Wafer adsorption device and vacuum nanoimprint equipment with same

By designing an adsorption device for wafers, using suction cups and top blocks to apply force to the wafers, the problem of bubble generation during nanoimprinting is solved, and a better imprinting effect is achieved.

CN223038909UActive Publication Date: 2025-06-27SUZHOU GUANGYUE MICRO NANO TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422201141.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-09
Publication Date
2025-06-27
Estimated Expiration
2034-09-09

AI Technical Summary

Technical Problem

During the nanoimprinting process, bubbles are prone to appear between the glass plate or hard plate motherboard and the wafer during the bonding process, affecting the imprinting effect.

Method used

A wafer adsorption device is designed, including a press-fit plate, an annular suction cup mounting plate and a top block. Through the suction cup and top block, upward and downward forces are applied to the edge and central area of ​​the wafer respectively, so that the wafer can be deformed, so that the central area is first applied to the edge and then the edge is then applied to prevent bubbles from occurring.

Benefits of technology

Through this device, the generation of bubbles is effectively prevented, the nanoimprinting effect is improved, and the transfer of wafer surface patterns is more refined and efficient.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223038909U_ABST
    Figure CN223038909U_ABST
Patent Text Reader

Abstract

The utility model discloses a wafer adsorption device and vacuum nanoimprint equipment with the same, the wafer adsorption device comprises a pressing plate, an annular sucker mounting plate and a top block, the pressing plate is in transmission connection with a pressing lifting driving mechanism, the annular sucker mounting plate is sleeved on the outer side of the pressing plate, and the top block is arranged on the outer side of the annular sucker mounting plate. A plurality of suction cups are installed on the annular suction cup installation plate in the circumferential direction of the annular suction cup installation plate, the suction cups are used for adsorbing the edge position of a wafer to be embossed, the annular suction cup installation plate is in transmission connection with a suction cup lifting driving mechanism, and the ejection block is in transmission connection with an ejection block lifting driving mechanism. And the top block is used for penetrating through the through hole in the pressing plate to apply downward pressure to the central area of the wafer adsorbed by the suction cup, so that the wafer is deformed. According to the utility model, the wafer is deformed, the central area of the wafer is firstly attached to the mother board, and then the edge of the wafer is attached to the mother board, so that the generation of bubbles is prevented, and the nanoimprint effect is better.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model specifically relates to a wafer adsorption device and a vacuum nanoimprinting device with the device. Background Art

[0002] Nanoimprinting technology is an advanced processing method for fabricating high-resolution structures at the nanoscale. Its core idea is to transfer nanoscale patterns to the target surface using a template, thereby achieving fine processing of materials. Nanoimprinting technology is widely used in fields such as semiconductor manufacturing, optical element preparation, and biomedical sensors.

[0003] When the master plate is a glass plate or other hard material plate, the microstructural pattern on the glass plate is transferred to the wafer. However, air bubbles are likely to appear during the bonding process between the two. Summary of the Utility Model

[0004] To solve the above technical problems, the utility model proposes a wafer adsorption device and a vacuum nanoimprinting device with the device.

[0005] To achieve the above object, the technical solution of the utility model is as follows:

[0006] In the first aspect, the utility model discloses a wafer adsorption device, including:

[0007] A pressing plate, which is in transmission connection with a pressing lifting driving mechanism, and the pressing lifting driving mechanism is used to drive the pressing plate to lift and lower;

[0008] A ring-shaped suction cup mounting plate, which is sleeved outside the pressing plate, and a plurality of suction cups are installed along the circumference of the ring-shaped suction cup mounting plate. The suction cups are used to adsorb the edge position of the wafer to be imprinted. The ring-shaped suction cup mounting plate is in transmission connection with a suction cup lifting driving mechanism, and the suction cup lifting driving mechanism is used to drive the ring-shaped suction cup mounting plate to lift and lower;

[0009] A top block, which is in transmission connection with a top block lifting driving mechanism, and a through hole is installed on the pressing plate. The top block lifting driving mechanism is used to drive the top block to lift and lower. The top block is used to pass through the through hole on the pressing plate to apply a downward pressure to the central area of the wafer adsorbed by the suction cups, so that it deforms.

[0010] On the basis of the above technical solution, the following improvements can be made:

[0011] As a preferred solution, the wafer adsorption device includes: a lifting plate, the pressing plate is installed on the lifting plate, and the lifting plate is in transmission connection with the pressing lifting driving mechanism.

[0012] As a preferred solution, a leveling substrate is installed on the lifting plate, and a number of leveling components are installed on the leveling substrate. The pressing plate is connected to the pressing plate through a number of leveling components, and the leveling components are used to adjust the parallelism of the pressing plate.

[0013] As a preferred solution, a fixed seat is installed on the leveling substrate, and the fixed seat is used to install the body part of the top block lifting drive mechanism.

[0014] As a preferred solution, the wafer adsorption device further includes: a guide shaft, the guide shaft passes through the through hole on the lifting plate, and the guide shaft is used to guide the lifting of the lifting plate.

[0015] As a preferred solution, the body part of the chuck lifting drive mechanism is fixedly installed on the lifting plate.

[0016] As a preferred solution, the top of the top block has a smooth arc-shaped top head.

[0017] In a second aspect, the present invention discloses a vacuum nanoimprinting device, including: an upper imprinting device having an upper cavity, a lower imprinting device having a lower cavity, and a vacuum pumping device. When the upper imprinting device and the lower imprinting device are closed, the upper cavity and the lower cavity form a sealed cavity, and the vacuum pumping device is used to convert the sealed cavity into a vacuum cavity;

[0018] Any one of the above wafer adsorption devices is installed in the upper cavity of the upper imprinting device.

[0019] The present invention discloses a wafer adsorption device and a vacuum nanoimprinting device having the device, and it has the following beneficial effects:

[0020] The present invention first uses a chuck and a top block to apply upward and downward forces to the edge and the central region of the wafer respectively, so that the wafer deforms correspondingly. Thus, the central region of the wafer fits the master plate first, and the edge fits the master plate later, preventing the generation of bubbles and achieving a better nanoimprinting effect. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can also be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic structural diagram of the upper imprinting device (hidden cavity shell) provided by the embodiment of the present invention.

[0023] Figure 2 It is a partially enlarged view of the wafer adsorption device provided by the embodiment of the present invention when adsorbing a wafer.

[0024] Figure 3 This is a partially enlarged view from another perspective when the wafer adsorption device provided by the embodiment of the present utility model does not adsorb the wafer.

[0025] Figure 4 This is a cross-sectional view of the upper imprinting device (hidden cavity shell) provided by the embodiment of the present utility model.

[0026] Figure 5 This is a schematic structural view of the upper imprinting device provided by the embodiment of the present utility model.

[0027] Wherein: 1 - pressing plate, 11 - through hole, 2 - annular suction cup mounting plate, 21 - suction cup, 3 - top block, 31 - arc-shaped top head, 4 - wafer, 51 - lifting plate, 52 - connecting column, 53 - leveling substrate, 54 - leveling member, 55 - fixed seat, 56 - guiding shaft, 61 - pressing and lifting driving mechanism, 62 - suction cup lifting driving mechanism, 63 - top block lifting driving mechanism, 64 - device lifting driving mechanism, 71 - cavity substrate, 72 - cavity shell. Specific embodiments

[0028] The following will describe in detail the preferred embodiments of the present utility model with reference to the accompanying drawings.

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only some of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts belong to the scope of protection of the present utility model.

[0030] In addition, the expression of "including" elements is an "open-ended" expression. This "open-ended" expression only means that there are corresponding components or steps, and should not be construed as excluding additional components or steps.

[0031] In order to achieve the purpose of the present utility model, in some embodiments of the wafer adsorption device and the vacuum nanoimprinting equipment having the device, as Figures 1-5 shown, the wafer adsorption device includes: a pressing plate 1, an annular suction cup mounting plate 2, and a top block 3.

[0032] The pressing plate 1 is in transmission connection with the pressing and lifting driving mechanism 61, and the pressing and lifting driving mechanism 61 is used to drive the pressing plate 1 to lift and lower;

[0033] The annular suction cup mounting plate 2 is sleeved on the outer side of the pressing plate 1, and a plurality of suction cups 21 are mounted on the annular suction cup mounting plate 2 along its circumference, and the suction cups 21 are used to absorb the edge position of the wafer 4 to be imprinted, and the annular suction cup mounting plate 2 is in transmission connection with the suction cup lifting drive mechanism 62, and the suction cup lifting drive mechanism 62 is used to drive the annular suction cup mounting plate 2 to rise and fall;

[0034] The top block 3 is transmission-connected to the top block lifting drive mechanism 63, and a through hole 11 is installed on the pressing plate 1. The top block lifting drive mechanism 63 is used to drive the top block 3 to rise and fall. The top block 3 is used to pass through the through hole 11 on the pressing plate 1 to apply downward pressure to the central area of ​​the wafer 4 adsorbed by the suction cup 21, so that it deforms.

[0035] In order to further optimize the implementation effect of the utility model, in some other embodiments, the other characteristic technologies are the same, the difference is that the wafer adsorption device includes: a lifting plate 51, the pressing plate 1 is installed on the lifting plate 51, and the lifting plate 51 is transmission-connected to the pressing lifting drive mechanism 61.

[0036] Furthermore, based on the above embodiment, the lifting plate 51 is connected to the leveling base plate 53 through a plurality of connecting columns 52, and a plurality of leveling parts 54 are installed on the leveling base plate 53. The pressing plate 1 is connected to the pressing plate 1 through the plurality of leveling parts 54, and the leveling parts 54 are used to adjust the parallelism of the pressing plate 1.

[0037] The leveling member 54 may be, but is not limited to, a micrometer head. A through hole is also provided on the leveling substrate 53 , and the position of the through hole corresponds to the position of the through hole 11 on the pressing plate 1 .

[0038] Furthermore, in order to increase the travel distance of the top block lifting drive mechanism 63 , holes are opened on the lifting plate 51 to reduce the dead weight of the lifting plate 51 .

[0039] Further, on the basis of the above embodiment, a fixing seat 55 is installed on the leveling base plate 53 , and the fixing seat 55 is used to install the body part of the top block lifting drive mechanism 63 .

[0040] Furthermore, based on the above embodiment, the wafer adsorption device further includes: a guide shaft 56 , the guide shaft 56 passes through a through hole on the lifting plate 51 , and the guide shaft 56 is used to guide the lifting and lowering of the lifting plate 51 .

[0041] Further, on the basis of the above embodiment, the body part of the suction cup lifting drive mechanism 62 is fixedly installed on the lifting plate 51 .

[0042] In order to further optimize the implementation effect of the utility model, in some other implementations, the other characteristic technologies are the same, and the difference is that the top of the top block 3 has a smooth arc head 31.

[0043] In addition, an embodiment of the present utility model also discloses a vacuum nano - imprinting device, including: an upper imprinting device with an upper cavity, a lower imprinting device with a lower cavity, and a vacuum pumping device. When the upper imprinting device and the lower imprinting device are closed, the upper cavity and the lower cavity form a sealed cavity, and the vacuum pumping device is used to convert the sealed cavity into a vacuum cavity;

[0044] In the upper cavity of the upper imprinting device, the wafer adsorption device disclosed in any of the above - mentioned embodiments is installed.

[0045] Furthermore, the upper imprinting device includes: a cavity substrate 71 and a cavity shell 72 connected to the cavity substrate 71, and the above - mentioned guide shaft 56 can be fixedly installed on the cavity substrate 71.

[0046] Furthermore, the body part of the above - mentioned pressing and lifting driving mechanism 61 is fixedly installed on the cavity substrate 71.

[0047] Furthermore, the cavity substrate 71 is in transmission connection with the device lifting driving mechanism 64, and the device lifting driving mechanism 64 drives the upper imprinting device to lift, so that it can be closed or separated from the lower imprinting device.

[0048] Each of the above - mentioned lifting driving mechanisms can be, but is not limited to, an electric cylinder, etc.

[0049] An embodiment of the present utility model also discloses a vacuum nano - imprinting method, which uses the above - mentioned vacuum nano - imprinting device for imprinting, and specifically includes:

[0050] Step S1: The suction cups 21 on the annular suction cup mounting plate 2 adsorb the edge position of the wafer 4 to be imprinted, and the master plate is placed at the designated position;

[0051] Step S2: The upper imprinting device and the lower imprinting device come into contact, the upper cavity and the lower cavity form a sealed cavity, and the vacuum pumping device converts the sealed cavity into a vacuum cavity;

[0052] Step S3: The suction cup lifting driving mechanism 62 drives the annular suction cup mounting plate 2 to rise a certain distance, and the suction cups 21 adsorb the wafer 4, causing its edge to deform upward;

[0053] And the top block lifting driving mechanism 63 drives the top block 3 to descend a certain distance, applying a downward pressure to the central area of the wafer 4, causing its central area to deform downward;

[0054] Step S4: The pressing and lifting driving mechanism 61 drives the lifting plate 51 to descend a certain distance, so that the central area of the wafer 4 is in contact with the master plate;

[0055] Step S5: The suction cup lifting driving mechanism 62 drives the annular suction cup mounting plate 2 to descend a certain distance, so that the edge of the wafer 4 is in contact with the master plate;

[0056] Step S6: After the imprinting is completed, each driving mechanism returns to its initial position.

[0057] The utility model discloses a wafer adsorption device and a vacuum nanoimprinting device with the device, and it has the following beneficial effects:

[0058] The utility model first uses the suction cup 21 and the top block 3 to apply upward and downward forces to the edge and the central area of the wafer 4 respectively, so that the wafer 4 undergoes corresponding deformation, so that the central area of the wafer 4 fits the master plate first and the edge fits the master plate later, preventing the generation of bubbles and having a better nanoimprinting effect.

[0059] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle part", "the other end", "upper", "one side", "top", "inner", "front part", "center", "both ends", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present utility model.

[0060] In the present utility model, unless otherwise clearly defined and limited, the terms "installation", "setting", "connection", "fixation", "swivel connection", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0061] The above shows and describes the basic principles, main features and advantages of the present utility model. Those skilled in the art of this industry should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed. The scope of protection claimed by the present utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer adsorption device, characterized in that: include: A pressing plate, the pressing plate is in transmission connection with a pressing lifting drive mechanism, and the pressing lifting drive mechanism is used to drive the pressing plate to rise and fall; An annular suction cup mounting plate, the annular suction cup mounting plate is sleeved on the outer side of the pressing plate, and a plurality of suction cups are mounted on the annular suction cup mounting plate along its circumference, the suction cups are used to absorb the edge position of the wafer to be imprinted, the annular suction cup mounting plate is in transmission connection with a suction cup lifting drive mechanism, and the suction cup lifting drive mechanism is used to drive the annular suction cup mounting plate to rise and fall; A top block is transmission-connected with a top block lifting drive mechanism, and a through hole is installed on the pressing plate. The top block lifting drive mechanism is used to drive the top block to rise and fall. The top block is used to pass through the through hole on the pressing plate to apply downward pressure to the central area of ​​the wafer adsorbed by the suction cup to cause it to deform.

2. The wafer adsorption device according to claim 1, characterized in that: The wafer adsorption device comprises: a lifting plate, the pressing plate is installed on the lifting plate, and the lifting plate is transmission-connected with a pressing lifting drive mechanism.

3. The wafer adsorption device according to claim 2, characterized in that: A leveling base plate is mounted on the lifting plate, and a plurality of leveling members are mounted on the leveling base plate. The pressing plate is connected to the pressing plate through the plurality of leveling members, and the leveling members are used to adjust the parallelism of the pressing plate.

4. The wafer adsorption device according to claim 3, characterized in that: A fixing seat is installed on the leveling base plate, and the fixing seat is used to install the body part of the top block lifting drive mechanism.

5. The wafer adsorption device according to claim 2, characterized in that: The wafer adsorption device further includes: a guide shaft, the guide shaft passes through a through hole on the lifting plate, and the guide shaft is used to guide the lifting and lowering of the lifting plate.

6. The wafer adsorption device according to claim 2, characterized in that: The body part of the suction cup lifting drive mechanism is fixedly installed on the lifting plate.

7. The wafer adsorption device according to any one of claims 1 to 6, characterized in that: The top end of the top block is provided with a smooth arc top end.

8. A vacuum nanoimprinting device, characterized in that: include: An upper stamping device having an upper cavity, a lower stamping device having a lower cavity, and a vacuum device, wherein when the upper stamping device and the lower stamping device are closed, the upper cavity and the lower cavity form a sealed cavity, and the vacuum device is used to convert the sealed cavity into a vacuum cavity; The wafer adsorption device according to any one of claims 1 to 7 is installed in the upper mold cavity of the upper imprinting device.