Heat dissipation device based on shape memory alloy

Abstract

The utility model relates to the technical field of shape memory alloy, in particular to a heat dissipation device based on shape memory alloy. A heat dissipation device based on shape memory alloy comprises heat dissipation equipment and is characterized by further comprising at least one shape memory alloy layer used for absorbing heat dissipated by a heat source. The surface of the shape memory alloy layer is in thermal contact with the heat source and the heat dissipation equipment respectively; when heat of a heat source is not absorbed, the internal microstructure of the shape memory alloy is martensite or martensite and austenite coexist. According to the heat dissipation device provided by the utility model, the characteristic that a large amount of latent heat can be absorbed when the internal microstructure of the shape memory alloy is converted from martensite to austenite is utilized, and a plurality of layers of shape memory alloy combinations are utilized, so that the heat dissipation efficiency of a heat source is improved; the temperature of the heat source is effectively prevented from rising or the heat source is cooled to a proper working temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of shape memory alloys, and particularly relates to a heat dissipation device based on shape memory alloys. Background Art

[0002] A shape memory alloy is a thermoelastic alloy material composed of two or more metal elements that has a shape memory effect through martensitic phase transformation and its reverse transformation. Currently, shape memory alloys have been successfully applied in fields such as electronic devices, aerospace, and medicine.

[0003] When shape memory alloys are applied in electronic devices, they mainly utilize the characteristics that shape memory alloys deform after absorbing heat and recover their shape after dissipating heat. For example: a ceramic backplane structure of a 5G mobile phone with easy heat dissipation. In this structure, the heat sink is made of shape memory alloy material, which deforms after being heated, causing the heat sink to tilt towards the inside of the heat dissipation cavity, exposing the heat dissipation port and accelerating the heat dissipation efficiency. A 5G base station AAU radiator based on memory alloy. In this radiator, the fins are made of shape memory alloy. The fins deform due to the heat generated by the 5G base station AAU system, and the heat dissipation area is increased after deformation, keeping the chip temperature within the normal operating range.

[0004] Based on the above application situations, when shape memory alloys dissipate heat, they all utilize shape memory alloys as a heat conduction medium and the characteristics of deforming when heated and recovering their shape when dissipating heat, ignoring the fact that the phase transformation process of shape memory alloys from martensite to austenite itself can absorb a large amount of latent heat, and also not using a combination of multiple shape memory alloys to improve the heat dissipation efficiency. Content of the Utility Model

[0005] In view of the above technical problems, the utility model provides a heat dissipation device based on shape memory alloys. This heat dissipation device utilizes the fact that the phase transformation process of the internal microstructure of shape memory alloys from martensite to austenite can absorb a large amount of latent heat, achieving the purpose of dissipating heat from the heat source.

[0006] To solve the above technical problems, the embodiments of the utility model adopt the following technical solutions:

[0007] In a first aspect, the embodiments of the utility model provide a heat dissipation device based on shape memory alloys, including a heat dissipation device, and further including at least one shape memory alloy layer for absorbing the heat dissipated by the heat source;

[0008] The surfaces of the shape memory alloy layer are in thermal contact with the heat source and the heat dissipation device respectively;

[0009] When not absorbing the heat of the heat source, the internal microstructure of the shape memory alloy is martensite or a coexistence of martensite and austenite.

[0010] In the present utility model, the heat source can be structures or objects that need to dissipate heat, such as chips, graphics cards, central processing units, water, etc. The surface of the shape memory alloy layer is in thermal contact with the heat source and the heat dissipation device. When the shape memory alloy layer absorbs the heat of the heat source, since the internal microstructure of the shape memory alloy layer is martensite or a coexistence of martensite and austenite, the martensite gradually increases in temperature after absorbing the heat dissipated by the heat source and gradually transforms into austenite, and a large amount of latent heat needs to be absorbed during the phase change process from martensite to austenite. At the same time, the shape memory alloy transfers the absorbed heat to the heat dissipation device, improving the heat dissipation efficiency of the heat source.

[0011] In some possible implementation manners, the austenite phase change termination temperature (the characteristic temperature at which martensite is completely transformed into austenite) of the shape memory alloy layer ≤ the limit working temperature of the heat source. The limit working temperature of the heat source can be the highest temperature when chips, graphics cards, central processing units, etc. maintain a normal working state, or the highest temperature of the heat dissipation temperature that the heat source such as water wants to reach. The austenite phase change termination temperature of the shape memory alloy layer ≤ the limit working temperature of the heat source can ensure that when all the internal microstructures of the shape memory alloy layer become austenite, the heat source has not reached the limit working temperature or has just reached the limit working temperature.

[0012] In some possible implementation manners, the austenite phase change initial temperature (the characteristic temperature at which martensite begins to transform into austenite) of the shape memory alloy layer ≥ the suitable working temperature of the heat source. The suitable working dimension of the heat source can be the temperature at which chips, graphics cards, central processing units, etc. are in the best working state, or the best temperature that the heat source such as water wants to reach. The austenite phase change initial temperature of the shape memory alloy layer ≥ the suitable working temperature of the heat source can ensure that when the heat source reaches the upper limit of the suitable working temperature, the internal microstructure of the shape memory alloy layer begins to transform from martensite to austenite.

[0013] In some possible implementation manners, the shape memory alloy layer includes a first surface and a second surface that are oppositely arranged, and a third surface adjacent to the first surface;

[0014] Wherein, any one surface is in thermal contact with the heat dissipation device and the heat source respectively; or the heat dissipation device and the heat source are respectively in contact with any two surfaces of the shape memory alloy layer.

[0015] In some possible implementation manners, the heat dissipation device is in thermal contact with the heat source. The heat dissipation device can directly dissipate heat from the heat source, and can also dissipate heat from the shape memory alloy layer that absorbs the heat of the heat source.

[0016] In some possible implementation manners, the deformation direction of the shape memory alloy layer does not affect the normal operation of the heat source and the heat dissipation device. In the present utility model, the deformation direction of the shape memory alloy layer can be adjusted so that the main deformation direction of the shape memory alloy does not affect the normal operation of the heat source and the heat dissipation device, and the influence of the deformation in other directions except the main deformation direction on the heat source and the heat dissipation device can be ignored.

[0017] In some possible implementation manners, two or more layers of the shape memory alloy layer are provided. Among them, for any two adjacent shape memory alloy layers, the martensite phase transformation termination temperature (the characteristic temperature at which austenite is completely transformed into martensite) of the shape memory alloy layer closer to the heat source ≤ the martensite phase transformation termination temperature of the shape memory alloy layer closer to the heat dissipation device. When the heat source operates at low power or stops operating or the heat source has cooled to an appropriate operating temperature, considering that the temperature of the shape memory alloy closer to the heat dissipation device is not higher than (lower than or equal to) the temperature of the shape memory alloy closer to the heat source, this can ensure that during the heat dissipation and cooling process, the shape memory alloy closer to the heat dissipation device completes the transformation from austenite to martensite or the initial state of coexistence of martensite and austenite prior to the shape memory alloy closer to the heat source, realizing cyclic heat absorption and heat dissipation. Considering that the phase transformation process of austenite to martensite of the shape memory alloy closer to the heat source will release latent heat, the shape memory alloy layer closer to the heat dissipation device can continue to absorb the heat of the shape memory alloy layer closer to the heat source and realize the phase transformation from martensite to austenite, and this phase transformation process requires a large amount of latent heat absorption, and can further dissipate heat outward through the heat dissipation device, thereby greatly reducing the transfer of the heat released during the phase transformation process of austenite to martensite of the shape memory alloy layer closer to the heat source to the heat source direction.

[0018] In some possible implementation manners, the heat dissipation device is selected from one of a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat pipe, a ring-shaped cold pump, graphite or graphene. The heat dissipation device includes, but is not limited to, a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat pipe, a ring-shaped cold pump, graphite or graphene, as long as it can transfer the heat absorbed by the shape memory alloy layer outward.

[0019] In some possible implementation manners, the shape memory alloy is selected from one or more of a nickel-titanium alloy, a nickel-titanium-copper alloy, a nickel-titanium-copper-cobalt alloy, a nickel-titanium-copper-vanadium alloy, a nickel-iron-gallium alloy, a copper-aluminum-zinc alloy, a copper-aluminum-manganese alloy or a copper-aluminum-nickel alloy. The shape memory alloy includes, but is not limited to, a nickel-titanium alloy, a nickel-titanium-copper alloy, a nickel-titanium-copper-cobalt alloy, a nickel-titanium-copper-vanadium alloy, a nickel-iron-gallium alloy, a copper-aluminum-zinc alloy, a copper-aluminum-manganese alloy or a copper-aluminum-nickel alloy, as long as it can satisfy absorbing the heat dissipated by the heat source and has a martensite or coexistence of martensite and austenite in its internal microstructure.

[0020] In some possible implementation manners, the heat dissipation device further includes a unidirectional heat conduction device located between the heat source and the shape memory alloy layer, configured to unidirectionally transfer the heat dissipated by the heat source to the shape memory alloy layer; the unidirectional heat conduction device is in thermal contact with the heat source and the shape memory alloy layer. By providing a unidirectional heat conduction device between the shape memory alloy and the heat source and making the unidirectional device in thermal contact with the heat source and the shape memory alloy layer, the heat of the heat source can be transferred to the shape memory alloy layer and further to the heat dissipation device, without transferring the heat from the shape memory alloy layer back to the heat source, thus ensuring the optimal temperature of the heat source and its normal operation.

[0021] In some possible implementation manners, the unidirectional heat conduction device includes one or more of thermally conductive silica gel, unidirectional heat conductive carbon fiber, unidirectional heat conductive graphite or graphene. The unidirectional heat conduction device includes, but is not limited to, thermally conductive silica gel, unidirectional heat conductive carbon fiber, unidirectional heat conductive graphite or graphene, and any heat conduction structure that can meet the requirement of not transferring the heat from the shape memory alloy layer back to the heat source is acceptable.

[0022] In a second aspect, the present utility model further provides a device including the above-mentioned heat dissipation device based on a memory alloy.

[0023] In the present utility model, the device adopts the above-mentioned heat dissipation device based on a shape memory alloy to achieve heat dissipation of the heat source. The device includes, but is not limited to, mobile phones, computer hosts, IT devices, data centers, water cups, air conditioners or fans.

[0024] Compared with the prior art, the present utility model has one of the following beneficial effects:

[0025] The heat dissipation device provided by the present utility model utilizes the characteristic that a large amount of latent heat can be absorbed when the internal microstructure of the shape memory alloy transforms from martensite to austenite, and uses a combination of multiple layers of shape memory alloys to improve the heat dissipation efficiency of the heat source, effectively suppressing the increase in the temperature of the heat source or cooling the heat source to a suitable operating temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0027] Figure 1 FIG. is a schematic side view structure diagram of a heat dissipation device based on a shape memory alloy provided by an embodiment of the present application;

[0028] Figure 2 FIG. is a schematic side view structure diagram of a heat dissipation device based on a shape memory alloy provided by an embodiment of the present application;

[0029] Figure 3 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0030] Figure 4 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0031] Figure 5 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0032] Figure 6 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0033] Figure 7 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0034] Figure 8 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0035] Figure 9 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0036] Figure 10 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0037] Figure 11 Side view structural schematic diagram of a heat dissipation device based on shape memory alloy provided by an embodiment of the present application;

[0038] Wherein, 1 - heat source; 2 - heat dissipation device; 3 - shape memory alloy layer; 4 - one-way heat conduction device. Detailed implementation manners

[0039] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below in conjunction with specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0040] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone.

[0041] In the description and claims of the embodiments of this application, terms such as "first" and "second" are used to distinguish different objects, rather than to describe a specific order of the objects. For example, a first target object and a second target object are used to distinguish different target objects, rather than to describe a specific order of the target objects.

[0042] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner.

[0043] In the heat dissipation device based on shape memory alloy provided in the embodiments of this application, it is one of a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat pipe or a ring cold pump, graphite or graphene. It should be noted that these heat dissipation devices can be adaptively adjusted according to different heat sources 1 to achieve the purpose of dissipating heat from the heat source 1 or cooling the heat source 1 to a suitable working temperature.

[0044] In the heat dissipation device based on shape memory alloy provided in the embodiments of this application, thermal contact means that the heat transfer effect between the two is good and the thermal conduction efficiency is high.

[0045] A heat dissipation device based on shape memory alloy includes a heat source 1, a heat dissipation device 2, and also includes a shape memory alloy layer 3. The positional relationship among the three only needs to satisfy that the surfaces of the shape memory alloy layer 3 are in thermal contact with the heat source 1 and the heat dissipation device 2 respectively, and is not limited to the positional relationships listed in the accompanying drawings of the specification. The shapes and sizes of the heat source 1, the heat dissipation device 2, and the shape memory alloy layer 3 are also not limited to the shapes and sizes in the accompanying drawings of the specification.

[0046] To further illustrate the technical solution of the present utility model, the technical solution of the present utility model will be described in detail below by combining with the accompanying drawings:

[0047] See Figures 1-4 , the shape memory alloy layer 3 is in thermal contact with the heat source 1 and the heat dissipation device 2. The number of the shape memory alloy layers 3 is one, and the internal microstructure of the shape memory alloy layer 3 is martensite or a coexistence of martensite and austenite. Taking the heat source 1 as a chip as an example, when the chip works and generates heat, the shape memory alloy layer 3 absorbs the heat generated by the chip. At the same time, the heat dissipation device 2 (air-cooled heat dissipation device) transfers the heat absorbed by the shape memory alloy layer 3 to the air, and as the temperature of the shape memory alloy layer 3 continuously rises, the absorbed heat continuously increases, and the martensite in the internal microstructure of the shape memory alloy layer 3 gradually undergoes a phase transformation into austenite.

[0048] Furthermore, when the shape memory alloy layer 3 absorbs the heat dissipated by the chip and the temperature of the shape memory alloy layer 3 rises to the initial temperature of the austenite phase transformation of the shape memory alloy layer 3, when the martensite in the internal microstructure of the shape memory alloy layer 3 begins to transform into austenite, it is necessary to satisfy that the initial temperature of the austenite phase transformation of the shape memory alloy layer 3 ≥ the suitable operating temperature of the chip, so that the shape memory alloy layer 3 can absorb more heat when the temperature exceeds the suitable operating temperature range of the chip.

[0049] Furthermore, when the shape memory alloy layer 3 absorbs the heat dissipated by the chip and the temperature of the shape memory alloy layer 3 continuously rises to the termination temperature of the austenite phase transformation of the shape memory alloy layer 3, when the internal microstructure of the shape memory alloy layer 3 completely transforms from martensite to austenite, it is necessary to satisfy that the termination temperature of the austenite phase transformation of the shape memory alloy layer 3 ≤ the maximum operating temperature of the chip, so as to prevent the shape memory alloy layer 3 from failing to absorb the heat dissipated by the chip in time, resulting in the temperature of the chip exceeding its maximum operating temperature and causing damage to the chip.

[0050] When the chip operates at low power (generating little heat) or stops working (generating no heat), the heat dissipation device 2 (air-cooled heat dissipation device) will still transfer the heat absorbed by the shape memory alloy layer 3 to the air. The temperature of the shape memory alloy gradually decreases, and the internal microstructure of the shape memory alloy gradually transforms from austenite to martensite or the initial state of coexistence of martensite and austenite, enabling cyclic heat absorption and dissipation of the heat source, so that the shape memory alloy layer can be used cyclically as part of the heat dissipation device of the present invention.

[0051] See Figure 5 , the surface of the shape memory alloy layer 3 is in thermal contact with the heat source 1 and the heat dissipation device 2, and at the same time, the heat dissipation device 2 is also in thermal contact with the heat source 1. Taking the heat source 1 as a chip as an example, when the chip operates to generate heat, the heat can be transferred to the circulating cooling water through the heat dissipation device 2 (water-cooled heat dissipation device), and can also be transferred to the shape memory alloy layer 3, and then transferred from the shape memory alloy layer 3 to the heat dissipation device 2 (water-cooled heat dissipation device), and then transferred to the circulating cooling water.

[0052] See Figure 6, the shape memory alloy layer 3 is in thermal contact with the heat source 1 and the heat dissipation device 2. The number of the shape memory alloy layers 3 is greater than one, and the internal microstructure of the shape memory alloy layer 3 is martensite or a coexistence of martensite and austenite. Taking the number of the shape memory alloy layers 3 as two and the heat source 1 being boiling water as an example. To reduce the heat of the boiling water (100 °C) to the temperature for direct drinking (35 °C), the boiling water is directly in thermal contact with the first shape memory alloy layer. The first shape memory alloy layer is in thermal contact with the second shape memory alloy layer, and the second shape memory alloy layer is in thermal contact with the heat dissipation device 2 (air-cooled heat dissipation device). The first shape memory alloy transfers the heat absorbed from the boiling water to the second shape memory alloy layer. The second shape memory alloy layer transfers the heat absorbed from the first shape memory alloy layer to the heat dissipation device 2 (air-cooled heat dissipation device). The heat dissipation device 2 (air-cooled heat dissipation device) transfers the heat absorbed by the second shape memory alloy layer to the air. And as the temperatures of the first shape memory alloy layer and the second shape memory alloy layer continuously increase, the absorbed heat continuously increases, and the martensite in the internal microstructure of the first shape memory alloy layer and the second shape memory alloy layer gradually undergoes a phase transformation into austenite.

[0053] Furthermore, when the boiling water cools to the temperature for direct drinking, the first shape memory alloy layer 3 stops absorbing the heat dissipated by the water. The temperatures of the first shape memory alloy layer 3 and the second shape memory alloy layer 3 start to decrease, and the internal structure gradually changes from austenite to martensite. When the martensite phase transformation termination temperature of the shape memory alloy layer 3 closer to the heat source 1 ≤ the martensite phase transformation termination temperature of the shape memory alloy layer 3 closer to the heat dissipation device 2, that is, the martensite phase transformation termination temperature of the first shape memory alloy layer 3 ≤ the martensite phase transformation termination temperature of the second shape memory alloy layer 3, it can be ensured that during the heat dissipation and cooling process, the second shape memory alloy layer 3 completely transforms its internal microstructure from austenite to martensite or to the initial state of a coexistence of martensite and austenite prior to the first shape memory alloy layer 3. Further, the second shape memory alloy layer 3 can absorb the heat dissipated by the first shape memory alloy layer 3 through the phase transformation of martensite to austenite, reducing the transfer of the heat of the first shape memory alloy layer 3 back to the heat source 1 direction.

[0054] See Figures 7-11 , the shape memory alloy layer 3 is in thermal contact with the heat source 1 and the heat dissipation device 2. The number of the shape memory alloy layers 3 is one, and the internal microstructure of the shape memory alloy layer 3 is martensite or a coexistence of martensite and austenite. A one-way heat conduction device 4 is located between the heat source 1 and the shape memory alloy layer 3, and the one-way heat conduction device 4 is in thermal contact with the heat source 1 and the shape memory alloy layer 3. By setting the one-way heat conduction device 4 between the shape memory alloy and the heat source 1, and the one-way device being in thermal contact with the heat source 1 and the shape memory alloy layer 3, when the heat of the shape memory alloy layer 3 is transferred to the heat dissipation device 2, the heat from the shape memory alloy layer 3 will not be transferred back to the heat source 1, ensuring the normal operation of the heat source 1.

[0055] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A heat dissipation device based on shape memory alloy, comprising a heat dissipation device, characterized in that: Also included is a shape memory alloy layer for absorbing heat emitted by a heat source; The oppositely disposed surfaces of the shape memory alloy layer are in thermal contact with a heat source and a heat dissipation device respectively; When the heat from the heat source is not absorbed, the internal microstructure of the shape memory alloy is martensite or martensite and austenite coexist; Wherein, the initial temperature of austenite phase transformation of the shape memory alloy layer is ≥ the suitable working temperature of the heat source; The shape memory alloy layer is provided with more than two layers, wherein the martensitic phase transformation termination temperature of the shape memory alloy layer close to the heat source side is less than or equal to the martensitic phase transformation termination temperature of the shape memory alloy layer close to the heat dissipation device side; The heat dissipation device also includes a unidirectional heat conduction device located between the heat source and the shape memory alloy layer, which is used to unidirectionally transfer the heat emitted by the heat source to the shape memory alloy layer; The one-way heat conducting device is in thermal contact with the heat source and the shape memory alloy layer.

2. The heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The austenite transformation termination temperature of the shape memory alloy layer is ≤ the limiting operating temperature of the heat source.

3. The heat dissipation device based on shape memory alloy according to any one of claims 1 or 2, characterized in that: The heat dissipation device is selected from a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat sink, a ring cold pump, graphite or graphene.

4. The heat dissipation device based on shape memory alloy according to any one of claims 1 or 2, characterized in that: The shape memory alloy is selected from one or more of nickel-titanium alloy, nickel-titanium-copper alloy, nickel-titanium-copper-cobalt alloy, nickel-titanium-copper-vanadium alloy, nickel-iron-gallium alloy, copper-aluminum-zinc alloy, copper-aluminum-manganese alloy or copper-aluminum-nickel alloy.

5. The heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The one-way heat conducting device includes one or more of heat conducting silica gel, one-way heat conducting carbon fiber, one-way heat conducting graphite or graphene.

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