Wafer deviation rectifying device and semiconductor equipment

Abstract

The utility model provides a wafer deviation rectifying device and semiconductor equipment. The wafer deviation rectifying device is provided with a supporting disc, a moving mechanism and at least three distance measuring sensors, the supporting disc is used for bearing a wafer; all the distance measuring sensors are distributed on the periphery of the supporting disc for a circle and are used for detecting the edge of a bearing wafer on the supporting disc; the supporting disc is installed on the moving mechanism, and the moving mechanism is used for controlling the supporting disc to move so as to rectify the deviation of the wafer on the supporting disc. Before the wafer is put into the cooling station, the distance measuring sensor is used for detecting the edge of the wafer, and the moving mechanism is used for controlling the supporting disc to move so as to quickly correct the deviation of the wafer on the supporting disc, so that the wafer can fall to the central position of the multilayer plate structure of the cooling station, and the wafer is prevented from being in contact with the edge of an upper plate of the cooling station; therefore, the damage to the wafer is reduced, and cross contamination is avoided, so that the yield of the wafer and the reliability of the subsequent process are improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, and particularly relates to a wafer alignment device and a semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing process, Chemical Vapor Deposition (CVD) technology is a key process, which is widely used in fields such as thin film growth and material modification. Most CVD machines are high-temperature process machines. After the CVD process is completed, the wafer needs to be quickly cooled after being transferred out of the high-temperature reaction chamber of the CVD machine to ensure that it will not be damaged due to high temperature during subsequent transmission and storage. Therefore, before the wafer enters the wafer cassette after being transferred out of the reaction chamber in the CVD machine, it also needs to pass through a cooling station to quickly cool the wafer, so that the wafer can be transferred to the wafer cassette more safely.

[0003] Existing cooling stations usually adopt a multi-layer board structure to place a relatively large number of wafers that need to be cooled after the CVD process at the same time. The structure of each layer of the board is the same and is a staircase structure. The lower layer is used for directly placing the wafers, and the upper layer is used as a protective structure to prevent the wafers from falling due to offset. However, this design has the following problems in practical applications:

[0004] First of all, due to factors such as the high-temperature environment inside the reaction chamber and mechanical vibration during wafer transmission, the wafer often has a certain position offset when being transferred out of the reaction chamber. Although this offset meets the specification requirements in most cases (such as the offset amount is less than 2.5 mm), in some extreme cases, it may cause the wafer to touch the edge of the upper layer board of the cooling station, resulting in damage to the edge (Bevel) and backside of the wafer. More seriously, due to the frequent contact between the wafer edge and the upper layer board edge, the upper layer board edge will gradually accumulate thin film residues from the wafer. Over time, the residues on the upper layer board edge will continue to increase, forming a thin film contamination layer.

[0005] Secondly, the damage to the wafer edge not only directly affects the quality of the wafer, but may also cause a chain reaction. The residual thin film material (such as Si / O / N, etc.) on the damaged wafer edge may be thrown onto the lower wafer in a centrifugal force manner during subsequent transmission, forming cross contamination. This contamination presents a specific arc pattern on the wafer surface, seriously affecting the yield of the wafer and the reliability of subsequent processes.

[0006] Therefore, there is an urgent need for a wafer alignment device and a semiconductor equipment to improve the above problems. Summary of the Utility Model

[0007] The purpose of the present utility model is to provide a wafer alignment device and a semiconductor device, which can quickly align the wafer and improve the yield of the wafer and the reliability of subsequent processes.

[0008] In a first aspect, the present utility model provides a wafer alignment device applied to a semiconductor device, including a support disk, a moving mechanism, and at least three distance measuring sensors;

[0009] The support disk is used for carrying the wafer;

[0010] All the distance measuring sensors are distributed in a circle around the support disk and are used for detecting the edge of the wafer carried on the support disk;

[0011] The support disk is installed on the moving mechanism, and the moving mechanism is used for controlling the movement of the support disk to align the wafer on the support disk.

[0012] The beneficial effects of the present utility model are as follows: By providing a support disk, a moving mechanism, and at least three distance measuring sensors; the support disk is used for carrying the wafer; all the distance measuring sensors are distributed in a circle around the support disk and are used for detecting the edge of the wafer carried on the support disk; the support disk is installed on the moving mechanism, and the moving mechanism is used for controlling the movement of the support disk to align the wafer on the support disk. Before the wafer is placed in the cooling station, the edge of the wafer is first detected by the distance measuring sensors, and the moving mechanism is used to control the movement of the support disk to quickly align the wafer on the support disk, ensuring that the wafer can fall to the center position of the multi-layer structure of the cooling station, avoiding contact between the edge of the wafer and the upper plate of the cooling station, not only reducing the damage of the wafer, but also avoiding cross-contamination, thereby improving the yield of the wafer and the reliability of subsequent processes.

[0013] Optionally, it further includes a telescopic rod adapted to each distance measuring sensor;

[0014] One end of the telescopic rod is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk, so that the distance measuring sensors fixed on the other end of the telescopic rod are distributed in a circle around the support disk;

[0015] The telescopic rod is used for adjusting the distance between the distance measuring sensor and the central area of the support disk to determine the edge of the wafer on the support disk. The beneficial effect is that the telescopic rod is used for transmission, which has a small volume, flexible adjustment and low cost. By using the telescopic rod adapted to each distance measuring sensor, the distance measuring sensors are distributed in a circle around the support disk, realizing that the distance measuring sensors can detect each edge of the wafer on the support disk during the movement, thereby improving the detection accuracy and facilitating the subsequent alignment by the moving mechanism.

[0016] Optionally, it further includes a slide rail adapted to each distance measuring sensor;

[0017] One end of the slide rail is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk;

[0018] The distance measuring sensor is slidably arranged on the slide rail;

[0019] The slide rail is used to adjust the distance between the distance measuring sensor and the central area of the support disk to determine the edge of the wafer on the support disk. Its beneficial effect is that the slide rail drive has good directivity and is convenient for improving the detection accuracy. By using the slide rail adapted to each distance measuring sensor, the distance measuring sensors are distributed in a circle around the support disk, realizing that the distance measuring sensors can detect each edge of the wafer on the support disk during the movement, thus improving the detection accuracy and facilitating the subsequent correction of the moving mechanism.

[0020] Optionally, it further includes a belt adapted to each distance measuring sensor;

[0021] One end of the belt is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk;

[0022] The distance measuring sensor is fixed on the belt;

[0023] The belt is used to adjust the distance between the distance measuring sensor and the central area of the support disk to determine the edge of the wafer on the support disk. Its beneficial effect is that the belt drive has high stability and is easy to maintain. By using the belt adapted to each distance measuring sensor, the distance measuring sensors are distributed in a circle around the support disk, realizing that the distance measuring sensors can detect each edge of the wafer on the support disk during the movement, thus improving the detection accuracy and facilitating the subsequent correction of the moving mechanism.

[0024] Optionally, the moving mechanism includes a first belt and a second belt arranged crosswise;

[0025] The support disk is fixed on the first belt through a support rod, and the first belt is fixed on the second belt;

[0026] The support rod drives the support disk to move forward or backward on the first belt;

[0027] The second belt moves the first belt, driving the support rod to move forward or backward on the second belt following the first belt;

[0028] The movement of the support disk is controlled by the cooperation of the first belt and the second belt to correct the deviation of the wafer on the support disk. The beneficial effect is that by using the cross - arranged first belt and second belt to cooperate to control the movement of the support disk, the stability of the wafer movement during deviation correction is ensured, thus improving the accuracy of deviation correction.

[0029] Optionally, the moving mechanism includes a first slide rail and a second slide rail arranged cross -wise;

[0030] The support disk is slidably arranged on the first slide rail through a support rod, and the first slide rail is slidably arranged on the second slide rail;

[0031] The support rod drives the support disk to slide forward or backward along the first slide rail;

[0032] The first slide rail drives the support rod to move forward or backward on the second slide rail by sliding along the second slide rail;

[0033] The movement of the support disk is controlled by the cooperation of the first slide rail and the second slide rail to correct the deviation of the wafer on the support disk. The beneficial effect is that by using the cross - arranged first slide rail and second slide rail to cooperate to control the movement of the support disk, the deviation of the wafer is corrected. During movement, the guiding property is good, which is beneficial to ensuring the accuracy of deviation correction.

[0034] Optionally, at least three struts or protrusions that are not on the same straight line are provided on the support disk;

[0035] The struts or protrusions are used to jointly carry the wafer. The beneficial effect is that by using the struts or protrusions to carry the wafer, the contact area between the support disk and the wafer can be reduced, avoiding damage to the wafer.

[0036] Optionally, the top of the strut or the top of the protrusion is sapphire. The beneficial effect is that by setting the top of the strut or the top of the protrusion as sapphire, the wafer can be better protected from being scratched.

[0037] Optionally, all the ranging sensors are evenly distributed in a circle around the support disk; and / or the ranging sensor is an ultrasonic distance sensor with a single transducer structure, which is used to simultaneously transmit and receive ultrasonic waves. The beneficial effect is that by evenly distributing all the ranging sensors in a circle around the support disk, the accuracy of wafer detection can be further improved and errors can be reduced. By using an ultrasonic distance sensor with a single transducer structure, the structure is simple, which is beneficial to reducing the volume of the entire wafer deviation correction device, thus meeting the wafer deviation correction requirements of different semiconductor devices and improving the space utilization rate of semiconductor devices.

[0038] In a second aspect, the present utility model further provides a semiconductor device, including the wafer alignment device of any possible combination in the above first aspect.

[0039] For the beneficial effects of the above second aspect, reference may be made to the description of the above first aspect. Description of the Drawings

[0040] Figure 1 FIG. is a schematic structural diagram of a wafer alignment device provided by an embodiment of the present utility model;

[0041] Figure 2 FIG. is a schematic diagram of the principle of a distance measuring sensor detecting the edge of a wafer provided by an embodiment of the present utility model;

[0042] Figure 3 FIG. is a schematic diagram of the principle of wafer alignment provided by an embodiment of the present utility model;

[0043] Figure 4 FIG. is a schematic structural diagram of another wafer alignment device provided by an embodiment of the present utility model;

[0044] Figure 5 FIG. is a schematic structural diagram of yet another wafer alignment device provided by an embodiment of the present utility model.

[0045] Description of the Reference Numerals:

[0046] 1, support disk; 2, moving mechanism; 3, distance measuring sensor; 4, telescopic rod; 5, wafer; 6, support rod; 7, pillar; 8, sapphire; 9, protrusion;

[0047] 21, first belt; 22, second belt. Detailed Embodiments

[0048] To make the objectives, technical solutions, and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present utility model pertains. The technical solutions in the embodiments of the present utility model will be described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Among them, in the description of the embodiments of the present utility model, the terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. As used in the specification and claims of the present utility model, the singular forms "a", "the", "above-mentioned", "this", and "such" are also intended to include, for example, the expression form of "one or more", unless clearly indicated to the contrary in the context. It should also be understood that in the following embodiments of the present utility model, "at least one" and "one or more" mean one or more than two (including two). The term "and / or" is used to describe the association relationship of associated objects and means that three relationships can exist; for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship.

[0049] Reference to "an embodiment" or "some embodiments" described in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present utility model. Thus, the phrases "in an embodiment", "in some embodiments", "in other some embodiments", and "in still other embodiments" that appear in different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprise", "include", "have", and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way. The term "connection" includes direct connection and indirect connection, unless otherwise stated. "First" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0050] In the embodiments of the present utility model, "exemplarily" or "for example" is used to give examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in the embodiments of the present utility model should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0051] Regarding the problems existing in the prior art, such as Figure 1 As shown, the present utility model provides a wafer alignment device, which is applied to semiconductor equipment (for example, the wafer alignment device is arranged between a CVD machine and a cooling station). The wafer alignment device includes a support plate 1, a moving mechanism 2 and three distance sensors 3 (the number of the distance sensors 3 can be adjusted according to actual needs); the support plate 1 is used for carrying a wafer 5; all the distance sensors 3 are distributed in a circle around the support plate 1 and are used to detect the edge of the wafer 5 carried on the support plate 1; the support plate 1 is installed on the moving mechanism 2, and the moving mechanism 2 is used to control the movement of the support plate 1 to align the wafer 5 on the support plate 1. The working principle of the present utility model is as follows: When in use, when the wafer 5 that has completed the CVD process is taken out from the high-temperature reaction chamber of the CVD machine, first place the wafer 5 to be cooled on the support plate 1, and the three distance sensors 3 detect the three edges of the wafer 5, so as to obtain the center point coordinates of the wafer 5. If the difference between the center point coordinates of the wafer 5 and the origin coordinates of the wafer alignment device exceeds the threshold range, the moving mechanism 2 is used to control the movement of the support plate 1 to align the wafer 5 on the support plate 1, ensuring that the aligned wafer 5 can fall to the center position of the multi-layer plate structure of the cooling station, avoiding the contact between the edge of the wafer 5 and the upper plate of the multi-layer plate of the cooling station, not only reducing the damage of the wafer 5, but also avoiding cross-contamination, thereby improving the yield of the wafer 5 and the reliability of the subsequent process. The cooled wafer 5 enters the wafer cassette from the multi-layer plate structure and enters the subsequent processing process. It should be noted that the support rod 6 can be lifted and lowered and is used to lower after alignment so that the wafer 5 can fall onto the multi-layer plate structure of the cooling station.

[0052] In order to meet the usage requirements of different application scenarios, a telescopic rod 4, a slide rail or a belt can be used to control the movement of the distance sensor 3, and the positions of the telescopic rod 4, the slide rail or the belt can be adjusted according to actual needs, that is, they can be arranged above the support plate 1 or below the support plate 1:

[0053] In some embodiments, in order to reduce the volume of the wafer alignment device, achieve flexible adjustment while reducing costs, such as Figure 1As shown, the wafer alignment device further includes a telescopic rod 4 adapted to each distance measuring sensor 3; one end of the telescopic rod 4 is fixed (such as by welding or integrally molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) in the central area of the support disk 1, and the other end is arranged away from the central area of the support disk 1, so that the distance measuring sensors 3 fixed (such as by welding or integrally molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) on the other end of the telescopic rod 4 are distributed in a circle around the support disk 1; the telescopic rod 4 is used to adjust the distance between the distance measuring sensor 3 and the central area of the support disk 1 to determine the edge of the wafer 5 on the support disk 1. By using the telescopic rod 4 adapted to each distance measuring sensor 3, the distance measuring sensors 3 are distributed in a circle around the support disk 1, realizing that the distance measuring sensors 3 can detect each edge of the wafer 5 on the support disk 1 during the movement process, thereby improving the detection accuracy and facilitating the subsequent alignment of the moving mechanism 2.

[0054] In some other embodiments, in order to make the movement of the distance measuring sensor 3 have better directivity and improve the detection accuracy, Figure 1 the shown telescopic rod 4 is replaced with a slide rail. The wafer alignment device further includes a slide rail (not shown) adapted to each distance measuring sensor 3; one end of the slide rail is fixed (such as by welding or integrally molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) in the central area of the support disk 1, and the other end is arranged away from the central area of the support disk 1; the distance measuring sensor 3 is slidably arranged on the slide rail; the slide rail is used to adjust the distance between the distance measuring sensor 3 and the central area of the support disk 1 to determine the edge of the wafer 5 on the support disk 1. By using the slide rail adapted to each distance measuring sensor 3, the distance measuring sensors 3 are distributed in a circle around the support disk 1, realizing that the distance measuring sensors 3 can detect each edge of the wafer 5 on the support disk 1 during the movement process, thereby improving the detection accuracy and facilitating the subsequent alignment of the moving mechanism 2.

[0055] In still some other embodiments, in order to improve the stability of the movement of the distance measuring sensor 3 and facilitate later maintenance, Figure 1The telescopic rod 4 shown is replaced with a belt, and the wafer alignment device further includes a belt (not shown) adapted to each distance measuring sensor 3; one end of the belt is fixed (such as by welding or integral molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) in the central area of the support disk 1, and the other end is arranged away from the central area of the support disk 1; the distance measuring sensor 3 is fixed (such as by welding or integral molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) on the belt; the belt is used to adjust the distance between the distance measuring sensor 3 and the central area of the support disk 1 to determine the edge of the wafer 5 on the support disk 1. By using the belt adapted to each distance measuring sensor 3, the distance measuring sensors 3 are distributed in a circle around the support disk 1, so that the distance measuring sensors 3 can detect each edge of the wafer 5 on the support disk 1 during the movement process, thereby improving the detection accuracy and facilitating the subsequent movement mechanism 2 to perform alignment.

[0056] In order to meet the usage requirements of different application scenarios, a movement mechanism 2 composed of a slide rail or a belt can be used to align the wafer 5:

[0057] In some embodiments, in order to ensure the stability of the movement of the wafer 5 during alignment and improve the alignment accuracy, such as Figure 1 shown, the movement mechanism 2 includes a first belt 21 and a second belt 22 arranged crosswise; the support disk 1 is fixed (such as by welding or integral molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) on the first belt 21, and the first belt 21 is fixed (such as by welding or integral molding and other fixed connection methods, or by threading, clamping and other detachable connection methods) on the second belt 22; the support rod 6 drives the support disk 1 to move forward or backward on the first belt 21; the second belt 22 moves the first belt 21, driving the support rod 6 to follow the first belt 21 to move forward or backward on the second belt 22; the movement of the support disk 1 is controlled by the cooperation of the first belt 21 and the second belt 22 to align the wafer 5 on the support disk 1.

[0058] In other embodiments, in order to enable the wafer 5 to have better guiding during alignment and ensure the alignment accuracy, Figure 1The first belt 21 and the second belt 22 arranged in a crosswise manner shown are replaced with a first slide rail and a second slide rail arranged in a crosswise manner. The moving mechanism 2 includes a first slide rail (not shown) and a second slide rail (not shown) arranged in a crosswise manner. The support disk 1 is slidably arranged on the first slide rail through a support rod 6, and the first slide rail is slidably arranged on the second slide rail. The support rod 6 drives the support disk 1 to slide forward or backward along the first slide rail. The first slide rail drives the support rod 6 to move forward or backward on the second slide rail by sliding along the second slide rail. The movement of the support disk 1 is controlled by the cooperation of the first slide rail and the second slide rail to correct the deviation of the wafer 5 on the support disk 1. It should be noted that in some specific embodiments, such as Figure 1 shown, the moving mechanism 2 further includes a chassis (not marked), and the first belt 21 and the second belt 22 or the first slide rail and the second slide rail are installed on the chassis, and the second belt 22 or the second slide rail is fixed on the upper surface of the chassis.

[0059] In some embodiments, in order to reduce the contact area between the support disk 1 and the wafer 5 and avoid damaging the wafer 5, such as Figure 4 and Figure 5 shown, at least three struts 7 or protrusions 9 that are not on the same straight line are provided on the support disk 1. The struts 7 or protrusions 9 are used to jointly carry the wafer 5. It should be noted that the struts 7 can be lifted or the support rod 6 can be lifted, and after the deviation is corrected, it descends so that the wafer 5 falls onto the multi-layer board structure of the cooling station. When the top of the support disk 1 is a protrusion 9, the support rod 6 can be lifted.

[0060] In some specific embodiments, in order to better protect the wafer 5 and avoid scratching the wafer 5, such as Figure 4 and Figure 5 shown, the top of the strut 7 or the top of the protrusion 9 is sapphire 8.

[0061] In some embodiments, in order to further improve the accuracy of wafer 5 detection, reduce errors, and reduce the volume of the entire wafer deviation correction device, meet the wafer 5 deviation correction requirements of different semiconductor devices, and improve the space utilization rate of semiconductor devices, such as Figure 1 and shown, all the ranging sensors 3 are evenly distributed in a circle around the support disk 1; and / or, such as Figure 2 shown, the ranging sensor 3 is an ultrasonic distance sensor using a single transducer structure, which is used to simultaneously transmit and receive ultrasonic waves.

[0062] Based on the above wafer deviation correction device, such as Figure 1As shown in the figure, the present utility model also provides a semiconductor device, which includes a wafer alignment device disposed between a CVD machine platform and a cooling station. During use, when the wafer 5 is transferred from the reaction chamber of the CVD machine platform to the cooling station, it will be lifted by the support column 7 with a sapphire 8 design at the top. Then, the telescopic rod 4 moves from the center point of the support disk 1 to the outside (or from the outside to the center point of the support disk 1), and the distance of the wafer 5 is continuously detected by the ranging sensor 3 of the single transducer. As Figure 2 shown; when the ranging sensor 3 detects a sudden change in distance, it is the outermost edge point of the wafer 5, that is, the outermost coordinate point of the wafer 5 in this direction is determined. The center point of the wafer alignment device is the coordinate origin (0, 0), and the three moving rods respectively detect the outermost coordinate points of the wafer 5 in three directions to determine the actual center position (X, Y), as Figure 3 shown; the moving mechanism 2 drives the entire support disk 1 and the wafer 5 to move through the support rod 6, so that the overall structure moves from (X, Y) to (0, 0). Subsequently, the support column 7 or the support rod 6 of the wafer 5 descends, so that the wafer 5 falls to the center position of the multi-layer board structure of the cooling station; this structural design can quickly complete the calibration of the wafer 5, and the entire process can be completed within 0.6 s, realizing the rapid alignment of the wafer 5, ensuring that the wafer 5 can fall to the center position of the multi-layer board structure of the cooling station, avoiding the edge contact between the wafer 5 and the upper board of the cooling station, not only reducing the damage of the wafer 5, but also avoiding cross-contamination, thereby improving the yield of the wafer 5 and the reliability of the subsequent process.

[0063] Although the embodiments of the present utility model have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present utility model described in the claims. Moreover, the present utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer alignment device is applied to semiconductor equipment, and is characterized in that, It includes a support disk, a moving mechanism and at least three distance sensors; The support disk is used to carry the wafer; All the distance sensors are distributed in a circle around the support disk and are used to detect the edge of the wafer carried on the support disk; The support disk is mounted on the moving mechanism, and the moving mechanism is used to control the movement of the support disk to correct the deviation of the wafer on the support disk.

2. The device according to claim 1, wherein It also includes a telescopic rod adapted to each distance sensor; One end of the telescopic rod is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk, so that the distance sensors fixed on the other end of the telescopic rod are distributed in a circle around the support disk; The telescopic rod is used to adjust the distance between the distance sensor and the central area of the support disk to determine the edge of the wafer on the support disk.

3. The device according to claim 1, wherein It also includes a slide rail adapted to each distance sensor; One end of the slide rail is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk; The distance sensor is slidably arranged on the slide rail; The slide rail is used to adjust the distance between the distance sensor and the central area of the support disk to determine the edge of the wafer on the support disk.

4. The device according to claim 1, characterized in that, It also includes a belt adapted to each distance sensor; One end of the belt is fixed in the central area of the support disk, and the other end is arranged away from the central area of the support disk; The distance sensor is fixed on the belt; The belt is used to adjust the distance between the distance sensor and the central area of the support disk to determine the edge of the wafer on the support disk.

5. The device according to claim 1, characterized in that The moving mechanism includes a first belt and a second belt arranged crosswise; The support disk is fixed on the first belt through a support rod, and the first belt is fixed on the second belt; The support rod drives the support disk to move forward or backward on the first belt; The second belt moves the first belt, driving the support rod to move forward or backward on the second belt following the first belt; The movement of the support disk is controlled by the cooperation of the first belt and the second belt to correct the deviation of the wafer on the support disk.

6. The device according to claim 1, characterized in that The moving mechanism includes a first slide rail and a second slide rail arranged crosswise; The support disk is slidably arranged on the first slide rail through a support rod, and the first slide rail is slidably arranged on the second slide rail; The support rod drives the support disk to slide forward or backward along the first slide rail; The first slide rail drives the support rod to move forward or backward on the second slide rail following the first slide rail by sliding along the second slide rail; The movement of the support disk is controlled by the cooperation of the first slide rail and the second slide rail to correct the deviation of the wafer on the support disk.

7. The device according to claim 1, characterized in that, There are at least three struts or protrusions on the support disk that are not on the same straight line; The struts or protrusions are used to jointly carry the wafer.

8. The device according to claim 7, characterized in that, The top of the strut or the top of the protrusion is sapphire.

9. The device according to any one of claims 1-8, characterized in that, All the distance sensors are evenly distributed in a circle around the support disk; and / or the distance sensor is an ultrasonic distance sensor with a single transducer structure for simultaneously transmitting and receiving ultrasonic waves.

10. A semiconductor device, characterized in that, Comprising the wafer alignment device according to any one of claims 1 to 9.

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