IGBT DBC substrate solder paste printing carrier

Abstract

The utility model relates to an IGBT (Insulated Gate Bipolar Translator) DBC (Direct Bonding Copper) substrate solder paste printing carrier, which belongs to the technical field of power electronics and comprises a main body plate, a plurality of A-surface printing carriers and a plurality of B-surface printing carriers, an element safety area is arranged in the middle of the main body plate, the A-side printing carrier and the B-side printing carrier are open grooves in the main body plate and are arranged on the two sides of the element safety area respectively, the A-side printing carrier is used for pasting a chip, and the B-side printing carrier is used for brushing flux paste. A surface A and a surface B of a DBC substrate can be printed at the same time, the surface A printing carrier is used for pasting a chip, the surface B printing carrier is used for brushing flux paste, an element safety area is arranged, and it is guaranteed that the surface A and the surface B can be printed respectively; the production efficiency is improved, the utilization rate of the printing machine and the carrier is improved, one carrier can be used simultaneously when the A face and the B face are produced, and the time for replacing the carrier is saved.

Description

Technical Field

[0001] The utility model belongs to the technical field of power electronics, and particularly relates to a solder paste printing carrier for an IGBT DBC substrate. Background Art

[0002] The IGBT DBC substrate has excellent thermal cycling performance, stable shape, good rigidity, high thermal conductivity, high reliability, and the copper-clad surface can be etched into various patterns. Moreover, it is a green product without pollution. The conventional solder paste printing carrier for the IGBT DBC substrate can only print one set of products each time. When producing the other side, the carrier needs to be replaced, resulting in low production efficiency and low utilization rate of the existing performance of the equipment and the carrier.

[0003] Therefore, aiming at the problem of low production efficiency of the conventional solder paste printing carrier for the IGBT DBC substrate in the prior art, a solder paste printing carrier for the IGBT DBC substrate is needed. Content of the Utility Model

[0004] The utility model provides a solder paste printing carrier for an IGBT DBC substrate, which solves the problem of low production efficiency of the conventional solder paste printing carrier for the IGBT DBC substrate.

[0005] The utility model is realized through the following technical solutions: it includes a main board, a plurality of A-side printing carriers, and a plurality of B-side printing carriers; an element safety area is arranged in the middle of the main board, and the A-side printing carriers and the B-side printing carriers are slots on the main board and are respectively arranged on both sides of the element safety area. The A-side printing carriers are used for attaching chips, and the B-side printing carriers are used for brushing solder paste.

[0006] In order to better realize the utility model, further optimization is made in the above structure. The main board is provided with exhaust grooves, and the exhaust grooves communicate the A-side printing carriers and the B-side printing carriers.

[0007] In order to better realize the utility model, further optimization is made in the above structure. The main board is a structural member made of aluminum alloy, and the surface of the main board is subjected to hard anodizing treatment.

[0008] In order to better realize the utility model, further optimization is made in the above structure. The number of the above-mentioned plurality of A-side printing carriers is the same as that of the plurality of B-side printing carriers.

[0009] In order to better realize the utility model, further optimization is made in the above structure. The number of the above-mentioned plurality of A-side printing carriers is the same as that of the plurality of B-side printing carriers.

[0010] In order to better realize the utility model, further optimization is made in the above structure. The area of the slot is the same as the area of the DBC substrate.

[0011] To better implement the present utility model, further optimization is made to the above structure. Square handling slots for manual picking and placing are provided both above and below the A-side printing carrier and the B-side printing carrier.

[0012] To better implement the present utility model, further optimization is made to the above structure. Protection rods are provided along the substrate dividing line inside both the A-side printing carrier and the B-side printing carrier.

[0013] To better implement the present utility model, further optimization is made to the above structure. The component safety area is strip-shaped.

[0014] The present utility model has the following beneficial effects compared with the prior art: The present utility model is implemented through the following technical solutions: It includes a main board, multiple A-side printing carriers, and multiple B-side printing carriers; an element safety area is provided in the middle of the main board, and the A-side printing carriers and the B-side printing carriers are slots on the main board and are respectively arranged on both sides of the element safety area. The A-side printing carrier is used for attaching chips, and the B-side printing carrier is used for brushing solder paste. With this structure, the A side of one DBC substrate and the B side of another DBC substrate can be printed simultaneously. Among them, the A-side printing carrier is used for attaching chips, and the B-side printing carrier is used for brushing solder paste. An element safety area is provided to ensure that the A side and the B side can be printed separately. The production efficiency is improved, the utilization rate of the printing machine and the carrier is increased, and the same carrier can be used simultaneously when producing the A side and the B side, saving the time for replacing the carrier. Description of the Drawings

[0015] To more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0016] Figure 1 It is the front view of the IGBT DBC substrate solder paste printing carrier in the present utility model.

[0017] In the figure:

[0018] 1 - Main board; 2 - A-side printing carrier; 3 - B-side printing carrier; 4 - Element safety area; 5 - Exhaust groove; 6 - Handling slot; 7 - Protection rod. Detailed Embodiments

[0019] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other implementation manners obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope protected by the present utility model.

[0020] In the description of the present utility model, it should be noted that unless otherwise specified, the meaning of "a plurality of" is two or more; the orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the present utility model. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0021] In the description of the present utility model, it should also be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] Embodiment 1:

[0023] As Figure 1 shown, an IGBT DBC substrate solder paste printing carrier includes: a main board 1, a plurality of A-side printing carriers 2, and a plurality of B-side printing carriers 3; an element safety area 4 is provided in the middle of the main board 1, and the A-side printing carriers 2 and B-side printing carriers 3 are slots on the main board 1 and are respectively arranged on both sides of the element safety area 4. The A-side printing carriers 2 are used for attaching chips, and the B-side printing carriers 3 are used for brushing solder paste.

[0024] With this structure, the A side of one DBC substrate and the B side of another DBC substrate can be printed simultaneously. Among them, the A-side printing carriers 2 are used for attaching chips, and the B-side printing carriers 3 are used for brushing solder paste. The element safety area 4 is provided to ensure that the A side and the B side can be printed separately. The production efficiency is improved, the utilization rate of the printing machine and the carrier is increased, and the same carrier can be used simultaneously when producing the A side and the B side, saving the time for replacing the carrier.

[0025] The above-mentioned main board 1 is provided with an exhaust groove 5 ， The above-mentioned exhaust groove 5 communicates with the A-side printing carrier 2 and the B-side printing carrier 3; during printing, there will be vacuum adsorption at the bottom of the IGBT DBC substrate solder paste printing carrier. When the stencil printing is carried out, the squeegee will scrape the solder paste into the stencil. At this time, if there is no exhaust device on the surface of the carrier, the vacuum adsorption will suck the solder paste from the gaps in the stencil, resulting in abnormal printing. With the exhaust groove 5, the excess gas will be discharged from the exhaust groove 5 during vacuum adsorption and will not affect the printing.

[0026] The above-mentioned main board 1 is made of aluminum alloy, and the surface of the main board 1 is subjected to hard anodizing treatment, which ensures the service life of the carrier and will not leave residual molten solder paste during reflow soldering.

[0027] The above-mentioned A-side printing carrier 2 and B-side printing carrier 3 are both slots on the main board 1, and the area of the slots is the same as the area of the DBC substrate. The DBC substrate can be placed in the slots.

[0028] The number of slots of the above-mentioned A-side printing carrier 2 and B-side printing carrier 3 on the main board 1 is the same, and they are respectively located on both sides of the component safety area 4.

[0029] The above-mentioned A-side printing carrier 2 and B-side printing carrier 3 are both provided with square handling slots 6 for manual handling up and down. The setting of the handling slots facilitates the replacement of the IGBT DBC substrate on the carrier.

[0030] The above-mentioned A-side printing carrier 2 and B-side printing carrier 3 are both provided with protection rods 7 along the substrate dividing line. When the A-side printing carrier 2 or B-side printing carrier 3 is printed, it avoids the occurrence of fragmentation of the IGBT DBC substrate solder paste printing carrier caused by pressure.

[0031] The above-mentioned component safety area 4 is strip-shaped, and the A-side printing carrier 2 and the B-side printing carrier 3 are respectively located on both sides of the component safety area 4; separating the A-side printing carrier 2 and the B-side printing carrier 3 reserves a space for avoidance.

[0032] The above is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, which should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claimed rights.

Claims

1. An IGBT DBC substrate solder paste printing carrier, characterized in that: It includes a main board (1), a plurality of A-side printing carriers (2), and a plurality of B-side printing carriers (3); an element safety area (4) is provided in the middle of the main board (1), and the A-side printing carriers (2) and the B-side printing carriers (3) are slots on the main board (1) and are respectively arranged on both sides of the element safety area (4). The A-side printing carriers (2) are used for attaching chips, and the B-side printing carriers (3) are used for brushing solder paste.

2. The solder paste printing carrier for an IGBT DBC substrate according to claim 1, wherein: The main board (1) is provided with an exhaust groove (5), and the exhaust groove (5) communicates with the A-side printing carrier (2) and the B-side printing carrier (3).

3. An IGBT DBC substrate solder paste printing carrier according to claim 2, characterized in that: The main board (1) is a structural member made of aluminum alloy, and the surface of the main board (1) is subjected to hard anodizing treatment.

4. An IGBT DBC substrate solder paste printing carrier according to claim 3, characterized in that: The number of the plurality of A-side printing carriers (2) is the same as that of the plurality of B-side printing carriers (3).

5. An IGBT DBC substrate solder paste printing carrier according to any one of claims 1-4, characterized in that: The area of the slot is the same as the area of the DBC substrate.

6. An IGBT DBC substrate solder paste printing carrier according to claim 5, characterized in that: Square handling grooves (6) for manual handling are provided above and below the A-side printing carrier (2) and the B-side printing carrier (3).

7. An IGBT DBC substrate solder paste printing carrier according to claim 6, characterized in that: Protective rods (7) are arranged along the substrate dividing line in both the A-side printing carrier (2) and the B-side printing carrier (3).

8. An IGBT DBC substrate solder paste printing carrier according to claim 7, characterized in that: The element safety area (4) is strip-shaped.

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