Wafer transmission device
By setting strain sensing components at the bi-dental forks and handles of the wafer transmission device, a Wheatstone bridge structure is formed, which solves the problem of vibration and position shift affecting the handling accuracy in the prior art, and achieves higher sensing accuracy and stability.
Patent Information
- Application Number
- CN202421954228.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-08-13
AI Technical Summary
When existing wafer transmission devices are impacted or disturbed by external forces, abnormal vibrations or wafer position offsets will occur, affecting the handling accuracy, and the sensor setting position affects the sensing accuracy.
A wafer transmission device is designed, including a body and a three-strain sensing assembly. The strain sensing assembly is arranged at the two forks and handles respectively, and is symmetrically arranged on the first and second sides of the body through the strain sensing element to form a Wheatstone bridge structure to accurately sense the strain of the body.
By accurately sensing the strain of the body and outputting the sensing signal, the sensing accuracy of the sensor is improved and the stability and accuracy of the wafer transmission device under the influence of external forces are enhanced.
Smart Images
Figure CN223038901U_ABST
Abstract
Description
Technical Field
[0001] The present utility model relates to a wafer transfer device; in particular, it relates to a wafer transfer device with a strain sensing component. Background Art
[0002] In the semiconductor industry, it is known that a wafer transfer device such as a robotic arm is used to perform the operation of transporting wafers to achieve more precise handling operations. However, although the wafer transfer device is controlled by a computer, when the wafer transfer device is subjected to external force collision or other interferences, the wafer transfer device will still generate abnormal vibrations or cause the position of the loaded wafer to shift, thereby affecting the accuracy during wafer transportation.
[0003] As mentioned above, generally, in order to improve the accuracy during wafer transportation, sensors are provided on the wafer transfer device to sense the actions or vibrations of the wafer transfer device in real time. However, the installation position of the sensors will significantly affect the accuracy of sensor sensing; therefore, how to provide a wafer transfer device that can improve the accuracy of sensor sensing is an urgent problem to be solved. Summary of the Utility Model
[0004] In view of this, the purpose of the present utility model is to provide a wafer transfer device that can significantly improve the accuracy of sensor sensing.
[0005] To achieve the above purpose, a wafer transfer device provided by the present utility model for carrying a wafer includes a body and three strain sensing components. The body has a handle portion and a carrying portion connected to each other. The carrying portion is for carrying the wafer. The carrying portion has two fork teeth that are spaced apart from each other. The body has a first surface and a second surface facing away from each other; the three strain sensing components are respectively disposed at the two fork teeth and the handle portion. Each strain sensing component includes two strain sensing elements, and the two strain sensing elements of each strain sensing component are symmetrically disposed on the first surface and the second surface respectively.
[0006] In one embodiment, the two strain sensing components disposed on the two fork teeth are symmetrically disposed with respect to each other.
[0007] In one embodiment, the handle portion has a first section and a second section connected to each other. One end of the first section is connected to the carrying portion, and the opposite end of the first section is connected to the second section. Wherein the width of the first section gradually decreases from the connection with the carrying portion to the connection with the second section. The strain sensing component disposed on the handle portion is located at the connection between the first section and the second section.
[0008] In one embodiment, the width of the second section is less than or equal to the width at the connection between the first section and the second section.
[0009] In one embodiment, the body has three mounting portions corresponding to the setting positions of the three strain sensing components. Each mounting portion includes two grooves. The two grooves of each mounting portion are symmetrically arranged on the first surface and the second surface respectively, and the two grooves of each mounting portion are recessed from the surfaces of the first surface and the second surface respectively. One strain sensing element is correspondingly accommodated in each groove.
[0010] In one embodiment, the wafer transfer device includes six encapsulating materials correspondingly arranged in the six grooves and covering the six strain sensing elements.
[0011] In one embodiment, the wafer transfer device includes a circuit board assembly electrically connected to the three strain sensing components respectively. The circuit board assembly receives the sensing signals output by the three strain sensing components respectively.
[0012] In one embodiment, the wafer transfer device includes a plurality of electrical conduction members. The plurality of strain sensing elements are electrically connected to the circuit board assembly through the plurality of electrical conduction members.
[0013] In one embodiment, the wafer transfer device includes a plurality of electrical conduction member grooves arranged on the first surface and the second surface. The plurality of electrical conduction member grooves are recessed from the surfaces of the first surface and the second surface respectively. The plurality of electrical conduction members are correspondingly accommodated in the plurality of electrical conduction member grooves.
[0014] In one embodiment, each strain sensing element includes two strain sensing structures. The strain sensing structures of the two strain sensing elements symmetrically arranged on the first surface and the second surface are electrically connected to form a Wheatstone bridge. The Wheatstone bridge has a first arm and a second arm. The two strain sensing structures of one strain sensing element are respectively located on an upper arm of the first arm and a lower arm of the second arm; the two strain sensing structures of the other strain sensing element are respectively located on a lower arm of the first arm and an upper arm of the second arm.
[0015] The effect of the present utility model is that through the design of respectively arranging the three strain sensing components at the two fork tines and the handle portion, the three strain sensing components can not only sense the strain of the body at the two fork tines, but also sense the strain of the body at the handle portion. Thus, the three strain sensing components can accurately sense the strain of the body and output sensing signals for the user's reference. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a perspective view of a wafer transfer device according to a preferred embodiment of the present utility model.
[0017] Figure 2 It is a top view of the wafer transfer device of the above preferred embodiment.
[0018] Figure 3 It is a stress distribution diagram of the said body.
[0019] Figure 4 It is Figure 2 a sectional view taken along the 4-4 direction of
[0020] Figure 5 It is a schematic diagram of the strain sensing component and the circuit board of the above preferred embodiment.
[0021] Figure 6 It is a schematic diagram of two strain sensing elements of the strain sensing component of the above preferred embodiment.
[0022] Figure 7 It is a circuit diagram of the strain sensing component of the above preferred embodiment.
[0023] Figure 8 It is a top view of the wafer transfer device of the above preferred embodiment.
[0024] Description of reference numerals:
[0025] 1: Wafer transfer device
[0026] 10: Body
[0027] 101: First surface
[0028] 102: Second surface
[0029] 10a: Handle
[0030] 10b: Carrying part
[0031] 12: Tooth fork
[0032] 14: First section
[0033] 16: Second section
[0034] 18: Groove
[0035] 19: Electrically conductive part groove
[0036] 20: Strain sensing component
[0037] 22: Strain sensing element
[0038] 221: Flexible substrate
[0039] 30: Encapsulation material
[0040] 40: Circuit board assembly
[0041] 42: Analog / digital signal converter
[0042] 44: Controller
[0043] 46: Transmission module
[0044] 48: Power control module
[0045] 50: Electrical conduction component
[0046] D1, D2, D3: Width
[0047] R1, R2, R3, R4: Strain sensing structure
[0048] V i : Input voltage
[0049] V S1 : Sensing signal
[0050] W: Wafer Detailed implementation manners
[0051] To more clearly illustrate the present utility model, preferred embodiments are cited below and described in detail with reference to the accompanying drawings. Please refer to Figures 1 to 2 As shown, a wafer transfer device 1 of a preferred embodiment of the present utility model is provided for carrying a wafer W. The wafer transfer device 1 includes a body 10 and three strain sensing components 20. The body 10 has a handle portion 10a and a carrying portion 10b connected to each other, and the body 10 has a first surface 101 and a second surface 102 facing away from each other (please refer to Figure 4 ). The handle portion 10a can be connected to a robotic arm. The carrying portion 10b is used to carry the wafer W at the first surface 101. The carrying portion 10b has two fork-like members 12, and the two fork-like members 12 are spaced apart and symmetrically arranged from each other. The three strain sensing components 20 are respectively disposed at the two fork-like members 12 and the handle portion 10a. Each strain sensing component 20 includes two strain sensing elements 22. The two strain sensing elements 22 of each strain sensing component 20 are respectively symmetrically disposed at the first surface 101 and the second surface 102 (please refer to Figure 4 ). The three strain sensing components 20 can not only sense the strain of the body 10 at the two fork-like members 12, but also sense the strain of the body 10 at the handle portion 10a. Thus, the three strain sensing components 20 can accurately sense the strain of the body and output a sensing signal for the user's reference.
[0052] As Figure 2As shown, the two strain sensing components 20 provided on the two-pronged fork 12 are symmetrically arranged with respect to each other; the handle portion 10a has a first section 14 and a second section 16 connected to each other. One end of the first section 14 is connected to the carrying portion 10b, and the other end of the first section 14 is connected to the second section 16. Wherein the width D1 of the first section 14 gradually decreases from the connection with the carrying portion 10b to the connection with the second section 16, and the width D2 of the second section 16 is less than or equal to the width D3 at the connection of the first section 14 and the second section 16. The strain sensing component 20 provided on the handle portion 10a is located at the connection of the first section 14 and the second section 16. Therefore, the strain sensing component 20 provided on the handle portion 10a can be located in the stress concentration area of the handle portion 10a. In this way, the accuracy of the strain sensing component 20 provided on the handle portion 10a for sensing the wafer transfer device 1 can be improved.
[0053] Please refer to Figure 3 , which is the stress distribution diagram of the body 10, Figure 3 is the result of finite element analysis for the material and average stress state of the body 10 itself. It can be seen from Figure 3 that the connection between the first section 14 and the second section 16 on the handle portion 10a is the stress concentration area. That is to say, the strain sensing component 20 at the connection of the first section 14 and the second section 16 provided on the handle portion 10a can be located in the stress concentration area of the handle portion 10a, thereby improving the accuracy of sensing the strain of the wafer transfer device 1.
[0054] Wherein the body 10 has three mounting portions corresponding to the installation positions of the three strain sensing components 20, and as Figure 4 shown, each mounting portion includes two grooves 18. The two grooves 18 of each mounting portion are symmetrically arranged on the first surface 101 and the second surface 102 respectively, and the two grooves 18 of each mounting portion are recessed from the surfaces of the first surface 101 and the second surface 102 respectively. Each groove 18 correspondingly accommodates one strain sensing element 22. That is to say, a total of six grooves 18 are provided on the first surface 101 and the second surface 102 at the two-pronged fork 12 and the handle portion 10a; Please continue to refer to Figure 4 , in this embodiment, the wafer transfer device 1 further includes six encapsulation materials 30, which are correspondingly arranged in the six grooves 18 and cover the six strain sensing elements 22. The plurality of encapsulation materials 30 can be made of materials such as epoxy resin, but are not limited thereto. Therefore, each strain sensing element 22 can be covered by each encapsulation material 30 and stably arranged in each groove 18 to isolate the external space.
[0055] Please cooperate with Figure 5 In this embodiment, the wafer transfer device 1 further includes a circuit board assembly 40 electrically connected to the three strain sensing components 20 respectively. The circuit board assembly 40 receives a sensing signal V output by each of the strain sensing components 20 S1 Furthermore, the circuit board assembly 40 is provided with an analog / digital signal converter 42, a controller 44, a transmission module 46 and a power control module 48. The controller 44 can be, for example, a microcontroller, and the transmission module 46 can be, for example, a wired transmission module or a wireless transmission module. In this embodiment, a wireless transmission module is taken as an example. Each of the strain sensing components 20 can receive an input voltage V from the power control module 48 i and convert the input voltage V i into the sensing signal V S1 ; The two strain sensing elements 22 of each of the strain sensing components 20 are electrically connected to the analog / digital signal converter. The controller 44 is electrically connected to the analog / digital signal converter 42 and the transmission module 46. The controller 44 obtains the sensing signal V of each of the strain sensing components 20 through the analog / digital signal converter 42 S1 and transmits the sensing signal V of each of the strain sensing components 20 to an external electronic device through the transmission module 46 S1 Therefore, the operator can receive the sensing signal V of each of the strain sensing components 20 in real time through the external electronic device S1 and effectively monitor and analyze it.
[0056] As described above, each of the strain sensing components 20 includes two strain sensing elements 22. Furthermore, each of the strain sensing elements 22 includes a flexible substrate 221 and two strain sensing structures disposed on the flexible substrate, as Figure 6 shown. Two strain sensing structures R1 and R2 are disposed on the flexible substrate 221 of one of the strain sensing elements 22 of each of the strain sensing components 20, and two strain sensing structures R3 and R4 are disposed on the flexible substrate 221 of the other strain sensing element 22. Each of the strain sensing structures R1 to R4 has a resistance value, and the two strain sensing elements 22 are electrically connected to form a Wheatstone bridge as Figure 7 shown. The Wheatstone bridge has a first arm and a second arm. The two strain sensing structures R3 and R4 of one of the strain sensing elements 22 are respectively located on an upper arm of the first arm and a lower arm of the second arm; the two strain sensing structures R1 and R2 of the other strain sensing element 22 are respectively located on a lower arm of the first arm and an upper arm of the second arm.
[0057] When the body 10 is subjected to stress, the resistance values of the strain sensing structures R1-R4 of the strain sensing components 20 change correspondingly. Among them, when one side of the body 10 is compressed and the other side is relatively stretched, the resistance value of the strain sensing element 22 on the compressed side is less than that of the other strain sensing element 22, so as to generate the corresponding sensing signal V S1 , when the stress applied to the body 10 is greater, the sensing signal V S1 has a larger absolute value. Since it is the relative change of the resistance values on the two strain sensing elements 22 (that is, the resistance values of the two strain sensing structures R1, R2 or R3, R4 on one strain sensing element increase, and the resistance values of the two strain sensing structures R3, R4 or R1, R2 on the other strain sensing element decrease), the structure of the Wheatstone bridge can be used to increase the sensing signal V S1 , that is, effectively increase the sensing signal V S1 sensitivity.
[0058] It should be further noted that the wafer transfer device 1 includes a plurality of electrical conductors. The plurality of strain sensing elements are electrically connected to the circuit board assembly through the plurality of electrical conductors. The electrical conductors can be wires or flexible circuit boards for example; in addition, as Figure 8 shown, the body 10 further includes a plurality of electrical conductor grooves 19. The plurality of electrical conductor grooves 19 are provided on the first surface 101 and the second surface 102, and the plurality of electrical conductor grooves 19 are respectively recessed from the surfaces of the first surface 101 and the second surface 102. The plurality of electrical conductors 50 are correspondingly accommodated in the plurality of electrical conductor grooves 19. Preferably, encapsulating materials can also be correspondingly provided in the plurality of electrical conductor grooves 19 to cover the plurality of electrical conductors.
[0059] In summary, the effect of the present invention is that through the design of respectively arranging the three strain sensing components 20 at the two fork 12 and the handle portion 10a, the three strain sensing components 20 can not only sense the strain of the body 10 at the two fork 12, but also sense the strain of the body 10 at the handle portion 10a. Thus, the three strain sensing components 20 can accurately sense the strain of the body 10 and output a sensing signal for the user to refer to.
[0060] The above are only the preferred and feasible embodiments of the present invention. Any equivalent changes made by applying the description and claims of the present invention should be included in the patent scope of the present invention.
Claims
1. A wafer transfer device for carrying a wafer, characterized in that: Include: A body having a handle and a carrying portion connected to each other, the carrying portion is used to carry the wafer, the carrying portion has two forks, the two forks are spaced apart from each other, and the body has a first surface and a second surface opposite to each other; as well as Three strain sensing components are respectively arranged at the two forks and the handle, each of the strain sensing components comprises two strain sensing elements, and the two strain sensing elements of each strain sensing component are respectively symmetrically arranged on the first surface and the second surface.
2. The wafer transfer device according to claim 1, characterized in that: The two strain sensing components disposed on the two forks are symmetrically disposed with respect to each other.
3. The wafer transfer device according to claim 1, characterized in that: The handle has a first section and a second section connected to each other, one end of the first section is connected to the load-bearing portion, and the other end of the first section is connected to the second section, wherein the width of the first section gradually decreases from the connection with the load-bearing portion to the connection with the second section, and the strain sensing component arranged on the handle is located at the connection between the first section and the second section.
4. The wafer transfer device according to claim 3, characterized in that: The width of the second segment is less than or equal to the width of a connection between the first segment and the second segment.
5. The wafer transfer device according to any one of claims 1 to 4, characterized in that: The main body has three mounting parts corresponding to the mounting positions of the three strain sensing components, each of the mounting parts includes two grooves, the two grooves of each mounting part are symmetrically arranged on the first surface and the second surface, and the two grooves of each mounting part are respectively formed inwardly from the surface of the first surface and the second surface, and each of the grooves accommodates a strain sensing element.
6. The wafer transfer device according to claim 5, characterized in that: The invention comprises six packaging materials, which are correspondingly arranged in the six grooves and cover the six strain sensing elements.
7. The wafer transfer device according to claim 1, characterized in that: A circuit board component is included which is electrically connected to the three strain sensing components respectively, and the circuit board component receives sensing signals output by the three strain sensing components respectively.
8. The wafer transfer device according to claim 7, characterized in that: It comprises a plurality of electrical conductive parts, and the plurality of strain sensing elements are electrically connected to the circuit board assembly through the plurality of electrical conductive parts.
9. The wafer transfer device according to claim 8, characterized in that: It comprises a plurality of electrically conductive member slots, which are arranged on the first surface and the second surface, and are respectively formed concavely from the surfaces of the first surface and the second surface, and the plurality of electrically conductive members are correspondingly accommodated in the plurality of electrically conductive member slots.
10. The wafer transfer device according to claim 1, wherein: Each of the strain sensing elements includes two strain sensing structures, and the strain sensing structures of the two strain sensing elements symmetrically arranged on the first surface and the second surface are electrically connected to form a Wheatstone bridge, wherein the Wheatstone bridge has a first arm and a second arm, wherein the two strain sensing structures of one of the strain sensing elements are respectively located on an upper arm of the first arm and a lower arm of the second arm; and the two strain sensing structures of the other strain sensing element are respectively located on a lower arm of the first arm and an upper arm of the second arm.