Device for monitoring state of wafer in coating machine
By installing monitoring devices of cameras, transparent boards, torque sensors, controllers and alarms on the coating machine, the wafer status is monitored in real time and alarm signals are issued, which solves the problem of wafer position offset caused by abnormal thimble movement, ensuring coating quality and wafer safety.
Patent Information
- Application Number
- CN202422195868.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-06
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2034-09-06
AI Technical Summary
During semiconductor manufacturing, abnormal movement of the thimble on the coating machine causes the wafer position to shift, which cannot be discovered in time, which will affect the coating quality or cause the wafer to be clamped.
A monitoring device is designed, including a camera, transparent plate, torque sensor, controller and alarm. By obtaining video signals and torque data in real time, it judges the vibration frequency and movement speed of the wafer. If it exceeds the preset range, start the alarm to remind the operator.
Real-time monitoring of the wafer status in the coating machine is realized. When the wafer position is offset, an alarm signal is issued in a timely manner to prevent damage to the coating quality or wafer damage.
Smart Images

Figure CN223038908U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, and particularly relates to a device for monitoring the state of a wafer in a coating machine. Background Art
[0002] In the process of semiconductor manufacturing, it is necessary to use an HDP-CVD (High Density Plasma Chemical Vapor Deposition) machine to coat a wafer, and the HDP-CVD machine can be called a coating machine. Refer to Figure 1 As shown, before coating, it is necessary to use a manipulator to take out the wafer 10 from the FOUP (Front Opening Unified Pod) and then place it on the chuck 11 (chuck) in the reaction chamber 7 of the machine. When the manipulator places the wafer 10 on the chuck 11, the three lift pins 8 in the chuck 11 need to be lifted under the drive of the motor 9 to carry the wafer 10. Refer to Figure 2 As shown, after the wafer 10 is placed on the lift pins 8, the lift pins 8 are smoothly retracted into the chuck 11 under the drive of the motor 9, so that the lower surface of the wafer 10 is attached to the upper surface of the chuck 11, and then the wafer 10 is coated. After the wafer 10 is coated, the lift pins 8 lift the wafer 10 under the drive of the motor 9, and the manipulator takes out the wafer 10 from the reaction chamber 7 of the machine.
[0003] Refer to Figure 1 and Figure 2 As shown, under normal circumstances, the lifting and lowering of the lift pins 8 are both smooth, and the lift pins 8 need to remain stationary when rising to the highest point or falling to the lowest point. However, refer to Figure 3 As shown, during the production process, the movement of the lift pins 8 sometimes becomes abnormal, resulting in the position of the wafer 10 on the lift pins 8 or on the chuck 11 shifting. When the position of the wafer 10 shifts, it cannot be detected in time, which may lead to the wafer 10 not being coated normally or being clamped and broken by the manipulator. For example, if the lift pins 8 vibrate during the descent or continuously vibrate at the lowest point, the position of the wafer 10 on the chuck 11 will shift, resulting in uneven film distribution on the wafer 10. If the lift pins 8 vibrate during the ascent or continuously vibrate at the highest point, the position of the wafer 10 on the lift pins 8 will shift, and it is not easy for the manipulator to clamp the wafer 10 firmly or may clamp and break the wafer 10. Summary of the Utility Model
[0004] The utility model provides a device for monitoring the state of a wafer in a coating machine to solve the technical problem that the shift of the position of the wafer cannot be detected in time.
[0005] To solve the above technical problems, the present utility model provides a device for monitoring the state of a wafer in a coating machine. The coating machine includes a reaction chamber for coating and a motor for driving a thimble. The device includes a camera, a transparent plate, a torque sensor, a controller, and an alarm; a window is provided on the side wall of the reaction chamber, and the transparent plate is fixed on the window; the lens of the camera faces the transparent plate;
[0006] The rotating shaft of the torque sensor is connected to the rotating shaft of the motor;
[0007] The camera, the torque sensor, and the alarm are respectively connected to the controller. The camera is used to obtain a video signal corresponding to the state of the wafer from the side of the wafer and send the video signal to the controller. The torque sensor is used to obtain the torque of the motor and send the torque of the motor to the controller. The controller is used to judge whether to activate the alarm according to the video signal and the torque of the motor.
[0008] Optionally, the device further includes a display screen. The display screen is installed outside the coating machine and is connected to the camera. The camera is used to send the video signal to the display screen, and the display screen is used to display the video signal.
[0009] Optionally, the camera is fixed on the side wall of the reaction chamber by screws.
[0010] Optionally, both the transparent plate and the window are circular in shape.
[0011] Optionally, the device further includes a switch, and the switch is arranged between the alarm and the controller.
[0012] Optionally, the rotating shaft of the torque sensor and the rotating shaft of the motor are connected by a coupling.
[0013] A device for monitoring the state of a wafer in a coating machine provided by the utility model includes a camera, a transparent plate, a torque sensor, a controller and an alarm. The camera can obtain the video signal corresponding to the state of the wafer in the coating machine in real time from the side of the wafer, that is, the side of the coating machine through the transparent plate. After the camera sends the video signal to the controller, the controller can determine the vibration frequency and moving speed of the wafer according to the video signal. If the vibration frequency and / or moving speed of the wafer is not within the preset range, it means that the ejector pin shakes, and the position of the wafer on the ejector pin or on the chuck is likely to shift. At this time, the controller sends a start signal to the alarm to turn on the alarm, reminding the operator to check the state of the wafer in time. If the vibration frequency and moving speed of the wafer are within the preset range, it means that the ejector pin does not shake, and the position of the wafer on the ejector pin or on the chuck is likely not to shift. At this time, the controller does not send a start signal to the alarm to keep the alarm off. In addition, the torque sensor can send the torque of the motor to the controller. If the torque of the motor is greater than the threshold value, it means that an ejector pin is stuck by the chuck, and the position of the wafer on the ejector pin or on the chuck is likely to shift. At this time, the controller sends a start signal to the alarm to turn on the alarm, reminding the operator to check the state of the wafer in time. If the torque of the motor is less than or equal to the threshold value, it means that the ejector pin is not stuck by the chuck, and the position of the wafer on the ejector pin or on the chuck is likely not to shift. At this time, the controller does not send a start signal to the alarm to keep the alarm off. The unexpected effect of this device is that it can monitor the state of the wafer in the coating machine in real time, and when the position of the wafer on the ejector pin or on the chuck shifts, it sends an alarm signal in time to remind the operator. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a schematic structural diagram when the ejector pin in the coating machine in the prior art lifts the wafer.
[0015] Figure 2 is a schematic structural diagram when the wafer in the coating machine in the prior art is adsorbed on the chuck.
[0016] Figure 3 is Figure 2 the schematic structural diagram when the position of the wafer on the chuck in
[0017] Figure 4 is a schematic structural diagram when a device for monitoring the state of a wafer in a coating machine provided by an embodiment of the utility model is in use.
[0018] [The description of the reference numerals is as follows]:
[0019] Camera - 1, transparent plate - 2, torque sensor - 3, controller - 4, alarm - 5, display screen - 6, reaction chamber - 7, ejector pin - 8, motor - 9, wafer - 10, chuck - 11. DETAILED DESCRIPTION
[0020] In order to make the purpose, advantages and features of the present invention more clear, the following is a further detailed description of a device for monitoring the state of wafers in a coating machine proposed by the present invention in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are all in a very simplified form and are not in precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
[0021] In the description of the present invention, the terms "first", "second", etc. are added for the convenience of description and reference, and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined by the terms "first", "second", etc. may explicitly or implicitly include one or more of the features.
[0022] refer to Figure 4 As shown, this embodiment provides a device for monitoring the state of wafers in a coating machine, the coating machine includes a reaction chamber 7 for coating and a motor 9 for driving an ejector pin 8, the device includes a camera 1, a transparent plate 2, a torque sensor 3, a controller 4 and an alarm 5; a window is provided on the side wall of the reaction chamber 7, and the transparent plate 2 is fixed on the window; the lens of the camera 1 faces the transparent plate 2; the rotating shaft of the torque sensor 3 is connected to the rotating shaft of the motor 9; the camera 1, the torque sensor 3 and the alarm 5 are respectively connected to the controller 4, the camera 1 is used to obtain a video signal corresponding to the state of the wafer from the side of the wafer 10 and send the video signal to the controller 4, the torque sensor 3 is used to obtain the torque of the motor 9 and send the torque of the motor 9 to the controller 4, and the controller 4 is used to determine whether to start the alarm 5 according to the video signal and the torque of the motor 9. Among them, the controller 4 can be a controller provided by the coating machine, or a controller of the same type as the controller provided by the coating machine.
[0023] The present embodiment provides a device for monitoring the state of a wafer in a coating machine, comprising a camera 1, a transparent plate 2, a torque sensor 3, a controller 4 and an alarm 5. The camera 1 can obtain a video signal corresponding to the state of the wafer in the coating machine from the side of the wafer 10, i.e., the side of the coating machine, through the transparent plate 2. After the camera 1 sends the video signal to the controller 4, the controller 4 can determine the vibration frequency and moving speed of the wafer 10 according to the video signal. If the vibration frequency and / or moving speed of the wafer 10 are not within a preset range, it indicates that the ejector pin 8 is shaking, and the position of the wafer 10 on the ejector pin 8 or on the suction cup 11 is likely to be offset. At this time, the controller 4 sends a start signal to the alarm 5 to turn on the alarm 5, reminding the operator to check the state of the wafer 10 in time. If the vibration frequency and moving speed of the wafer 10 are within the preset range, it indicates that the ejector pin 8 is not shaking, and the position of the wafer 10 on the ejector pin 8 or on the suction cup 11 is likely not to be offset. At this time, the controller 4 does not send a start signal to the alarm 5 to keep the alarm 5 off. In addition, the torque sensor 3 can send the torque of the motor 9 to the controller 4. If the torque of the motor 9 is greater than the threshold, it means that the ejector pin 8 is stuck by the suction cup 11, and the position of the wafer 10 on the ejector pin 8 or on the suction cup 11 is likely to be offset. At this time, the controller 4 sends a start signal to the alarm 5 to turn on the alarm 5 to remind the operator to check the status of the wafer 10 in time. If the torque of the motor 9 is less than or equal to the threshold, it means that the ejector pin 8 is not stuck by the suction cup 11, and the position of the wafer 10 on the ejector pin 8 or on the suction cup 11 is likely not to be offset. At this time, the controller 4 does not send a start signal to the alarm 5 to keep the alarm 5 closed. The unexpected effect of the device is that the device can monitor the status of the wafer 10 in the coating machine in real time, and when the position of the wafer 10 on the ejector pin 8 or on the suction cup 11 is offset, an alarm signal is sent in time to remind the operator.
[0024] Optional, reference Figure 4 As shown, the device further includes a display screen 6, which is installed outside the coating machine, and is connected to the camera 1. The camera 1 is used to send the video signal to the display screen 6, and the display screen 6 is used to display the video signal. The operator can view the status of the wafer 10 in the coating machine in real time through the display screen 6 to prevent the wafer 10 from shifting during the production process.
[0025] Optional, reference Figure 4 As shown, the camera 1 is fixed to the side wall of the reaction chamber 7 by screws. The screws facilitate the installation and removal of the camera 1. In other embodiments, the camera 1 can be fixed to the side wall of the coating machine by glue.
[0026] Optional, reference Figure 4As shown, the transparent plate 2 and the window are both circular in shape, which facilitates processing to form the transparent plate 2 and the window. In other embodiments, the transparent plate 2 and the window may be rectangular or in other shapes.
[0027] Optional, reference Figure 4 As shown, the device further comprises a switch, which is arranged between the alarm 5 and the controller 4. The state of the switch can be set to a normally closed state. When the alarm 5 is turned on, if the operator has arrived at the site for processing, the alarm 5 can be turned off in time by the switch.
[0028] Optional, reference Figure 4 As shown, the rotating shaft of the torque sensor 3 is connected to the rotating shaft of the motor 9 via a coupling. The coupling is used to conveniently connect the rotating shaft of the torque sensor 3 and the rotating shaft of the motor 9.
[0029] Optional, reference Figure 4 As shown, the controller 4 is a controller provided by the coating machine, so no additional controller is required. The controller 4 can also stop the coating machine while activating the alarm 5 to prevent the wafer 10 from being broken by the robot or coating abnormality.
[0030] In summary, a device for monitoring the state of a wafer in a coating machine provided by the present utility model includes a camera 1, a transparent plate 2, a torque sensor 3, a controller 4, and an alarm 5. The camera 1 can obtain the video signal corresponding to the state of the wafer in the coating machine in real time through the transparent plate 2. After the camera 1 sends the video signal to the controller 4, the controller 4 can determine the vibration frequency and moving speed of the wafer 10 according to the video signal. If the vibration frequency and / or moving speed of the wafer 10 is not within the preset range, it indicates that the ejector pin 8 shakes, and the position of the wafer 10 on the ejector pin 8 or on the chuck 11 is likely to shift. At this time, the controller 4 sends a start signal to the alarm 5 to turn on the alarm 5, reminding the operator to check the state of the wafer 10 in time. If the vibration frequency and moving speed of the wafer 10 are within the preset range, it indicates that the ejector pin 8 does not shake, and the position of the wafer 10 on the ejector pin 8 or on the chuck 11 is likely not to shift. At this time, the controller 4 does not send a start signal to the alarm 5 to keep the alarm 5 off. In addition, the torque sensor 3 can send the torque of the motor 9 to the controller 4. If the torque of the motor 9 is greater than the threshold value, it indicates that an ejector pin 8 is stuck by the chuck 11, and the position of the wafer 10 on the ejector pin 8 or on the chuck 11 is likely to shift. At this time, the controller 4 sends a start signal to the alarm 5 to turn on the alarm 5, reminding the operator to check the state of the wafer 10 in time. If the torque of the motor 9 is less than or equal to the threshold value, it indicates that the ejector pin 8 is not stuck by the chuck 11, and the position of the wafer 10 on the ejector pin 8 or on the chuck 11 is likely not to shift. At this time, the controller 4 does not send a start signal to the alarm 5 to keep the alarm 5 off. The unexpected effect of this device is that it can monitor the state of the wafer 10 in the coating machine in real time, and when the position of the wafer 10 on the ejector pin 8 or on the chuck 11 shifts, it issues an alarm signal in time to remind the operator.
[0031] The above description is only a description of the preferred embodiments of the present utility model, and does not limit the scope of the present utility model in any way. Any changes and modifications made by those of ordinary skill in the art according to the above disclosure belong to the protection scope of the present utility model.
Claims
1. A device for monitoring the state of wafers in a coating machine, wherein the coating machine comprises a reaction chamber for coating and a motor for driving an ejector pin, characterized in that: The device comprises a camera, a transparent plate, a torque sensor, a controller and an alarm; a window is arranged on the side wall of the reaction chamber, and the transparent plate is fixed on the window; the lens of the camera faces the transparent plate; The rotating shaft of the torque sensor is connected to the rotating shaft of the motor; The camera, the torque sensor and the alarm are respectively connected to the controller. The camera is used to obtain a video signal corresponding to the wafer status from the side of the wafer and send the video signal to the controller. The torque sensor is used to obtain the torque of the motor and send the torque of the motor to the controller. The controller is used to determine whether to activate the alarm based on the video signal and the torque of the motor.
2. A device for monitoring the state of a wafer in a coating machine as claimed in claim 1, characterized in that: The device also includes a display screen, which is installed on the outside of the coating machine. The display screen is connected to the camera. The camera is used to send the video signal to the display screen, and the display screen is used to display the video signal.
3. A device for monitoring the state of a wafer in a coating machine as claimed in claim 1, characterized in that: The camera is fixed on the side wall of the reaction chamber by screws.
4. The device for monitoring the wafer status in a coating machine according to claim 1, characterized in that: The transparent plate and the window are both circular in shape.
5. The device for monitoring the wafer status in a coating machine according to claim 1, characterized in that: The device further comprises a switch, which is arranged between the alarm and the controller.
6. The device for monitoring the wafer status in a coating machine according to claim 1, characterized in that: The rotating shaft of the torque sensor is connected to the rotating shaft of the motor via a coupling.