Double-sided polishing jig

Abstract

The utility model discloses a double-sided polishing jig, which relates to the technical field of semiconductor processing, and comprises a bottom plate and a support frame fixedly arranged at the top of the bottom plate, the side part of the support frame is provided with a moving groove, a driving clamping mechanism is arranged in the moving groove, and two symmetrically arranged moving plates are arranged through the driving clamping mechanism; a fixing frame is fixedly arranged at the end of the moving plate, a supporting pipe is fixedly arranged at the lower end of the fixing frame, the lower end of the supporting pipe needs to be rotationally sleeved with a rotating pipe, the pipe wall of the rotating pipe is fixedly sleeved with a polishing piece, a driving polishing mechanism used for driving the polishing piece to rotate is arranged at the bottom of the moving plate, and an electric push rod is fixedly arranged at the top of the fixing frame. The movable plate, the fixing frame, the electric push rod, the connecting pipe, the suction cup, the supporting pipe, the rotating pipe, the polishing piece and the driving and grinding mechanism can conduct double-face polishing on the wafer by conducting double-face transposition adsorption on the wafer, no extra mechanism is needed for overturning the wafer, and the semiconductor polishing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a double-sided polishing fixture. Background Art

[0002] With the continuous development of semiconductor technology, the design rules are continuously shrinking, and the requirements for the surface flatness of wafers are also getting higher and higher. The double-sided polishing process can more effectively meet these high-precision requirements and ensure that the wafers perform excellently in subsequent processes such as lithography and etching.

[0003] After retrieval, a patent document with the publication number of CN221495565U discloses a double-sided polishing fixture. This fixture drives the lifting table to descend through an electric push rod, making the upper surface of the rotating table higher than the upper surface of the lifting table. Then, through a flipping component, the upper surface of the U-shaped plate is brought close to the lower surface of the wafer, so that the suction cup adsorbs the wafer, and then flipping can complete the double-sided polishing of the wafer. The structure of this device is simple and easy to use, meeting the existing usage requirements.

[0004] When the above device performs polishing, it is necessary to use the flipping component to turn over the wafer during the polishing process, which increases the operation steps required during the wafer polishing process and reduces the polishing efficiency. Summary of the Utility Model

[0005] In view of the problems existing in the above-mentioned existing double-sided polishing fixtures, the present utility model is proposed.

[0006] Therefore, the purpose of the present utility model is to provide a double-sided polishing fixture, which solves the problem that when polishing, it is necessary to use a flipping component to turn over the wafer during the polishing process, increasing the operation steps required during the wafer polishing process and reducing the polishing efficiency.

[0007] In order to achieve the above purpose, the present utility model provides the following technical solutions:

[0008] A double-sided polishing fixture includes a bottom plate and a support frame fixedly arranged on the top of the bottom plate. A moving groove is provided on the side of the support frame. A driving clamping mechanism is arranged inside the moving groove, and two symmetrically arranged moving plates are provided through the driving clamping mechanism. A fixed frame is fixedly arranged at the end of the moving plate. A support tube is fixedly arranged at the lower end of the fixed frame. A rotating tube is rotatably sleeved on the outer lower end of the support tube. A polishing sheet is fixedly sleeved on the tube wall of the rotating tube. A driving grinding mechanism for driving the polishing sheet to rotate is arranged at the bottom of the moving plate;

[0009] At the top of the fixing frame, an electric push rod is fixedly installed. The end of the output shaft of the electric push rod penetrates into the fixing frame and is fixedly provided with a connecting pipe. At the bottom of the connecting pipe, a suction cup is communicated and arranged. The suction cup is located inside the rotating pipe. At the top of the moving plate, a two-way air pump is fixedly installed. Both ends of the two-way air pump are communicated with air pipes, and the air pipes are communicated with the connecting pipe.

[0010] Preferably, the driving and grinding mechanism includes a driving motor, the driving motor is fixedly connected with the moving plate, and a first bevel gear is fixedly installed at the end of the output shaft. A second bevel gear is fixedly sleeved on the outer wall of the rotating pipe, and the first bevel gear and the second bevel gear are cooperatively arranged.

[0011] Preferably, the driving and clamping mechanism includes a bidirectional lead screw. The bidirectional lead screw is rotatably arranged in the moving groove and is threaded inside the two moving plates. At the top of the support frame, a motor is fixedly installed. The end of the output shaft of the motor penetrates into the moving groove and is fixedly connected with the bidirectional lead screw.

[0012] Preferably, a through hole for the suction cup to pass through is formed inside the polishing sheet.

[0013] Furthermore, at the lower end of the side wall of the support frame, a vacuum cleaner is fixedly installed. The end of the air inlet pipe of the vacuum cleaner is communicated with a dust suction hopper.

[0014] Preferably, the end of the moving plate is in contact and cooperation with the inner wall of the moving groove.

[0015] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:

[0016] 1. In the present utility model, through the provided moving plate, fixing frame, electric push rod, connecting pipe, suction cup, support pipe, rotating pipe, polishing sheet and driving and grinding mechanism, the wafer can be polished on both sides by adsorbing the wafer with both sides in position and exchanging positions, without the need for an additional mechanism to flip the wafer, improving the semiconductor polishing efficiency.

[0017] 2. In the present utility model, through the provided support frame, moving groove, moving plate and driving and clamping mechanism, the two polishing sheets can be made to approach the wafer to effectively adsorb the wafer before polishing. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.

[0019] Figure 1 It is a three-dimensional structural schematic diagram of the present utility model;

[0020] Figure 2 is the front view of the present utility model;

[0021] Figure 3 of the present utility model Figure 1 schematic enlarged view of part A.

[0022] Explanation of reference numerals:

[0023] 1, bottom plate; 2, support frame; 3, moving plate; 4, fixing frame; 5, support tube; 6, rotating tube; 7, polishing disc; 8, electric push rod; 9, connecting pipe; 10, suction cup; 11, two-way air pump; 12, air pipe; 13, driving motor; 14, first bevel gear; 15, second bevel gear; 16, two-way lead screw; 17, motor; 18, vacuum cleaner; 19, dust suction hopper. Specific implementation manners

[0024] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0025] An embodiment of the present utility model discloses a double-sided polishing jig.

[0026] The present utility model provides a double-sided polishing jig as Figures 1-3 shown, which includes a bottom plate 1 and a support frame 2 fixedly arranged on the top of the bottom plate 1. A moving groove is formed in the side part of the support frame 2, and a driving clamping mechanism is arranged inside the moving groove. Two symmetrically arranged moving plates 3 are arranged through the driving clamping mechanism. A fixing frame 4 is fixedly arranged at the end of the moving plate 3. A support tube 5 is fixedly arranged at the lower end of the fixing frame 4. A rotating tube 6 is rotatably sleeved on the outer lower end of the support tube 5. A polishing disc 7 is fixedly sleeved on the tube wall of the rotating tube 6. An electric push rod 8 is fixedly arranged on the top of the fixing frame 4. The end of the output shaft of the electric push rod 8 penetrates into the fixing frame 4 and is fixedly provided with a connecting pipe 9. A suction cup 10 is communicated and arranged at the bottom of the connecting pipe 9. The suction cup 10 is located inside the rotating tube 6. A through hole for the suction cup 10 to pass through is formed inside the polishing disc 7. A two-way air pump 11 is fixedly arranged on the top of the moving plate 3. Both ends of the two-way air pump 11 are communicated with an air pipe 12. The air pipe 12 is communicated with the connecting pipe 9;

[0027] A vacuum cleaner 18 is fixedly arranged at the lower end of the side wall of the support frame 2. The end of the air inlet pipe of the vacuum cleaner 18 is communicated with a dust suction hopper 19.

[0028] Before polishing the wafer, through two electric push rods 8, the bottom of the suction cup 10 can be made to be on the same horizontal line as the bottom of the polishing pad 7. Subsequently, the two moving plates 3 approach, and the polishing pad 7 contacts the surface of the wafer. The right end of the two-way air pump 11 sucks air, causing the upper suction cup 10 to adsorb the wafer. At this time, the lower polishing pad 7 rotates rapidly under the rotational cooperation of the rotating tube 6 and the support tube 5 to rapidly rotate and polish the lower surface of the wafer. After one side of the wafer is polished, the two-way air pump 11 changes positions, causing the left air tube 12 to cooperate with the lower connecting tube 9 to suck air. At this time, the upper suction cup 10 separates from the wafer, and the lower suction cup 10 rapidly adsorbs the wafer. At this time, the upper rotating tube 6 drives the polishing pad 7 to rotate rapidly to polish the upper surface of the wafer, thereby completing the double-sided polishing of the semiconductor without the need to flip the wafer. During the semiconductor polishing process, the vacuum cleaner 18 is started, and the dust suction hopper 19 rapidly absorbs and processes the dust generated during the polishing process.

[0029] In order to enable the polishing pad 7 to rotate rapidly to perform rotational polishing on the wafer, as Figure 1 and Figure 3 shown, a driving and grinding mechanism for driving the rotation of the polishing pad 7 is provided at the bottom of the moving plate 3. The end of the moving plate 3 is in contact and cooperation with the inner wall of the moving groove. The driving and grinding mechanism includes a driving motor 13, the driving motor 13 is fixedly connected to the moving plate 3, and a first bevel gear 14 is fixedly provided at the end of the output shaft. A second bevel gear 15 is fixedly sleeved on the outer wall of the rotating tube 6, and the first bevel gear 14 and the second bevel gear 15 are arranged in cooperation.

[0030] After the position of the wafer is fixed by the suction cup 10, the driving motor 13 can be started, causing the first bevel gear 14 to rotate. Through the cooperation of the first bevel gear 14 and the second bevel gear 15, and with the support of the support tube 5, the rotating tube 7 drives the polishing pad 7 to rotate rapidly to effectively grind the wafer.

[0031] And in order to enable the suction cup 10 to stably support the wafer before polishing, as Figure 1 and Figure 3 shown, the driving and clamping mechanism includes a bidirectional lead screw 16. The bidirectional lead screw 16 is rotatably arranged in the moving groove and is threadedly arranged inside the two moving plates 3. A motor 17 is fixedly provided at the top of the support frame 2. The end of the output shaft of the motor 17 penetrates into the moving groove and is fixedly connected to the bidirectional lead screw 16.

[0032] Before polishing the wafer, place the wafer between the two suction cups 10 and start the motor 17, causing the bidirectional lead screw 16 to rotate while the two moving plates 3 approach each other, and the polishing pad 7 contacts the surface of the wafer, thereby enabling the suction cup 10 to rapidly adsorb the wafer, ensuring stable fixed support during the wafer polishing process, and improving polishing stability.

[0033] Only some exemplary embodiments of the present utility model are described by way of illustration. Without doubt, for those of ordinary skill in the art, various different ways can be used to modify the described embodiments without departing from the spirit and scope of the present utility model. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present utility model.

Claims

1. A double-sided polishing fixture, comprising a bottom plate (1) and a support frame (2) fixedly arranged on the top of the bottom plate (1), characterized in that, A moving groove is formed in the side of the support frame (2). A driving clamping mechanism is arranged inside the moving groove, and two symmetrically arranged moving plates (3) are arranged through the driving clamping mechanism. A fixing frame (4) is fixedly arranged at the end of the moving plate (3). A support pipe (5) is fixedly arranged at the lower end of the fixing frame (4). A rotating pipe (6) is rotatably sleeved on the outer lower end of the support pipe (5). A polishing sheet (7) is fixedly sleeved on the pipe wall of the rotating pipe (6). A driving grinding mechanism for driving the polishing sheet (7) to rotate is arranged at the bottom of the moving plate (3). An electric push rod (8) is fixedly arranged at the top of the fixing frame (4). The end of the output shaft of the electric push rod (8) penetrates into the fixing frame (4) and is fixedly provided with a connecting pipe (9). A suction cup (10) is communicated and arranged at the bottom of the connecting pipe (9). The suction cup (10) is located inside the rotating pipe (6). A two-way air pump (11) is fixedly arranged at the top of the moving plate (3). Both ends of the two-way air pump (11) are communicated with an air pipe (12). The air pipe (12) is communicated with the connecting pipe (9).

2. The double-sided polishing fixture according to claim 1, wherein, The driving grinding mechanism includes a driving motor (13). The driving motor (13) is fixedly connected with the moving plate (3), and a first bevel gear (14) is fixedly arranged at the end of the output shaft. A second bevel gear (15) is fixedly sleeved on the outer wall of the rotating pipe (6). The first bevel gear (14) and the second bevel gear (15) are cooperatively arranged.

3. The double-sided polishing fixture according to claim 1, characterized in that, The driving clamping mechanism includes a bidirectional lead screw (16). The bidirectional lead screw (16) is rotatably arranged in the moving groove and is threadedly arranged inside the two moving plates (3). A motor (17) is fixedly arranged at the top of the support frame (2). The end of the output shaft of the motor (17) penetrates into the moving groove and is fixedly connected with the bidirectional lead screw (16).

4. The double-sided polishing fixture according to claim 1, wherein, A through hole for the suction cup (10) to pass through is formed in the polishing sheet (7).

5. The double-sided polishing fixture according to claim 1, characterized in that, A dust collector (18) is fixedly arranged at the lower end of the side wall of the support frame (2). The end of the air inlet pipe of the dust collector (18) is communicated with a dust suction hopper (19).

6. The double-sided polishing fixture according to claim 1, wherein The end of the moving plate (3) is in contact and cooperation with the inner wall of the moving groove.

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