Probe station installation assembly and wafer detection equipment

Abstract

The utility model provides a probe station installation assembly and wafer detection equipment. The probe station installation assembly comprises a pedestal, the pedestal comprises a base and an installation part, the installation part is arranged on the base in a protruding mode, and the base and the installation part are of an integrated structure; and the rail assembly is located on the side, away from the base, of the mounting part and is partially embedded in the mounting part. The probe station installation assembly can better prevent dislocation and deformation of the track assembly.

Description

Technical Field

[0001] The present application relates to the field of wafer testing, and in particular to a probe station mounting assembly and wafer testing equipment. Background Art

[0002] The upper surface of the probe station base in the related art is flat, and the track assembly for driving the sample stage to move is directly installed on the probe station base. However, in the extension direction perpendicular to the track assembly, the track assembly is easily misplaced or deformed, affecting the accuracy of the sample stage position adjustment. Utility Model Content

[0003] An embodiment of the present application provides a probe station mounting assembly, which can better prevent misalignment and deformation of a track assembly.

[0004] In a first aspect, the present application provides a probe station installation assembly, the probe station installation assembly comprising:

[0005] A base, the base comprising a pedestal and a mounting portion, the mounting portion being protruding from the base, the base and the mounting portion being an integral structure; and

[0006] A track component is located on a side of the mounting portion away from the base and is partially embedded in the mounting portion.

[0007] Further, the mounting portion extends along a first direction, and the track assembly includes a track member and a sliding member, the track member extends along the first direction, the track member is partially embedded in a side of the mounting portion away from the base, and the sliding member is slidably connected to the track member along the first direction; the probe station mounting assembly also includes a limit member, the limit member is partially embedded in a side of the mounting portion away from the base and abuts against the track member, the limit member cooperates with the mounting portion to limit the movement of the track member along a second direction, wherein the second direction intersects with the first direction.

[0008] Further, the mounting portion includes a first groove and a second groove located on the surface thereof facing away from the base, the first groove and the second groove both extend along a first direction, the first groove and the second groove are arranged along a second direction and are interconnected, the depth of the first groove is less than the depth of the second groove, the rail member is arranged in the first groove and abuts against the side wall of the first groove facing away from the second groove, and the limit member is arranged in the second groove and abuts against the side wall of the rail member close to the second groove.

[0009] Furthermore, the mounting portion has a first side wall and a first bottom wall that enclose the first groove, the first side wall is connected to the first bottom wall by a bend, the track member is arranged on the first bottom wall and abuts against the first side wall, along the second direction, the width of the track member is greater than the width of the first bottom wall, and the difference w1-w2 between the width w1 of the track member and the width w2 of the first bottom wall along the second direction is in the range of 0.5mm≤w1-w2≤1mm.

[0010] Furthermore, the mounting portion also has a second side wall, a second bottom wall and a third side wall that enclose the second groove, the second side wall, the second bottom wall and the third side wall are bent and connected in sequence, the second side wall and the third side wall are bent toward the same side compared to the second bottom wall, and the end of the second side wall facing away from the second bottom wall is bent and connected to the first bottom wall; the angle α between the second bottom wall and the third side wall is greater than 90°; the limiting member has a first surface facing the second groove and a surface facing away from the track member as the second surface, the angle β between the first surface and the second surface is greater than 90°, and the second surface abuts against the third side wall.

[0011] Furthermore, the angle α between the second bottom wall and the third side wall is equal to the angle β between the first surface and the second surface, and the range of the angle α between the second bottom wall and the third side wall is 120°≤α≤125°; the range of the angle β between the first surface and the second surface is 120°≤β≤125°.

[0012] Further, along the second direction, a difference w3-w4 between a width w3 of the second bottom wall and a width w4 of the first surface is in a range of 0.5 mm≤w3-w4≤1.5 mm.

[0013] Further, a difference w5-w6 between a width w5 of the third side wall and a width w6 of the second surface is in a range of 1.7 mm≤w5-w6≤2.0 mm.

[0014] Furthermore, the probe station mounting assembly also includes a first fastener and a second fastener, the first fastener is respectively passed through the rail member and the mounting portion to fix the rail member to the mounting portion, and the second fastener is respectively passed through the limit member and the mounting portion to fix the limit member to the mounting portion.

[0015] Further, the rail member has a first groove and a second groove, both the first groove and the second groove extend along a first direction, and the first groove and the second groove are arranged away from each other along a second direction; the sliding member includes a first clamping portion, a connecting portion, and a second clamping portion that are sequentially bent and connected, the first clamping portion and the second clamping portion are located on the same side of the connecting portion, a part of the first clamping portion is slidably clamped in the first groove, and a part of the second clamping portion is slidably clamped in the second groove.

[0016] Further, the bottom walls of the first groove and the second groove are both arc surfaces, and the surfaces of the first clamping portion facing the first groove and the second clamping portion facing the second groove are also both arc surfaces.

[0017] In a second aspect, an embodiment of the present application further provides a wafer inspection device, which includes:

[0018] The probe stage mounting assembly described in the embodiment of the present application;

[0019] A displacement adjustment mechanism, the displacement adjustment mechanism is mounted on the rail assembly;

[0020] A sample stage, the sample stage is arranged on the displacement adjustment mechanism, the displacement adjustment mechanism and the rail assembly cooperate to adjust the spatial position of the sample stage, and the sample stage is used to carry the workpiece to be detected;

[0021] A probe holder, the probe holder and the displacement adjustment mechanism are arranged on the same side of the base and are spaced apart from the displacement adjustment mechanism; and

[0022] A probe assembly, the probe assembly is arranged on the probe holder and is located on the side of the sample stage away from the base, and is used to detect the workpiece to be detected.

[0023] The probe stage mounting assembly of the embodiment of the present application includes a base and a rail assembly. The base includes a base and a mounting portion. The mounting portion protrudes from the base, and the base and the mounting portion are an integral structure; the rail assembly is located on the side of the mounting portion away from the base and is partially embedded in the mounting portion. The mounting portion is provided on the base, and the mounting portion plays a role of a reinforcing rib for the base, making the force distribution of the base more uniform, avoiding local deformation due to local stress, and thus improving the mechanical strength and load-bearing capacity of the base; in addition, the rail assembly is partially embedded in the mounting portion, and the mounting portion can play a role in strengthening and stabilizing the rail assembly, and can better prevent the rail assembly from being misaligned or deformed along the direction perpendicular to the extension direction of the rail assembly. Therefore, when the probe stage mounting assembly is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be more accurate, and thus the accuracy of wafer inspection can be better improved. Description of the Drawings

[0024] To more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0025] Figure 1 It is a schematic perspective view of a probe station mounting assembly according to an embodiment of the present application.

[0026] Figure 2 It is an exploded schematic view of a probe station mounting assembly according to an embodiment of the present application.

[0027] Figure 3 is Figure 1 an enlarged view of the dashed box I in

[0028] Figure 4 It is a schematic plan view of a base according to an embodiment of the present application.

[0029] Figure 5 It is a schematic plan view of a probe station mounting assembly according to an embodiment of the present application.

[0030] Figure 6 is Figure 5 an enlarged view of the dashed box II in

[0031] Figure 7 is Figure 6 an enlarged view of the dashed box III in

[0032] Figure 8 It is a partial exploded schematic view of a probe station mounting assembly according to an embodiment of the present application.

[0033] Figure 9 It is a schematic plan view of an orbital assembly according to an embodiment of the present application.

[0034] Figure 10 It is a schematic view of the structure of a wafer inspection device according to an embodiment of the present application.

[0035] Explanation of reference numerals:

[0036] 100 - Probe station mounting assembly, 10 - Base, 11 - Base plate, 12 - Mounting part, 121 - First sink, 122 - Second sink, 123 - First side wall, 124 - First bottom wall, 125 - Second side wall, 126 - Second bottom wall, 127 - Third side wall, 20 - Track assembly, 21 - Track member, 211 - First groove, 212 - Second groove, 22 - Sliding member, 221 - First clamping part, 222 - Connecting part, 223 - Second clamping part, 30 - Limiting member, 31 - First surface, 32 - Second surface, 40 - First fastener, 50 - Second fastener, 60 - Boss, 200 - Wafer inspection equipment, 210 - Displacement adjustment mechanism, 220 - Sample stage, 230 - Probe holder, 240 - Probe assembly. Detailed implementation manner

[0037] In order to enable those skilled in the art to better understand the solution of this application, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

[0038] The terms "first", "second", etc. in the specification and claims of this application and the above - mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non - exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0039] The technical solutions in the embodiments of this application will be described below in conjunction with the accompanying drawings.

[0040] It should be noted that, for the sake of convenience of description, in the embodiments of this application, the same reference numerals represent the same components, and for the sake of brevity, the detailed description of the same components is omitted in different embodiments.

[0041] The upper surface of the probe station base in the related art is flat, and the track assembly for driving the sample stage to move is directly installed on the probe station base. However, in the direction perpendicular to the extension direction of the track assembly, the track assembly is prone to dislocation or deformation, affecting the accuracy of the position adjustment of the sample stage.

[0042] Please refer to Figure 1 and Figure 2, an embodiment of the present application provides a probe station mounting assembly 100. The probe station mounting assembly 100 includes a base 10 and a rail assembly 20. The base 10 includes a base plate 11 and a mounting portion 12. The mounting portion 12 protrudes from the base plate 11, and the base plate 11 and the mounting portion 12 are of an integral structure; the rail assembly 20 is located on a side of the mounting portion 12 away from the base plate 11 and is partially embedded in the mounting portion 12.

[0043] The probe station mounting assembly 100 of the embodiment of the present application can be applied to a wafer inspection device and used as a mounting base for the wafer inspection device, for carrying a displacement adjustment mechanism, a sample stage, a probe holder, a probe assembly, etc. of the wafer inspection device. When the probe station mounting assembly 100 is applied to a wafer inspection device, the displacement adjustment mechanism of the wafer inspection device is arranged on the rail assembly 20 of the probe station mounting assembly 100. The sample stage is arranged on the displacement adjustment mechanism. The displacement adjustment mechanism cooperates with the rail assembly 20 to adjust the height and position of the sample stage, so as to adjust the height and position of the workpiece to be detected (such as a wafer or a needle card carrying the wafer) carried on the sample stage. The probe holder is mounted on the base plate 11, and the probe holder is used to carry the probe assembly. The probe assembly is used to detect the workpiece to be detected on the sample stage.

[0044] Optionally, the base plate 11 and the mounting portion 12 are of an integral structure. The base plate 11 and the mounting portion 12 are different parts of the same component. The base 10 can be prepared by an integral casting process.

[0045] It should be noted that there are no connection interfaces such as welding or fusion welding between the various parts of the base 10.

[0046] Optionally, the base plate 11 can be of a frame structure or a framework structure, which can reduce the cost of the base 10 without overly reducing the load-bearing capacity of the base 10.

[0047] The probe stage mounting assembly 100 according to the embodiment of the present application includes a base 10 and a rail assembly 20. The base 10 includes a base plate 11 and a mounting portion 12. The mounting portion 12 protrudes from the base plate 11, and the base plate 11 and the mounting portion 12 are of an integral structure. The rail assembly 20 is located on the side of the mounting portion 12 away from the base plate 11 and is partially embedded in the mounting portion 12. By providing the mounting portion 12 on the base plate 11, the mounting portion 12 functions as a reinforcing rib for the base plate 11, making the force distribution of the base 10 more uniform, avoiding local deformation due to local stress, and thus improving the mechanical strength and load-bearing capacity of the base 10. In addition, since the rail assembly 20 is partially embedded in the mounting portion 12, the mounting portion 12 can strengthen and stabilize the rail assembly 20, better preventing the rail assembly 20 from being misaligned or deformed in the direction perpendicular to the extension direction of the rail assembly 20. Therefore, when the probe stage mounting assembly 100 is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be more accurate, thereby better improving the accuracy of wafer inspection.

[0048] Please refer to Figures 1 to 3 In some embodiments, as shown in, the mounting portion 12 extends in a first direction. The rail assembly 20 includes a rail member 21 and a sliding member 22. The rail member 21 extends in the first direction (such as Figure 1 the double arrow X indicates), and the rail member 21 is partially embedded in the side of the mounting portion 12 away from the base plate 11. The sliding member 22 is slidably connected to the rail member 21 in the first direction. The probe stage mounting assembly 100 further includes a limiting member 30. The limiting member 30 is partially embedded in the side of the mounting portion 12 away from the base plate 11 and abuts against the rail member 21. The limiting member 30 cooperates with the mounting portion 12 to limit the movement of the rail member 21 in a second direction (such as Figure 1 the double arrow Y indicates), where the second direction intersects with the first direction.

[0049] Optionally, the number of the mounting portions 12 is two. The two mounting portions 12 are spaced apart in the second direction on the same surface of the base plate 11. The number of the rail assemblies 20 is two. One of the two rail assemblies 20 is partially embedded in one of the two mounting portions 12, and the other of the two rail assemblies 20 is partially embedded in the other of the two mounting portions 12.

[0050] Optionally, the first direction is perpendicular to the second direction.

[0051] Optionally, the number of the limiting members 30 can be one or more. When the limiting member 30 is one, the limiting member 30 extends in the first direction. When the limiting member 30 is multiple, the multiple limiting members 30 are arranged in sequence in the first direction.

[0052] In this embodiment, by partially embedding the rail member 21 in the mounting portion 12 and the limiting member 30 abutting against the rail member 21, through the cooperation between the limiting member 30 and the mounting portion 12, the dislocation or deformation of the rail member 21 in the second direction can be better restricted. Thus, when the probe stage mounting assembly 100 is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be made more accurate, thereby better improving the accuracy of wafer inspection.

[0053] Please refer to Figure 4 , in some embodiments, the mounting portion 12 includes a first sink 121 and a second sink 122 located on the surface thereof facing away from the base 11. The first sink 121 and the second sink 122 both extend in the first direction. The first sink 121 and the second sink 122 are arranged in the second direction and communicate with each other. The depth of the first sink 121 is less than the depth of the second sink 122. The rail member 21 is disposed in the first sink 121 and abuts against the side wall of the first sink 121 facing away from the second sink 122. The limiting member 30 is disposed in the second sink 122 and abuts against the side wall of the rail member 21 close to the second sink 122.

[0054] It can be understood that the depth of the first sink 121 is shallower and the depth of the second sink 122 is deeper.

[0055] It should be noted that the sliding member 22 and the limiting member 30 are arranged at intervals.

[0056] In this embodiment, by providing the first sink 121 and the second sink 122, the first sink 121 is used to dispose the rail member 21, and the second sink 122 is used to dispose the limiting member 30. By the rail member 21 abutting against the side wall of the first sink 121 and the limiting member 30 abutting against the side wall of the rail member 21 facing the second sink 122, the rail member 21 can better abut against the side wall of the first sink 121 facing away from the second sink 122 through the abutting action of the limiting member 30. Thus, the dislocation or deformation of the rail member 21 in the second direction can be better prevented. When the probe stage mounting assembly 100 is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be made more accurate, thereby better improving the accuracy of wafer inspection. In addition, the depth of the second sink 122 is greater than the depth of the first sink 121, which not only improves the installation stability of the limiting member 30 in the second sink 122, but also better avoids interference between the limiting member 30 and the sliding member 22.

[0057] Please refer to Figure 5 and Figure 6, in some embodiments, the mounting portion 12 has a first side wall 123 and a first bottom wall 124 that enclose the first sunk groove 121. The first side wall 123 and the first bottom wall 124 are bent and connected. The rail member 21 is disposed on the first bottom wall 124 and abuts against the first side wall 123. In the second direction, the width of the rail member 21 is greater than the width of the first bottom wall 124.

[0058] Optionally, the first side wall 123 is perpendicular to the first bottom wall 124.

[0059] Optionally, in the second direction, the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 ranges from w1 - w2 ≥ 0.5 mm. Further, in the second direction, the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 ranges from 0.5 mm ≤ w1 - w2 ≤ 1 mm.

[0060] Specifically, in the second direction, the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 can be, but is not limited to, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. If the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 in the second direction is too small, after the limiting member 30 is disposed in the second groove, it cannot well abut against the surface of the rail member 21 away from the first side wall 123, and the abutting force on the rail member 21 is insufficient, reducing the effect of preventing the rail member 21 from being displaced or deformed in the second direction; if the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 in the second direction is too large, the width of the rail member 21 protruding from the first sunk groove 121 (or the first bottom wall 124) is too wide, also reducing the stability of the installation of the rail member 21 and reducing the effect of preventing the rail member 21 from being displaced or deformed in the second direction.

[0061] Optionally, when the limiting member 30 is installed on the mounting portion 12, there is a gap between the surface of the limiting member 30 facing the first side wall 123 and the first side wall 123. The size of this gap is related to the difference w1 - w2 between the width w1 of the rail member 21 and the width w2 of the first bottom wall 124 in the second direction.

[0062] In this embodiment, by making the rail member 21 abut against the first side wall 123, in the second direction, the width of the rail member 21 is greater than the width of the first bottom wall 124. Thus, by applying a force pointing to the first side wall 123 to the rail member 21 only through the limiting member 30, the rail member 21 can be tightly attached to the first side wall 123, restricting the displacement or deformation of the rail member 21 in the second direction. Therefore, when the probe stage mounting assembly 100 is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be made more precise, thereby better improving the accuracy of wafer inspection.

[0063] Please refer to Figures 5 to 7 , in some embodiments, the mounting portion 12 further has a second side wall 125, a second bottom wall 126, and a third side wall 127 that enclose the second sinking groove 122. The second side wall 125, the second bottom wall 126, and the third side wall 127 are bent and connected in sequence. The second side wall 125 and the third side wall 127 are bent toward the same side with respect to the second bottom wall 126. One end of the second side wall 125 facing away from the second bottom wall 126 is bent and connected to the first bottom wall 124; the included angle α between the second bottom wall 126 and the third side wall 127 is > 90°; the limiting member 30 has a first surface 31 facing the second sinking groove 122 and a second surface 32 facing away from the rail member 21. The angle β between the first surface 31 and the second surface 32 is > 90°, and the second surface 32 abuts against the third side wall 127.

[0064] It can be understood that the first side wall 123, the first bottom wall 124, the second side wall 125, the second bottom wall 126, and the third side wall 127 are bent and connected in sequence.

[0065] Optionally, the first bottom wall 124 is perpendicular to the second side wall 125, and the second side wall 125 is perpendicular to the second bottom wall 126.

[0066] It can be understood that the second surface 32 is arranged in contact with the third side wall 127.

[0067] In this embodiment, by making the included angle α between the second bottom wall 126 and the third side wall 127 greater than 90°, and the angle β between the first surface 31 and the second surface 32 greater than 90°, when the limiting member 30 is assembled, only a force perpendicular to the first surface 31 and pointing to the first surface 31 needs to be applied to the limiting member 30, and the limiting member 30 can move along the second surface 32 towards the direction close to the base 11 and close to the rail member 21 (that is, along the arrangement direction of the base 11 and the mounting portion 12, a pressure is applied from the limiting member 30 to the mounting portion 12), so that the limiting member 30 tightly abuts against the rail member 21, and the rail member 21 tightly abuts against the first side wall 123. This can not only prevent the rail member 21 from being displaced or deformed in the second direction well, but also make the spatial position adjustment of the sample stage more accurate when the probe stage mounting assembly 100 is applied to a wafer inspection device, thereby better improving the accuracy of wafer inspection. In addition, the installation of the rail member 21 and the limiting member 30 can be simplified.

[0068] In some embodiments, the range of the included angle α between the second bottom wall 126 and the third side wall 127 is 120° ≤ α ≤ 125°.

[0069] Specifically, the included angle α between the second bottom wall 126 and the third side wall 127 can be, but is not limited to, 120°, 121°, 122°, 123°, 124°, 125°, etc.

[0070] In this embodiment, if the included angle α between the second bottom wall 126 and the third side wall 127 is too small, when a pressure is applied from the limiting member 30 to the mounting portion 12 along the arrangement direction of the base 11 and the mounting portion 12, the squeezing force of the limiting member 30 on the rail member 21 (that is, the component force generated towards the rail) is insufficient, reducing the stability of the installation of the rail member 21; if the included angle α between the second bottom wall 126 and the third side wall 127 is too large, when a pressure is applied from the limiting member 30 to the mounting portion 12, the squeezing force of the limiting member 30 on the rail member 21 (that is, the component force generated towards the rail) is also insufficient, reducing the stability of the installation of the rail member 21.

[0071] Optionally, the range of the angle β between the first surface 31 and the second surface 32 is 120° ≤ β ≤ 215°.

[0072] Specifically, the angle β between the first surface 31 and the second surface 32 can be, but is not limited to, 120°, 121°, 122°, 123°, 124°, 125°, etc.

[0073] In this embodiment, if the angle β between the first surface 31 and the second surface 32 is too small, when a pressure is applied from the limiting member 30 towards the mounting portion 12 along the arrangement direction of the base 11 and the mounting portion 12, the extrusion force of the limiting member 30 on the rail member 21 (i.e., the component force towards the rail generated) is insufficient, reducing the installation stability of the rail member 21; if the angle β between the first surface 31 and the second surface 32 is too large, when a pressure is applied from the limiting member 30 towards the mounting portion 12, the extrusion force of the limiting member 30 on the rail member 21 (i.e., the component force towards the rail generated) is also insufficient, reducing the installation stability of the rail member 21.

[0074] Optionally, the included angle α between the second bottom wall 126 and the third side wall 127 is equal to the angle β between the first surface 31 and the second surface 32. This can enable the second surface 32 to better fit with the third side wall 127. Thus, when a force pointing to the mounting portion 12 is applied on the limiting member 30, due to the reaction force of the third side wall 127, the limiting member 30 moves towards the rail member 21 and generates a force pointing to the first side wall 123 on the rail member 21, thereby tightly installing the rail member 21 between the first side wall 123 and the limiting member 30.

[0075] Please refer to again Figure 7 , in some embodiments, along the second direction, the range of the difference w3 - w4 between the width w3 of the second bottom wall 126 and the width w4 of the first surface 31 is 0.5 mm ≤ w3 - w4 ≤ 1.5 mm.

[0076] Specifically, along the second direction, the difference w3 - w4 between the width w3 of the second bottom wall 126 and the width w4 of the first surface 31 can be, but is not limited to, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, etc.

[0077] Along the second direction, if the difference w3 - w4 between the width w3 of the second bottom wall 126 and the width w4 of the first surface 31 is too small, that is, the width w3 of the second bottom wall 126 is too small and the width w4 of the first surface 31 is too large, after the limiting member 30 is assembled, there may be a gap between the first surface 31 and the second bottom wall 126, and the assembly is not tight, so that after a period of use, the limiting member 30 is likely to become loose; if the difference w3 - w4 between the width w3 of the second bottom wall 126 and the width w4 of the first surface 31 is too large, that is, the width w3 of the second bottom wall 126 is too large and the width w4 of the first surface 31 is too small, then after the limiting member 30 is assembled, the pre-tightening force generated on the rail member 21 is insufficient, reducing the installation stability of the rail member 21.

[0078] In some embodiments, the range of the difference w5 - w6 between the width w5 of the third side wall 127 and the width w6 of the second surface 32 is 1.7 mm ≤ w5 - w6 ≤ 2.0 mm.

[0079] Specifically, the difference w5 - w6 between the width w5 of the third side wall 127 and the width w6 of the second surface 32 may be, but is not limited to, 1.7 mm, 1.75 mm, 1.8 mm, 1.85 mm, 1.9 mm, 1.95 mm, 2.0 mm, etc.

[0080] In this embodiment, if the difference w5 - w6 between the width w5 of the third side wall 127 and the width w6 of the second surface 32 is too small, the width w5 of the third side wall 127 is too small, the width w6 of the second surface 32 is too large, and the overall height of the limiting member 30 is too high, which is likely to interfere with the sliding member 22; if the difference w5 - w6 between the width w5 of the third side wall 127 and the width w6 of the second surface 32 is too large, the width w5 of the third side wall 127 is too large, the width w6 of the second surface 32 is too small, and the height of the limiting member 30 is too low. After assembly, the contact area between the limiting member 30 and the rail member 21 is too small, and the limiting effect of the limiting member 30 on the rail member 21 is weakened, thereby reducing the assembly stability of the limiting member 30 and the rail member 21. After a period of use, loosening and other phenomena are likely to occur.

[0081] Please refer to Figure 8 , in some embodiments, the probe stage mounting assembly 100 further includes a first fastener 40 and a second fastener 50. The first fastener 40 passes through the rail member 21 and the mounting portion 12 respectively to fix the rail member 21 to the mounting portion 12, and the second fastener 50 passes through the limiting member 30 and the mounting portion 12 respectively to fix the limiting member 30 to the mounting portion 12.

[0082] Optionally, the first fastener 40 may be, but is not limited to, a screw, a bolt, a stud, etc.

[0083] Optionally, the number of the first fasteners 40 is multiple, and the multiple first fasteners 40 are arranged at intervals along the first direction.

[0084] Optionally, the second fastener 50 may be, but is not limited to, a screw, a bolt, a stud, etc.

[0085] Optionally, the number of the second fasteners 50 is multiple, and the multiple second fasteners 50 are arranged at intervals along the second direction.

[0086] In this embodiment, through the cooperation of the first fastener 40 and the second fastener 50, the rail member 21 and the limiting member 30 can be better installed on the installation part 12. And through the cooperation of the installation part 12 with the limiting member 30, the first fastener 40 and the second fastener 50, it can better prevent the rail member 21 from being misaligned or deformed in the second direction. Thus, when the probe stage mounting assembly 100 is applied to a wafer inspection device, the spatial position adjustment of the sample stage can be made more accurate, thereby better improving the accuracy of wafer inspection.

[0087] Please refer to Figure 9 , in some embodiments, the rail member 21 has a first groove 211 and a second groove 212. Both the first groove 211 and the second groove 212 extend along the first direction, and the first groove 211 and the second groove 212 are arranged opposite to each other in the second direction; the sliding member 22 includes a first clamping portion 221, a connecting portion 222 and a second clamping portion 223 that are sequentially bent and connected. The first clamping portion 221 and the second clamping portion 223 are located on the same side of the connecting portion 222. A part of the first clamping portion 221 is slidably clamped in the first groove 211, and a part of the second clamping portion 223 is slidably clamped in the second groove 212.

[0088] It should be noted that both the first groove 211 and the second groove 212 are located on the side of the first sink 121 away from the base 11. Understandably, when the probe stage mounting assembly 100 is set on the placement surface, the first groove 211 and the second groove 212 are spaced above the first sink 121.

[0089] It should be noted that the first groove 211 is located on the surface of the rail member 21 away from the limiting member 30, and the second groove 212 is located on the surface of the rail member 21 facing the limiting member 30.

[0090] In this embodiment, through the cooperation of the first clamping portion 221 and the first groove 211, and the cooperation of the second clamping portion 223 and the second groove 212, the sliding member 22 can be better slidably connected to the rail member 21 and can slide back and forth relative to the rail member 21 better along the first direction.

[0091] In some embodiments, the bottom walls of both the first groove 211 and the second groove 212 are arc surfaces, and the surfaces of the first clamping portion 221 facing the first groove 211 and the surfaces of the second clamping portion 223 facing the second groove 212 are also arc surfaces.

[0092] Optionally, the bottom walls of the first groove 211 and the second groove 212 are both cylindrical arc surfaces, and the surfaces of the first engaging portion 221 facing the first groove 211 and the surfaces of the second engaging portion 223 facing the second groove 212 are also both cylindrical arc surfaces.

[0093] In this embodiment, by making the bottom walls of the first groove 211 and the second groove 212 both arc surfaces, and the surfaces of the first engaging portion 221 facing the first groove 211 and the surfaces of the second engaging portion 223 facing the second groove 212 also both arc surfaces, this can better reduce the frictional resistance when the sliding member 22 slides relative to the rail member 21, improving the user experience.

[0094] Please refer to again Figure 8 , optionally, the base 10 further includes a boss 60, the boss 60 and the mounting portion 12 are disposed on the same side of the base 11, and the boss 60 is used to mount the probe holder of the wafer inspection device.

[0095] Please refer to Figure 10 , an embodiment of the present application further provides a wafer inspection device 200, which includes: the probe stage mounting assembly 100 described in the embodiment of the present application; a displacement adjustment mechanism 210, the displacement adjustment mechanism 210 is mounted on the rail assembly 20; a sample stage 220, the sample stage 220 is disposed on the displacement adjustment mechanism 210, and the displacement adjustment mechanism 210 and the rail assembly 20 cooperate to adjust the spatial position of the sample stage 220, and the sample stage 220 is used to carry the workpiece to be detected; a probe holder 230, the probe holder 230 and the displacement adjustment mechanism 210 are disposed on the same side of the base 10 and are spaced apart from the displacement adjustment mechanism 210; and a probe assembly 240, the probe assembly 240 is disposed on the probe holder 230 and is located on the side of the sample stage 220 away from the base 10, and is used to detect the workpiece to be detected.

[0096] For a detailed description of other aspects of the probe stage mounting assembly 100, please refer to the description of the corresponding part of the above embodiment, and details are not described herein again.

[0097] Optionally, the displacement adjustment mechanism 210 is mounted on the sliding member 22 of the rail assembly 20. When the sliding member 22 slides relative to the rail member 21 in the first direction, it drives the displacement adjustment mechanism 210 to slide relative to the rail member 21 in the first direction. The displacement adjustment mechanism 210 and the rail assembly 20 cooperate to adjust the position of the sample stage 220 in three-dimensional space, that is, to adjust the height and horizontal position of the sample stage 220, so as to adjust the wafer on the sample stage 220 to the position corresponding to the probe assembly 240, so that the probe assembly 240 can detect the information of the wafer.

[0098] Optionally, the probe holder 230 is mounted on the boss 60 for carrying the probe assembly 240.

[0099] The probe stage mounting assembly 100 according to an embodiment of the present application includes a base 10 and a rail assembly 20. The base 10 includes a base 11 and a mounting portion 12. The mounting portion 12 protrudes from the base 11, and the base 11 and the mounting portion 12 are of an integral structure. The rail assembly 20 is located on a side of the mounting portion 12 away from the base 11 and is partially embedded in the mounting portion 12. By providing the mounting portion 12 on the base 11, the mounting portion 12 functions as a reinforcing rib for the base 11, making the force distribution on the base 10 more uniform, avoiding local deformation due to local stress, and thus improving the mechanical strength and load-bearing capacity of the base 10. In addition, since the rail assembly 20 is partially embedded in the mounting portion 12, the mounting portion 12 can strengthen and stabilize the rail assembly 20, better preventing the rail assembly 20 from being misaligned or deformed in a direction perpendicular to the extension direction of the rail assembly 20. When the probe stage mounting assembly 100 is applied to the wafer inspection device 200, the spatial position adjustment of the sample stage 220 can be made more accurate, thereby better improving the accuracy of wafer inspection.

[0100] In this application, the mention of "embodiment" or "embodiment mode" means that the specific features, structures, or characteristics described in connection with the embodiment may be included in at least one embodiment of this application. The phrase appears in various positions in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described in this application may be combined with other embodiments. In addition, it should also be understood that the features, structures, or characteristics described in each embodiment of this application can be combined arbitrarily without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of this application.

[0101] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and not to limit them. Although the above preferred embodiments have been described in detail for this application, those of ordinary skill in the art should understand that the technical solutions of this application can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A probe station installation assembly, characterized in that: The probe station installation assembly includes: A base, the base comprising a pedestal and a mounting portion, the mounting portion being protruding from the base, the base and the mounting portion being an integral structure; and A track component is located on a side of the mounting portion away from the base and is partially embedded in the mounting portion.

2. The probe station installation assembly according to claim 1, characterized in that: The mounting portion extends along a first direction, and the track assembly includes a track member and a sliding member. The track member extends along the first direction, and the track member is partially embedded in a side of the mounting portion away from the base, and the sliding member is slidably connected to the track member along the first direction; the probe station mounting assembly also includes a limit member, which is partially embedded in a side of the mounting portion away from the base and abuts against the track member. The limit member cooperates with the mounting portion to limit the movement of the track member along a second direction, wherein the second direction intersects with the first direction.

3. The probe station installation assembly according to claim 2, characterized in that: The mounting portion includes a first groove and a second groove located on a surface thereof facing away from the base, the first groove and the second groove both extend along a first direction, the first groove and the second groove are arranged along a second direction and are connected to each other, the depth of the first groove is less than the depth of the second groove, the rail member is arranged in the first groove and abuts against a side wall of the first groove facing away from the second groove, and the limiting member is arranged in the second groove and abuts against a side wall of the rail member close to the second groove.

4. The probe station mounting assembly according to claim 3, characterized in that: The mounting portion comprises a first side wall and a first bottom wall which enclose the first groove, the first side wall being connected to the first bottom wall by a bend, the track member being arranged on the first bottom wall and abutting against the first side wall, and along the second direction, the width of the track member is greater than the width of the first bottom wall, and the difference w1-w2 between the width w1 of the track member and the width w2 of the first bottom wall along the second direction is in the range of 0.5mm≤w1-w2≤1mm.

5. The probe station mounting assembly according to claim 4, characterized in that: The mounting portion further comprises a second side wall, a second bottom wall and a third side wall which enclose the second sink groove, the second side wall, the second bottom wall and the third side wall are bent and connected in sequence, the second side wall and the third side wall are bent toward the same side compared to the second bottom wall, and an end of the second side wall which is away from the second bottom wall is bent and connected to the first bottom wall; The included angle α between the second bottom wall and the third side wall is greater than 90°; the limiting member has a first surface facing the second sink groove and a surface facing away from the track member as a second surface, the angle β between the first surface and the second surface is greater than 90°, and the second surface abuts against the third side wall.

6. The probe station mounting assembly according to claim 5, characterized in that: The angle α between the second bottom wall and the third side wall is equal to the angle β between the first surface and the second surface, and the range of the angle α between the second bottom wall and the third side wall is 120°≤α≤125°; the range of the angle β between the first surface and the second surface is 120°≤β≤125°.

7. The probe station mounting assembly according to claim 5, characterized in that: Along the second direction, a difference w3-w4 between a width w3 of the second bottom wall and a width w4 of the first surface is in a range of 0.5 mm≤w3-w4≤1.5 mm.

8. The probe station mounting assembly according to claim 5, characterized in that: A difference w5-w6 between a width w5 of the third side wall and a width w6 of the second surface is in a range of 1.7 mm≤w5-w6≤2.0 mm.

9. The probe station mounting assembly according to claim 2, characterized in that: The probe station mounting assembly also includes a first fastener and a second fastener, the first fastener is respectively penetrated through the rail member and the mounting portion to fix the rail member to the mounting portion, and the second fastener is respectively penetrated through the limit member and the mounting portion to fix the limit member to the mounting portion.

10. A wafer inspection device, characterized in that: include: The probe station mounting assembly according to any one of claims 1 to 9; A displacement adjustment mechanism, wherein the displacement adjustment mechanism is installed on the track assembly; A sample stage, wherein the sample stage is arranged on the displacement adjustment mechanism, the displacement adjustment mechanism and the track assembly cooperate to adjust the spatial position of the sample stage, and the sample stage is used to carry the object to be detected; A probe rack, wherein the probe rack and the displacement adjustment mechanism are arranged on the same side of the base and are spaced apart from the displacement adjustment mechanism; as well as A probe assembly is arranged on the probe rack and located on the sample stage away from the base, and is used to detect the object to be detected.

Images