Gene sequencer

Abstract

The gene sequencer comprises a bottom frame body and a plurality of side frame bodies, a first area, a second area and a third area are defined by the side frame bodies respectively, the first area and the second area are located on the front side side by side, the third area is located on the rear side, and the first area is used for containing a carrying table and an optical system; the second area is used for placing a reagent storage assembly and a reagent suction assembly, the third area is used for placing hardware integrated board cards, an industrial personal computer and a heat dissipation assembly, the hardware integrated board cards are centrally arranged at the top of the third area, and the industrial personal computer is in communication connection with the hardware integrated board cards and is used for receiving information of the hardware integrated board cards; the heat dissipation assembly is used for conveying heat to the outside. According to the gene sequencer provided by the invention, the spatial positions of the functional components / devices are reasonably distributed, and the hardware integrated board cards are intensively arranged at the top position of the third area, so that wire harness concentration of the hardware integrated board cards is facilitated, and the problem of unreasonable spatial distribution in the prior art is solved.

Description

Technical Field

[0001] This application belongs to the technical field of biochemical analysis, and particularly relates to a gene sequencer. Background Art

[0002] Gene sequencing technology has been widely used in whole-genome sequencing, transcriptome sequencing, metagenome sequencing, etc. It is a powerful tool for analyzing the evolution and classification of organisms, studying disease-related genes such as cancer and autism, and performing in vitro diagnostics. It has promoted people's further understanding of life sciences and also driven the development of the health industry.

[0003] The composition of a gene sequencer mainly includes an optical system, a stage, a reagent storage component, a reagent aspiration component, a hardware integration board, and other modules. Each functional component / device is connected to a corresponding hardware integration board to achieve information signal transmission between components / devices and with the outside. Existing gene sequencers usually arrange the hardware integration boards dispersedly in the vicinity. However, this method leads to messy wiring harnesses on the one hand and brings inconvenience to the installation of other components on the other hand. Therefore, there is an urgent need to provide a gene sequencer with reasonable space allocation, convenient installation, and maintenance. Summary of the Utility Model

[0004] This application discloses a gene sequencer to solve the problem of unreasonable space allocation in the prior art.

[0005] This application provides a gene sequencer, including: a bottom frame body and a plurality of side frame bodies. The plurality of side frame bodies respectively enclose a first area, a second area, and a third area. The first area and the second area are arranged side by side at the front side, and the third area is located at the rear side. The first area is used to place the stage for carrying the sequencing chip and the optical system arranged above the stage. The second area is used to place the reagent storage component and the reagent aspiration component arranged above the reagent storage component. The third area is used to place the hardware integration board, an industrial control computer, and a heat dissipation component. The hardware integration board is centrally arranged at the top of the third area. The industrial control computer is communicatively connected to the hardware integration board for receiving information from the hardware integration board. The heat dissipation component is used to transfer heat to the outside.

[0006] Optionally, notch openings for wire routing are arranged on the edges of the side frame bodies, and the wire harnesses of the hardware integration board are centrally arranged through the notch openings.

[0007] Optionally, the heat dissipation component includes a heat dissipation air duct, a liquid-cooled heat dissipation fan, and a whole-machine heat dissipation fan. The heat dissipation air duct is arranged at the rear side of the reagent storage component. The liquid-cooled heat dissipation fan is arranged at the rear side of the stage. The whole-machine heat dissipation fan is arranged above the liquid-cooled heat dissipation fan.

[0008] Optionally, the reagent storage component is provided with a Peltier refrigeration component for temperature control. The Peltier refrigeration component includes a Peltier module, heat dissipation fins and refrigeration fins arranged on both sides of the Peltier module. The heat dissipation fins are located outside the reagent storage component, and the refrigeration fins are located inside the reagent storage component;

[0009] The heat dissipation air duct includes a heat dissipation channel and an air inlet channel. The air inlet channel is used to introduce cold air from the outside into the heat dissipation channel. The heat dissipation fins are arranged inside the heat dissipation channel, and the heat dissipation channel is used to discharge the hot air formed after the cold air exchanges heat with the heat dissipation fins.

[0010] Optionally, a board fixing member is fixed to the top of the third area. The board fixing member includes a bottom plate and side plates surrounding the bottom plate. The hardware integration board is fixed on the bottom plate, and the side plates are provided with a plurality of heat dissipation holes.

[0011] Optionally, the third area is also used to place a power supply and a hard disk.

[0012] Optionally, the gene sequencer further includes a housing, which covers the outside of the frame formed by the bottom frame body and the side frame body. A heat dissipation outlet is provided at a position corresponding to the heat dissipation component at the rear side of the housing.

[0013] Optionally, a display is provided on the front side of the second area, and the display is communicatively connected to the industrial control computer.

[0014] Optionally, a vibration damping component is provided in the first area. The vibration damping component includes a vibration damping support, a support frame hung on the vibration damping support, a first platform fixed to the top end of the support frame, and a second platform fixed to the bottom end of the support frame. The first platform is used to place the optical system, and the second platform is used to place the stage.

[0015] As can be seen from the above technical solutions, in the gene sequencer provided by the present application, the spatial positions of various functional components / devices are reasonably distributed, and the hardware integration board is centrally arranged at the top position of the third area, which is beneficial to the concentration of the wire harnesses of the hardware integration board, thereby solving the problems of unreasonable space allocation and messy wire harnesses in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the main structure of a gene sequencer provided by an embodiment of the present application;

[0017] Figure 2 It is another schematic diagram of a gene sequencer provided by an embodiment of the present application;

[0018] Figure 3The figure is a schematic assembly structure diagram of a heat dissipation air duct and a Peltier refrigeration component in a gene sequencer provided by an embodiment of the present application;

[0019] Figure 4 Provided by an embodiment of the present application Figure 3 Cross-sectional view.

[0020] Reference numerals: 1 - frame; 11 - bottom frame body; 12 - side frame body; 121 - notch; 2 - stage; 3 - optical system; 4 - reagent storage component; 41 - Peltier refrigeration component; 411 - Peltier module; 412 - heat dissipation fins; 413 - refrigeration fins; 5 - reagent aspiration component; 6 - hardware integration board; 61 - board fixing member; 601 - bottom plate; 602 - side plate; 603 - heat dissipation small holes; 7 - industrial control computer; 8 - heat dissipation component; 81 - heat dissipation air duct; 82 - liquid cooling heat dissipation fan; 83 - whole machine heat dissipation fan; 811 - heat dissipation channel; 812 - air inlet channel; 10 - display. Detailed implementation manners

[0021] The technical solutions in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0022] Referring to Figure 1 and Figure 2 As shown in the schematic structure diagram, an embodiment of the present application provides a gene sequencer. Each functional component / device of the gene sequencer is placed inside the frame 1. The frame 1 includes: a bottom frame body 11 and a plurality of side frame bodies 12. The plurality of side frame bodies 12 respectively enclose a first area a, a second area b, and a third area c. The first area a and the second area b are arranged side by side at the front side, and the third area c is located at the rear side. The first area a is used to place the stage 2 for carrying a sequencing chip and the optical system 3 disposed above the stage 2. The second area b is used to place the reagent storage component 4 and the reagent aspiration component 5 disposed above the reagent storage component 4. The third area c is used to place the hardware integration board 6, the industrial control computer 7, and the heat dissipation component 8. The hardware integration board 6 is centrally disposed at the top of the third area c. The industrial control computer 7 is communicatively connected to the hardware integration board 6 for receiving information from the hardware integration board 6. The heat dissipation component 8 is used to transfer heat to the outside.

[0023] The stage 2 is used to place the sequencing chip. After the sequencing chip is added, a complete liquid path system is formed. The liquid path system is used to sequentially transport reagents to the sequencing chip. The sample and reagents undergo a sequencing reaction on the sequencing chip, and then the optical system 3 is used to take pictures of the products of the sequencing reaction, thereby obtaining the sequence of the sample. During this process, the reagent storage component 4 is used to store reagents, and the reagent aspiration component 5 is used to aspirate and transport the reagents in the reagent storage component 4. In this embodiment, the liquid path system requires corresponding pump-valve components. For example, a dual syringe pump is used as the power component of the liquid path system, and this dual syringe pump can be placed at a position on the side of the third area c close to the first area.

[0024] In the gene sequencer, components such as pumps, valves, and motors are all provided with corresponding hardware integration boards. The hardware integration boards are electrically connected to these components to control the actions of each component. The hardware integration board 6 is further communicatively connected to the industrial control computer 7. The industrial control computer 7 receives the information from the hardware integration board 6 and calculates, and continues to control the next actions of each component according to the calculation results.

[0025] Since the sequencing reaction and the photographing process need to be carried out at a specific temperature, a temperature control component (not shown in the figure) is provided below the stage 2. The temperature control component mainly consists of a TEC and a liquid cooling mechanism. The TEC is used to heat the stage 2, and the liquid cooling mechanism is used for cooling. The TEC is combined with the liquid cooling component to achieve temperature control. Reagents usually need to be stored at low temperature. In this embodiment, another temperature control component is provided in the reagent storage component, so that the inside of the reagent storage component is maintained in a heat preservation environment of 2°C to 8°C. The heat dissipation component 8 provided for this embodiment is respectively arranged at the positions that need temperature control. On the one hand, the heat dissipation component 8 is beneficial to temperature control. On the other hand, it sends the heat generated inside the instrument to the outside, which is beneficial to maintaining a relatively constant temperature environment inside the instrument.

[0026] In this embodiment, support feet are provided at the bottom of the bottom frame body 11, and the setting of the support feet avoids direct contact between the bottom frame body 11 and the ground.

[0027] As can be seen from the above technical solutions, in the gene sequencer provided in this embodiment, the spatial positions of each functional component / device are reasonably distributed, and the hardware integration board 6 is centrally arranged at the top position of the third area, which is beneficial to the concentration of the wire harness of the hardware integration board 6, thereby solving the problems of unreasonable space allocation and messy wire harnesses in the prior art.

[0028] Furthermore, notches 121 for wire routing are arranged along the edge of the side frame body 12 on the side of the third area c close to the second area b. The wire harness of the hardware integration board 6 is centrally arranged through the notches 121. The notches 121 are arranged up and down along the edge of the side frame body 12, guiding the wire harness of the hardware integration board 6 from the top of the third area c to the bottom, and then connecting to the external interface provided at the bottom end of the third area c.

[0029] Reference Figure 2 to the structural schematic diagram shown, the heat dissipation component 8 includes a heat dissipation air duct 81, a liquid-cooled heat dissipation fan 82 and a whole machine heat dissipation fan 83. The heat dissipation air duct 81 is arranged at the rear side of the reagent storage component 4, the liquid-cooled heat dissipation fan 82 is arranged at the rear side of the stage 2, and the whole machine heat dissipation fan 83 is arranged above the liquid-cooled heat dissipation fan 82.

[0030] Reference Figure 3 and Figure 4 to the structural schematic diagram shown. In this embodiment, the reagent storage component 4 is provided with a Peltier refrigeration component 41. The Peltier refrigeration component 41 includes a Peltier module 411, heat dissipation fins 412 and refrigeration fins 413. The heat dissipation fins 412 are located outside the reagent storage component 4, and the refrigeration fins 413 are located inside the reagent storage component 4. The Peltier module 411 works based on the Peltier effect. The Peltier has two sides. One side close to the reagent storage component 4 is for refrigeration, and the side far from the reagent storage component 4 is for heating. One side of the Peltier module 411 is closely attached to the refrigeration fins 413 inside the chamber, and the other side is closely attached to the heat dissipation fins 412 outside the chamber. When cooling the reagent storage component 4, the side closely attached to the refrigeration fins 413 is for refrigeration to cool the fins; the side closely attached to the heat dissipation fins 412 will generate heat. Further, an external fan is arranged outside the heat dissipation fins, and the external fan blows air to take away the heat in time. If the heat is not taken away in time, the refrigeration efficiency will be affected.

[0031] The heat dissipation air duct 81 provided in this embodiment is a T-shaped heat dissipation air duct. The T-shaped heat dissipation air duct includes two heat dissipation channels 811 and an air inlet channel 812. The heat dissipation fins of the Peltier refrigeration component are arranged at the entrance of the heat dissipation channel 811. The air inlet of the air inlet channel 812 is arranged at the bottom. The air inlet is used to introduce cold air into the heat dissipation channel 811. When the cold air enters through the air inlet, the cold air is blown towards the heat dissipation fins. The heat dissipation fins are strip-shaped groove-shaped wide openings. The cold air is heated here after heat exchange to form hot air. The hot air will escape from both ends of the heat dissipation fins and then be discharged out of the instrument through the two heat dissipation channels 811 of the T-shaped heat dissipation air duct. Among them, the air inlet channel is isolated from the two heat dissipation channels. The main function of the heat dissipation air duct 81 is to blow the temperature of the heat dissipation fins out of the instrument through the fan to avoid the increase of the internal temperature of the sequencer system.

[0032] In this embodiment, an air inlet with the same size as the air inlet channel is opened at the corresponding position of the bottom plate, and a very fine mesh filter is also arranged at the air inlet to filter the pollution and particles in the air and prevent the particles from entering the instrument.

[0033] As Figure 1As shown, a board fixing member 61 is fixed on the top of the third area c, and the board fixing member 61 includes a base plate 601 and side panels 602 arranged around the base plate 601. The hardware integrated board 6 is fixed on the base plate 61, and the side panels 602 are provided with a plurality of heat dissipation holes 603 to facilitate heat dissipation of the hardware integrated board 6.

[0034] Furthermore, the third area c is also used to place a power supply and a hard disk. The third area c is divided into two left and right partitions by the side frame located in the middle, and each partition is divided into a first layer, a second layer and a third layer from top to bottom by a horizontal plate. Among them, the left partition corresponds to the first area a, and the right partition corresponds to the second area b. In the right partition, the first layer is used to place an industrial personal computer (IPC), a power supply and a hard disk, and the second layer is used to place components such as a switching power supply, a rocker switch and a filter. The space between these components is compactly arranged to shorten the length of the AC line as much as possible, reduce electromagnetic shielding interference, and provide corresponding grounding measures. The third layer is used to place the heat dissipation duct.

[0035] Furthermore, the gene sequencer also includes a shell (not shown), which is covered on the outside of the frame 1 composed of the bottom frame 11 and the side frame 12, and a heat dissipation outlet is provided at a position on the rear side of the shell corresponding to the heat dissipation component.

[0036] Furthermore, a display 10 is disposed at the front side of the second area b, and the display 10 is communicatively connected to the industrial computer.

[0037] Furthermore, the first area a is provided with a vibration reduction assembly 20, and the vibration reduction assembly 20 includes a vibration reduction support 21, a support frame 22 hung on the vibration reduction support 21, a first platform 23 fixed to the top end of the support frame 22, and a second platform 24 fixed to the bottom end of the support frame 22, the first platform 23 is used to place the optical system 3, and the second platform 24 is used to place the carrier 2.

[0038] The above are merely embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application are included in the scope of the claims of the present application to be approved.

Claims

1. A gene sequencer, characterized in that: include: A bottom frame and a plurality of side frames, wherein the plurality of side frames respectively enclose a first area, a second area and a third area, wherein the first area and the second area are arranged side by side on the front side, and the third area is arranged on the rear side, wherein the first area is used for placing a carrier carrying a sequencing chip and an optical system arranged above the carrier, wherein the second area is used for placing a reagent storage component and a reagent suction component arranged above the reagent storage component, wherein the third area is used for placing a hardware integrated board, an industrial computer and a heat dissipation component, wherein the hardware integrated board is centrally arranged on the top of the third area, wherein the industrial computer is communicatively connected with the hardware integrated board for receiving information from the hardware integrated board, and wherein the heat dissipation component is used for transferring heat to the outside.

2. A gene sequencer according to claim 1, characterized in that: The edge of the side frame is arranged with slots for wiring, and the wiring harness of the hardware integrated board is centrally arranged through the slots.

3. A gene sequencer according to claim 1, characterized in that: The heat dissipation component includes a heat dissipation duct, a liquid-cooled heat dissipation fan and a whole-machine heat dissipation fan. The heat dissipation duct is arranged on the rear side of the reagent storage component, the liquid-cooled heat dissipation fan is arranged on the rear side of the carrier, and the whole-machine heat dissipation fan is arranged above the liquid-cooled heat dissipation fan.

4. A gene sequencer according to claim 3, characterized in that: The reagent storage assembly is provided with a Peltier refrigeration assembly for temperature control, the Peltier refrigeration assembly comprises a Peltier module, heat dissipation fins and refrigeration fins arranged on both sides of the Peltier module, the heat dissipation fins are located outside the reagent storage assembly, and the refrigeration fins are located inside the reagent storage assembly; The heat dissipation air duct includes a heat dissipation channel and an air inlet channel, the air inlet channel is used to introduce external cold air into the heat dissipation channel, the heat dissipation fins are arranged inside the heat dissipation channel, and the heat dissipation channel is used to discharge hot air formed after the cold air exchanges heat with the heat dissipation fins.

5. A gene sequencer according to claim 1, characterized in that: A board fixing member is fixed on the top of the third area, and the board fixing member includes a bottom plate and side plates arranged around the bottom plate. The hardware integrated board is fixed on the bottom plate, and the side plates are provided with a plurality of heat dissipation holes.

6. A gene sequencer according to claim 1, characterized in that: The third area is also used for placing a power supply and a hard disk.

7. A gene sequencer according to claim 5, characterized in that: The gene sequencer also includes a shell, which is covered on the outside of a frame formed by the bottom frame and the side frame. A heat dissipation outlet is provided at a position on the rear side of the shell corresponding to the heat dissipation component.

8. A gene sequencer according to claim 1, characterized in that: A display is arranged at the front side of the second area, and the display is communicatively connected with the industrial computer.

9. A gene sequencer according to claim 1, characterized in that: A vibration reduction assembly is provided in the first area, and the vibration reduction assembly includes a vibration reduction support, a support frame hung on the vibration reduction support, a first platform fixed to the top end of the support frame, and a second platform fixed to the bottom end of the support frame. The first platform is used to place the optical system, and the second platform is used to place the carrier.

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