800G 2XFR4 silicon optical chip and optical engine
By integrating additional optical waveguides and wave dividers in the 800G 2XFR4 silicon optical chip, the Z-b l cok and RX collimator lenses are eliminated and multi-channel fiber arrays are used for coupling, solving the problem of large space occupancy of traditional optical engines, achieving smaller sizes and simpler assembly.
Patent Information
- Application Number
- CN202422325435.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-23
AI Technical Summary
The traditional 800G 2XFR4 silicon light engine has a large Z-b l cok size, takes up a lot of PCB board layout space, and has three optical fiber arrays, which are complex in coupling.
In the 800G 2XFR4 silicon optical chip, eight additional RX outgoing waveguides, two RX incoming waveguides and two wave dividers are integrated, and the Z-b l cok and RX collimating lenses are eliminated and multi-channel fiber arrays are used for coupling.
The size of the optical engine is reduced, the impact on the layout space of the PCB board is reduced, the number and coupling process of optical fiber arrays are simplified, and the convenience of assembly is improved.
Smart Images
Figure CN223038212U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical engines, and particularly relates to an 800G 2XFR4 silicon optical chip and an optical engine. Background Art
[0002] The structure of a traditional 800G 2XFR4 silicon optical engine is specifically as Figure 1 shown, which includes: an 800G 2XFR4 silicon optical chip, four optical emission components, a two-channel fiber array, two TIA chips, two array detector chips, eight RX focusing lenses, two Z-blocks, two RX collimating lenses, and two single-channel fiber arrays. One Z-block is distributed on each side of the 800G 2XFR4 silicon optical chip. The four TX incoming optical waveguides of the 800G 2XFR4 silicon optical chip are respectively coupled with the four optical emission components. The two TX outgoing optical waveguides of the 800G 2XFR4 silicon optical chip are coupled with the two-channel fiber array. At the light input port of each Z-block, an RX collimating lens and a single-channel fiber array are sequentially coupled. The four light output ports of each Z-block are coupled with an array detector chip through four RX focusing lenses. Each array detector chip is wire-bonded to a TIA chip. In this solution, the Z-block has a large size, occupies a very large layout space of the PCB board, and has three fiber arrays. Summary of the Utility Model
[0003] The technical problem to be solved by the utility model is to provide an 800G 2XFR4 silicon optical chip and an optical engine to overcome the deficiencies in the above prior art.
[0004] The technical solution of the utility model to solve the above technical problem is as follows: An 800G 2XFR4 silicon optical chip has four TX incoming optical waveguides, two TX outgoing optical waveguides, eight RX outgoing optical waveguides, two RX incoming optical waveguides, and two demultiplexers. Each TX outgoing optical waveguide is respectively coupled with the four TX incoming optical waveguides. The eight RX outgoing optical waveguides are grouped into two groups of four. Each group of RX outgoing optical waveguides is coupled with one of the two RX incoming optical waveguides through a demultiplexer.
[0005] The beneficial effect of the utility model is: On the basis of the original 800G 2XFR4 silicon optical chip, eight RX outgoing optical waveguides, two RX incoming optical waveguides, and two demultiplexers are additionally integrated. When the 800G 2XFR4 silicon optical chip is applied to an 800G 2XFR4 silicon optical engine, the Z-block and the RX collimating lens can be not configured, so that the size can be reduced, the influence on the layout space of the PCB board can be reduced, and the coupling is convenient.
[0006] Based on the above technical solutions, the present utility model can be further improved as follows.
[0007] Further, the two TX output optical waveguides and the two RX input optical waveguides are on the same side and are adjacent and equally spaced.
[0008] The beneficial effect of the above further improvement is that when coupling a multi-channel fiber array subsequently, only one fiber array can be used, reducing the number of fiber arrays, thereby reducing the number of couplings and facilitating coupling.
[0009] Further, the four TX input optical waveguides, the two TX output optical waveguides, and the two RX input optical waveguides are on the same side.
[0010] Further, the two groups of RX output optical waveguides are on opposite sides.
[0011] Further, each TX output optical waveguide is coupled to the output end of a multiplexer, each TX input optical waveguide is coupled to the input end of a 1×2 ratio coupler, and the two output ends of each 1×2 ratio coupler are respectively coupled to the input ends of two multiplexers.
[0012] Further, the two output ends of each 1×2 ratio coupler are respectively coupled to the input ends of two multiplexers through an MZM modulator.
[0013] Based on the above technical solutions, the present utility model also provides an 800G 2XFR4 silicon photonics optical engine, which is characterized in that it includes: eight RX focusing lenses, two array detector chips, two TIA chips, four optical emission components, a multi-channel fiber array, and an 800G 2XFR4 silicon photonics chip. The four optical emission components are respectively coupled to the four TX input optical waveguides, the two TX output optical waveguides are coupled to the multi-channel fiber array, the two RX input optical waveguides are coupled to the multi-channel fiber array, and the four RX output optical waveguides in each group are respectively coupled to an array detector chip through four RX focusing lenses, and each array detector chip is wire-bonded to a TIA chip.
[0014] The beneficial effect of the above further improvement is that the 800G 2XFR4 silicon photonics optical engine does not need to be configured with a Z-block and an RX collimating lens, which can reduce the size and thus reduce the impact on the PCB board layout space.
[0015] Further, the two TX output optical waveguides and the two RX input optical waveguides are coupled to the same multi-channel fiber array.
[0016] Further, the optical emission component includes: a laser chip, a collimating lens, an optical isolator, and a TX focusing lens that are sequentially coupled along the optical propagation direction. The TX focusing lens is coupled to the TX input optical waveguide, and the laser chip is integrated on a ceramic heat sink. Brief Description of the Drawings
[0017] Figure 1 FIG. 5 is a structural diagram of an 800G 2XFR4 silicon photonics optical engine in the prior art;
[0018] Figure 2 FIG. 6 is a structural diagram of an 800G 2XFR4 silicon photonics chip in the present invention;
[0019] Figure 3 FIG. 7 is a structural diagram of an 800G 2XFR4 silicon photonics optical engine in the present invention.
[0020] In the drawings, the list of components represented by each reference numeral is as follows:
[0021] 1. 800G 2XFR4 silicon photonics chip, 110. TX input optical waveguide, 120. TX output optical waveguide, 130. RX output optical waveguide, 140. RX input optical waveguide, 150. Demultiplexer, 160. Multiplexer, 170. 1×2 equal ratio coupler, 180. MZM modulator, 2. RX focusing lens, 3. Array detector chip, 4. TIA chip, 5. Optical emission component, 510. Laser chip, 520. Collimating lens, 530. Optical isolator, 540. TX focusing lens, 550. Ceramic heat sink, 6. Multi-channel fiber array. Detailed Embodiments
[0022] The principles and features of the present invention will be described below with reference to the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.
[0023] Embodiment 1
[0024] As shown in FIG. Figure 2 , an 800G 2XFR4 silicon photonics chip has four TX input optical waveguides 110, two TX output optical waveguides 120, eight RX output optical waveguides 130, two RX input optical waveguides 140, and two demultiplexers 150. Each TX output optical waveguide 120 is respectively coupled to four TX input optical waveguides 110; the eight RX output optical waveguides 130 are grouped in sets of four, and the four RX output optical waveguides 130 in each group are arranged side by side. Each of the two groups of RX output optical waveguides 130 is coupled to one of the two RX input optical waveguides 140 through a demultiplexer 150. Specifically, it can be understood that one group of the two groups of RX output optical waveguides 130 is coupled to one of the two RX input optical waveguides 140 through a demultiplexer 150, and the other group of RX output optical waveguides 130 is coupled to the other of the two RX input optical waveguides 140 through the other demultiplexer 150;
[0025] On the basis of the original 800G 2XFR4 silicon photonics chip, eight RX output optical waveguides 130, two RX input optical waveguides 140 and two optical demultiplexers 150 are additionally integrated. When the 800G 2XFR4 silicon photonics chip is applied to an 800G 2XFR4 silicon photonics optical engine, it is not necessary to configure a Z-block and an RX collimating lens, thereby reducing the size and the impact on the PCB board layout space, and facilitating coupling.
[0026] Embodiment 2
[0027] As Figure 2 shown, this embodiment is a further improvement on the basis of Embodiment 1, and the specific content is as follows:
[0028] The two TX output optical waveguides 120 and the two RX input optical waveguides 140 are on the same side and are adjacent and equally spaced. Subsequently, when coupling a multi-channel fiber array 6, a four-channel fiber array can be used, thereby reducing the number of couplings and facilitating coupling.
[0029] Embodiment 3
[0030] As Figure 2 shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the specific content is as follows:
[0031] The four TX input optical waveguides 110, the two TX output optical waveguides 120 and the two RX input optical waveguides 140 are on the same side. For example, in the perspective shown in the figure, the four TX input optical waveguides 110, the two TX output optical waveguides 120 and the two RX input optical waveguides 140 are on one side in the length direction of the 800G 2XFR4 silicon photonics chip 1, while the two groups of RX output optical waveguides 130 are on the opposite sides. For example, in the perspective shown in the figure, the two groups of RX output optical waveguides 130 are on both sides in the width direction of the 800G 2XFR4 silicon photonics chip 1.
[0032] Embodiment 4
[0033] As Figure 2 shown, this embodiment is a further improvement on the basis of any one of Embodiments 1 to 3, and the specific content is as follows:
[0034] Each TX output optical waveguide 120 is coupled to the output end of a multiplexer 160, and each TX input optical waveguide 110 is coupled to the input end of a 1×2 ratio coupler 170, that is, there are four 1×2 ratio couplers 170. The two output ends of each 1×2 ratio coupler 170 are respectively coupled to the input ends of two multiplexers 160.
[0035] Furthermore: The two output ends of each 1×2 ratio coupler 170 are respectively coupled to the input ends of two multiplexers 160 through an MZM modulator 180, that is, there are eight MZM modulators 180.
[0036] Embodiment 5
[0037] As Figure 3 shown, an 800G 2XFR4 silicon photonics optical engine includes: eight RX focusing lenses 2, two array detector chips 3, two TIA chips 4, four optical emission components 5, a multi-channel fiber array 6, and an 800G 2XFR4 silicon photonics chip 1 as described in any one of Embodiments 1 to 4. The four optical emission components 5 are respectively coupled to four TX incoming optical waveguides 110 in the 800G 2XFR4 silicon photonics chip 1. Two TX outgoing optical waveguides 120 in the 800G 2XFR4 silicon photonics chip 1 are coupled to the multi-channel fiber array 6. Two RX incoming optical waveguides 140 in the 800G 2XFR4 silicon photonics chip 1 are coupled to the multi-channel fiber array 6. Each group of four RX outgoing optical waveguides 130 in the 800G 2XFR4 silicon photonics chip 1 are respectively coupled to an array detector chip 3 through four RX focusing lenses 2. Each array detector chip 3 is respectively wire-bonded to a TIA chip 4. This 800G 2XFR4 silicon photonics optical engine does not need to be configured with a Z-block and an RX collimating lens, which can reduce the size and thus reduce the impact on the PCB board layout space, and the coupling is convenient.
[0038] Embodiment 6
[0039] As Figure 3 shown, this embodiment is a further improvement on Embodiment 5, specifically as follows:
[0040] The two TX outgoing optical waveguides 120 and the two RX incoming optical waveguides 140 are coupled to the same multi-channel fiber array 6, which can reduce the number of multi-channel fiber arrays 6 and the number of coupling times.
[0041] Embodiment 7
[0042] As Figure 3 shown, this embodiment is a further improvement on Embodiment 5 or 6, specifically as follows:
[0043] The optical emission component 5 includes: a laser chip 510, a collimating lens 520, an optical isolator 530, and a TX focusing lens 540 that are sequentially coupled along the optical propagation direction. The TX focusing lens 540 is coupled to the TX incoming optical waveguide 110. The laser chip 510 is integrated on a ceramic heat sink 550. The emitted light emitted by the laser chip 510 is sequentially passed through the collimating lens 520, the optical isolator 530, and the TX focusing lens 540 and then coupled into the TX incoming optical waveguide 110.
[0044] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present invention.
Claims
1. An 800G 2XFR4 silicon photonic chip, characterized in that: The invention comprises four TX input optical waveguides (110), two TX output optical waveguides (120), eight RX output optical waveguides (130), two RX input optical waveguides (140) and two splitters (150). Each TX output optical waveguide (120) is coupled with four TX input optical waveguides (110) respectively. The eight RX output optical waveguides (130) are grouped into four groups. Two groups of RX output optical waveguides (130) are coupled with two RX input optical waveguides (140) one by one via a splitter (150).
2. The 800G 2XFR4 silicon photonic chip according to claim 1, characterized in that: The two TX output light waveguides (120) and the two RX input light waveguides (140) are located on the same side and are adjacently and evenly spaced.
3. The 800G 2XFR4 silicon photonic chip according to claim 1, characterized in that: Four TX input optical waveguides (110), two TX output optical waveguides (120) and two RX input optical waveguides (140) are located on the same side.
4. The 800G 2XFR4 silicon photonic chip according to claim 1, characterized in that: Two groups of RX light output waveguides (130) are located at opposite sides.
5. The 800G 2XFR4 silicon photonic chip according to claim 1, characterized in that: Each TX output optical waveguide (120) is coupled to the output end of a combiner (160), each TX input optical waveguide (110) is coupled to the input end of a 1×2 geometric ratio coupler (170), and the two output ends of each 1×2 geometric ratio coupler (170) are respectively coupled to the input ends of two combiners (160).
6. The 800G 2XFR4 silicon photonic chip according to claim 5, characterized in that: The two output ends of each 1×2 proportional coupler (170) are coupled to the input ends of two combiners (160) via an MZM modulator (180) respectively.
7. An 800G 2XFR4 silicon photonics engine, characterized in that: include: Eight RX converging lenses (2), two array detector chips (3), two TIA chips (4), four optical transmission components (5), a multi-channel optical fiber array (6), and an 800G 2XFR4 silicon photonic chip (1) as described in any one of claims 1 to 6, the four optical transmission components (5) are respectively coupled to four TX input light waveguides (110), two TX output light waveguides (120) are coupled to the multi-channel optical fiber array (6), two RX input light waveguides (140) are coupled to the multi-channel optical fiber array (6), the four RX output light waveguides (130) in each group are respectively coupled to an array detector chip (3) via four RX converging lenses (2), and each array detector chip (3) is respectively wire-bonded to a TIA chip (4).
8. The 800G 2XFR4 silicon photonics engine according to claim 7, characterized in that: Two TX output optical waveguides (120) and two RX input optical waveguides (140) are coupled to the same multi-channel optical fiber array (6).
9. The 800G 2XFR4 silicon photonics engine according to claim 7, characterized in that: The optical transmission component (5) comprises: a laser chip (510), a collimating lens (520), an optical isolator (530), and a TX converging lens (540) which are sequentially coupled along the light propagation direction; the TX converging lens (540) is coupled to the TX optical input waveguide (110); and the laser chip (510) is integrated on a ceramic heat sink (550).