Wafer surface attachment removing jig and removing system

Abstract

The embodiment of the utility model provides a jig and system for removing attachments on the surface of a wafer, the jig comprises a bearing seat, a groove body and a lifting mechanism, the groove body is arranged in the central area of the bearing seat and is used for accommodating removing liquid for removing the attachments on the surface of the wafer; the lifting mechanism is arranged on the edge area of the bearing seat and used for bearing a to-be-cleaned wafer and adjusting the position of immersion of attachments on the surface of the to-be-cleaned wafer into the cleaning liquid. By means of the jig, the skip plating attached to the edge area of the wafer can be soaked in the removing liquid in the tank body to be removed, the problems of scratching, cracking and the like of the wafer in the skip plating scraping process of a cutter are avoided, and the product quality is improved. In addition, the jig can adjust the positions where attachments on the surfaces of the wafers at different positions intrude into the cleaning liquid through the lifting mechanism, and the application range is wide.

Description

Technical Field

[0001] Embodiments of the present disclosure belong to the technical field of semiconductor equipment, and particularly relate to a fixture and a cleaning system for removing attachments on the surface of a wafer. Background Art

[0002] In semiconductor manufacturing, abnormal edges after wafer coating or poor sealing during electroplating may cause edge non-plating. For products with non-plating, manual scraping is required using relevant tools. During the scraping process, it is easy to damage the products, affecting product quality. To scrape off non-plating, the wafer needs to be placed on a vacuum chuck, and then relevant tools are used for scraping. During the scraping process, if too much force is applied or the cutting edge of the tool is damaged, it is easy to scrape the effective chips and break the wafer, affecting product quality.

[0003] In view of the above problems, it is necessary to propose a fixture and a cleaning system for removing attachments on the surface of a wafer that are reasonably designed and can effectively improve the above problems. Utility Model Content

[0004] Embodiments of the present disclosure aim to at least solve one of the technical problems existing in the prior art, and provide a fixture and a cleaning system for removing attachments on the surface of a wafer.

[0005] One aspect of the embodiments of the present disclosure provides a fixture for removing attachments on the surface of a wafer, including:

[0006] A carrier seat;

[0007] A tank body, arranged in the central area of the carrier seat, for accommodating a cleaning liquid for removing attachments on the surface of the wafer;

[0008] A lifting mechanism, arranged in the edge area of the carrier seat, for carrying the wafer to be cleaned and adjusting the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid.

[0009] Optionally, a groove is arranged in the edge area of the carrier seat, and the lifting mechanism is arranged in the groove.

[0010] Optionally, the lifting mechanism includes a lifting platform and a lifting drive structure connected to the lifting platform.

[0011] Optionally, the lifting drive structure includes a handle, a gear, and a transmission rack;

[0012] The gear and the transmission rack are arranged on the inner side wall of the groove;

[0013] The handle passes through the groove wall and is fixedly connected to the gear. The gear meshes with the transmission rack, and the transmission rack is fixedly connected to the lifting platform.

[0014] Optionally, the lifting drive structure further includes a motor, and an output shaft of the motor is in transmission connection with the gear.

[0015] Optionally, the lifting drive structure includes a guide rail and a slider;

[0016] The guide rail is disposed on an inner sidewall of the groove along a depth direction of the groove, and a chute is provided on the guide rail;

[0017] A first end of the slider is slidably disposed in the chute, and a second end of the slider is fixedly connected to the lifting platform.

[0018] Optionally, the lifting drive mechanism includes a drive motor and a lead screw;

[0019] The drive motor is fixed to the inner sidewall of the groove;

[0020] A first end of the lead screw is connected to a transmission shaft of the drive motor, and a second end of the lead screw is fixedly connected to the lifting platform.

[0021] Another aspect of the embodiments of the present disclosure provides a system for removing attachments on a wafer surface, which is characterized by including a wafer cassette, a cleaning liquid, and the wafer surface attachment removal jig described above;

[0022] The wafer cassette is used for placing a wafer to be cleaned, and a position to be cleaned of the wafer to be cleaned is exposed at the bottom of the wafer cassette; wherein,

[0023] When removing attachments on the wafer surface, the wafer cassette is placed on the lifting mechanism, and the wafer cassette is driven to lift by the lifting mechanism so as to adjust a position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid.

[0024] Optionally, the wafer cassette includes a cassette body and a support frame connected to the bottom of the cassette body;

[0025] An installation groove is provided in the cassette body, and the wafer to be cleaned is inserted into the installation groove;

[0026] The support frame is placed on the lifting mechanism.

[0027] Optionally, a depth of the cleaning liquid in the tank body is a preset depth.

[0028] The wafer surface attachment removal fixture and removal system according to the embodiments of the present disclosure. The fixture includes a carrier base, a tank body, and a lifting mechanism. The tank body is disposed in the central region of the carrier base and is used to accommodate a cleaning liquid for removing attachments on the wafer surface. The lifting mechanism is disposed in the edge region of the carrier base and is used to carry the wafer to be cleaned and adjust the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid. By using this fixture, the unplated portions attached to the edge region of the wafer can be immersed in the cleaning liquid in the tank body for removal, avoiding problems such as scratching and cracking of the wafer during the process of scraping the unplated portions with a tool, and improving the product quality. In addition, this fixture can adjust the position where the attachments on the surface of the wafers at different positions are immersed in the cleaning liquid through the lifting mechanism, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. is a schematic structural diagram of a wafer surface attachment removal fixture according to an embodiment of the present disclosure;

[0030] Figure 2 FIG. is a schematic structural diagram of a wafer surface attachment removal system according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] To enable those skilled in the art to better understand the technical solutions of the embodiments of the present disclosure, the following further describes the embodiments of the present disclosure in detail with reference to the drawings and specific embodiments.

[0032] As Figure 1 shown, one aspect of the embodiments of the present disclosure provides a wafer surface attachment removal fixture 100, including a carrier base 110, a tank body 120, and a lifting mechanism 130.

[0033] The tank body 120 is disposed in the central region of the carrier base 110 and is used to accommodate a cleaning liquid 220 for removing attachments on the wafer surface.

[0034] The lifting mechanism 130 is disposed in the edge region of the carrier base 110 and is used to carry the wafer to be cleaned and adjust the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid 220.

[0035] Specifically, in this embodiment, taking the attachments on the wafer surface as the unplated portions caused by abnormal edge or poor sealing during electroplating after glue coating of the wafer as an example for illustration. The wafer cassette 210 carrying the wafer 300 to be cleaned is placed on the lifting mechanism 130, and the unplated position A at the edge of the wafer 300 to be cleaned is adjusted so that the unplated position A of the wafer 300 to be cleaned is exposed at the bottom of the wafer cassette 210. The height of the wafer cassette 210 is adjusted through the lifting mechanism, so that the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid 220 for removal.

[0036] It should be noted that when other contaminants are attached to other positions on the wafer surface, this fixture can also be used to remove the contaminants. Select the corresponding cleaning liquid according to the type of contaminants.

[0037] The fixture for removing attachments on the wafer surface according to the embodiments of the present disclosure includes a carrier, a tank body, and a lifting mechanism. The tank body is arranged in the central area of the carrier and is used to accommodate the cleaning liquid for removing the attachments on the wafer surface; the lifting mechanism is arranged in the edge area of the carrier and is used to carry the wafer to be cleaned and adjust the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid. With this fixture, the exposed plating attached to the edge area of the wafer can be immersed in the cleaning liquid in the tank body for removal, avoiding problems such as scratching and cracking of the wafer during the process of scraping the exposed plating with a tool, and improving the product quality. In addition, this fixture can adjust the position where the attachments on the wafer surface at different positions are immersed in the cleaning liquid through the lifting mechanism, and has a wide range of applications.

[0038] Exemplarily, as Figure 1 shown, a groove 111 is provided in the edge area of the carrier 110, and a lifting mechanism is arranged in the groove 111.

[0039] Exemplarily, the lifting mechanism 130 includes a lifting platform and a lifting drive structure connected to the lifting platform. The lifting platform is used to carry the wafer to be cleaned, and the lifting drive structure drives the lifting platform to lift, and then drives the wafer to be cleaned to lift.

[0040] Specifically, in one embodiment, the lifting drive structure includes a handle, a gear, and a transmission rack. The gear and the transmission rack are arranged on the inner side wall of the groove 111. The handle passes through the groove wall and is fixedly connected to the gear. The gear meshes with the transmission rack, and the transmission rack is fixedly connected to the lifting platform.

[0041] That is to say, in this embodiment, the lifting of the lifting mechanism is controlled manually. Specifically, the rotation of the handle drives the rotation of the gear, and the rotation of the gear drives the transmission rack to lift, so as to drive the lifting platform to lift, and then adjust the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid.

[0042] Exemplarily, in another embodiment, the lifting of the lifting mechanism can also be driven by a motor. Specifically, the output shaft of the motor is in transmission connection with the gear. The gear meshes with the transmission rack, and the transmission rack is fixedly connected to the lifting platform. The rotation of the output shaft of the motor drives the rotation of the gear, and the rotation of the gear drives the transmission rack to lift, so as to drive the lifting platform to lift, and then adjust the position where the attachments on the surface of the wafer to be cleaned are immersed in the cleaning liquid.

[0043] Exemplarily, in another embodiment, the lifting drive structure includes a guide rail and a slider. The guide rail is disposed on the inner sidewall of the groove 111 along the depth direction of the groove 111, and a chute is provided on the guide rail. The first end of the slider is slidably disposed in the chute, and the second end of the slider is fixedly connected to the lifting platform.

[0044] Specifically, in this embodiment, the slider slides up and down in the chute of the guide rail to drive the lifting platform to lift, thereby adjusting the position where the attachment on the surface of the wafer to be cleaned is immersed in the cleaning liquid.

[0045] Exemplarily, in another embodiment, the lifting drive mechanism includes a drive motor and a lead screw. The drive motor is fixed to the inner sidewall of the groove 111. The first end of the lead screw is connected to the transmission shaft of the drive motor, and the second end of the lead screw is fixedly connected to the lifting platform.

[0046] Specifically, in this embodiment, the drive motor drives the lead screw to move up and down, and the up and down movement of the lead screw drives the lifting platform to lift, thereby adjusting the position where the attachment on the surface of the wafer to be cleaned is immersed in the cleaning liquid.

[0047] It should be noted that, in addition to the structures described above, the lifting drive structure can also be other structures, such as a crank-slider structure, a linear bearing, a linear motor, etc., as long as it can drive the lifting platform to lift. It can be selected according to actual needs, and this embodiment does not make specific limitations.

[0048] As Figure 2 shown, another aspect of the embodiments of the present disclosure provides a system 200 for removing attachments on the surface of a wafer, including a wafer cassette 210, a cleaning liquid 220, and the aforementioned wafer surface attachment removal jig 100. The specific structure of the wafer surface attachment removal jig 100 has been described in detail above and will not be repeated here.

[0049] The wafer cassette 210 is used to place the wafer 300 to be cleaned, and the position to be cleaned of the wafer 300 to be cleaned is exposed at the bottom of the wafer cassette. Among them, when removing the attachments on the surface of the wafer, the wafer cassette 210 is placed on the lifting mechanism 130, and the lifting mechanism 130 drives the wafer cassette 210 to lift to adjust the position where the attachment on the surface of the wafer 300 to be cleaned is immersed in the cleaning liquid 220.

[0050] Exemplarily, as Figure 2 shown, the wafer cassette 210 includes a cassette body 211 and a support frame 212 connected to the bottom of the cassette body 211. An installation groove is provided in the cassette body 211, and the wafer 300 to be cleaned is inserted into the installation groove.

[0051] The support frame 212 is placed on the lifting mechanism 130. The lifting of the support frame 212 is adjusted by the lifting mechanism 130 to adjust the lifting of the wafer cassette 210, and further adjust the position where the attachment on the surface of the wafer to be cleaned is immersed in the cleaning liquid 220.

[0052] Exemplarily, the depth of the cleaning liquid 220 in the tank body 120 is a preset depth. That is to say, the depth of the cleaning liquid 220 in the tank body 120 is maintained at the preset depth. By adjusting the lifting of the wafer to be cleaned, the position where the attachment on the surface of the wafer to be cleaned is immersed in the cleaning liquid 220 is adjusted, which is simple and convenient to operate and saves the cleaning liquid.

[0053] Specifically, in this embodiment, the attachment on the surface of the wafer to be cleaned is taken as an example of the plating omission in the wafer edge area. According to the type of the plated metal, the corresponding type of cleaning liquid 220 is poured into the tank body 120 to the preset depth. The wafer 300 to be cleaned is inserted into the box body 211 of the wafer cassette 210, wherein the plating omission position A of the wafer 300 to be cleaned is exposed at the bottom of the box body 211. The support frame 212 of the wafer cassette 210 is placed on the lifting mechanism 130 of the cleaning fixture 100 for the attachment on the surface of the wafer. The lifting mechanism 130 drives the wafer cassette 210 to lower so that the plating omission position A is immersed in the cleaning liquid for plating omission removal. After the plating omission is completed, the lifting mechanism 130 drives the wafer cassette 210 to rise so that the plating omission position A is separated from the cleaning liquid.

[0054] The cleaning system for the attachment on the surface of the wafer in the embodiment of the present disclosure can immerse the plating omission attached to the surface of the wafer in the cleaning liquid in the tank body through the cleaning fixture for the attachment on the surface of the wafer, avoiding problems such as scratching and cracking of the wafer during the process of scraping the plating omission by the tool, and improving the product quality. In addition, the fixture can adjust the position where the attachment on the surface of the wafer at different positions penetrates into the cleaning liquid through the lifting mechanism, and has a wide range of applications.

[0055] It can be understood that the above embodiments are merely exemplary embodiments adopted to illustrate the principle of the embodiments of the present disclosure. However, the embodiments of the present disclosure are not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of the present disclosure, and these modifications and improvements are also regarded as the protection scope of the embodiments of the present disclosure.

Claims

1. A jig for removing deposits from the surface of a wafer, characterized in that: include: Bearing seat; A tank body, arranged in the central area of ​​the supporting seat, for containing a cleaning liquid for removing attachments from the surface of the wafer; The lifting mechanism is arranged at the edge area of ​​the supporting seat, and is used for supporting the wafer to be cleaned and adjusting the position where the attached objects on the surface of the wafer to be cleaned are immersed in the cleaning liquid.

2. The fixture according to claim 1, characterized in that: A groove is arranged at the edge area of ​​the bearing seat, and the lifting mechanism is arranged in the groove.

3. The fixture according to claim 2, characterized in that: The lifting mechanism comprises a lifting platform and a lifting drive structure connected to the lifting platform.

4. The fixture according to claim 3, characterized in that: The lifting drive structure includes a handle, a gear and a transmission rack; The gear and the transmission rack are arranged on the inner side wall of the groove; The handle passes through the groove wall and is fixedly connected to the gear, the gear is meshed with the transmission rack, and the transmission rack is fixedly connected to the lifting platform.

5. The fixture according to claim 4, characterized in that: The lifting drive structure also includes a motor, and the output shaft of the motor is transmission-connected to the gear.

6. The fixture according to claim 3, characterized in that: The lifting drive structure includes a guide rail and a slider; The guide rail is arranged on the inner side wall of the groove along the depth direction of the groove, and a slide groove is arranged on the guide rail; The first end of the slider is slidably disposed in the slide groove, and the second end of the slider is fixedly connected to the lifting platform.

7. The fixture according to claim 3, characterized in that: The lifting drive structure includes a driving motor and a lead screw; The driving motor is fixed to the inner side wall of the groove; The first end of the lead screw is connected to the transmission shaft of the drive motor, and the second end of the lead screw is fixedly connected to the lifting platform.

8. A system for removing deposits from the surface of a wafer, characterized in that: It comprises a wafer box, a cleaning liquid and a wafer surface attachment removal jig as claimed in any one of claims 1 to 7; The wafer box is used to place the wafer to be cleaned, and the position to be cleaned of the wafer to be cleaned is exposed at the bottom of the wafer box; wherein, When removing the deposits on the wafer surface, the wafer box is placed on the lifting mechanism, and the lifting mechanism is used to drive the wafer box to move up and down to adjust the position where the deposits on the wafer surface to be cleaned are immersed in the cleaning liquid.

9. The system according to claim 8, characterized in that The wafer box comprises a box body and a support frame connected to the bottom of the box body; The box body is provided with a mounting groove, and the wafer to be cleaned is inserted into the mounting groove; The support frame is placed on the lifting mechanism.

10. The system according to claim 8, characterized in that The depth of the cleaning liquid in the tank body is a preset depth.

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