Wafer transfer device
By designing a wafer transfer device, using the combination of abutment, mounting part, pallet and fixture, the problems of inconvenience and cleanliness of wafer transfer are solved, and stable and safe wafer transfer is achieved.
Patent Information
- Application Number
- CN202421659499.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-07-15
AI Technical Summary
The wafer is inconvenient to transport, especially during processing, which is prone to scratches and difficult to keep clean.
A wafer transfer device is designed, including a base, mounting part, pallet and fixture. The gripper and transfer of wafers in the pallet are realized through the traction mechanism and drive parts. The fixture is lifted and lowered in the traction groove to clamp the wafer to ensure stability and cleanliness.
The wafer is transported stably and safely, avoid scratches and keeps clean, and improves the transport efficiency.
Smart Images

Figure CN223066134U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of transfer devices, in particular to a wafer transfer device. Background Art
[0002] A wafer refers to a substrate (also called a base) for manufacturing semiconductor transistors or integrated circuits. Since it is a crystalline material and usually circular in shape, it is called a wafer. Various circuit element structures can be processed and fabricated on a wafer (such as a silicon wafer) to become an integrated circuit product with specific electrical functions.
[0003] With the continuous development of technology, various electronic products have developed rapidly, and the demand is constantly increasing, directly leading to an increase in the demand for wafers. Wafer processing equipment is a key device for performing processes such as coating, etching, and developing on wafers.
[0004] During the working process of wafer processing equipment, it is necessary to ensure the cleanliness of the wafer surface and prevent the wafer from being scratched. Manual transfer is quite inconvenient. Therefore, a dedicated device is needed to perform the transfer work of wafers. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a wafer transfer device to solve the problem of inconvenient wafer transfer in the prior art.
[0006] The technical solution of the utility model is: a wafer transfer device, including a base, an installation part is arranged on the base, a tray for installing a wafer is arranged on the installation part, a traction mechanism is arranged corresponding to the installation part, a clamp is arranged on the traction mechanism, and the clamp clamps the wafer in the tray under the drive of the traction mechanism;
[0007] Wherein, the traction mechanism includes a traction groove opened on the base and a traction member arranged in the traction groove; the traction member moves in a direction close to or away from the installation part along the traction groove under the drive of a driving member arranged inside the base.
[0008] Preferably, the installation part includes an installation frame fixed on one side of the base, the installation frame is set as a C-shaped structure, and notch openings are formed on both parallel inner walls, and the notch openings are used for accommodating the tray.
[0009] Preferably, a plurality of the notch openings are arranged in parallel in the vertical direction, and any notch opening has a diameter and height dimension corresponding to the tray.
[0010] Preferably, a carrying platform is arranged at the opening of the installation part, a pair of carrying platforms are arranged in parallel along the length direction of the traction groove, the top end of the carrying platform is flush with the bottom end of the notch opening at the bottom, and the top end of the carrying platform has a frosted structure to increase the friction with the tray carried thereon.
[0011] Preferably, the fixture has a clamping part and a connecting part, and the traction member passes through the connecting part of the fixture, so that the fixture can move up and down along the connecting part, and the relative position of the fixture and the traction member is fixed by a setscrew.
[0012] Preferably, the upper surface of the tray is provided with a mounting groove that is shaped to fit the wafer, and an outer edge of the tray is provided with a cut corner that penetrates the mounting groove. The clamping part of the fixture is provided with a clamping groove corresponding to the cut corner; when the cut corner abuts against the clamping part of the fixture, the clamping groove and the mounting groove form a circular structure.
[0013] Preferably, the fixture includes a first clamping member and a second clamping member. The connecting part is arranged on the first clamping member, and the second clamping member moves relative to the first clamping member in an opening and closing manner under the action of a guiding member.
[0014] Compared with the prior art, the advantages of the present utility model are as follows: This application is provided with a mounting part for storing wafers, a tray for carrying wafers, and a fixture for clamping wafers in cooperation with the tray. The fixture is arranged to move up and down on the traction member and can move horizontally under the action of a driving member arranged inside the base, which is convenient for clamping and transporting the wafers in the tray. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The present utility model will be further described below in conjunction with the drawings and embodiments:
[0016] Figure 1 Structural diagram of a wafer transfer device according to the present utility model;
[0017] Figure 2 Structural diagram of the mounting part according to the present utility model;
[0018] Figure 3 Structural diagram of the tray according to the present utility model;
[0019] Figure 4 Structural diagram of the fixture according to the present utility model;
[0020] Wherein: 1. Base, 2. Mounting part, 21. Mounting frame, 22. Notch, 23. Mounting table, 3. Tray, 31. Mounting groove, 32. Cut corner, 4. Traction mechanism, 41. Traction groove, 42. Traction member, 5. Fixture, 51. Clamping part, 52. Connecting part, 53. Guiding member, 54. Clamping groove, 55. First clamping member, 56. Second clamping member, 6. Setscrew. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] The content of the present utility model will be further described in detail below in conjunction with specific embodiments:
[0022] As Figure 1As shown in the figure, a wafer transfer device includes a base 1, an installation part 2 is arranged on the base 1, and a tray 3 for carrying wafers is arranged on the installation part 2. A traction mechanism 4 is arranged corresponding to the installation part 2, and a clamp 5 is arranged on the traction mechanism 4. The clamp 5 clamps the wafer in the tray 3 under the drive of the traction mechanism 4.
[0023] The traction mechanism 4 includes a driving part arranged inside the base 1. A traction groove 41 is formed on the base 1, and a traction part 42 is arranged in the traction groove 41. Two ends of the traction part 42 are respectively connected to the driving part and the clamp 5. The driving part drives the traction part 42 to drive the clamp 5 to move in a direction close to or away from the installation part 2 along the traction groove 41. In this embodiment, the driving part is composed of a lead screw and a servo motor.
[0024] As Figure 2 shown in the figure, the installation part 2 includes an installation frame 21 fixed to one side of the base 1. The installation frame 21 is set as a C-shaped structure and has a pair of parallel inner walls. Moreover, notch openings 22 are formed on the pair of parallel inner walls. The depth dimension and height dimension of the notch openings 22 correspond to those of the tray 3 and can be used to accommodate the tray 3.
[0025] In this embodiment, the notch openings 22 are arranged vertically in two numbers and can be used to accommodate two trays 3. A carrying platform 23 is further arranged at the opening of the installation frame 21. The carrying platform 23 is arranged in a pair parallel to the length direction of the traction groove 41. The top end of the carrying platform 23 is flush with the bottom end of the notch opening 22 at the bottom. The tray 3 taken out from the notch opening 22 can be directly placed on the carrying platform 23. In order to make the tray 3 more stable on the carrying platform 23, the upper surface of the carrying platform 23 is provided with a frosted structure to increase the friction with the tray 3.
[0026] As Figure 4 shown in the figure, the clamp 5 has a clamping part 51 and a connecting part 52. Among them, the connecting part 52 is set as a square through hole and is penetrated by the traction part 42. The clamp 5 can move up and down along the length direction of the traction part 42. A through top screw hole is further arranged on one side of the connecting part 52, and the relative position of the clamping part 51 and the traction part 42 is fixed by a matched top screw 6, so that the clamping part 51 and the tray 3 maintain the same height.
[0027] Specifically, the clamp 5 includes a first clamping piece 55 and a second clamping piece 56. The connecting part 52 is arranged on the first clamping piece 55. The second clamping piece 56 makes an opening and closing movement relative to the first clamping piece 55 under the action of a guiding part 53. The clamp 5 includes a first clamping piece 55 and a second clamping piece 56. The connecting part 52 is arranged on the first clamping piece 55. The second clamping piece 56 makes an opening and closing movement relative to the first clamping piece 55 under the action of a guiding part 53.
[0028] As Figure 3As shown in the figure, the upper surface of the tray 3 is provided with a mounting groove 31 that is shaped to conform to the wafer to be mounted. A chamfer 32 that penetrates the mounting groove 31 is provided on the outer edge surface of the tray 3, so that a flat surface is formed on the outer edge surface of the tray 3, which can abut against the clamping end of the fixture 5 and makes the wafer mounted thereon have a portion that is suspended for the fixture 5 to clamp. The clamping portion 51 of the fixture 5 is provided with a clamping groove 54 corresponding to the chamfer 32. When the clamping end of the fixture 5 abuts against the chamfer 32 of the tray 3, the clamping groove 54 and the mounting groove 31 can form a circular structure.
[0029] The above embodiments are only used to illustrate the technical concept and characteristics of the present invention. The purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention.
Claims
1. A wafer transfer device, characterized in that, It includes a base (1), on which an installation part (2) is provided. A tray (3) for installing a wafer is provided on the installation part (2). A traction mechanism (4) is provided corresponding to the installation part (2). A clamp (5) is provided on the traction mechanism (4). The clamp (5) clamps the wafer in the tray (3) under the drive of the traction mechanism (4). Among them, the traction mechanism (4) includes a traction groove (41) opened on the base (1) and a traction member (42) arranged in the traction groove (41). The traction member (42) moves in a direction close to or away from the installation part (2) along the traction groove (41) under the drive of a driving member arranged inside the base (1).
2. The wafer transfer device according to claim 1, wherein, The installation part (2) includes an installation frame (21) fixed to one side of the base (1). The installation frame (21) is arranged in a C-shaped structure, and notch openings (22) are opened on both parallel inner walls. The notch openings (22) are used to accommodate the tray (3).
3. A wafer transfer device according to claim 1, wherein, The notch openings (22) are arranged in multiple parallel vertical directions, and any notch opening (22) has a diameter and height dimension corresponding to the tray (3).
4. A wafer transfer device according to claim 1, wherein A loading platform (23) is provided at the opening of the installation part (2). The loading platform (23) is arranged in a pair parallel to the length direction of the traction groove (41). The top end of the loading platform (23) is flush with the bottom end of the notch opening (22) at the bottom, and the top end of the loading platform (23) has a frosted structure to increase the friction with the tray (3) carried thereon.
5. A wafer transfer device according to claim 1, characterized in that The clamp (5) has a clamping part (51) and a connecting part (52). The traction member (42) penetrates through the connecting part (52) of the clamp (5), so that the clamp (5) can move up and down along the connecting part (52), and the relative position of the clamp (5) and the traction member (42) is fixed by a setscrew (6).
6. A wafer transfer device according to claim 1, wherein The upper surface of the tray (3) is provided with a loading groove (31) in imitation of the wafer, and a chamfer (32) penetrating the loading groove (31) is provided at the outer edge of the tray (3). A clamping groove (54) is provided on the clamping part (51) of the clamp (5) corresponding to the chamfer (32). When the chamfer (32) abuts against the clamping part (51) of the clamp (5), the clamping groove (54) and the loading groove (31) form a circular structure.
7. A wafer transfer device according to claim 1, characterized in that, The clamp (5) includes a first clamping member (55) and a second clamping member (56). The connecting part (52) is arranged on the first clamping member (55). The second clamping member (56) moves relatively to the first clamping member (55) under the action of a guiding member (53).