Wax applying and attaching tool for wafer

Abstract

The utility model discloses a waxing and attaching tool for a wafer. The waxing and attaching tool comprises two first fixing columns; the two first fixing columns are arranged in parallel in a spaced mode, and a first connecting column is connected between the opposite ends of the two first fixing columns. A second connecting column is further connected between the two first connecting columns; the two ends of the top of the second connecting column are each connected with a first stand column, and a first cross beam is further connected between the upper portions of the two first stand columns. And a downward pressing driving mechanism is mounted at the bottom of the first cross beam, and the downward pressing driving mechanism is further in driving connection with a downward pressing plate. The wafer waxing and attaching device is reasonable in design, compact in structure and convenient to use, can greatly improve wafer waxing and attaching efficiency, can save human resources and further reduce labor cost, in addition, the lower pressing plate and the lower pressing air cylinder are connected in a floating mode, the movable freedom degree can be provided for the lower pressing plate, it is guaranteed that the tool can flatten a product with the heating plate as the reference, and the production efficiency is improved. And the attaching precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer attachment, in particular to a waxing and attaching tooling for wafers. Background Art

[0002] In the process of sapphire and silicon carbide wafer thinning, the wafer needs to be heated by paraffin first, then cooled and solidified onto a ceramic chuck, and then the ceramic disc substrate with the wafer is placed on a workbench for processing together (the wafer needs to go through a series of processing steps, such as dicing, chip bonding, wire bonding, plastic encapsulation, etc. In this process, in order to protect the chip from damage by the external environment, wax is needed to cover the chip). However, most of the existing wafer attachment methods adopt manual attachment, which is cumbersome in operation, low in work efficiency, and high in labor cost. Content of the Utility Model

[0003] The purpose of the utility model is to provide a waxing and attaching tooling for wafers, which is reasonable in design, compact in structure, and convenient to use. It can greatly improve the efficiency of wafer waxing and attachment. At the same time, it can save human resources, thereby reducing labor costs. In addition, the lower pressing plate and the lower pressing cylinder are connected in a floating manner, which can provide the lower pressing plate with freedom of movement, ensure that the tooling can press the product flat with the heating plate as a reference, and improve the attachment accuracy.

[0004] To achieve the above purpose, the following technical solutions are adopted:

[0005] A waxing and attaching tooling for wafers includes two first fixing columns; the two first fixing columns are arranged in parallel at intervals, and a first connecting column is connected between the opposite ends of the two first fixing columns; a second connecting column is also connected between the two first connecting columns; two first upright columns are respectively connected to the two ends of the top of the second connecting column, and a first cross beam is further connected between the upper parts of the two first upright columns; a lower pressing driving mechanism is installed at the bottom of the first cross beam, and the lower pressing driving mechanism also drives and connects a lower pressing plate; a bottom plate is also connected to the middle of the top of the second connecting column corresponding to the lower pressing plate, and both ends of the bottom plate extend to the top of a first fixing column for arrangement; a heat insulation plate is installed on the top of the bottom plate, and a heating plate is installed on the top of the heat insulation plate; the top of the heating plate is used for carrying the product to be attached, and a heating element for heating is installed inside the heating plate.

[0006] Further, the lower pressing driving mechanism includes a cylinder backing plate connected to the bottom of the first cross beam, a lower pressing cylinder installed at the bottom of the cylinder backing plate, a first joint connected to the output shaft of the lower pressing cylinder, and a first connecting block connected to the first joint; the lower pressing plate is installed at the bottom of the first connecting block.

[0007] Further, the first joint is in a cylindrical structure, and the interior of the first joint is axially hollow; a first limiting boss extends outward from the lower outer wall of the first joint; the first connecting block is in a cylindrical structure, and a first connecting through hole penetrating from its top to its bottom is provided at the top of the first connecting block; a second limiting boss extending outward is integrally connected to the corresponding position of the top of the first connecting block and the first connecting through hole, and a second connecting through hole penetrating into the first connecting through hole and adapted to the first joint is provided at the top of the second limiting boss; the bottom edge of the second limiting boss extends towards the inside of the first connecting through hole and forms a first limiting step in a ring structure; the first limiting boss is arranged in the first connecting through hole, the upper part of the first joint passes through the second connecting through hole and is connected to the output shaft of the downward pressing cylinder, and the first limiting step is used to limit the first limiting boss in the first connecting through hole.

[0008] Further, a plurality of fixing holes are spaced apart in the circumferential direction on the top edge of the first connecting block.

[0009] Further, a speed regulating joint is installed on the downward pressing cylinder; a manual solenoid valve is installed on one side of the first cross beam, and an air inlet joint and an air outlet joint are also installed on the manual solenoid valve.

[0010] Further, a silencer is installed on the manual solenoid valve.

[0011] Further, a foot cup is installed at each of the two ends of the bottom of each first fixing column.

[0012] Further, the heating element includes an electric heating tube.

[0013] Adopting the above scheme, the beneficial effects of the present utility model are as follows:

[0014] The present utility model is reasonably designed, compact in structure and convenient to use, which can greatly improve the efficiency of wax sticking and attaching on the wafer. At the same time, it can save human resources, thereby reducing the labor cost. In addition, the lower pressing plate and the downward pressing cylinder are connected in a floating manner, which can provide freedom of movement for the lower pressing plate, ensure that the tooling can flatten the product based on the heating plate, and improve the attaching accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of the present utility model;

[0016] Figure 2 is Figure 1 the front view of;

[0017] Figure 3 is a sectional view of the downward pressing drive mechanism of the present utility model;

[0018] Among them, the description of the attached drawing reference numerals:

[0019] 1. First fixing column; 2. First connecting column; 3. Second connecting column; 4. First vertical column; 5. First cross beam; 6. Lower pressing driving mechanism; 7. Lower pressing plate; 8. Manual solenoid valve; 101. First limiting boss; 102. First connecting through hole; 103. Second limiting boss; 104. First limiting step; 105. Fixing hole; 106. Foot cup; 31. Bottom plate; 32. Heat insulation plate; 33. Heating plate; 34. Heating element; 61. Cylinder cushion plate; 62. Lower pressing cylinder; 63. First joint; 64. First connecting block; 65. Speed regulating joint. Detailed implementation mode

[0020] The present utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] Refer to Figures 1 to 3 As shown, the present utility model provides a wax pasting and attaching tooling for wafers. In one embodiment, it includes two first fixing columns 1; the two first fixing columns 1 are arranged in parallel at intervals, and each of the opposite ends of the two first fixing columns 1 is connected with a first connecting column 2; a second connecting column 3 is also connected between the two first connecting columns 2; both ends of the top of the second connecting column 3 are respectively connected with a first vertical column 4, and a first cross beam 5 is also connected between the upper parts of the two first vertical columns 4; a lower pressing driving mechanism 6 is installed at the bottom of the first cross beam 5, and the lower pressing driving mechanism 6 also drives and connects a lower pressing plate 7; the middle of the top of the second connecting column 3 is also connected with a bottom plate 31 corresponding to the lower pressing plate 7, and both ends of the bottom plate 31 respectively extend to the top of a first fixing column 1 for arrangement; a heat insulation plate 32 is also installed on the top of the bottom plate 31, and a heating plate 33 is also installed on the top of the heat insulation plate 32; the top of the heating plate 33 is used for carrying the product to be attached, and a heating element 34 for heating is also installed inside the heating plate 33.

[0022] Continue to refer to Figures 1 to 3 As shown, in this embodiment, a frame with a square structure is formed between the two first fixing columns 1 and the two first connecting columns 2 to provide a supporting force for the bottom plate 31, which is convenient for the lower pressing plate 7 to press the product. At the same time, a second connecting column 3 is also connected between the two first connecting columns 2, which can strengthen the stability of the connection and support of the frame. During work, first, the heating plate 33 is powered on and a constant temperature is set. Then, the ceramic plate is placed on the heating plate 33 and heated to a constant temperature. Then, paraffin wax is evenly applied on the upper surface of the ceramic plate, and the wafer is placed on the paraffin wax. Then, the lower pressing driving mechanism 6 drives the lower pressing plate 7 to descend to press the wafer. After pressing for a period of time, the heating plate 33 is powered off, the ceramic plate is cooled to room temperature, and the lower pressing driving mechanism 6 drives the lower pressing plate 7 to rise and reset to complete the wafer attachment.

[0023] In this embodiment, the pressing drive mechanism 6 includes a cylinder backing plate 61 connected to the bottom of the first cross beam 5, a pressing cylinder 62 installed at the bottom of the cylinder backing plate 61, a first joint 63 connected to the output shaft of the pressing cylinder 62, and a first connecting block 64 connected to the first joint 63; the lower pressing plate 7 is installed at the bottom of the first connecting block 64. Driven by the pressing cylinder 62, the lower pressing plate 7 can be driven to move up and down so as to press the wafer. At the same time, the first joint 63 is in a cylindrical structure, and the inside of the first joint 63 is in an axially hollow structure; a first limiting boss 101 extends outward from the outer wall of the lower part of the first joint 63; the first connecting block 64 is in a cylindrical structure, and a first connecting through hole 102 penetrating through its top to the bottom is formed at the top of the first connecting block 64; a second limiting boss 103 extending outward is integrally connected to the position corresponding to the first connecting through hole 102 at the top of the first connecting block 64, and a second connecting through hole adapted to the first joint 63 is formed at the top of the second limiting boss 103 and penetrates into the first connecting through hole 102; the bottom edge of the second limiting boss 103 extends towards the inside of the first connecting through hole 102 and forms a first limiting step 104 in an annular structure; the first limiting boss 101 is arranged in the first connecting through hole 102, the upper part of the first joint 63 passes through the second connecting through hole and is connected to the output shaft of the pressing cylinder 62, and the first limiting step 104 is used for limiting the first limiting boss 101 in the first connecting through hole 102.

[0024] In this embodiment, the upper part of the first joint 63 passes through the second connecting through hole, and there is a certain gap between the first joint 63 and the second connecting through hole. The first limiting boss 101 is arranged in the first connecting through hole 102 and has a certain moving space. A plurality of fixing holes 105 are also spaced apart circumferentially at the top edge of the first connecting block 64. Screws can be locked in the fixing holes 105 to lock and fix the first connecting block 64 and the lower pressing plate 7. That is, the pressing cylinder 62 is floatingly connected to the lower pressing plate 7 through the first joint 63 and the first connecting block 64, and can provide a degree of freedom of movement for the lower pressing plate 7, ensuring that the tooling can flatten the product with the heating plate 33 as a reference and improving the attachment accuracy.

[0025] In one embodiment, a speed regulating joint 65 is further installed on the pressing cylinder 62; a manual solenoid valve 8 is installed on one side of the first cross beam 5, and an air inlet joint and an air outlet joint are further installed on the manual solenoid valve 8. The air inlet joint and the air outlet joint are used for the air inlet and outlet of the manual solenoid valve 8. The speed regulating joint 65 can adjust the extending and retracting speeds of the pressing cylinder 62 to adapt to different use environments. At the same time, a silencer is further installed on the manual solenoid valve 8. Through the silencer, the noise can be reduced. In addition, a foot cup 106 is installed at each of the two ends of the bottom of each first fixing column 1 to ensure the stability of the tooling placement.

[0026] In one embodiment, the heating element 34 includes an electric heating tube. The heating element 34 can also be an electric heating wire, a PTC heater, etc. At the same time, a temperature sensor can be installed on the heating plate 33 to facilitate temperature monitoring and control. In addition, a heat insulation plate 32 is provided to isolate the heat transfer between the heating plate 33 and the bottom plate 31.

[0027] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A waxing and attaching tooling for a wafer, characterized in that It includes two first fixing columns; the two first fixing columns are arranged in parallel at intervals, and a first connecting column is connected between the opposite ends of the two first fixing columns; a second connecting column is further connected between the two first connecting columns; at both ends of the top of the second connecting column, a first upright column is connected respectively, and a first cross beam is further connected between the upper parts of the two first upright columns; a downward pressing driving mechanism is installed at the bottom of the first cross beam, and the downward pressing driving mechanism also drives and connects a downward pressing plate; at the middle of the top of the second connecting column corresponding to the downward pressing plate, a bottom plate is further connected, and both ends of the bottom plate extend to the top of a first fixing column respectively; a heat insulation plate is installed on the top of the bottom plate, and a heating plate is installed on the top of the heat insulation plate; the top of the heating plate is used for carrying the product to be mounted, and a heating element for heating is installed inside the heating plate.

2. The waxing and attaching tooling for the wafer according to claim 1, wherein The downward pressing driving mechanism includes a cylinder backing plate connected to the bottom of the first cross beam, a downward pressing cylinder installed at the bottom of the cylinder backing plate, a first joint connected to the output shaft of the downward pressing cylinder, and a first connecting block connected to the first joint; the downward pressing plate is installed at the bottom of the first connecting block.

3. The waxing and attaching tooling for the wafer according to claim 2, characterized in that, The first joint has a cylindrical structure, and the inside of the first joint is axially hollow; a first limiting boss extends outward from the outer wall of the lower part of the first joint; the first connecting block has a cylindrical structure, and a first connecting through hole penetrating from the top to the bottom is opened at the top of the first connecting block; at the position corresponding to the first connecting through hole at the top of the first connecting block, a second limiting boss extending outward is integrally connected, and a second connecting through hole penetrating into the first connecting through hole and adapted to the first joint is opened at the top of the second limiting boss; the bottom edge of the second limiting boss extends towards the inside of the first connecting through hole and forms a first limiting step in an annular structure; the first limiting boss is arranged in the first connecting through hole, the upper part of the first joint passes through the second connecting through hole and is connected to the output shaft of the downward pressing cylinder, and the first limiting step is used for limiting the first limiting boss in the first connecting through hole.

4. The waxing and attaching tooling for the wafer according to claim 3, characterized in that, A plurality of fixing holes are spaced apart circumferentially at the top edge of the first connecting block.

5. The waxing and attaching tooling for the wafer according to claim 2, wherein A speed regulating joint is further installed on the downward pressing cylinder; a manual solenoid valve is installed on one side of the first cross beam, and an air inlet joint and an air outlet joint are further installed on the manual solenoid valve.

6. The waxing and attaching tooling for the wafer according to claim 5, wherein A silencer is further installed on the manual solenoid valve.

7. The waxing and attaching tooling for the wafer according to claim 1, wherein A foot cup is installed at both ends of the bottom of each first fixing column.

8. The waxing and attaching tooling for the wafer according to claim 1, characterized in that, The heating element includes an electric heating tube.

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