Graphene multilayer composite heat-conducting gasket
By inserting a silicone cover into a graphene multi-layer composite thermal conductivity monolithic sheet and using the design of a silicone extension sheet, the problem of poor adaptability of traditional graphene multi-layer composite thermal conductivity is solved, and efficient thermal conductivity in different shapes and structures is achieved.
Patent Information
- Application Number
- CN202422565656.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-22
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2034-10-22
AI Technical Summary
Traditional graphene multi-layer composite thermal gaskets are difficult to adapt to lamps or structures of different shapes and sizes due to poor adaptability of large-size plate-like structures, resulting in poor thermal conductivity or inconvenient installation.
Graphene multi-layer composite thermal conductivity monolith is embedded in a silicone cover, and a deformable structure is formed by combining the silicone extension sheet, so that multiple graphene multi-layer composite thermal conductivity monoliths can be wound and installed on structures of different shapes and fixed by bonding and bonding of the silicone extension sheet.
The applicability and thermal efficiency of graphene multi-layer composite thermal gaskets in complex shape structures is improved, ensuring a tight fit to improve thermal conductivity.
Smart Images
Figure CN223053349U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat conducting sheets, in particular to a graphene multi-layer composite heat conducting gasket. Background Technique
[0002] The graphene multi-layer composite heat conducting gasket usually consists of multiple layers of graphene foam films and adhesives. As the main heat conducting body, the graphene foam film has high thermal conductivity, low thermal resistance and good flexibility. The adhesive is used to bond the multiple layers of graphene foam films together to form a stable composite structure. In addition, according to specific requirements, the gasket may also contain other filling materials or additives to enhance its heat conducting performance or mechanical properties.
[0003] In the existing heat conducting technologies, the graphene multi-layer composite heat conducting gasket is widely used due to its excellent heat conducting performance. However, the traditional graphene multi-layer composite heat conducting gasket often adopts a single large-sized plate structure, which has certain limitations when adapting to different shapes and sizes of lamps or other structures that require heat conduction. Specifically, it may face difficulties when bending or winding the large-sized plate structure to adapt to complex shapes, and it is easy to cause poor heat conduction effect or inconvenient installation due to shape mismatch.
[0004] To solve this problem, there is an urgent need in the market for a graphene multi-layer composite heat conducting gasket that can adapt to different shapes and sizes and at the same time has excellent heat conducting performance. Content of the Utility Model
[0005] The purpose of the utility model is to provide a graphene multi-layer composite heat conducting gasket to solve the problems raised in the above background technique.
[0006] To achieve the above purpose, the utility model provides the following technical solution: a graphene multi-layer composite heat conducting gasket, including a graphene multi-layer composite heat conducting single piece, the graphene multi-layer composite heat conducting single piece is embedded in the bottom surface of a silica gel cover, and the top of the graphene multi-layer composite heat conducting single piece penetrates through the top surface of the silica gel cover, and silica gel extension pieces are integrally formed on both sides of the silica gel cover.
[0007] Preferably, a clamping groove is opened on the bottom surface of the silica gel cover, the clamping groove is an inverted "convex"-shaped groove, notches are opened on both sides of the bottom surface of the graphene multi-layer composite heat conducting single piece, the graphene multi-layer composite heat conducting single piece with notches is an inverted "convex"-shaped plate, the top plate body of the graphene multi-layer composite heat conducting single piece is inserted into the clamping groove, and the top surface of the graphene multi-layer composite heat conducting single piece is bonded to the top surface of the clamping groove.
[0008] Preferably, the height of the clamping groove is less than the thickness of the graphene multi-layer composite heat conducting single piece, the width of the clamping groove is equal to the width of the silica gel cover, and the length of the long side of the graphene multi-layer composite heat conducting single piece is equal to the length of the long side of the clamping groove.
[0009] Preferably, a through hole is formed in the top surface of the silica gel cover, and the through hole communicates with the card slot. A graphene multi-layer composite heat conduction convex piece is integrally formed on the top surface of the graphene multi-layer composite heat conduction single piece. The graphene multi-layer composite heat conduction convex piece is inserted into the through hole, and the top surface size of the graphene multi-layer composite heat conduction convex piece is smaller than the top surface size of the graphene multi-layer composite heat conduction single piece.
[0010] Preferably, a plurality of silica gel covers and silica gel extension pieces are provided, and the silica gel covers and the silica gel extension pieces are distributed alternately.
[0011] Preferably, a plurality of through holes are formed in the surface of the silica gel extension piece, and the through holes are oblong holes.
[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0013] The graphene multi-layer composite heat conduction gasket proposed by the present utility model, through the design of embedding the graphene multi-layer composite heat conduction single piece in the silica gel cover, and cooperating with the silica gel extension piece to form a deformable structure between two adjacent graphene multi-layer composite heat conduction single pieces, enables a plurality of graphene multi-layer composite heat conduction single pieces to be wound and installed on lamps or structures that need heat conduction with different shapes in cooperation with the silica gel extension piece. This design effectively solves the problem of low adaptability of a single large-size plate-shaped graphene multi-layer composite heat conduction gasket, and improves the applicability of the gasket on various complex-shaped structures. Both the graphene multi-layer composite heat conduction single piece and the silica gel cover have heat conduction functions, and this design ensures the superiority of the gasket in heat conduction performance. At the same time, through the deformable structure design, the gasket can be more closely attached to the structure that needs heat conduction, further improving the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 is a schematic structural diagram of the present utility model;
[0015] Figure 2 is a top view of the structure of the present utility model;
[0016] Figure 3 is Figure 2 a sectional view of the structure at A-A in
[0017] Figure 4 is Figure 3 an enlarged schematic view of the structure at A in
[0018] Figure 5 is a schematic structural diagram of the connection structure of the silica gel cover and the silica gel extension piece of the present utility model;
[0019] Figure 6 is Figure 5 an enlarged schematic view of the structure at B in
[0020] Figure 7This is a schematic diagram of the structure of the graphene multi-layer composite heat-conducting single sheet of the present utility model.
[0021] In the figure: graphene multi-layer composite heat-conducting single sheet 1, notch 2, graphene multi-layer composite heat-conducting convex sheet 3, card slot 4, silica gel cover 5, through hole 6, silica gel extension piece 7, through hole 8. Specific implementation manners
[0022] In order to clearly and completely describe the purpose, technical solution of the present utility model and make the advantages more clearly understood, the following further details the embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present utility model, rather than all of the embodiments, and are only used to explain the embodiments of the present utility model, not to limit the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.
[0023] Please refer to Figures 1 - 7 , the present utility model provides a technical solution: a graphene multi-layer composite heat-conducting gasket, including a graphene multi-layer composite heat-conducting single sheet 1, the graphene multi-layer composite heat-conducting single sheet 1 is embedded in the bottom surface of the silica gel cover 5, a card slot 4 is opened on the bottom surface of the silica gel cover 5, the card slot 4 is an inverted "convex" shaped groove, notches 2 are opened on both sides of the bottom surface of the graphene multi-layer composite heat-conducting single sheet 1, and the graphene multi-layer composite heat-conducting single sheet 1 with the notches 2 is an inverted "convex" shaped plate. The top plate body of the graphene multi-layer composite heat-conducting single sheet 1 is inserted into the card slot 4, and the top surface of the graphene multi-layer composite heat-conducting single sheet 1 is adhered to the top surface of the card slot 4. The height of the card slot 4 is less than the thickness of the graphene multi-layer composite heat-conducting single sheet 1, the width of the card slot 4 is equal to the width of the silica gel cover 5, and the length of the long side of the graphene multi-layer composite heat-conducting single sheet 1 is equal to the length of the long side of the card slot 4; after the graphene multi-layer composite heat-conducting single sheet 1 is pushed into the corresponding card slot 4, since the top surface of the through hole 6 is lapped on the bottom surface of the card slot 4, it is avoided that the graphene multi-layer composite heat-conducting single sheet 1 falls off downward from the graphene multi-layer composite heat-conducting single sheet 1. Glue is pre-applied on the top surface of the graphene multi-layer composite heat-conducting single sheet 1. After the graphene multi-layer composite heat-conducting single sheet 1 is pushed into the card slot 4 from bottom to top, the glue is solidified to firmly fix the graphene multi-layer composite heat-conducting single sheet 1 in the card slot 4.
[0024] Moreover, the top of the graphene multi-layer composite heat-conducting single piece 1 penetrates through the top surface of the silica gel cover 5. A through hole 6 is formed in the top surface of the silica gel cover 5, and the through hole 6 is communicated with the card slot 4. A graphene multi-layer composite heat-conducting convex piece 3 is integrally formed on the top surface of the graphene multi-layer composite heat-conducting single piece 1. The graphene multi-layer composite heat-conducting convex piece 3 is inserted into the through hole 6. The top surface size of the graphene multi-layer composite heat-conducting convex piece 3 is smaller than the top surface size of the graphene multi-layer composite heat-conducting single piece 1. The reason for forming the through hole 6 in the top surface of the silica gel cover 5 is that after the graphene multi-layer composite heat-conducting single piece 1 is pushed into the card slot 4, the graphene multi-layer composite heat-conducting convex piece 3 is inserted into the through hole 6. In this way, the card slot 4 prevents the graphene multi-layer composite heat-conducting single piece 1 from falling off downward, and the graphene multi-layer composite heat-conducting convex piece 3 is stuck in the through hole 6 to prevent the graphene multi-layer composite heat-conducting single piece 1 from translating along the card slot 4, so as to pre-fix the graphene multi-layer composite heat-conducting single piece 1 in the card slot 4 when the glue has not solidified.
[0025] Silica gel extension pieces 7 are integrally formed on both sides of the silica gel cover 5. There are multiple silica gel covers 5 and silica gel extension pieces 7, and the silica gel covers 5 and the silica gel extension pieces 7 are distributed alternately; a plurality of through holes 8 are formed in the surface of the silica gel extension piece 7, and the through holes 8 are oblong holes; both the graphene multi-layer composite heat-conducting single piece 1 and the silica gel cover 5 have heat-conducting functions. The reason for embedding the graphene multi-layer composite heat-conducting single piece 1 in the silica gel cover 5 is to cooperate with the silica gel extension piece 7 to form a deformable structure between two adjacent graphene multi-layer composite heat-conducting single pieces 1. In this way, it is convenient for multiple graphene multi-layer composite heat-conducting single pieces 1 to be wound and installed on lamps or structures that need heat conduction in different shapes in cooperation with the silica gel extension piece 7. After winding, only the silica gel extension piece 7 at the end needs to be bonded to the structure; effectively solving the problem of low adaptability of a single large-size plate-shaped graphene multi-layer composite heat-conducting single piece 1.
[0026] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A graphene multilayer composite thermally conductive gasket, comprising a graphene multilayer composite thermally conductive single sheet (1), characterized in that: The graphene multilayer composite heat-conducting single sheet (1) is embedded in the bottom surface of the silicone cover (5), and the top of the graphene multilayer composite heat-conducting single sheet (1) penetrates the top surface of the silicone cover (5), and silicone extension sheets (7) are integrally formed on both sides of the silicone cover (5).
2. The graphene multilayer composite thermally conductive gasket according to claim 1, characterized in that: The bottom surface of the silicone cover (5) is provided with a card slot (4), the card slot (4) is an inverted "convex" shaped slot, both sides of the bottom surface of the graphene multilayer composite heat conductive single sheet (1) are provided with notch slots (2), the graphene multilayer composite heat conductive single sheet (1) provided with the notch slots (2) is an inverted "convex" shaped plate, the top plate body of the graphene multilayer composite heat conductive single sheet (1) is inserted into the card slot (4), and the top surface of the graphene multilayer composite heat conductive single sheet (1) is bonded to the top surface of the card slot (4).
3. The graphene multilayer composite thermally conductive pad according to claim 2, characterized in that: The height of the card slot (4) is less than the thickness of the graphene multilayer composite heat-conducting single sheet (1), the width of the card slot (4) is equal to the width of the silicone cover (5), and the length of the long side of the graphene multilayer composite heat-conducting single sheet (1) is equal to the length of the long side of the card slot (4).
4. The graphene multilayer composite thermally conductive pad according to claim 2, characterized in that: The top surface of the silicone cover (5) is provided with a through opening (6), the through opening (6) is connected to the card slot (4), the top surface of the graphene multilayer composite heat conductive single sheet (1) is integrally formed with a graphene multilayer composite heat conductive convex sheet (3), the graphene multilayer composite heat conductive convex sheet (3) is inserted into the through opening (6), and the top surface size of the graphene multilayer composite heat conductive convex sheet (3) is smaller than the top surface size of the graphene multilayer composite heat conductive single sheet (1).
5. The graphene multilayer composite thermally conductive gasket according to claim 1, characterized in that: The silicone cover (5) and the silicone extension piece (7) are both provided in plurality, and the silicone cover (5) and the silicone extension piece (7) are distributed alternately.
6. The graphene multilayer composite thermally conductive gasket according to claim 1, characterized in that: A plurality of through holes (8) are provided on the surface of the silicone extension sheet (7), and the through holes (8) are oblong holes.