Anti-oxidation device for wire box of bonding equipment

Abstract

The utility model relates to the technical field of semiconductor sealing testing, in particular to an anti-oxidation device for a wire box of bonding equipment, which comprises a bearing plate for bearing the bonding equipment, a cover plate matched with the bearing plate is rotatably connected onto the bearing plate, the bearing plate and the cover plate are combined to form the wire box, and a semiconductor bonding lead anti-oxidation mechanism is arranged on the cover plate. The semiconductor bonding wire anti-oxidation mechanism comprises a nitrogen gas filling pipe fixedly communicated with the cover plate, the nitrogen gas filling pipe is externally connected with a nitrogen gas filling machine, and one side of the cover plate is fixedly communicated with a guide inclined pipe for guiding the semiconductor bonding wire; the bearing plate and the cover plate are sealed through a sealing mechanism; according to the utility model, after the bearing plate and the cover plate are sealed, nitrogen can be filled into the wire box through the nitrogen filling pipe by driving the nitrogen filling machine, so that the problem that the semiconductor bonding wire at one side of the bonding equipment in the wire box is easy to oxidize is solved, the service life of the semiconductor bonding wire is prolonged, and the service life of the semiconductor bonding wire is prolonged. And the use requirements of workers are conveniently met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging and testing, in particular to an anti-oxidation device for a wire box of a bonding device. Background Technique

[0002] In semiconductor packaging and testing, wire bonding is a method that uses fine semiconductor bonding wires and utilizes heat, pressure, and ultrasonic energy to tightly weld the semiconductor bonding wires to the substrate pads, realizing electrical interconnection between the chip and the substrate and information communication between chips.

[0003] In the prior art, a utility model patent with the publication (announcement) number of CN204289428U and the name of semiconductor bonding wire and semiconductor packaging structure, the semiconductor bonding wire thereof includes a first end portion, a bent portion, and a tail portion; wherein, the first end portion is fixed on the first bonding point of the semiconductor component; the bent portion contains at least one bend; the tail portion is fixed on the second bonding point of the semiconductor component; and the shortest path connecting the first bonding point and the second bonding point does not coincide with the wire; the semiconductor bonding wire of this utility model includes a bent portion, which can keep an appropriate distance between the shortest path of the wire and the conventional wire, greatly reducing the mutual inductance between adjacent wires.

[0004] While maintaining good electrical conductivity and low wire heating, the semiconductor packaging structure of this patent can have a small mutual inductance between adjacent wires; however, since the material of the semiconductor bonding wire is usually a metal wire, such as a gold wire, a silver wire, or a copper wire, and the wire box used to store the bonding device in this patent is not filled with nitrogen, it is very easy for the semiconductor bonding wire made of copper wire to be oxidized, thereby affecting the service life of the semiconductor bonding wire and being inconvenient to meet the use requirements of the staff. Content of the Utility Model

[0005] The purpose of the utility model is to provide an anti-oxidation device for a wire box of a bonding device.

[0006] The technical problem solved by the utility model is: the problem that the semiconductor bonding wire made of copper wire is easily oxidized due to the lack of nitrogen filling in the wire box for storing the bonding device in the prior art.

[0007] The utility model can be realized by the following technical solutions: an anti-oxidation device for a wire box of a bonding device, including a carrier plate for carrying the bonding device, a cover plate rotatably connected to the carrier plate and adapted to it, the carrier plate and the cover plate form a wire box in combination, a semiconductor bonding wire anti-oxidation mechanism is arranged on the cover plate, and the semiconductor bonding wire anti-oxidation mechanism includes a nitrogen filling pipe fixedly communicated with the cover plate, the nitrogen filling pipe is externally connected to a nitrogen filling machine, and a guiding inclined pipe for guiding the semiconductor bonding wire is fixedly communicated with one side of the cover plate;

[0008] The carrier plate and the cover plate are sealed by a sealing mechanism. The sealing mechanism includes a U-shaped insertion block fixedly connected to the cover plate, and a U-shaped slot adapted to the U-shaped insertion block is provided in the inner cavity of the carrier plate.

[0009] A further technical improvement of the present utility model lies in that: a surrounding plate for closing the gap between the carrier plate and the cover plate is fixedly installed on the outer peripheral wall of the carrier plate.

[0010] A further technical improvement of the present utility model lies in that: a first U-shaped magnetic block is elastically slidably connected to the side of the U-shaped insertion block away from the cover plate. A U-shaped narrow slot adapted to the first U-shaped magnetic block is provided in the inner cavity of the carrier plate. A second U-shaped magnetic block with a magnetic property opposite to that of the first U-shaped magnetic block is elastically slidably connected to the inner cavity of the U-shaped narrow slot. The first U-shaped magnetic block and the second U-shaped magnetic block attract each other within a certain distance range.

[0011] A further technical improvement of the present utility model lies in that: circular rods are horizontally elastically slidably connected to both sides of the surrounding plate. A limiting block is fixedly connected to one end of the circular rod. A limiting slot adapted to the limiting block is provided on one side of the second U-shaped magnetic block. The cooperation of the circular rod, the limiting block and the limiting slot facilitates the height limitation of the second U-shaped magnetic block, and thus facilitates the subsequent use of the wire box.

[0012] A further technical improvement of the present utility model lies in that: a control rod is fixedly installed at the bottom end of the second U-shaped magnetic block. An inner groove for accommodating the control rod is provided on the bottom wall of the carrier plate. Sliding the control rod facilitates driving the second U-shaped magnetic block to slide synchronously.

[0013] A further technical improvement of the present utility model lies in that: the width of the U-shaped narrow slot is smaller than the width of the U-shaped slot, which facilitates ensuring the sealing performance of the wire box during operation.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] 1. In the present utility model, the second U-shaped magnetic block is moved to the highest point by the control rod. When the second U-shaped magnetic block moves to the highest point, the elastic force of the compression spring sleeved on the outer peripheral wall of the circular rod enables the limiting block at one end of the circular rod to enter the limiting slot on one side of the second U-shaped magnetic block, thereby realizing the height limitation of the second U-shaped magnetic block. After the limitation, the bonding equipment is placed in the carrier plate. When placing, pay attention to passing the semiconductor bonding lead on one side of the bonding equipment through the guiding inclined tube. When the U-shaped insertion block on the cover plate enters the U-shaped slot of the carrier plate, the first U-shaped magnetic block elastically slidably connected in the inner cavity of the U-shaped insertion block will move towards the second U-shaped magnetic block until the first U-shaped magnetic block and the second U-shaped magnetic block attract each other and merge into one body, which facilitates ensuring the sealing performance of the wire box during use. Finally, driving the nitrogen inflator can fill nitrogen into the wire box through the nitrogen filling pipe, thus solving the problem that the semiconductor bonding lead on one side of the bonding equipment in the wire box is prone to oxidation, and further facilitating the extension of the service life of the semiconductor bonding lead.

[0016] 2. During the use of the utility model by the staff, the bonding equipment can be selectively taken out according to the actual use requirements. When taking it out, first pull the two circular rods simultaneously, so that the limiting blocks at one end of the two circular rods can be disengaged from the limiting grooves on one side of the second U-shaped magnet, and then move the second U-shaped magnet downward through the control rod. When the second U-shaped magnet is far enough away from the first U-shaped magnet, the elastic force of the second spring group can reset the second U-shaped magnet. After the second U-shaped magnet is reset, it is convenient for the staff to separate the bearing plate and the cover plate, thereby facilitating the improvement of the overall flexibility of the equipment and further facilitating the use of the staff. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] For the convenience of those skilled in the art to understand, the present utility model will be further described below with reference to the accompanying drawings.

[0018] Figure 1 is the overall structural schematic diagram of the present utility model;

[0019] Figure 2 is the rear view structural schematic diagram of the cover plate of the present utility model;

[0020] Figure 3 is the rear view structural schematic diagram of the cover plate of the present utility model when the first U-shaped magnet is not installed;

[0021] Figure 4 is the three-dimensional structural schematic diagram of the bearing plate of the present utility model;

[0022] Figure 5 is the partial structural schematic diagram of the bearing plate of the present utility model;

[0023] Figure 6 is Figure 5 the structural schematic diagram when the second U-shaped magnet structure is not installed in

[0024] Figure 7 is the bottom view structural schematic diagram of the bearing plate of the present utility model.

[0025] In the figure:

[0026] 1. Bearing plate; 11. Cover plate;

[0027] 2. Enclosure panel;

[0028] 3. Nitrogen filling pipe; 31. Guide inclined pipe;

[0029] 4. U-shaped insert block; 41. U-shaped slot; 42. Inner groove; 43. First spring group; 44. First U-shaped magnet; 45. U-shaped narrow groove; 46. Second U-shaped magnet; 47. Circular rod; 48. Limiting block; 49. Second spring group; 410. Control rod. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0030] To further illustrate the technical means and effects adopted by the present utility model to achieve the intended utility model purpose, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation manners, structures, features and their effects of the present utility model as follows.

[0031] Please refer to Figure 1-7 As shown, this embodiment provides a technical solution, an anti-oxidation device for the wire box of a bonding device, which includes a carrier plate 1 for carrying the bonding device. A cover plate 11 adapted thereto is rotatably connected to the carrier plate 1. The carrier plate 1 and the cover plate 11 form a wire box in combination. A nitrogen filling pipe 3 for preventing oxidation of the semiconductor bonding leads on one side of the bonding device is fixedly communicated with the cover plate 11. The nitrogen filling pipe 3 is externally connected to a nitrogen filling machine. A guiding inclined pipe 31 through which the semiconductor bonding leads on one side of the bonding device pass is fixedly communicated with one side of the cover plate 11.

[0032] A sealing mechanism is arranged between the carrier plate 1 and the cover plate 11. The sealing mechanism includes a U-shaped insertion block 4 fixed to the back surface of the cover plate 11. A U-shaped slot 41 adapted to the U-shaped insertion block 4 is opened in the inner cavity of the carrier plate 1. An inner groove 42 is opened on the side of the U-shaped insertion block 4 away from the back surface of the cover plate 11. A first spring group 43 is fixedly installed on the inner wall of the inner groove 42. One end of the first spring group 43 away from the inner wall of the inner groove 42 is fixedly connected to a first U-shaped magnetic block 44. A U-shaped narrow slot 45 communicated with the U-shaped slot 41 is opened in the inner cavity of the carrier plate 1 and below the U-shaped slot 41. A second spring group 49 is fixedly installed on the inner wall of the U-shaped narrow slot 45. A second U-shaped magnetic block 46 with a magnetic property opposite to that of the first U-shaped magnetic block 44 is fixedly installed on the side of the second spring group 49 away from the inner wall of the U-shaped narrow slot 45. A surrounding plate 2 is fixedly installed on the outer peripheral wall of the carrier plate 1. Circular rods 47 are horizontally elastically slidably connected to both sides of the surrounding plate 2. One end of each circular rod 47 is fixedly connected to a limiting block 48. A limiting groove adapted to the limiting block 48 is opened on one side of the second U-shaped magnetic block 46.

[0033] A control rod 410 is fixedly installed at the bottom end of the second U-shaped magnetic block 46. An inner groove for accommodating the control rod 410 is opened on the bottom wall of the carrier plate 1. The hidden design of the control rod 410 facilitates the protection of the control rod 410.

[0034] When the utility model is in use, the position of the second U-shaped magnetic block 46 in the carrier plate 1 is first adjusted. During the adjustment, the staff moves the control rod 410 upward, and the second U-shaped magnetic block 46 fixedly connected thereto moves synchronously through the upward movement of the control rod 410. At the same time, the second U-shaped magnetic block 46 moves upward so that the second spring group 49 is continuously stretched. When the second U-shaped magnetic block 46 moves to the highest point, the second spring group 49 is stretched to the limit. At the same time, when the second U-shaped magnetic block 46 moves to the highest point, the elastic force of the extrusion spring sleeved on the outer peripheral wall of the circular rod 47 allows the limit block 48 at one end of the circular rod 47 to enter the limit groove on one side of the second U-shaped magnetic block 46, thereby realizing the height limitation of the second U-shaped magnetic block 46.

[0035] After the second U-shaped magnetic block 46 is limited, the bonding device is placed in the carrier plate 1. When placing it, pay attention to pass the semiconductor bonding lead on one side of the bonding device through the guiding inclined tube 31, and the U-shaped plug block 4 on the cover plate 11 enters the U-shaped slot 41 of the carrier plate 1. The first U-shaped magnetic block 44 elastically slidably connected to the inner cavity of the U-shaped plug block 4 will move toward the second U-shaped magnetic block 46 until the first U-shaped magnetic block 44 and the second U-shaped magnetic block 46 attract each other and merge into one, thereby facilitating the sealing of the carrier plate 1 when it is used. Finally, the nitrogen inflator is driven to inflate nitrogen into the carrier plate 1 through the nitrogen inflation pipe 3, thereby solving the problem of oxidation of the semiconductor bonding lead in the bonding device wire box, thereby facilitating meeting the use needs of the staff.

[0036] During use, the staff can selectively take out the bonding device according to actual usage needs. When taking it out, first pull the two circular rods 47 at the same time so that the limit blocks 48 at one end of the two circular rods 47 can be separated from the limit grooves on one side of the second U-shaped magnetic block 46, and then use the control rod 410 to move the second U-shaped magnetic block 46 downward. When the second U-shaped magnetic block 46 is away from the first U-shaped magnetic block 44 by a certain distance, the elastic force of the second spring group 49 can reset the second U-shaped magnetic block 46. After the second U-shaped magnetic block 46 is reset, it is convenient for the staff to separate the carrier plate 1 and the cover plate 11, thereby facilitating the improvement of the overall flexibility of the equipment and further facilitating the use of the staff.

[0037] The above description is only a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Although the present invention has been disclosed as a preferred embodiment as above, it is not intended to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A bonding device wire box anti-oxidation device, comprising a carrier plate (1) for carrying a bonding device, a cover plate (11) adapted thereto being rotatably connected to the carrier plate (1), the carrier plate (1) and the cover plate (11) being combined to form a wire box, characterized in that: The cover plate (11) is provided with a semiconductor bonding wire anti-oxidation mechanism, the semiconductor bonding wire anti-oxidation mechanism comprising a nitrogen gas charging pipe (3) fixedly connected to the cover plate (11), the nitrogen gas charging pipe (3) being externally connected to a nitrogen gas charging machine, and one side of the cover plate (11) is fixedly connected to a guide inclined pipe (31) for guiding the semiconductor bonding wire; The carrier plate (1) and the cover plate (11) are sealed by a sealing mechanism, wherein the sealing mechanism comprises a U-shaped plug-in block (4) fixedly connected to the cover plate (11), and the inner cavity of the carrier plate (1) is provided with a U-shaped slot (41) adapted to the U-shaped plug-in block (4).

2. The bonding equipment wire box anti-oxidation device according to claim 1, characterized in that: A surrounding plate (2) for closing a gap between the supporting plate (1) and the cover plate (11) is fixedly mounted on the outer peripheral wall of the supporting plate (1).

3. The bonding equipment wire box anti-oxidation device according to claim 2, characterized in that: The U-shaped plug block (4) is elastically slidably connected to a first U-shaped magnetic block (44) on one side away from the cover plate (11); the inner cavity of the carrier plate (1) is provided with a U-shaped narrow groove (45) matching the first U-shaped magnetic block (44); the inner cavity of the U-shaped narrow groove (45) is elastically slidably connected to a second U-shaped magnetic block (46) having opposite magnetic properties to the first U-shaped magnetic block (44).

4. The bonding equipment wire box anti-oxidation device according to claim 3, characterized in that: Both sides of the enclosure (2) are horizontally elastically slidably connected with circular rods (47), one end of the circular rod (47) is fixedly connected to a limiting block (48), and one side of the second U-shaped magnetic block (46) is provided with a limiting groove adapted to the limiting block (48).

5. The bonding equipment wire box anti-oxidation device according to claim 3, characterized in that: A control rod (410) is fixedly mounted on the bottom end of the second U-shaped magnetic block (46), and an inner groove for accommodating the control rod (410) is formed on the bottom wall of the supporting plate (1).

6. The bonding equipment wire box anti-oxidation device according to claim 3, characterized in that: The width of the U-shaped narrow groove (45) is smaller than the width of the U-shaped slot (41).

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