Radio frequency power device

Abstract

The utility model provides a radio frequency power device which comprises a first tube shell heat sink, the first tube shell heat sink is provided with an insulated second tube shell heat sink, one end of the second tube shell heat sink, which is far away from the first tube shell heat sink, is provided with a plurality of conductive substrates which are arranged in a crossed manner, and the conductive substrates which are arranged in the crossed manner are encircled to form a mounting area. The bottom of the mounting area is connected with the second tube shell heat sink, a radio frequency power chip is mounted on the surface of the top of the mounting area, the radio frequency power chip is electrically connected with the mounting area through a heat-conducting fin, and one end, far away from the heat-conducting fin, of the radio frequency power chip is electrically connected with the conductive substrate through a gold wire. The radio frequency power device provided by the utility model is low in packaging cost and good in heat dissipation performance.

Description

Technical Field

[0001] The utility model belongs to the technical field of power device preparation, and particularly relates to a radio frequency power device. Background Art

[0002] Most of the existing power device packages adopt a package structure in which a lead frame is encapsulated by epoxy resin to realize electrical interconnection between a chip and a substrate. The main package structure includes setting conductive silver paste on the first surface of the substrate of the lead frame by means of scribing glue, then mounting the chip on the surface of the silver paste by means of chip mounting, and finally encapsulating the device by means of epoxy resin encapsulation process to realize the electrical conduction of the radio frequency power chip and the working requirements of the power supply.

[0003] The traditional packaging process is applicable to low radio frequency power chips with small heat generation. With the development of 5G and power electronics, the heat dissipation requirements of industrial equipment for power devices during use are getting higher and higher. The heat dissipation of the traditional lead frame packaging process can no longer meet the heat dissipation requirements of high-power devices in the radio frequency energy industry. Summary of the Utility Model

[0004] Based on this, the purpose of the utility model is to provide a radio frequency power device to solve the problems existing in the prior art.

[0005] The utility model provides a radio frequency power device, which includes a first tube shell heat sink. An insulating second tube shell heat sink is arranged on the first tube shell heat sink. A plurality of cross-arranged conductive substrates are arranged at one end of the second tube shell heat sink far away from the first tube shell heat sink. A mounting area is formed by surrounding between the cross-arranged conductive substrates. The bottom of the mounting area is connected with the second tube shell heat sink. A radio frequency power chip is mounted on the top surface of the mounting area. The radio frequency power chip is electrically connected with the mounting area through a heat conducting sheet. One end of the radio frequency power chip far away from the heat conducting sheet is electrically connected with the conductive substrate through a gold wire.

[0006] The beneficial effects of the present utility model are as follows: The radio frequency power device provided by the present utility model includes a first package heat sink. An insulating second package heat sink is provided on the first package heat sink. At one end of the second package heat sink away from the first package heat sink, a number of cross-arranged conductive substrates are provided. The cross-arranged conductive substrates enclose a mounting area. The radio frequency power chip is arranged in the enclosed mounting area. At the bottom of the mounting area, the second package heat sink and the first package heat sink are arranged in sequence, and heat absorption and cooling are carried out through the package heat sink. The radio frequency power chip is arranged in the mounting area. The radio frequency power chip is electrically connected to the mounting area through a heat conducting sheet. The heat conducting sheet can timely conduct the heat generated by the radio frequency power chip to the package heat sink for heat dissipation. One end of the radio frequency power chip away from the heat conducting sheet is electrically connected to the conductive substrate through a gold wire to achieve interconnection and conduction. The radio frequency power device provided by this application improves the heat dissipation of the radio frequency power chip during operation and is suitable for wide promotion.

[0007] Preferably, a number of fixing holes are provided on the first package heat sink, and the radio frequency power device is fixedly connected to the machine platform through the fixing holes.

[0008] Preferably, at one end of the second package heat sink away from the first package heat sink, four cross-arranged conductive substrates are provided, and a marking area is provided on one of the conductive substrates.

[0009] Preferably, the mounting area includes a first mounting area and a second mounting area. The size of the first mounting area is larger than that of the second mounting area. The radio frequency power chip is mounted on the first mounting area, and the radio frequency resistor is mounted on the second mounting area.

[0010] Preferably, the size of the radio frequency power chip is 3mm*5mm - 5mm*6mm, and the size of the radio frequency resistor is 1mm*1mm - 2mm*2mm.

[0011] Preferably, a groove is provided between the first mounting area and the second mounting area, and a part of the second package heat sink is filled into the groove.

[0012] Preferably, a heat conducting enclosure is provided around the side of the radio frequency power chip.

[0013] Preferably, a plastic sealing glue is provided above the mounting area. A protective cover is fixedly provided outside the plastic sealing glue. The plastic sealing glue is used to encapsulate the radio frequency power chip and the gold wire, and the protective cover is used to provide protection for the encapsulated radio frequency power chip and the gold wire.

[0014] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present utility model. Description of the Drawings

[0015] Figure 1 Schematic diagram of the structure of the radio frequency power device provided in the first embodiment;

[0016] Figure 2 For Figure 1 Schematic diagram of the internal cross-sectional structure of the radio frequency power device in

[0017] Figure 3 For Figure 1 Schematic diagram of the structure when the plastic encapsulation glue is not coated;

[0018] Figure 4 For Figure 1 Schematic diagram of the arrangement of the conductive substrate in

[0019] Figure 5 Schematic diagram of the structure of the radio frequency power device provided in the second embodiment;

[0020] Figure 6 For Figure 5 Schematic diagram of the internal cross-sectional structure of the radio frequency power device in

[0021] Description of the main component symbols:

[0022] 10. First tube shell heat sink; 11. Fixing hole; 20. Second tube shell heat sink; 30. Conductive substrate; 31. Identification area; 40. Mounting area; 41. First mounting area; 42. Second mounting area; 50. Radio frequency power chip; 51. Radio frequency resistor; 60. Heat conducting sheet; 70. Gold wire; 80. Plastic encapsulation glue; 81. Protection cover; 90. Heat conducting enclosure.

[0023] The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings. Specific embodiments

[0024] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this utility model belongs. The terms used in the description of the present utility model herein are for the purpose of describing specific embodiments only and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0027] Embodiment 1

[0028] As Figures 1 to 4 shown, a radio frequency power device provided in this embodiment includes a first package heat sink 10. An insulating second package heat sink 20 is provided on the first package heat sink 10. A plurality of cross-arranged conductive substrates 30 are provided at one end of the second package heat sink 20 away from the first package heat sink. The cross-arranged conductive substrates 30 enclose a mounting area 40. The bottom of the mounting area 40 is connected to the second package heat sink 20. A radio frequency power chip 50 is mounted on the top surface of the mounting area 40. The radio frequency power chip 50 is electrically connected to the mounting area 40 through a heat conducting sheet 60. One end of the radio frequency power chip 50 away from the heat conducting sheet 60 is electrically connected to the conductive substrate 30 through a gold wire 70.

[0029] Optionally, in the embodiment, the first package heat sink 10 provides support for the radio frequency power device and has a heat dissipation function. The second package heat sink 20 is made of an insulating material with high thermal conductivity. Optionally, the second package heat sink 20 can be Al2O3 ceramic or BeO ceramic and other materials; the conductive substrate 30 can be made of copper or aluminum with high thermal and electrical conductivity. Preferably, the second package heat sink 20 and the conductive substrate 30 can be integrally formed by a sintering process; a conductive plating layer, such as a gold layer or a silver layer, is provided on the surface of the conductive substrate 30 to improve the electrical conductivity; the conductive substrates 30 enclose a mounting area 40 in the middle. Optionally, the mounting area 40 is a concave area. A plurality of radio frequency power chips 50 are arranged in the mounting area. The radio frequency power chips 50 can be made of Si, SiC or GaN materials. A heat conducting sheet 60 is provided at the bottom of the radio frequency power chip 50. The heat conducting sheet 60 has high thermal conductivity and can effectively conduct the heat generated during the operation of the radio frequency power chip 50 to the second package heat sink 20 for heat dissipation; optionally, the heat conducting sheet 60 can be a gold-tin solder sheet, which is melted by an automated eutectic device at high temperature and eutectic to the surface of the mounting area. The radio frequency power chip 50 is mounted on the surface of the heat conducting sheet 60 through an automated eutectic device; the gold wire on the radio frequency power chip 50 is electrically connected to the conductive substrate through a bonding process to achieve interconnection and conduction; the conductive substrate 30 is electrically connected to an external power supply device.

[0030] Optionally, as Figure 1As shown, the first package heat sink 10 is provided with fixing holes 11, and the RF power device is fixed to the machine table through the fixing holes 11; optionally, in this embodiment, there are two fixing holes 11 and they are on the same straight line.

[0031] Optionally, at one end of the second package heat sink away from the first package heat sink, there are four cross-arranged conductive substrates, and the four conductive substrates are arranged at equal intervals, as Figure 3 shown, the four conductive substrates are arranged at 90° intervals; on one of the conductive substrates, there is an identification area 31 for distinguishing directions.

[0032] As Figure 4 shown, the mounting area 40 includes a first mounting area 41 and a second mounting area 42. The size of the first mounting area 41 is larger than that of the second mounting area 42. An RF power chip 50 is mounted on the first mounting area 41, and an RF resistor 51 is mounted on the second mounting area; the size of the RF power chip 50 is larger than that of the RF resistor 51, and the RF resistor 51 can provide functions such as shunting, voltage division, and current limiting for the RF power device. In this embodiment, two RF power chips 50 are respectively mounted on the first mounting areas 41 on both sides, and two RF resistors 51 are mounted front and back on the second mounting area 42; optionally, the size of the RF power chip is 3mm*5mm - 5mm*6mm, and the size of the RF resistor is 1mm*1mm - 2mm*2mm; in this embodiment, the size of the RF power chip is 5mm*5mm, and the size of the RF resistor is 1mm*1mm; further, as Figure 4 shown, a gap is reserved between the first mounting area 41 and the second mounting area 42 to form a groove, and a part of the second package heat sink 20 is filled into the groove.

[0033] Optionally, as Figure 2 shown, there is a potting compound 80 above the mounting area. The potting compound 80 can be coated on the mounting area through a dispensing or spraying process. The potting compound 80 can be silicone or epoxy resin glue, which is used to encapsulate the RF power chip 50 and the gold wire 70 to provide protection for the RF power chip 50 and the gold wire 70. Further, a protective cover 81 is fixedly provided outside the potting compound 80, and the protective cover 81 can be adhered to the device surface through glue; through the potting compound 80 and the protective cover 81, while effectively protecting the RF power chip, the usage amount of the encapsulation glue is reduced, and the encapsulation cost is reduced.

[0034] In summary, the radio frequency power device provided by the present utility model includes a first housing heat sink 10. An insulating second housing heat sink 20 is provided on the first housing heat sink 10. At one end of the second housing heat sink 20 away from the first housing heat sink, a number of cross-arranged conductive substrates 30 are provided. The cross-arranged conductive substrates 30 enclose a mounting area 40. The radio frequency power chip 50 is arranged in the enclosed mounting area 40. At the bottom of the mounting area 40, the second housing heat sink 20 and the first housing heat sink 10 are arranged in sequence to absorb heat and cool down through the two housing heat sinks. The radio frequency power chip 50 is arranged in the mounting area 40. The radio frequency power chip 50 is electrically connected to the mounting area 40 through a heat conducting sheet 60. The heat conducting sheet 60 can timely conduct the heat generated by the radio frequency power chip to the second housing heat sink for heat dissipation. One end of the radio frequency power chip 50 away from the heat conducting sheet 60 is electrically connected to the conductive substrate 30 through a gold wire 70 to achieve interconnection and conduction. The radio frequency power device provided by this application improves the heat dissipation of the radio frequency power chip during operation and is suitable for wide promotion.

[0035] Embodiment 2

[0036] This embodiment also provides a radio frequency power device. The difference between the radio frequency power device in this embodiment and that in Embodiment 1 is as follows:

[0037] As Figure 5 and Figure 6 shown, in this embodiment, a heat conducting enclosure 90 is provided around the side of the radio frequency power chip 50. The heat conducting enclosure 90 can adopt a graphene film with a high heat conductivity to improve the heat dissipation efficiency of the radio frequency power chip 50.

[0038] It should be noted that the above implementation process is only to illustrate the feasibility of this application, but this does not mean that the radio frequency power device of this application only has the above implementation process. On the contrary, as long as the radio frequency power device of this application can be implemented, it can be included in the feasible implementation solutions of this application.

[0039] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0040] The above embodiments only represent several implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. A radio frequency power device, characterized in that, It includes a first package heat sink, on which an insulated second package heat sink is provided. At one end of the second package heat sink away from the first package heat sink, there are several cross-arranged conductive substrates. A mounting area is formed by enclosing between the cross-arranged conductive substrates. The bottom of the mounting area is connected to the second package heat sink. A radio frequency power chip is mounted on the top surface of the mounting area. The radio frequency power chip is electrically connected to the mounting area through a heat conducting sheet. One end of the radio frequency power chip away from the heat conducting sheet is electrically connected to the conductive substrate through a gold wire.

2. The radio frequency power device according to claim 1, wherein Several fixing holes are provided on the first package heat sink. The radio frequency power device is fixedly connected to the machine table through the fixing holes.

3. The radio frequency power device according to claim 1, characterized in that, At one end of the second package heat sink away from the first package heat sink, there are four cross-arranged conductive substrates, and an identification area is provided on one of the conductive substrates.

4. The radio frequency power device according to claim 3, characterized in that The mounting area includes a first mounting area and a second mounting area. The size of the first mounting area is larger than that of the second mounting area. A radio frequency power chip is mounted on the first mounting area, and a radio frequency resistor is mounted on the second mounting area.

5. The radio frequency power device according to claim 4, wherein The size of the radio frequency power chip is 3mm*5mm - 5mm*6mm, and the size of the radio frequency resistor is 1mm*1mm - 2mm*2mm.

6. The radio frequency power device according to claim 4, wherein A groove is provided between the first mounting area and the second mounting area, and a part of the second package heat sink is filled into the groove.

7. The radio frequency power device according to claim 1, wherein A heat conducting enclosure is provided around the side of the radio frequency power chip.

8. The radio frequency power device according to claim 1, wherein A plastic encapsulant is provided above the mounting area. A protective cover is fixedly provided on the outside of the plastic encapsulant. The plastic encapsulant is used to encapsulate the radio frequency power chip and the gold wire, and the protective cover is used to provide protection for the encapsulated radio frequency power chip and the gold wire.

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