended, and further, purge operations can be performed on multiple air supply branches, which can reduce the implementation cost and the structural complexity of the air supply system.

[0184] Then refer to Figure 6 , the suction pipeline can further include a fourth suction branch (not marked in the figure) respectively communicating with the first suction branch and the second air supply branch.

[0185] Among them, the fourth suction branch may include a fourth suction channel GS55 communicating with the first suction branch (such as the first suction channel GS51), a fifth suction channel GS56 respectively communicating with one side of the air inlet IN2 of the fourth suction channel GS55 and the second air supply branch, and a fourth suction valve AV4R sequentially arranged on the fifth suction channel GS56; and a sixth suction channel GS57 respectively communicating with one side of the fourth suction channel GS55 and the first air outlet OUT1 of the second air supply branch, and a sixth one-way valve CV4R and a fifth suction valve V6R sequentially arranged on the sixth suction channel GS57.

[0186] In other words, the same suction principle and structure as the first air supply pipeline GS1 can be adopted to suck the air source in the second air supply pipeline GS2. The specific scheme for sucking the air source in the second air supply pipeline GS2 can refer to the description of the first air supply pipeline GS1 above and will not be described here.

[0187] Next, refer to Figure 6 , the suction pipeline may further include a fifth suction branch (not marked in the figure) respectively communicating with the first suction branch and the auxiliary air supply branch.

[0188] Among them, the fifth suction branch may include: a seventh suction channel GS58 respectively communicating with the first suction branch (such as the first suction channel GS51) and the auxiliary air supply branch (such as the third sub-air supply pipeline GS33), and a seventh one-way valve CV5 and a sixth suction valve V7 sequentially arranged on the seventh suction channel GS58 (for example, one end of the sixth suction valve V7 may be located on the third sub-air supply pipeline GS33 where the second switching device is located).

[0189] In some embodiments of the present disclosure, the above air supply system can be applied to various processing scenarios.

[0190] As an optional example, the air supply system can be applied to semiconductor equipment. More specifically, the semiconductor equipment may include the air supply system of the semiconductor equipment described in any of the foregoing embodiments, and a wafer processing equipment connected to the air supply system.

[0191] It should be noted that in this specification, for the convenience of description and distinction of similar objects, prefixes such as "first", "second", and "third" can be added before similar objects. These prefixes are only for the purpose of description and distinction, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features, nor are they used to limit the order or sequence, and can be adjusted under appropriate circumstances.

[0192] Although the present disclosure is disclosed as above, the present utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the scope defined by the claims.

Claims

1. A gas supply pipeline for semiconductor equipment, characterized in that: The invention comprises at least one gas supply branch, wherein the gas supply branch comprises: an air supply conduit having an air inlet and a first air outlet, wherein the air inlet is in communication with an air source; A first switch device disposed on the gas supply pipeline for switching on the pipeline between the gas inlet and the first gas outlet; A first pressure regulating device disposed on the gas supply pipeline and located between the first switch device and the first gas outlet; A second switch device is provided on the gas supply pipeline, located between the first pressure regulating device and the first gas outlet, and switches on the pipeline between the first pressure regulating device and the first gas outlet.

2. The gas supply pipeline according to claim 1, characterized in that: The first switching device comprises: A first pressure sensor disposed at one side of the air inlet of the air supply pipeline and detecting the pressure value of the air source; A first pneumatic valve is disposed between the first pressure sensor and the first pressure regulating device.

3. The gas supply pipeline according to claim 1, characterized in that: The first pressure regulating device includes a pressure regulating valve.

4. The gas supply pipeline according to claim 1, characterized in that: The second switching device comprises: A second pressure sensor is disposed at one side of the first air outlet of the air supply pipeline and detects the pressure value of the air source; A second pneumatic valve is disposed between the second pressure sensor and the first air outlet.

5. The gas supply pipeline according to claim 1, characterized in that: At least one gas supply branch includes a first gas supply branch and a second gas supply branch, wherein the first gas supply pipe of the first gas supply branch and the second gas supply pipe of the second gas supply branch share the first gas outlet, and the second switch device of the first gas supply branch and the second switch device of the second gas supply branch have different switching states, and the first switch device of the first gas supply branch and the first switch device of the second gas supply branch have the same switching states.

6. The gas supply pipeline according to claim 5, characterized in that: Also includes: an auxiliary air supply branch connected to the first air supply branch and the second air supply branch respectively; The auxiliary air supply branch includes: a first auxiliary air supply branch connected to the first air supply branch, a second auxiliary air supply branch connected to the second air supply branch, and a third auxiliary air supply branch connected to both the first auxiliary air supply branch and the second auxiliary air supply branch, and the third auxiliary air supply branch shares the first air outlet with the first air supply branch and the second air supply branch.

7. The gas supply pipeline according to claim 6, characterized in that: The first auxiliary air supply branch comprises: a first sub-air supply pipeline connected to the first air supply pipeline, and a third switch device arranged on the first sub-air supply pipeline, wherein the third switch device is in a normally closed state; The second auxiliary gas supply branch comprises: a second sub-gas supply pipeline connected to the second gas supply pipeline, and a fourth switch device arranged on the second sub-gas supply pipeline, wherein the fourth switch device is in a normally closed state; The third auxiliary air supply branch includes: a third sub-air supply pipeline connected to both the first sub-air supply pipeline and the second sub-air supply pipeline; a second pressure regulating device arranged on the third sub-air supply pipeline, and a fifth switching device arranged on the third sub-air supply pipeline and located between the second pressure regulating device and the first air outlet.

8. The gas supply pipeline according to claim 1, characterized in that: Also includes: A first filter disposed on the gas supply pipeline and located between the first switch device and the first voltage regulating device; And / or a second filter disposed on the air supply pipeline and located between the second switch device and the first voltage regulating device.

9. The gas supply pipeline according to claim 1, characterized in that: Also includes: A controller is connected to the first switching device and the second switching device, and changes the switching states of the first switching device and the second switching device.

10. The gas supply pipeline according to claim 1, characterized in that: Also includes: A sixth switch device is disposed at one side of the first air outlet of the air supply pipeline and switches on the pipeline between the second switch device and the first air outlet.

11. The gas supply pipeline according to claim 1, characterized in that: The air supply branch also includes a spare pipeline connected to the air supply pipeline, and the spare pipeline has at least one second air outlet on the same side as the first air outlet, and a seventh switch device is arranged on the spare pipeline to select the pipeline between the air inlet and the second air outlet.

12. A gas supply system for semiconductor equipment, characterized in that: include: The gas supply pipeline according to any one of claims 1 to 11; A gas supply device is connected to the gas supply pipeline to provide a gas source.

13. The gas supply system according to claim 12, characterized in that: Also includes: A purge pipeline connected to the air supply pipeline to purge the air source in the air supply pipeline; and / or a suction pipeline connected to the air supply pipeline to suck the air source in the air supply pipeline.

14. The gas supply system according to claim 13, characterized in that: In the case where the gas supply system includes the purge pipeline, the purge pipeline includes: a first purge branch and a second purge branch for the circulation of a purge medium, and a third purge branch respectively connected to the first purge branch, the second purge branch and the gas supply pipeline; Wherein, the first purge branch comprises: a first purge channel connected to the third purge branch, and a first purge medium inlet is provided on a side of the first purge channel away from the third purge branch; and an eighth switch device is arranged on the first purge channel; The second purge branch comprises: a second purge channel connected to the third purge branch, and a second purge medium inlet is provided on a side of the second purge channel away from the third purge branch; and a ninth switch device is arranged on the second purge channel; The third purge branch includes: a third purge channel connected to the first purge branch, the second purge branch and the gas supply pipeline, and a tenth switch device arranged on the third purge channel.

15. The gas supply system according to claim 13, characterized in that: The air supply pipeline includes an air inlet and a first air outlet In the case where the air supply system includes the suction pipeline, the suction pipeline includes: a negative pressure generating device that generates negative pressure; a first suction branch respectively connected to the negative pressure generating device, and a second suction branch respectively connected to the first suction branch and the air inlet side of the air supply pipeline, and a third suction branch respectively connected to the first suction branch and the first air outlet side of the air supply pipeline.

16. The gas supply system according to claim 15, characterized in that The first suction branch comprises: a first suction channel connected to the negative pressure generating device, the second suction branch and the third suction branch respectively; and an eleventh switch device arranged on the first suction channel; The second suction branch comprises: a second suction channel connected to one side of the air inlet of the air supply pipe; and a twelfth switch device arranged on the second suction channel; The third suction branch includes: a third suction channel connected to one side of the first outlet of the air supply pipeline; and a thirteenth switch device arranged on the third suction channel.

17. A semiconductor device, characterized in that: include: A gas supply system for a semiconductor device as claimed in any one of claims 12 to 16; Wafer processing equipment connected to the gas supply system.

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