Headlamp based on MICROLED light source

Abstract

The headlamp based on the MICROLED light source comprises a controller, the MICROLED light source, a PCB, a heat conduction layer, a semiconductor chilling plate and a fan, the MICROLED light source, the PCB, the heat conduction layer, the semiconductor chilling plate and the fan are sequentially stacked, and the controller is electrically connected with the PCB, the semiconductor chilling plate and the fan. According to the utility model, the MICROLED light source is applied to the headlamp, the MICROLED light source is quickly cooled through the semiconductor chilling plate with a smaller area and the fan, and meanwhile, the temperature sensor is integrated on the CMOS layer in the MICROLED light source, so that the internal temperature of the light source is directly sensed, the light source of the headlamp is cooled in time, the temperature of the light source of the headlamp is effectively prevented from being too high, and the service life of the headlamp is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of headlamp design, in particular to a headlamp based on a MICROLED light source. Background Technique

[0002] The size of MICROLED is usually less than 100μm, with extremely high pixel density, and can achieve direct high-definition imaging with tens of thousands of pixels. The most common application field of MICROLED is the display technology field, and its application in the headlamp field is less. With the improvement of people's requirements for vehicle experience, the application prospect of MICROLED technology in the automotive headlamp field is also broader. It can not only provide high-definition lighting, but also improve road safety and vehicle interaction experience through intelligent control.

[0003] However, compared with the display technology field, the headlamp has higher requirements for illumination brightness. Applying high-energy MICROLED to the vehicle lamp has high requirements for its heat dissipation. If the temperature inside the light source is too high, the electrical components inside the MICROLED will be damaged and clear imaging cannot be achieved.

[0004] Due to the limited space of the headlamp, a complex heat dissipation structure cannot be installed inside the lamp housing. Traditional headlamps usually use aluminum sheets, fans, etc. for heat dissipation, and the heat dissipation efficiency is not high, which cannot meet the heat dissipation of MICROLED. Moreover, the traditional heat dissipation structure can only install the temperature sensing element on the circuit board outside the light source, and can only detect the temperature outside the light source, resulting in deviation and delay in temperature detection, thus reducing the service life of the light source.

[0005] Due to the immaturity of the heat dissipation technology, the use cost and space requirements of MICROLED headlamps are relatively high, and they can only be applied to high-end models at present and cannot be widely promoted. Therefore, how to design a MICROLED light source-based headlamp with low cost, simple structure and good heat dissipation effect is a technical problem that needs to be solved at present. Summary of the Utility Model

[0006] In order to solve the technical problem that the heat dissipation structure of the existing headlamp cannot meet the heat dissipation requirements of the MICROLED light source, resulting in the inability of the MICROLED light source to be widely applied in the automotive headlamp field, the utility model provides a headlamp based on a MICROLED light source to solve the above problems.

[0007] The technical solution adopted by the utility model to solve its technical problems is: a headlamp based on a MICROLED light source, including a controller and a MICROLED light source, a PCB board, a heat conduction layer, a semiconductor refrigeration sheet and a fan stacked in sequence, and the controller is electrically connected to the PCB board, the semiconductor refrigeration sheet and the fan.

[0008] The MICROLED light source includes a number of integrally packaged MICROLEDs, a bonding layer, a CMOS layer, and a substrate layer. The MICROLEDs are electrically connected to the CMOS layer through the bonding layer, the CMOS layer is electrically connected to the substrate layer, and a temperature sensor is provided on the CMOS layer. When the temperature inside the MICROLED light source reaches a specified value, the controller controls the start or stop of the thermoelectric cooler and the fan.

[0009] Further, the thermoelectric cooler includes metal plates at both ends, an N-type semiconductor and a P-type semiconductor connected between the metal plates, and ceramic gaskets outside the metal plates. One end of the ceramic gasket is connected to the heat conduction layer, and a wire is connected to the metal plate at the end away from the MICROLED light source.

[0010] Further, the PCB board is a copper substrate.

[0011] Further, the ceramic gasket is connected to the metal plate through a heat-conducting adhesive.

[0012] Further, the substrate layer is a resin substrate, and pads for soldering the lead-out wires of the CMOS layer are provided on the substrate layer.

[0013] Further, the metal plate is a copper substrate.

[0014] Further, the pixel of each MICROLED is less than 100 microns.

[0015] Further, the thickness of the PCB board is 1 mm - 2 mm.

[0016] The beneficial effects of the present utility model are as follows:

[0017] (1) The present utility model applies the MICROLED light source to the headlamp, which can not only provide high-definition lighting, but also improve road safety and vehicle interaction experience through intelligent control. The headlamp uses a thermoelectric cooler and a fan with a small area to quickly dissipate heat from the MICROLED light source. At the same time, a temperature sensor is integrated on the CMOS layer in the MICROLED light source to directly sense the internal temperature of the power supply, timely dissipate heat from the power supply, effectively avoid excessive power supply temperature, and improve the service life of the vehicle lamp.

[0018] (2) By reasonably setting the materials and dimensions of each component, the present utility model enables the headlamp to have a lower system cost, a smaller system volume, and a higher luminous efficiency. Description of the Drawings

[0019] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0020] Figure 1It is a schematic diagram of the specific implementation of the headlamp based on the MICROLED light source described in the present utility model;

[0021] Figure 2 It is a schematic diagram of the MICROLED light source in the present utility model;

[0022] Figure 3 It is a schematic diagram of the semiconductor refrigeration sheet in the present utility model.

[0023] In the figure, 1 is a controller, 2 is a MICROLED light source, 201 is a MICROLED, 202 is a bonding layer, 203 is a CMOS layer, 204 is a substrate layer, 205 is a packaging adhesive, 3 is a PCB board, 4 is a heat conduction layer, 5 is a semiconductor refrigeration sheet, 501 is a metal plate, 502 is an N-type semiconductor, 503 is a P-type semiconductor, 504 is a ceramic gasket, 505 is a wire, 506 is a heat conduction adhesive, and 6 is a fan. Specific implementation

[0024] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0025] As Figures 1-3 shown, a headlamp based on a MICROLED light source includes a controller 1 and a MICROLED light source 2, a PCB board 3, a heat conduction layer 4, a semiconductor refrigeration sheet 5, and a fan 6 that are stacked in sequence. The controller 1 is electrically connected to the PCB board 3, the semiconductor refrigeration sheet 5, and the fan 6. The MICROLED light source 2 is used to provide illumination and form a clear pattern. The PCB board 3 is used to control the turning on or off of the MICROLED light source 2. The semiconductor refrigeration sheet 5 is a cooling device composed of semiconductors, and its characteristics are no moving parts, small volume, and relatively high reliability.

[0026] The PCB board 3 is a connection structure between the MICROLED light source 2 and the heat conduction layer 4. It is made of a copper substrate material and has good heat conductivity. Compared with a resin substrate, the copper substrate has a higher density and a higher cost. In order to ensure its good heat dissipation effect and practicability, the PCB board 3 needs to meet certain thickness requirements. The thickness of the PCB board 3 in the present utility model is preferably 1 mm - 2 mm.

[0027] The MICROLED light source 2 includes a number of MICROLEDs 201, a bonding layer 202, a CMOS layer 203, and a substrate layer 204 that are integrally encapsulated. The MICROLEDs 201 are electrically connected to the CMOS layer 203 through the bonding layer 202. The CMOS layer 203 is electrically connected to the substrate layer 204. A temperature sensor is provided on the CMOS layer 203. When the temperature inside the MICROLED light source 2 reaches a specified value, the controller 1 controls the thermoelectric cooler 5 and the fan 6 to start. To ensure clear and accurate imaging, the pixel of each MICROLED 201 is usually less than 100 microns. The bonding layer 202 is used to bond the MICROLEDs 201 and the CMOS layer 203 to achieve the electrical signal connection of the CMOS layer 203 to each MICROLED 201. The MICROLEDs 201, the bonding layer 202, the CMOS layer 203, and the substrate layer 204 are integrally encapsulated and fixed by the encapsulation adhesive 205. The substrate layer 204 serves as the carrier of the light source and is generally a resin substrate for easy heat dissipation. Pads for soldering the lead-out wires of the CMOS layer 203 are provided on the substrate layer 204.

[0028] The headlamp of the present utility model uses the MICROLED light source 2 to replace the traditional LED lamp. Compared with the traditional vehicle lamp heat dissipation structure, the thermoelectric cooler 5 with fast heat dissipation speed and small occupied area and the fan 6 are combined. At the same time, the temperature sensor is integrated inside the MICROLED light source 2 to timely feedback the internal temperature of the power supply, thereby avoiding damage to the internal components of the power supply caused by untimely cooling.

[0029] After the MICROLED light source 2 starts to work, a large amount of heat will be generated. The internal CMOS layer 203 has a temperature detection function. When the temperature exceeds the threshold range, a signal is sent to the controller 1. The internal chip of the controller 1 is converted into a current signal to control the current of the thermoelectric cooler 5 and turn on the fan 6. The heat of the thermoelectric cooler 5 is conducted from one side of the MICROLED light source 2 to the side of the fan 6 and finally dissipated by the fan 6 to achieve temperature control and heat dissipation of the MICROLED light source 2.

[0030] The thermoelectric cooler 5 generally includes metal plates 501 at both ends, an N-type semiconductor 502 and a P-type semiconductor 503 connected between the metal plates 501, and ceramic gaskets 504 outside the metal plates 501. One end of the ceramic gasket 504 is connected to the heat conduction layer 4, and a wire 505 is connected to the metal plate 501 at the end far from the MICROLED light source 2. The ceramic material has insulation and good heat conductivity, and can transfer the heat of the upper layer to the lower layer. As Figure 3 shown, the upper ceramic gasket 504 is connected to the heat conduction layer 4, which is the cold end of the thermoelectric cooler 5. The positive and negative poles are provided on the lower metal plate 501 and are respectively connected to the controller 1 through the wires 505.

[0031] The fixation of the ceramic gasket 504 and the metal plate 501 can be welding fixation or adhesive bonding fixation. The present utility model preferably connects them through a heat-conducting adhesive 506 with good heat conductivity.

[0032] The metal plate 501 is also preferably a copper substrate with good heat dissipation.

[0033] The headlamp described in the present utility model adopts a MICROLED light source 2. Through the selection of high heat-conducting materials for the semiconductor refrigeration sheet 5, the fan 6 and each component, rapid heat dissipation in a small space is achieved, thereby ensuring the service life of the headlamp, reducing the use cost, and contributing to its popularization in ordinary vehicle models.

[0034] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations. In addition, in the description of the present utility model, unless otherwise stated, the meaning of "a number of" is two or more.

[0035] In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments.

[0036] Based on the above inspiration from the ideal embodiments of the present utility model, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A headlamp based on MICROLED light source, characterized in that: It includes a controller and a MICROLED light source, a PCB board, a heat-conducting layer, a semiconductor cooling sheet and a fan which are stacked in sequence, wherein the controller is electrically connected to the PCB board, the semiconductor cooling sheet and the fan; The MICROLED light source includes a plurality of MICROLEDs, a bonding layer, a CMOS layer and a substrate layer which are integrally packaged. The MICROLED is electrically connected to the CMOS layer via the bonding layer, and the CMOS layer is electrically connected to the substrate layer. A temperature sensor is arranged on the CMOS layer. When the temperature inside the MICROLED light source reaches a specified value, the controller controls the semiconductor cooling sheet and the fan to start or shut down.

2. The headlamp based on MICROLED light source according to claim 1, characterized in that: The semiconductor cooling plate includes metal plates at both ends, an N-type semiconductor and a P-type semiconductor connected between the metal plates, and a ceramic gasket located outside the metal plates, wherein one end of the ceramic gasket is connected to the heat conductive layer, and the metal plate at one end away from the MICROLED light source is connected to a wire.

3. The headlamp based on MICROLED light source according to claim 1, characterized in that: The PCB board is a copper substrate.

4. The headlamp based on MICROLED light source according to claim 2, characterized in that: The ceramic gasket is connected to the metal plate via heat-conducting adhesive.

5. The headlamp based on MICROLED light source according to claim 1, characterized in that: The substrate layer is a resin substrate, and a pad for welding the lead wires of the CMOS layer is arranged on the substrate layer.

6. The headlamp based on MICROLED light source according to claim 2, characterized in that: The metal plate is a copper substrate.

7. The headlamp based on MICROLED light source according to claim 2, characterized in that: Each MICROLED pixel is less than 100 microns.

8. The headlamp based on MICROLED light source according to claim 3, characterized in that: The thickness of the PCB board is 1mm-2mm.

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