Wafer mounting mechanism and wafer mounting equipment

Abstract

The utility model provides a wafer mounting mechanism and wafer mounting equipment, and belongs to the technical field of semiconductor processing equipment. The horizontal moving assembly and the linear guide rail assembly are installed on the base plate in a horizontal moving mode, and the linear guide rail assembly is arranged to be matched with the horizontal moving assembly so as to guide the moving direction of the horizontal moving assembly; and the wafer adsorption moving mechanism is installed on the horizontal moving assembly, and the wafer adsorption moving mechanism is arranged to be used for adsorbing a wafer and carrying the wafer to move. The wafer adsorption moving mechanism is installed on the horizontal moving assembly, and the wafer adsorption moving mechanism is used for adsorbing a wafer and carrying the wafer to move. The linear guide rail assembly is arranged and matched with the horizontal moving assembly to drive the wafer adsorption moving mechanism to horizontally move, the linear guide rail assembly guides the wafer adsorption moving mechanism, and when the equipment size is large, it can be guaranteed that the wafer adsorption moving mechanism stably moves.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor processing equipment, and more particularly, to a wafer bonding mechanism and a wafer bonding device. Background Art

[0002] Wafer bonding is the process of fixing the cut wafers (also known as chips) in place by pasting. This process is usually carried out after wafer cutting to ensure that the cut wafer pieces can be stably processed and packaged subsequently.

[0003] In traditional wafer picking, placing, and bonding mechanisms, a servo motor drives a ball screw to rotate through a synchronous pulley assembly, enabling the spring suction cup joint and the vacuum suction cup head located above to move smoothly.

[0004] When using a ball screw for horizontal transmission, when the equipment size is large, the length of the ball screw will increase accordingly. However, when the ball screw is too long, it will vibrate, resulting in poor stability and being unfavorable for wafer bonding. Summary of the Utility Model

[0005] The purpose of this application is to provide a wafer bonding mechanism and a wafer bonding device, aiming to solve the problem in the related art that when the ball screw used in the wafer bonding process is too long, it will vibrate, resulting in poor stability and being unfavorable for wafer bonding.

[0006] The additional aspects and advantages of this application will be partially described below, and partially will become apparent from the description, or can be learned through the practice of this application.

[0007] According to the first aspect of this application, a wafer bonding mechanism is provided, including:

[0008] A substrate;

[0009] A horizontal movement component and a linear guide rail component, which are movably installed on the substrate horizontally. The linear guide rail component is configured to cooperate with the horizontal movement component to guide the moving direction of the horizontal movement component;

[0010] A wafer adsorption and movement mechanism, which is installed on the horizontal movement component. The wafer adsorption and movement mechanism is configured to adsorb wafers and carry the wafers for movement.

[0011] In an exemplary embodiment of this application, the linear guide rail component includes a slide rail and a slider. The extending direction of the slide rail is the same as the moving direction of the horizontal movement component, and the slider is slidably installed on the slide rail.

[0012] In an exemplary embodiment of this application, the horizontal movement component includes:

[0013] Drive motor;

[0014] Ball screw, including a screw rod and a nut, the screw rod is connected to the drive end of the drive motor through a first coupling, and the wafer adsorption and moving mechanism is connected to the nut.

[0015] In an exemplary embodiment of the present application, it further includes: a horizontal drag chain, and the horizontal moving component is connected to the horizontal drag chain through a drag chain support plate.

[0016] In an exemplary embodiment of the present application, the wafer adsorption and moving mechanism includes:

[0017] A vertical moving component, installed on the drive end of the horizontal moving component, and the vertical moving component is configured to move in the horizontal direction under the drive of the horizontal moving component;

[0018] A terminal flipping component, installed on the drive end of the vertical moving component, and the terminal flipping component is configured to move in the vertical direction under the drive of the vertical moving component;

[0019] An adsorption component, installed on the terminal flipping component, and the adsorption component is configured to rotate under the drive of the terminal flipping component, and the adsorption component is used to adsorb the cut chips.

[0020] In an exemplary embodiment of the present application, the vertical moving component includes:

[0021] A lifting shaft component, connected to the nut;

[0022] A lifting bottom plate, installed on the lifting shaft component, the terminal flipping component is installed on the lifting bottom plate, and the lifting shaft component is used to drive the lifting bottom plate to move in the vertical direction.

[0023] In an exemplary embodiment of the present application, the terminal flipping component includes:

[0024] A servo motor, installed on the lifting bottom plate;

[0025] A synchronous pulley component, connected to the servo motor;

[0026] A rotary joint, connected to the servo motor through the synchronous pulley component;

[0027] An adsorption component, connected to the rotary joint, and the adsorption component is used to adsorb wafers;

[0028] The servo motor is used to drive the rotary joint and the adsorption component to rotate through the synchronous pulley component.

[0029] In an exemplary embodiment of the present application, the adsorption assembly includes a vacuum connection shaft, a shaft adapter plate, a suction cup connection plate, a spring suction cup head, and a vacuum suction cup head;

[0030] The vacuum connection shaft is connected to the rotary joint. The shaft adapter plate is installed at the end of the vacuum connection shaft. The suction cup connection plate is installed on the shaft adapter plate. The spring suction cup head is installed on the suction cup connection plate. The vacuum suction cup head is installed on the spring suction cup head. The vacuum connection shaft, the spring suction cup head, and the vacuum suction cup head form a vacuum channel, so that the vacuum suction cup head can adsorb the wafer.

[0031] In an exemplary embodiment of the present application, a zero position pointer and a zero position sensor are further included, which are installed at the position of the rotary joint to set the origin position of the rotation of the end flipping assembly.

[0032] In a second aspect of the present application, a wafer bonding device is provided, including the above-mentioned wafer bonding mechanism.

[0033] The exemplary embodiments of the present application may have some or all of the following beneficial effects:

[0034] In the wafer bonding mechanism provided by the exemplary embodiment of the present application, it includes a substrate, a horizontal movement assembly, a linear guide rail assembly, and a wafer adsorption and movement mechanism. The horizontal movement assembly and the linear guide rail assembly are installed on the substrate. The linear guide rail assembly is configured to cooperate with the horizontal movement assembly to guide the direction when the horizontal movement assembly drives the wafer adsorption and movement mechanism to move horizontally on the substrate. The wafer adsorption and movement mechanism is installed on the horizontal movement assembly. The wafer adsorption and movement mechanism is configured to adsorb the wafer and carry the wafer for movement. By setting the linear guide rail assembly and cooperating with the horizontal movement assembly to drive the wafer adsorption and movement mechanism to move horizontally, the linear guide rail assembly guides the wafer adsorption and movement mechanism, and when the device size is large, it can also ensure the stable movement of the wafer adsorption and movement mechanism.

[0035] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings here are incorporated into the specification and form a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0037] Figure 1Shows the structural schematic diagram of the wafer bonding mechanism in Embodiment 1 of the present application;

[0038] Figure 2 Shows the structural schematic diagram of the wafer adsorption and movement mechanism in Embodiment 1 of the present application;

[0039] Figure 3 Shows the structural schematic diagram of the lifting bottom plate in Embodiment 1 of the present application;

[0040] Figure 4 Shows the structural schematic diagram of the end flipping assembly and the adsorption assembly in Embodiment 1 of the present application.

[0041] Description of the reference numerals in the drawings:

[0042] 1. Driving motor; 2. Left bellows cover; 3. Horizontal drag chain groove; 4. Vertical drag chain groove; 5. Drag chain connecting plate; 6. Second coupling; 7. Electrical module; 9. Horizontal drag chain; 10. Drag chain support plate; 11. Lifting shaft assembly; 12. Right bellows cover; 13. Linear guide rail assembly; 14. Vertical drag chain; 15. Ball screw; 16. Substrate; 17. Sensor; 18. First coupling; 19. Lifting bottom plate; 20. Zero position pointer; 21. Zero position sensor; 22. Servo motor; 23. Synchronous pulley assembly; 24. Rotary joint; 25. Pillow block bearing; 26. Vacuum connection shaft; 27. Shaft adapter plate; 28. Suction cup connecting plate; 29. Spring suction cup joint; 30. Vacuum suction cup head. Detailed implementation manners

[0043] Now, the exemplary embodiments will be described more comprehensively with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; on the contrary, these embodiments are provided so that this application will be thorough and complete, and the concept of the exemplary embodiments will be fully conveyed to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted. In addition, the drawings are only schematic diagrams of the present application and are not necessarily drawn to scale.

[0044] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of the icon to another component, these terms are used in this specification only for convenience, for example, according to the directions in the examples of the drawings. It can be understood that if the device of the icon is flipped so that it is upside down, the component described as "upper" will become the component "lower". When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" provided on another structure, or that a structure is "indirectly" provided on another structure through another structure.

[0045] The terms "a", "an", "the", and "at least one" are used to denote the presence of one or more elements / components / etc.; the terms "comprising" and "having" are used in an open-ended inclusive sense and mean that there may be additional elements / components / etc. in addition to the listed elements / components / etc.; the terms "first", "second" are used only as labels and are not a limitation on the quantity of their objects.

[0046] Embodiment

[0047] This embodiment provides a specific implementation manner of a wafer bonding mechanism, as Figure 1 shown, including a substrate 16, a horizontal movement component, a linear guide rail component 13, and a wafer adsorption and movement mechanism. The horizontal movement component and the linear guide rail component 13 are installed on the substrate 16. The linear guide rail component 13 is arranged to cooperate with the horizontal movement component to guide the direction when the horizontal movement component drives the wafer adsorption and movement mechanism to move horizontally on the substrate 16. The wafer adsorption and movement mechanism is installed on the horizontal movement component. The wafer adsorption and movement mechanism is arranged to adsorb the wafer and carry the wafer to move, so as to move the wafer to a suitable bonding position. By setting the linear guide rail component 13 and cooperating with the horizontal movement component to drive the wafer adsorption and movement mechanism to move horizontally, the linear guide rail component 13 guides the wafer adsorption and movement mechanism. When the equipment size is large, it can also ensure the stable movement of the wafer adsorption and movement mechanism.

[0048] In this embodiment, the linear guide rail component 13 includes a slide rail and a slider. The extending direction of the slide rail is the same as the moving direction of the horizontal movement component. The slider is slidably installed on the slide rail. The wafer adsorption and movement mechanism is connected to the slider. When the wafer adsorption and movement mechanism is driven by the horizontal movement component to move horizontally, the slider connected to the wafer adsorption and movement mechanism slides in the slide rail to guide the moving direction of the wafer adsorption and movement mechanism and ensure the stable movement of the wafer adsorption and movement mechanism. When the horizontal movement component drives the wafer adsorption and movement mechanism to move in the horizontal direction, the wafer adsorption and movement mechanism is connected to the slider. When the slider slides on the slide rail, it guides the wafer adsorption and movement mechanism to ensure that the wafer adsorption and movement mechanism can move stably.

[0049] In some other embodiments, the linear guide rail component 13 can also be a chute cooperating with a slider to guide the wafer adsorption and movement mechanism.

[0050] In this embodiment, the horizontal movement component includes a driving motor 1 and a ball screw 15. The ball screw 15 includes a screw rod and a nut. The screw rod is connected to the driving end of the driving motor 1 through a first coupling 18. The wafer adsorption and movement mechanism is connected to the nut. When the driving motor 1 drives the screw rod to rotate through the first coupling 18, the nut moves along the axial direction of the screw rod to drive the wafer adsorption and movement mechanism to move in the horizontal direction.

[0051] In some other embodiments, the horizontal movement component can also be devices or components such as air cylinders, electric cylinders, linear motors, etc., as long as they can meet the horizontal movement of components in larger-sized devices.

[0052] In this embodiment, the wafer adsorption and movement mechanism includes a vertical movement component, an end flipping component, and an adsorption component. The vertical movement component is connected to the nut in the horizontal movement component. The end flipping component is installed on the vertical movement component, and the adsorption component is installed on the end flipping component.

[0053] In this embodiment, the vertical movement component includes a lifting shaft component 11 and a lifting bottom plate 19. The lifting shaft component 11 includes a motor and a ball screw 15. The ball screw 15 includes a screw rod and a nut. The screw rod is connected to the motor through a second coupling 6. The lifting bottom plate 19 is connected to the nut. The end flipping component is installed on the lifting bottom plate 19. By driving the screw rod to rotate with the motor, the nut moves along the circumference of the screw rod to drive the end flipping component and the adsorption component to move up and down. In some other embodiments, the lifting shaft component 11 can also be components such as air cylinders, electric cylinders, telescopic rods, lifting rods, etc. The lifting bottom plate 19 is connected to the driving end of the vertical movement component, such as being connected to the piston of an air cylinder.

[0054] In this embodiment, the end flipping component includes a servo motor 22, a synchronous pulley assembly 23, and a rotary joint 24. The servo motor 22 is installed on the lifting bottom plate 19. The rotary joint 24 is connected to the servo motor 22 through the synchronous pulley assembly 23. The adsorption component is installed on the rotary joint 24. The servo motor 22 drives the rotary joint 24 to rotate through the synchronous pulley assembly 23. When the rotary joint 24 rotates, it drives the adsorption component to rotate, so as to drive the wafer adsorbed by the adsorbed component to rotate.

[0055] Furthermore, the synchronous pulley assembly 23 includes a synchronous belt, a driving pulley, and a driven pulley. The driving pulley is connected to the driving shaft of the servo motor 22. The driven pulley is installed on the lifting bottom plate 19. The driven pulley is connected to the rotary joint 24. The synchronous belt is sleeved on the driving pulley and the driven pulley.

[0056] In this embodiment, the adsorption assembly includes a vacuum connection shaft 26, a shaft adapter plate 27, a suction cup connection plate 28, a spring suction cup joint 29, and a vacuum suction cup head 30. Among them, the vacuum connection shaft 26 passes through the pedestal bearing 25 and is connected to the rotary joint 24. The suction cup connection plate 28 is connected to the vacuum connection shaft 26 through the shaft adapter plate 27 to change the connection direction at the end of the vacuum connection shaft 26. The spring suction cup head and the vacuum suction cup head 30 are sequentially installed on the suction cup connection plate 28. The rotary joint 24, the vacuum connection shaft 26, the spring suction cup head, and the vacuum suction cup head 30 form a vacuum channel, which can adsorb the wafer on the surface of the vacuum suction cup head 30. Further, the formed vacuum channel can be connected to a vacuum pumping device, such as a vacuum pump and other devices.

[0057] In this embodiment, there are also a zero position pointer 20 and a zero position sensor 21, which are installed at the position of the rotary joint 24. The origin position of the rotation can be set through the zero position pointer 20 and the zero position sensor 21.

[0058] In this embodiment, cables and air pipes are connected between the components and mechanisms on the wafer bonding mechanism, so that the components and mechanisms can cooperate and move with each other. In this embodiment, a horizontal drag chain groove 3 and a vertical drag chain groove 4 are provided on the substrate 16, which are respectively used to install the horizontal drag chain 9 and the vertical drag chain 14. The horizontal moving assembly is connected to the horizontal drag chain 9 through the drag chain support plate 10, and the horizontal drag chain 9 can protect some cables and air pipes.

[0059] In this embodiment, the lifting bottom plate 19 in the lifting shaft assembly 11 that moves vertically is connected to the vertical drag chain 14 through the drag chain connection plate 5, and the vertical drag chain 14 is used to protect some cables and air pipes.

[0060] In this embodiment, there is also a sensor 17, which is installed on the substrate 16, and the sensor is used to monitor the moving distance of the horizontal moving assembly.

[0061] In this embodiment, there is also an electric module 7, which is electrically connected to the servo motor 22, and the rotation angle of the end flipping assembly can be controlled through the electric module 7.

[0062] In this embodiment, a left bellows cover 2 and a right bellows cover 12 are provided on the outside of the entire device to provide dust protection for the linear guide rail assembly 13, the horizontal moving assembly, etc., and prevent dust from falling into the wafer bonding mechanism and affecting the service life of the components.

[0063] Embodiment 2

[0064] This embodiment provides a specific implementation manner of the wafer bonding device, including the wafer bonding mechanism in Embodiment 1.

[0065] Those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include well-known common general knowledge or conventional technical means in the technical field not claimed in the present application. The specification and embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the appended claims.

Claims

1. A wafer bonding mechanism, characterized in that: include: substrate; A horizontal moving component and a linear guide rail component are mounted on the base plate so as to be horizontally movable, and the linear guide rail component is configured to cooperate with the horizontal moving component to guide the moving direction of the horizontal moving component; The wafer adsorption and movement mechanism is installed on the horizontal movement component, and the wafer adsorption and movement mechanism is configured to adsorb the wafer and carry the wafer to move.

2. The wafer bonding mechanism according to claim 1, characterized in that: The linear guide rail assembly comprises a slide rail and a slider. The extension direction of the slide rail is the same as the movement direction of the horizontal moving assembly. The slider is slidably mounted on the slide rail.

3. The wafer bonding mechanism according to claim 1, characterized in that: The horizontal movement component comprises: Drive motor; The ball screw comprises a screw rod and a nut. The screw rod is connected to the driving end of the driving motor through a first coupling, and the wafer adsorption moving mechanism is connected to the nut.

4. The wafer bonding mechanism according to claim 3, characterized in that: Also includes: A horizontal drag chain, wherein the horizontal moving component is connected to the horizontal drag chain via a drag chain support plate.

5. The wafer bonding mechanism according to claim 3, characterized in that: The wafer adsorption and movement mechanism comprises: A vertical moving assembly is mounted on the driving end of the horizontal moving assembly, and the vertical moving assembly is configured to move in the horizontal direction under the drive of the horizontal moving assembly; An end flip assembly is installed on the driving end of the vertical moving assembly. The end flip assembly is arranged to move in the vertical direction under the drive of the vertical moving assembly. The adsorption component is installed on the end flip component. The adsorption component is configured to rotate under the drive of the end flip component. The adsorption component is used to adsorb the cut chips.

6. The wafer bonding mechanism according to claim 5, characterized in that: The vertical moving assembly comprises: A lifting shaft assembly connected to the nut; The lifting base plate is installed on the lifting shaft assembly, the end flip assembly is installed on the lifting base plate, and the lifting shaft assembly is used to drive the lifting base plate to move in the vertical direction.

7. The wafer bonding mechanism according to claim 6, characterized in that: The end flip assembly comprises: A servo motor is installed on the lifting base plate; A synchronous pulley assembly connected to the servo motor; A rotary joint connected to the servo motor via the synchronous pulley assembly; An adsorption component connected to the rotary joint, the adsorption component is used to adsorb the wafer; The servo motor is used to drive the rotary joint and the adsorption assembly to rotate through the synchronous pulley assembly.

8. The wafer bonding mechanism according to claim 7, characterized in that: The adsorption assembly includes a vacuum connecting shaft, a shaft adapter plate, a suction cup connecting plate, a spring suction cup head and a vacuum suction cup head; The vacuum connecting shaft is connected to the rotary joint, the shaft adapter plate is installed on the end of the vacuum connecting shaft, the suction cup connecting plate is installed on the shaft adapter plate, the spring suction cup head is installed on the suction cup connecting plate, and the vacuum suction cup head is installed on the spring suction cup head. The vacuum connecting shaft, the spring suction cup head and the vacuum suction cup head form a vacuum channel so that the vacuum suction cup head can adsorb the wafer.

9. The wafer bonding mechanism according to claim 7, characterized in that: It also includes a zero position pointer and a zero position sensor, which are installed at the position of the rotary joint to set the origin position of the rotation of the end flip assembly.

10. Wafer bonding equipment, characterized in that: The invention comprises the wafer bonding mechanism as described in any one of claims 1 to 9.

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