Throwing type wafer cleaning mechanism

Abstract

The utility model discloses a throwing type wafer cleaning mechanism which comprises a base, a first driving piece, a transmission mechanism and a bearing piece, the fixed end of the first driving piece is installed on the base, the driving end of the first driving piece is connected with the first end of the transmission mechanism, and the second end of the transmission mechanism is connected with the bearing piece. The first driving piece is configured to drive the bearing piece to ascend and descend through a transmission mechanism; the bearing part is configured to bear a wafer box containing wafers, and the wafers in the wafer box are located below the liquid level of the cleaning liquid; according to the throwing type wafer cleaning mechanism, the bearing piece is driven to ascend and descend in the mode that the first driving piece is matched with the transmission mechanism, the wafer box containing the wafer is driven to throw up and down, then the wafer in the wafer box is cleaned, the structure is compact, the occupied space is small, the cleaning effect is good, and the cleaning efficiency is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a swinging wafer cleaning mechanism. Background Art

[0002] A wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. The silicon ingot is then ground, polished, and sliced to form a silicon wafer, that is, a wafer.

[0003] As is well known, after the wafer processing is completed, a specific cleaning device is required to clean the wafer. Currently, there are various types of cleaning devices on the market, but they generally have the disadvantages of large occupied space and poor cleaning effect. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a swinging wafer cleaning mechanism to solve the problems of large occupied space and poor cleaning effect existing in the conventional cleaning devices in the prior art.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A swinging wafer cleaning mechanism, which includes a base, a first driving member, a transmission mechanism, and a carrier, wherein:

[0007] The fixed end of the first driving member is installed on the base, the driving end of the first driving member is connected to the first end of the transmission mechanism, the second end of the transmission mechanism is connected to the carrier, and the first driving member is configured to drive the carrier to lift and lower through the transmission mechanism;

[0008] The carrier is configured to carry a cassette containing wafers, and the wafers in the cassette are located below the liquid level of the cleaning liquid;

[0009] The first driving member drives the carrier to lift and lower to drive the cassette containing wafers to swing up and down, thereby cleaning the wafers in the cassette.

[0010] Further, the transmission mechanism includes a transmission component, a lifting member, and a connecting member. The lifting member is installed on the base in a liftable manner. The first driving member is configured to drive the lifting member to lift and lower through the transmission component. The upper end of the connecting member is connected to the lifting member, and the lower end of the connecting member is connected to the carrier.

[0011] Furthermore, the first driving member is a motor, the transmission assembly includes a transmission shaft and a transmission plate. The transmission shaft is rotatably installed on the base, the driving shaft of the motor is coaxially connected to the first end of the transmission shaft, the transmission plate is vertically arranged, the upper end of the transmission plate is eccentrically hinged to the second end of the transmission shaft, and the lower end of the transmission plate is hinged to the lifting member. The motor drives the transmission shaft to rotate, so as to drive the lifting member to lift through the transmission plate.

[0012] Furthermore, an eccentric shaft is eccentrically arranged at the second end of the transmission shaft. The upper end of the transmission plate is rotatably installed on the eccentric shaft through a bearing. A hinge shaft is arranged on the lifting member, and the lower end of the transmission plate is rotatably installed on the hinge shaft through a bearing.

[0013] Furthermore, the lifting member is arranged on the base in a liftable manner through a guiding assembly. The guiding assembly includes two guiding rails arranged at intervals on the base. The two guiding rails extend in the height direction, and both sides of the lifting member are slidably arranged on the two guiding rails through sliders.

[0014] Furthermore, a plurality of liquid leakage holes are spaced apart on the bearing member. When the crystal cassette is tossed up and down, the cleaning liquid flows through the plurality of liquid leakage holes.

[0015] Furthermore, a protective cover is arranged on the base. The protective cover is configured to prevent the cleaning liquid from splashing onto the transmission assembly during cleaning.

[0016] Compared with the prior art, the beneficial effects of the tossing type wafer cleaning mechanism are as follows: The first driving member is used in cooperation with the transmission mechanism to drive the bearing member to lift, drive the crystal cassette containing the wafer to be tossed up and down, and then clean the wafer in the crystal cassette. It not only has a compact structure and small occupied space, but also has good cleaning effect and high cleaning efficiency. The lifting member is driven to lift through the cooperation of the transmission shaft and the transmission plate, with a clever design and easy realization of the lifting method. The guiding assembly is added, and both sides of the lifting member are slidably arranged on the two guiding rails through sliders, further improving the stability of the lifting. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the background technology and the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained according to the content of the embodiments of the present invention and these drawings without creative efforts.

[0018] Figure 1It is a three-dimensional structure schematic diagram of a throwing type wafer cleaning mechanism provided by an embodiment of the present utility model;

[0019] Figure 2 It is a top view schematic diagram of a throwing type wafer cleaning mechanism provided by an embodiment of the present utility model;

[0020] Figure 3 It is a side view schematic diagram of a throwing type wafer cleaning mechanism provided by an embodiment of the present utility model. Detailed implementation manners

[0021] The technical solution of the present utility model will be further described below with reference to the accompanying drawings and through specific implementation manners.

[0022] To facilitate the understanding of the present utility model, the present utility model will be described more comprehensively below with reference to the relevant accompanying drawings. Preferred embodiments of the present utility model are shown in the drawings. However, the present utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present utility model can be understood more thoroughly and comprehensively. It should be noted that when a component is referred to as being "fixed to" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation manner. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0023] Please refer to Figures 1 to 3 As shown, in this embodiment, a throwing type wafer cleaning mechanism includes a base 1, a first driving member 2, a transmission mechanism 3 and a carrier 4, wherein: the fixed end of the first driving member 2 is installed on the base 1, the driving end of the first driving member 2 is connected to the first end of the transmission mechanism 3, the second end of the transmission mechanism 3 is connected to the carrier 4, and the first driving member 2 is configured to drive the carrier 4 to move up and down through the transmission mechanism 3; the carrier 4 is configured to carry a cassette containing wafers, and the wafers in the cassette are located below the liquid level of the cleaning liquid; the first driving member 2 drives the carrier 4 to move up and down to drive the cassette containing wafers to be thrown up and down, thereby cleaning the wafers in the cassette.

[0024] It can be seen that by using the first driving member 2 in cooperation with the transmission mechanism 3 to drive the lifting of the carrier 4, driving the cassette containing the wafers to move up and down, and then cleaning the wafers in the cassette, not only is the structure compact and occupies a small space, but also the cleaning effect is good and the cleaning efficiency is high.

[0025] As an implementation manner, the transmission mechanism 3 includes a transmission assembly 30, a lifting member 31, and a connecting member 32. The lifting member 31 is installed on the base 1 in a liftable manner. The first driving member 2 is configured to drive the lifting member 31 to lift through the transmission assembly 30. The upper end of the connecting member 32 is connected to the lifting member 31, and the lower end of the connecting member 32 is connected to the carrier 4.

[0026] As an implementation manner, the first driving member 2 is a motor. The transmission assembly 30 includes a transmission shaft 300 and a transmission plate 301. The transmission shaft 300 is rotatably installed on the base 1. The driving shaft of the motor is coaxially connected to the first end of the transmission shaft 300. The transmission plate 301 is vertically arranged. The upper end of the transmission plate 301 is eccentrically hinged to the second end of the transmission shaft 300. The lower end of the transmission plate 301 is hinged to the lifting member 31. The motor drives the transmission shaft 300 to rotate to drive the lifting member 31 to lift through the transmission plate 301.

[0027] Specifically, the driving shaft of the motor is connected to the first end of the transmission shaft 300 through a coupling 5.

[0028] It can be seen that by the cooperation of the transmission shaft 300 and the transmission plate 301 to drive the lifting of the lifting member 31, the design is ingenious and the lifting method is easy to implement.

[0029] As an implementation manner, an eccentric shaft 6 is eccentrically arranged at the second end of the transmission shaft 300. The upper end of the transmission plate 301 is rotatably installed on the eccentric shaft 6 through a bearing. An articulated shaft 7 is arranged on the lifting member 31. The lower end of the transmission plate 301 is rotatably installed on the articulated shaft 7 through a bearing.

[0030] As an implementation manner, the lifting member 31 is arranged on the base 1 in a liftable manner through a guiding assembly 8. The guiding assembly 8 includes two guiding tracks 80 arranged at intervals on the base 1. The two guiding tracks 80 extend in the height direction. Both sides of the lifting member 31 are slidably arranged on the two guiding tracks 80 through sliders 81.

[0031] It can be seen that by adding the guiding assembly 8, both sides of the lifting member 31 are slidably arranged on the two guiding tracks 80 through sliders 81, further improving the stability of the lifting.

[0032] As an implementation manner, a plurality of liquid leakage holes 40 are spaced apart on the carrier 4. When the cassette moves up and down, the cleaning liquid flows through the plurality of liquid leakage holes 40.

[0033] As an implementation manner, a protective cover 9 is provided on the base 1, and the protective cover 9 is configured to prevent the cleaning liquid from splashing onto the transmission component 30 during cleaning.

[0034] When the above-mentioned wafer cleaning mechanism with a tossing motion is cleaning: The handling device or manipulator places the cassette containing the wafer on the carrier 4. The first driving member 2 drives the transmission shaft 300 to rotate through the coupling 5, and drives the transmission plate 301 to move up and down through the eccentric shaft 6. At the same time, the transmission plate 301 drives the lifting member 31 to slide up and down on the two guiding rails 80 through the hinge shaft 7; both sides of the lifting member 31 slide on the two guiding rails 80 through the sliders 81, driving the cassette containing the wafer to be tossed up and down, thereby cleaning the wafer in the cassette; during the tossing motion, the cleaning liquid flows through the plurality of liquid leakage holes 40.

[0035] The above embodiments only illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above examples. Without departing from the spirit and scope of the present invention, there are various changes and modifications to the present invention, and these changes and modifications all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A throwing type wafer cleaning mechanism, characterized in that: The throwing type wafer cleaning mechanism comprises a base, a first driving member, a transmission mechanism and a bearing member, wherein: The fixed end of the first driving member is mounted on the base, the driving end of the first driving member is connected to the first end of the transmission mechanism, the second end of the transmission mechanism is connected to the bearing member, and the first driving member is configured to drive the bearing member to rise and fall through the transmission mechanism; The carrier is configured to carry a wafer box containing wafers, and the wafers in the wafer box are located below the liquid level of the cleaning liquid; The first driving member drives the carrier to move up and down, so as to drive the crystal box containing the wafers to toss up and down, thereby cleaning the wafers in the crystal box.

2. The throwing type wafer cleaning mechanism according to claim 1, characterized in that: The transmission mechanism includes a transmission assembly, a lifting member and a connecting member. The lifting member is installed on the base in a liftable manner. The first driving member is configured to drive the lifting member to move up and down through the transmission assembly. The upper end of the connecting member is connected to the lifting member, and the lower end of the connecting member is connected to the supporting member.

3. The throwing type wafer cleaning mechanism according to claim 2, characterized in that: The first driving member is a motor, and the transmission assembly includes a transmission shaft and a transmission plate. The transmission shaft is rotatably mounted on the base, the driving shaft of the motor is coaxially connected to the first end of the transmission shaft, the transmission plate is vertically arranged, the upper end of the transmission plate is eccentrically hinged to the second end of the transmission shaft, and the lower end of the transmission plate is hinged to the lifting member. The motor drives the transmission shaft to rotate to drive the lifting member to rise and fall through the transmission plate.

4. The throwing type wafer cleaning mechanism according to claim 3, characterized in that: An eccentric shaft is eccentrically arranged at the second end of the transmission shaft, and the upper end of the transmission plate is rotatably mounted on the eccentric shaft via a bearing. A hinge shaft is arranged on the lifting member, and the lower end of the transmission plate is rotatably mounted on the hinge shaft via a bearing.

5. The throwing type wafer cleaning mechanism according to claim 3, characterized in that: The lifting member is liftably arranged on the base through a guide assembly, and the guide assembly includes two guide rails spaced apart on the base, the two guide rails extend in the height direction, and both sides of the lifting member are slidably arranged on the two guide rails through sliders.

6. The throwing type wafer cleaning mechanism according to claim 1, characterized in that: The carrier is provided with a plurality of leakage holes at intervals, and when the crystal box is tossed up and down, the cleaning liquid flows through the plurality of leakage holes.

7. The throwing type wafer cleaning mechanism according to claim 2, characterized in that: A protective cover is arranged on the base, and the protective cover is configured to prevent the cleaning liquid from splashing onto the transmission component during cleaning.

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