Automatic testing device for compressive strength of high-security chip

Abstract

The utility model provides an automatic compressive strength testing device for a high-security chip. The automatic compressive strength testing device comprises an electric control box, a pressure sensor and a pressure sensor, wherein the electric control box is provided with an industrial control module; the lifting mechanism is installed on the upper side of the electric cabinet, the lifting mechanism is provided with a pressure measuring device, the pressure measuring device comprises a pressure sensor and a cutting die, the pressure sensor is connected with the cutting die, and the lifting mechanism and the pressure sensor are electrically connected with the industrial control module; the mounting table is mounted on the upper side of the electric cabinet and located on the lower side of the pressure measuring device, the mounting table is provided with a first die and a second die which are transversely arranged, and the first die and the second die are provided with mounting grooves used for mounting the high-safety chip and can move under driving of the micrometer. According to the technical scheme of the embodiment, high-security chips of different sizes and shapes can be flexibly adapted through position adjustment of the first mold and the second mold, compressive strength tests of various high-security chips are completed in combination with the industrial control system and the pressure measuring device, and the universality and practicability of the testing device are effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and particularly relates to an automatic testing device for the compressive strength of a high-security chip. Background Technique

[0002] A high-security chip is an integrated circuit chip with high security performance, which can independently generate keys and perform encryption and decryption. It has an independent processor and storage unit inside. The high-security chip plays an important role in data security protection with its unique functions and advantages, and has broad application prospects in many fields.

[0003] After the high-security chip is manufactured, it needs to be subjected to a compressive strength test. A pressure is applied to the high-security chip through a knife die until it breaks to determine the compressive performance of the high-security chip. However, due to the small size of the high-security chip and the inconsistent sizes and shapes of different models of high-security chips, it is required to configure a test die for each model of high-security chip, resulting in a high cost of test hardware and low flexibility in use. Content of the Utility Model

[0004] The embodiment of the utility model provides an automatic testing device for the compressive strength of a high-security chip, which can flexibly adapt to the compressive tests of high-security chips with different sizes and shapes, improve the versatility of the testing device, and reduce the cost of test hardware.

[0005] In a first aspect, the embodiment of the utility model provides an automatic testing device for the compressive strength of a high-security chip, including:

[0006] An electric control box, which is provided with an industrial control module;

[0007] A lifting mechanism, installed on the upper side of the electric control box. The lifting mechanism is installed with a pressure measuring device, and the pressure measuring device includes a pressure sensor and a knife die. The pressure sensor is connected to the knife die, and the lifting mechanism and the pressure sensor are electrically connected to the industrial control module;

[0008] An installation table, installed on the upper side of the electric control box, located below the pressure measuring device. The upper side of the installation table is provided with a first die, a second die, a first micrometer and a second micrometer. The first die is located on the right side of the second die. A first installation groove is provided on the side of the first die close to the second die, and a second installation groove is provided on the side of the second die close to the first die. The first installation groove and the second installation groove are located below the knife die. The first installation groove and the second installation groove are used to install the high-security chip. The first micrometer is used to drive the first die to approach or move away from the second die, and the second micrometer is used to drive the second die to approach or move away from the first die.

[0009] According to some embodiments of the present utility model, it further includes

[0010] A CCD vision module, including a CCD unit and a camera. The CCD unit is respectively communicatively connected to the camera and the industrial control module. The camera is used for taking a surface image of the high-security chip installed in the first installation slot and the second installation slot, and the CCD unit is used for detecting the surface image.

[0011] According to some embodiments of the present utility model, the electric control box further includes a first display screen and a second display screen. The first display screen is used for displaying the output signal of the CCD vision module, and the second display screen is used for displaying the sensing value of the pressure sensor.

[0012] According to some embodiments of the present utility model, the electric control box is further provided with a first button and a second button. Both the first button and the second button are electrically connected to the lifting mechanism. The first button is used for sending a manual lifting signal to the lifting mechanism, and the second button is used for sending an automatic lifting signal to the lifting mechanism.

[0013] According to some embodiments of the present utility model, the lifting mechanism further includes

[0014] A numerical control motor;

[0015] A transmission assembly, connected to the numerical control motor. The numerical control motor is used for driving the transmission assembly to lift;

[0016] A mounting plate. One side of the mounting plate is fixedly connected to the transmission assembly, and the other side is provided with a pressure fixing assembly. The pressure measuring device is fixedly installed on the lower side of the pressure fixing assembly.

[0017] According to some embodiments of the present utility model, the lifting mechanism further includes

[0018] An upper limit switch, communicatively connected to the numerical control motor. The upper limit switch can be triggered by the mounting plate to send an upper limit signal;

[0019] A lower limit switch, communicatively connected to the numerical control motor. The lower limit switch can be triggered by the mounting plate to send a lower limit signal.

[0020] According to some embodiments of the present utility model, the first mold includes a first translation block and a first carrier table. The first translation block is movably installed on the installation table. The first carrier table is fixedly installed on the upper side of the first translation block. The first installation slot is arranged on the first carrier table. The first micrometer is used for driving the first translation block to move;

[0021] The second mold includes a second translation block and a second carrier. The second translation block is movably installed on the installation table. The second carrier is fixedly installed on the upper side of the second translation block. The second installation groove is provided on the second carrier. The second micrometer is used to drive the second translation block to move.

[0022] According to some embodiments of the present invention, it further includes:

[0023] A first fixing component, the first fixing component includes a first fixing piece and a first fixing shaft. The first fixing piece is fixed to the installation table. The first fixing piece is provided with a first sliding groove. The first translation block is located inside the first fixing piece. The first fixing shaft passes through the first sliding groove and abuts against the first translation block. The first fixing shaft is used to lock the first translation block to the first fixing piece;

[0024] A second fixing component, the second fixing component includes a second fixing piece and a second fixing shaft. The second fixing piece is fixed to the installation table. The second fixing piece is provided with a second sliding groove. The second translation block is located inside the second fixing piece. The second fixing shaft passes through the second sliding groove and abuts against the second translation block. The second fixing shaft is used to lock the second translation block to the second fixing piece.

[0025] According to some embodiments of the present invention, it further includes,

[0026] A waste recycling box, which is movably installed on the upper side of the electric control box. The waste recycling box is located below the first carrier and the second carrier. An avoidance groove is provided on one side of the waste recycling box close to the lifting mechanism. The avoidance groove is aligned with the lower edges of the first mold and the second mold.

[0027] According to some embodiments of the present invention, the first installation groove is an L-shaped groove with an opening facing the second mold, and the second installation groove is an L-shaped groove with an opening facing the first mold; the bottom corners of the first installation groove and the second installation groove are obtuse arc surfaces, and the contact surface of the cutting die is an arc surface.

[0028] Embodiments of the present utility model include: an electric control box provided with an industrial control module; a lifting mechanism installed on the upper side of the electric control box, the lifting mechanism being equipped with a pressure measuring device, the pressure measuring device including a pressure sensor and a die, the pressure sensor being connected to the die, the lifting mechanism and the pressure sensor being electrically connected to the industrial control module; a mounting table installed on the upper side of the electric control box and located below the pressure measuring device, the upper side of the mounting table being provided with a first mold, a second mold, a first micrometer, and a second micrometer, the first mold being located on the right side of the second mold, a first installation groove being provided on the side of the first mold close to the second mold, a second installation groove being provided on the side of the second mold close to the first mold, the first installation groove and the second installation groove being located below the die, the first installation groove and the second installation groove being used for installing high-security chips, the first micrometer being used to drive the first mold to approach or move away from the second mold, and the second micrometer being used to drive the second mold to approach or move away from the first mold. According to the technical solution of this embodiment, it is possible to adjust the distance between the first installation groove and the second installation groove by adjusting the positions of the first mold and the second mold, flexibly adapting to high-security chips of different sizes and shapes. Then, the industrial control module can control the lifting of the die through the lifting mechanism, apply pressure to the surface of the high-security chip through the die, and detect the pressure value through the pressure sensor to complete the compressive strength test, effectively improving the versatility and practicality of the testing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 FIG. 6 is a perspective schematic diagram of an automatic compressive strength testing device for high-security chips provided by an embodiment of the present utility model;

[0030] Figure 2 FIG. 10 is an internal schematic diagram of a lifting mechanism provided by another embodiment of the present utility model;

[0031] Figure 3 FIG. 14 is a rear perspective view after removing the lifting mechanism provided by another embodiment of the present utility model;

[0032] Figure 4 FIG. 18 is an enlarged view of a mounting table provided by another embodiment of the present utility model;

[0033] Figure 5 is Figure 4 an enlarged view of part A in FIG. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] In order to make the objectives, technical solutions, and advantages of the present utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model.

[0035] It should be noted that although the functional modules are divided in the schematic diagram of the device and the logical sequence is shown in the flowchart, in some cases, the steps shown or described can be executed in a different module division from that in the device or a different sequence from that in the flowchart. Terms such as "first" and "target" in the description, claims or the above-mentioned drawings are used to distinguish similar objects and do not necessarily need to describe a specific order or sequence.

[0036] The present utility model provides an automatic testing device for the compressive strength of a high-security chip, including: an electric control box provided with an industrial control module; a lifting mechanism installed on the upper side of the electric control box, the lifting mechanism is installed with a pressure measuring device, the pressure measuring device includes a pressure sensor and a cutting die, the pressure sensor is connected to the cutting die, and the lifting mechanism and the pressure sensor are electrically connected to the industrial control module; a mounting table installed on the upper side of the electric control box and located below the pressure measuring device, the upper side of the mounting table is provided with a first mold, a second mold, a first micrometer and a second micrometer, the first mold is located on the right side of the second mold, a first installation groove is provided on the side of the first mold close to the second mold, a second installation groove is provided on the side of the second mold close to the first mold, the first installation groove and the second installation groove are located below the cutting die, the first installation groove and the second installation groove are used for installing the high-security chip, the first micrometer is used to drive the first mold to approach or move away from the second mold, and the second micrometer is used to drive the second mold to approach or move away from the first mold. According to the technical solution of this embodiment, the distance between the first installation groove and the second installation groove can be adjusted by adjusting the positions of the first mold and the second mold, so as to flexibly adapt to high-security chips of different sizes and shapes. Then, the industrial control module can control the lifting of the cutting die through the lifting mechanism, apply pressure on the surface of the high-security chip through the cutting die, and detect the pressure value through the pressure sensor to complete the compressive strength test, effectively improving the versatility and practicality of the testing device.

[0037] Referring to Figures 1 to 5 , the automatic testing device for the compressive strength of the high-security chip provided in this embodiment includes:

[0038] An electric control box 10, the electric control box 10 is provided with an industrial control module;

[0039] A lifting mechanism 20, installed on the upper side of the electric control box 10, the lifting mechanism 20 is installed with a pressure measuring device 211, the pressure measuring device 211 includes a pressure sensor and a cutting die 212, the pressure sensor is connected to the cutting die 212, and the lifting mechanism 20 and the pressure sensor are electrically connected to the industrial control module;

[0040] The mounting table is installed on the upper side of the electric control box 10 and is located below the pressure measuring device 211. On the upper side of the mounting table, there are a first mold 310, a second mold 320, a first micrometer 311 and a second micrometer 321. The first mold 310 is located on the right side of the second mold 320. On the side of the first mold 310 close to the second mold 320, there is a first installation groove 318. On the side of the second mold 320 close to the first mold 310, there is a second installation groove 328. The first installation groove 318 and the second installation groove 328 are located below the cutting die 212. The first installation groove 318 and the second installation groove 328 are used to install the high-security chip 50. The first micrometer 311 is used to drive the first mold 310 to approach or move away from the second mold 320, and the second micrometer 321 is used to drive the second mold 320 to approach or move away from the first mold 310.

[0041] It should be noted that the industrial control module is used for signal processing. For example, after startup, it controls the lifting mechanism 20 to perform lifting, and collects the sensing values of the pressure sensor in real time and other control operations. The industrial control module can adopt a common signal processing unit with data processing and control functions. This embodiment does not involve the improvement of the control method of the industrial control module, and only provides a conventional industrial control system as the control device for the compressive strength detection, and will not be repeated hereinafter.

[0042] It should be noted that the pressure measuring device 211 in this embodiment is internally provided with a high-precision pressure sensor. The pressure sensor is connected to the cutting die 212. The lifting mechanism 20 performs lifting under the control of the industrial control system. When the cutting die 212 descends and abuts against the high-security chip 50, the pressure sensor detects the pressure sensing value fed back by the cutting die 212. When the cutting die 212 breaks the high-security chip 50, the pressure peak value detected by the pressure sensor is the compressive strength of the high-security chip 50.

[0043] It should be noted that as Figure 1 and Figure 2 shown, the mounting table is located in front of the lifting mechanism 20, so that the cutting die 212 is located on the upper side of the mounting table. After the high-security chip 50 is installed on the mounting table, the cutting die 212 can be aligned directly above the high-security chip 50, so that the cutting die 212 can abut against the high-security chip 50 after descending and complete the compressive strength detection.

[0044] It should be noted that as Figures 1 to 4 shown, the mounting table includes a first mold 310 and a second mold 320 adjacent to each other on the left and right. A first installation groove 318 is provided in the first mold 310, and a second installation groove 328 is provided in the second mold 320. As Figure 5As shown, an installation space for the high-security chip 50 is formed between the first installation groove 318 and the second installation groove 328. The right side of the high-security chip 50 is placed on the surface of the first installation groove 318, and the left side is placed on the surface of the second installation groove 328. In this embodiment, it is not limited that the side surface of the high-security chip 50 abuts against the side wall of the corresponding installation groove to avoid the influence of the side wall friction on the compressive test. It only needs to ensure that one end of the high-security chip 50 is placed on the surface of the first installation groove 318 and the other end is placed on the surface of the second installation groove 328.

[0045] It should be noted that since the size of the high-security chip 50 is small, a micrometer is used as the position adjustment device in this embodiment. The lateral position of the first mold 310 is finely adjusted by the first micrometer 311, and the lateral position of the second mold 320 is finely adjusted by the second micrometer 321, so as to meet the installation of high-security chips 50 with different sizes and shapes. For example, when the specification of the high-security chip 50 is small, the first mold 310 is moved to the left by the first micrometer 311, and the second mold 320 is moved to the right by the second micrometer 321, so that the first installation groove 318 and the second installation groove 328 are close to each other, and the installation space becomes smaller to adapt to the high-security chip 50 with a smaller specification; similarly, when the specification of the high-security chip 50 is large, the first mold 310 is moved to the right, and the second mold 320 is moved to the left, so that the first installation groove 318 and the second installation groove 328 are far away from each other, and the installation space becomes larger.

[0046] Through the technical solution of this embodiment, installation grooves with opposite positions can be set on the first mold 310 and the second mold 320. The first micrometer 311 is set on the first mold 310, and the second micrometer 321 is set on the second mold 320. The fine adjustment of the mold position is realized through the micrometer, so as to realize the flexible adjustment of the installation space between the first installation groove 318 and the second installation groove 328, so as to adapt to high-security chips 50 with different sizes and shapes; after the installation of the high-security chip 50 is completed, the lifting mechanism 20 is controlled by the industrial control module to lift and lower, so as to drive the cutting die 212 to descend and apply pressure to the high-security chip 50 until the high-security chip 50 breaks. The industrial control module collects the sensing values detected by the pressure sensor in real time, and automatically completes the detection of the compressive strength according to the sensing values during the compression process of the high-security chip 50. The compressive strength test of high-security chips 50 with different specifications can be automatically completed by one test device, reducing the hardware cost of the compressive strength test and improving the versatility of the test device.

[0047] In addition, in one embodiment, it further includes

[0048] The CCD vision module includes a CCD unit and a camera. The CCD unit is communicatively connected to the camera and the industrial control module respectively. The camera is used to capture the surface image of the high-security chip 50 installed in the first installation groove 318 and the second installation groove 328, and the CCD unit is used to detect the surface image.

[0049] It should be noted that the camera can be installed at any position. For example, it can be installed on the upper side of the electric control box 10 or beside the electric control box 10, as long as it can capture the surface image of the high-security chip 50.

[0050] It should be noted that the CCD unit can be installed inside the electric control box 10 and is connected to the camera and the industrial control module in a wired manner. The surface image obtained by the camera is sent to the CCD unit in real time. The CCD unit performs image recognition on the surface image through a conventional CCD algorithm to determine whether there is a break. The CCD vision module is a functional module well-known to those skilled in the art. This embodiment does not involve the improvement of the CCD image recognition algorithm. Only relevant modules are integrated in the test device to achieve automatic processing and analysis, so as to quickly and accurately improve the compressive strength test. The specific image recognition principle will not be elaborated here.

[0051] In addition, in one embodiment, referring to Figure 1 , the electric control box 10 further includes a first display screen 11 and a second display screen 12. The first display screen 11 is used to display the output signal of the CCD vision module, and the second display screen 12 is used to display the sensing value of the pressure sensor.

[0052] It should be noted that according to the description of the above embodiment, the industrial control module is communicatively connected to the CCD unit and the pressure sensor. Therefore, the industrial control simulation can obtain the detection signal of the CCD unit and the sensing value of the pressure sensor. In this embodiment, the first display screen 11 and the second display screen 12 are provided in the electric control box 10. The industrial control module sends the sensing value of the pressure sensor to the second display screen 12 in real time, facilitating the tester to observe the current compressive strength of the high-security chip 50 in real time; the industrial control module also sends the output signal of the CCD vision module to the first display screen 11 in real time, such as displaying the current surface image of the high-security chip 50 and giving a real-time prompt when a crack or deformation is detected, facilitating the tester to observe the surface condition of the high-security chip 50 through the first display screen 11 in real time.

[0053] In addition, in one embodiment, referring to Figure 1 , the electric control box 10 is further provided with a first button 13 and a second button 14. Both the first button 13 and the second button 14 are electrically connected to the lifting mechanism 20. The first button 13 is used to send a manual lifting signal to the lifting mechanism 20, and the second button 14 is used to send an automatic lifting signal to the lifting mechanism 20.

[0054] It should be noted that according to the description of the above embodiments, the lifting mechanism 20 is controlled to lift by the industrial control module. For example, after controlling the lifting mechanism 20 to rise, new high-security chips 50 are placed in the first installation groove 318 and the second installation groove 328. After the placement is completed, the lifting mechanism 20 is controlled to descend, and the cutting die 212 is driven to descend to complete the compressive strength test. In this embodiment, a first button 13 and a second button 14 are arranged on the electric control box 10, and the manual lifting of the lifting mechanism 20 is realized through the first button 13.

[0055] Exemplarily, as Figure 1 shown, the first button 13 is a knob that can be twisted to both sides. When it is rotated to one side, the lifting mechanism 20 is controlled to rise, and when it is rotated to the other side, the lifting mechanism 20 is controlled to descend. The second button 14 is a button. After being pressed, the lifting mechanism 20 automatically executes lifting. For example, after pressing the second button 14, the lifting mechanism 20 is controlled to rise, and after a preset time period, the lifting mechanism 20 is automatically controlled to descend. The principle of automatic control in this embodiment will not be elaborated here.

[0056] In addition, in one embodiment, referring to Figure 1 and Figure 2 , the lifting mechanism 20 further includes,

[0057] a numerical control motor;

[0058] a transmission assembly 221, connected to the numerical control motor, and the numerical control motor is used to drive the transmission assembly 221 to lift;

[0059] a mounting plate 222, one side of the mounting plate 222 is fixedly connected to the transmission assembly 221, and the other side is provided with a pressure fixing assembly 223, and the pressure measuring device 211 is fixedly installed on the lower side of the pressure fixing assembly 223.

[0060] It should be noted that since the compressive strength test of the high-security chip 50 requires relatively precise stroke control, in this embodiment, the lifting is controlled by a numerical control motor to improve the controllability of the lifting control. For example, after starting the compressive test, the numerical control motor drives the cutting die 212 to descend at a relatively fast speed. When the sensing value of the pressure sensor is obtained, the numerical control motor automatically reduces the speed, so that the cutting die 212 gradually increases the extrusion force on the surface of the high-security chip 50, avoiding the high-security chip 50 from being quickly broken.

[0061] It should be noted that, as Figure 2 shown, the transmission assembly 221 of this embodiment can adopt longitudinally distributed transmission rods or transmission chains. The transmission assembly 221 is connected to the numerical control motor and can be lifted under the drive of the numerical control motor. The transmission assembly 221 is fixedly connected to the mounting plate 222. The mounting plate 222 is horizontally distributed, and a pressure fixing assembly 223 is provided at the other end. The pressure fixing assembly 223 can be Figure 2The combination of the fixed plate and the reinforcing rib shown can provide a parallel mounting surface, enabling the pressure measuring device 211 to be fixedly mounted on the lower side of the pressure fixing assembly 223 as shown in Figure 2 and the pressure measuring device 211 only needs to be kept vertically downward. The specific shape of the pressure fixing assembly 223 is not limited in this embodiment.

[0062] In addition, in one embodiment, as shown in Figure 1 and Figure 2 , the lifting mechanism 20 further includes

[0063] an upper limit switch 231, communicatively connected to the numerical control motor. The upper limit switch 231 can be triggered by the mounting plate 222 to generate an upper limit signal;

[0064] a lower limit switch 232, communicatively connected to the numerical control motor. The lower limit switch 232 can be triggered by the mounting plate 222 to generate a lower limit signal.

[0065] It should be noted that the upper limit switch 231 is used to trigger the upper limit signal. For example, in the above embodiment, after the automatic lifting signal is triggered by the second button 14, when the mounting plate 222 moves to the upper limit switch 231 to trigger the upper limit signal, the industrial control module stops rising after receiving the upper limit signal.

[0066] It should be noted that the lower limit switch 232 is used to trigger the lower limit signal. When the industrial control module obtains the lower limit signal, it stops the lifting mechanism 20 from descending, and limits the descending position of the lifting mechanism 20 through the lower limit signal to avoid damaging the mounting table.

[0067] It should be noted that other limit switches can also be set in the lifting mechanism 20. For example, Figure 2 as shown, a trigger switch 233 is provided between the upper limit switch 231 and the lower limit switch 232. For example, after the mounting plate 222 descends from the upper limit switch 231 to the trigger switch 233, the trigger switch 233 generates a trigger signal. The industrial control module can reduce the descending speed of the numerical control motor based on the trigger signal, or standby at the position of the trigger switch 233, etc. Those skilled in the art can increase or decrease the number of trigger switches 233 according to actual needs, and no more limitations are made here.

[0068] In addition, in one embodiment, referring to Figure 1 , Figure 3 and Figure 4 , the first mold 310 includes a first translation block 314 and a first carrier table 313. The first translation block 314 is movably mounted on the mounting table, the first carrier table 313 is fixedly mounted on the upper side of the first translation block 314, a first installation groove 318 is provided on the first carrier table 313, and a first micrometer 311 is used to drive the first translation block 314 to move;

[0069] The second mold 320 includes a second translation block 324 and a second carrier 323. The second translation block 324 is movably mounted on the mounting table. The second carrier 323 is fixedly mounted on the upper side of the second translation block 324. A second mounting groove 328 is provided in the second carrier 323. A second micrometer 321 is used to drive the second translation block 324 to move.

[0070] It should be noted that, as Figure 3 shown, the mounting table may include a first mounting seat 312 and a second mounting seat 322. The first translation block 314 is movably mounted on the first mounting seat 312, and the second translation block 324 is movably mounted on the second mounting seat 322. For example, slide rails are provided in the first mounting seat 312 and the second mounting seat 322. When the first micrometer 311 rotates, it drives the first translation block 314 to move. The first carrier 313 is fixedly mounted on the upper side of the first translation block 314 and thus moves following the movement of the first translation block 314. The second carrier 323 is the same, as long as it can move.

[0071] It should be noted that, as Figure 4 and Figure 5 shown, the first mounting groove 318 is located at the lower left corner of the first carrier 313, and the second mounting groove 328 is located at the lower right corner of the second carrier 323, ensuring that their openings are aligned so that the high-security chip 50 can be placed.

[0072] In addition, in one embodiment, referring to Figure 4 , it further includes:

[0073] A first fixing component, which includes a first fixing piece 315 and a first fixing shaft 317. The first fixing piece 315 is fixed to the mounting table. The first fixing piece 315 is provided with a first sliding groove 316. The first translation block 314 is located inside the first fixing piece 315. The first fixing shaft 317 passes through the first sliding groove 316 and abuts against the first translation block 314. The first fixing shaft 317 is used to lock the first translation block 314 to the first fixing piece 315;

[0074] A second fixing component, which includes a second fixing piece 325 and a second fixing shaft 327. The second fixing piece 325 is fixed to the mounting table. The second fixing piece 325 is provided with a second sliding groove 326. The second translation block 324 is located inside the second fixing piece 325. The second fixing shaft 327 passes through the second sliding groove 326 and abuts against the second translation block 324. The second fixing shaft 327 is used to lock the second translation block 324 to the second fixing piece 325.

[0075] It should be noted that the first translation block 314 and the second translation block 324 can be translated on the installation table. In this embodiment, the first fixing piece 315 can be installed in the first mounting seat 312, and the second fixing piece 325 can be installed in the second mounting seat 322. After the first translation block 314 completes the position adjustment, the first fixing shaft 317 passes through the first sliding groove 316 to press the first translation block 314. Since the first fixing piece 315 is fixed, the first translation block 314 will not move after being locked, realizing the fixation of the first translation block 314 and ensuring that the first installation groove 318 will not shift during the test. The same applies to the second translation block 324 and will not be repeated here.

[0076] It should be noted that in addition to fine-tuning through the micrometer, this embodiment can also achieve rough adjustment of the first translation block 314. For example, after loosening the first fixing shaft 317, the tester can manually move the position of the first translation block 314. After completing the rough position adjustment, fine-tuning can be performed through the first micrometer 311 to improve the flexibility of position adjustment. The same applies to the second translation block 324 and will not be repeated here.

[0077] It should be noted that the first fixing shaft 317 and the second fixing shaft 327 can be knobs. Taking the first fixing shaft 317 as an example, a screw hole is provided in the first translation block 314, and a bolt is provided inside the first fixing shaft 317. By rotating the first fixing shaft 317, the bolt is screwed into the screw hole to achieve fixation.

[0078] In addition, in one embodiment, referring to Figure 1 、 Figure 3 and Figure 5 , it further includes

[0079] A waste recycling box 40, which is movably installed on the upper side of the electric control box 10. The waste recycling box 40 is located below the first loading platform 313 and the second loading platform 323. An avoidance groove is provided on one side of the waste recycling box 40 close to the lifting mechanism, and the avoidance groove is aligned with the lower edges of the first mold 310 and the second mold 320.

[0080] It should be noted that the high-security chip 50 will be crushed during the compressive test. As Figure 5 shown, there is a certain gap between the first installation groove 318 and the second installation groove 328. After the high-security chip 50 is crushed, it will fall from this gap. In this embodiment, a waste recycling box 40 is provided below the first loading platform 313 and the second loading platform 323, which can recycle the high-security chips 50 crushed during the compressive test.

[0081] It should be noted that the waste recycling box 40 needs to be taken out regularly to clean the waste therein. Therefore, the waste recycling box 40 is an independent device that can be moved and taken out. In this embodiment, an avoidance groove is provided on the inner side of the waste recycling box 40 to avoid the lower edges of the first mold 310 and the second mold 320, so that the waste recycling box 40 can be pushed into the surface of the electric control box 10 from the front side, simplifying the taking and placing of the waste recycling box 40.

[0082] In addition, in one embodiment, referring to Figure 5 , the first installation groove 318 is an L-shaped groove with an opening facing the second mold 320, and the second installation groove 328 is an L-shaped groove with an opening facing the first mold 310; the bottom corners of the first installation groove 318 and the second installation groove 328 are obtuse arc surfaces, and the contact surface of the cutting die 212 is an arc surface.

[0083] It should be noted that, as Figure 5 shown, the first installation groove 318 and the second installation groove 328 are L-shaped grooves and the openings are opposite to each other, which is convenient for placing the high-security chip 50. At the same time, in this embodiment, the bottom corners of the first installation groove 318 and the second installation groove 328 are processed with R corners, so that the corners are obtuse arc surfaces, reducing the contact area with the high-security chip 50, and enabling the high-security chip 50 to better independently bear the downward pressure of the cutting die 212.

[0084] It should be noted that the contact surface of the cutting die 212 is also processed with an R corner to form an arc surface, so that the cutting die 212 can better contact the surface of the high-security chip 50 and improve the test effect of the security chip 50.

[0085] After considering the specification and practicing the disclosed embodiments here, those skilled in the art will readily think of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application.

[0086] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

[0087] The above is a specific description of the preferred embodiment of the present invention, but the present invention is not limited to the above embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included in the scope defined by the claims of the present invention.

Claims

1. An automated testing device for the compressive strength of a high-security chip, characterized in that, including an electric control box, which is provided with an industrial control module a lifting mechanism, installed on the upper side of the electric control box, the lifting mechanism is installed with a pressure measuring device, the pressure measuring device includes a pressure sensor and a tool die, the pressure sensor is connected to the tool die, and the lifting mechanism and the pressure sensor are electrically connected to the industrial control module a mounting table, installed on the upper side of the electric control box, located below the pressure measuring device, the upper side of the mounting table is provided with a first mold, a second mold, a first micrometer and a second micrometer, the first mold is located on the right side of the second mold, a first installation groove is provided on the side of the first mold close to the second mold, a second installation groove is provided on the side of the second mold close to the first mold, the first installation groove and the second installation groove are located below the tool die, the first installation groove and the second installation groove are used for installing high-security chips, the first micrometer is used to drive the first mold to approach or move away from the second mold, and the second micrometer is used to drive the second mold to approach or move away from the first mold 2. The automated compressive strength testing device for the high-security chip according to claim 1, characterized in that, further including a CCD vision module, including a CCD unit and a camera, the CCD unit is communicatively connected to the camera and the industrial control module respectively, the camera is used to capture the surface image of the high-security chip installed in the first installation groove and the second installation groove, and the CCD unit is used to detect the surface image 3. The automatic compressive strength testing device for high-security chips according to claim 2, wherein the electric control box further includes a first display screen and a second display screen, the first display screen is used to display the output signal of the CCD vision module, and the second display screen is used to display the sensing value of the pressure sensor 4. The automatic compressive strength testing device for high-security chips according to claim 1, wherein the electric control box is further provided with a first button and a second button, both the first button and the second button are electrically connected to the lifting mechanism, the first button is used to send a manual lifting signal to the lifting mechanism, and the second button is used to send an automatic lifting signal to the lifting mechanism 5. The automated compressive strength testing device for the high-security chip according to claim 4, characterized in that, The lifting mechanism further includes a numerical control motor a transmission component, connected to the numerical control motor, the numerical control motor is used to drive the transmission component to lift a mounting plate, one side of the mounting plate is fixedly connected to the transmission component, and the other side is provided with a pressure fixing assembly, and the pressure measuring device is fixedly installed below the pressure fixing assembly 6. The automated compressive strength testing device for the high-security chip according to claim 5, characterized in that, The lifting mechanism further includes an upper limit switch, communicatively connected to the numerical control motor, and the upper limit switch can be triggered by the mounting plate to send an upper limit signal a lower limit switch, communicatively connected to the numerical control motor, and the lower limit switch can be triggered by the mounting plate to send a lower limit signal 7. The automatic compressive strength testing device for high-security chips according to claim 1, wherein The first mold includes a first translation block and a first loading platform. The first translation block is movably installed on the installation table. The first loading platform is fixedly installed on the upper side of the first translation block. The first installation groove is arranged on the first loading platform. The first micrometer is used to drive the first translation block to move; The second mold includes a second translation block and a second loading platform. The second translation block is movably installed on the installation table. The second loading platform is fixedly installed on the upper side of the second translation block. The second installation groove is arranged on the second loading platform. The second micrometer is used to drive the second translation block to move.

8. The automated compressive strength testing device for a high-security chip according to claim 7, characterized in that, It further includes: A first fixing component, which includes a first fixing piece and a first fixing shaft. The first fixing piece is fixed on the installation table. The first fixing piece is provided with a first sliding groove. The first translation block is located inside the first fixing piece. The first fixing shaft passes through the first sliding groove and abuts against the first translation block. The first fixing shaft is used to lock the first translation block to the first fixing piece; A second fixing component, which includes a second fixing piece and a second fixing shaft. The second fixing piece is fixed on the installation table. The second fixing piece is provided with a second sliding groove. The second translation block is located inside the second fixing piece. The second fixing shaft passes through the second sliding groove and abuts against the second translation block. The second fixing shaft is used to lock the second translation block to the second fixing piece.

9. The automated compressive strength testing device for the high-security chip according to claim 7, characterized in that, It also includes, A waste recycling box, which is movably installed on the upper side of the electric control box. The waste recycling box is located under the first loading platform and the second loading platform. An avoidance groove is arranged on one side of the waste recycling box close to the lifting mechanism. The avoidance groove is aligned with the lower edges of the first mold and the second mold.

10. The automated compressive strength testing device for the high-security chip according to claim 1, characterized in that, The first installation groove is an L-shaped groove with an opening facing the second mold. The second installation groove is an L-shaped groove with an opening facing the first mold. The bottom corners of the first installation groove and the second installation groove are obtuse arc surfaces. The contact surface of the cutting die is an arc surface.

Images