Adsorption carrying table structure and wafer detection device

Abstract

The utility model relates to the technical field of wafer detection, and provides an adsorption carrying table structure and a wafer detection device. The adsorption carrying table structure at least comprises a fork table group with a central axis, wherein the fork table group comprises at least two adsorption fork tables which are arranged around the central axis at intervals; each adsorption fork table is provided with a limiting step, each limiting step is provided with a step face, each adsorption fork table is provided with an adsorption groove in the corresponding step face, and the limiting steps and the adsorption grooves are arranged in an arc shape around the central axis. The adsorption carrying table structure provided by the utility model can ensure that the wafer is effectively adsorbed and positioned on the carrying table, and the offset is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of wafer detection, and particularly to an adsorption stage structure and a wafer detection device. Background Art

[0002] Defects on the back side of a wafer have important impacts on patterning accuracy, doping uniformity, mechanical strength, heat treatment effect, electrical properties, yield, and cost in the semiconductor manufacturing process. Therefore, the detection and control of wafer backside defects are key links throughout the front, middle, and back-end semiconductor manufacturing processes to ensure the smooth progress of the semiconductor manufacturing process and the compliance of product quality.

[0003] When detecting the back side of a wafer, a fixture or an adsorption mechanism is needed as a wafer detection stage to position and fix the wafer for convenient detection. However, when fixing the wafer, slight offsets often occur, affecting the detection accuracy and efficiency. Summary of the Utility Model

[0004] Based on this, it is necessary to provide an adsorption stage structure that can ensure effective adsorption and positioning of the wafer on the stage and reduce the offset amount.

[0005] An adsorption stage structure, the adsorption stage structure at least includes a fork stage group, the fork stage group has a central axis, and includes at least two adsorption fork stages arranged at intervals around the central axis; each adsorption fork stage is configured with a limiting step, the limiting step has a step surface, and each group of adsorption fork stages is configured with an adsorption groove on the corresponding step surface, and both the limiting step and the adsorption groove are arranged in an arc shape around the central axis.

[0006] It can be understood that the wafer can be supported on the step surface, and the adsorption groove on the step surface is used to adsorb and fix the wafer. In this process, due to the setting of the limiting step, it has a limiting surface in the vertical direction and a step surface in the horizontal direction. Therefore, the limiting surface can play a limiting role on the edge of the wafer to prevent the wafer from offsetting in the horizontal direction; moreover, precisely because the limiting step is arranged in an arc shape, it can be adapted to the edge of the wafer, increasing the limiting range, improving the accuracy, and at the same time enabling a larger area of the wafer to be exposed for detection. In addition, the setting of at least two spaced adsorption fork stages can improve the support stability and ensure that the wafer is stressed as evenly as possible. In this way, it can be ensured that the wafer is effectively adsorbed and positioned through this adsorption stage structure, reducing the offset amount.

[0007] In some embodiments, each adsorption fork stage is configured with at least two adsorption grooves arranged at intervals around the central axis;

[0008] The central angle α corresponding to each adsorption groove is between 8 degrees and 15 degrees; and / or, among at least two of the adsorption grooves, the central angle β corresponding to the arc formed by the adsorption groove at the head end and the adsorption groove at the tail end opposite to each other is between 35 degrees and 60 degrees.

[0009] In some embodiments, the adsorption fork platform is configured with an air hole corresponding to each of the adsorption slots, and the adsorption fork platform is configured with an air channel, one end of each of the air holes is connected to a corresponding air channel, and the other end is connected to the corresponding adsorption slot.

[0010] In some embodiments, the air channel includes a horizontal section and a vertical section, which are connected and arranged at an angle, and one end of the horizontal section facing away from the vertical section is connected to the corresponding air hole, and the vertical section is used to connect the gas connector.

[0011] In some embodiments, the adsorption platform structure further includes a driving group, which includes at least two driving mechanisms, each of which is connected to an adsorption fork platform and is used to drive the corresponding adsorption fork platform to move closer to or away from the central axis.

[0012] In some embodiments, each of the driving mechanisms includes a driving member, an adapter seat and a fixed platform; the driving member and the fixed platform are arranged on opposite sides of the adapter seat along the driving direction, and the driving end of the driving member passes through the adapter seat and is connected to the fixed platform; a guide member is provided between the fixed platform and the adapter seat and can move under the action of the driving member, and the fixed platform is connected to the corresponding adsorption fork platform.

[0013] In some embodiments, the adapter seat is constructed with a through hole, the guide member is penetrated through the through hole, and can move axially along the through hole; each of the driving mechanisms also includes a limit baffle, the limit baffle is arranged on the side of the adapter seat away from the fixed table, and is connected to the end of the guide member away from the fixed table; the adapter seat is provided with a buffer member along at least one side of the axial direction of the through hole, and the buffer member is used to abut against the fixed table or the limit baffle.

[0014] In some embodiments, the adsorption platform structure includes at least two groups of fork platforms, each group of the fork platforms is surrounded by a limiting space, and the sizes of the limiting spaces are different; the adsorption platform structure also includes a driving group, at least two groups of the fork platforms can selectively cooperate with the driving group; the driving group includes at least two driving mechanisms, each of the driving mechanisms can be detachably connected to one of the adsorption forks in any group of the fork platforms, for driving the corresponding adsorption fork to move.

[0015] In some of these embodiments, a limiting space penetrating along the central axis is defined around the fork platform group; the adsorption stage structure further includes a support platform which is configured with an opening corresponding to the limiting space and penetrating through the support platform, and the fork platform group is movably connected to the support platform.

[0016] In some of these embodiments, the adsorption stage structure further includes a leveling mechanism connected to the support platform; the leveling mechanism includes a reference component and an adjustment component, both of which are connected to the support platform and arranged at intervals, and the adjustment component is used to drive the support platform to generate an offset along the direction of the central axis.

[0017] This application also provides a wafer detection device, including the above-mentioned adsorption stage structure for adsorbing and carrying a wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of this application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of this application, and those of ordinary skill in the art can also obtain other drawings based on these drawings without creative efforts.

[0019] Figure 1 Schematic diagram of the adsorption stage structure provided by an embodiment of this application;

[0020] Figure 2 For Figure 1 Top view of the adsorption stage structure provided;

[0021] Figure 3 For Figure 1 First top view of the adsorption fork platform in the adsorption stage structure provided;

[0022] Figure 4 For Figure 1 Second top view of the adsorption fork platform in the adsorption stage structure provided;

[0023] Figure 5 For Figure 3 Cross-sectional view taken along A-A in;

[0024] Figure 6 For Figure 1 Schematic diagram of the cooperation between the adsorption fork platform and the driving mechanism in the adsorption stage structure provided;

[0025] Figure 7 For Figure 6 Partial schematic diagram of the cooperation between the adsorption fork platform and the driving mechanism provided;

[0026] Figure 8Partial schematic view of the driving mechanism in the adsorption stage structure provided by an embodiment of the present application;

[0027] Figure 9 Schematic view of the adsorption stage structure provided by another embodiment of the present application;

[0028] Figure 10 For Figure 9 Top view of the provided adsorption stage structure;

[0029] Figure 11 For Figure 9 Schematic view of the adsorption fork stage in the provided adsorption stage structure.

[0030] Reference numerals: 100, adsorption stage structure; 10, fork stage group; 11, adsorption fork stage; 20, driving group; 21, driving mechanism; 30, detection assembly; 31, proximity switch; 32, trigger piece; 40, support platform; 50, leveling mechanism; 51, reference assembly; 52, adjustment assembly; 111, limit step; 112, adsorption groove; 113, air hole; 114, air passage; 116, gas joint; 117, extension; 211, driving member; 212, adapter seat; 213, fixed platform; 214, guide member; 215, limit baffle; 216, buffer member; 216a, first buffer member; 216b, second buffer member; 217, floating head; 218, connecting column; 321, connecting portion; 322, triggering portion; 401, opening; 1101, assembly hole; 1111, step surface; 1141, horizontal section; 1142, vertical section; 2121, avoidance notch. Detailed implementation manners

[0031] To make the above objects, features and advantages of the present application more obvious and understandable, the following detailed description of the specific implementation manners of the present application is made with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0032] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly on the other component or there may also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the description of the present application are only for the purpose of illustration and do not represent the only implementation manner.

[0033] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0034] In this application, unless otherwise clearly specified and defined, the first feature may be in direct contact with the second feature or in indirect contact with the second feature through an intermediate medium when the first feature is "on" or "under" the second feature. Moreover, when the first feature is "above", "over" or "on top of" the second feature, it may be directly above or obliquely above the second feature, or merely indicate that the first feature has a higher horizontal height than the second feature. When the first feature is "under", "beneath" or "underneath" the second feature, it may be directly below or obliquely below the second feature, or merely indicate that the first feature has a lower horizontal height than the second feature.

[0035] Unless otherwise defined, all technical and scientific terms used in the description of this application have the same meaning as commonly understood by those skilled in the technical field to which this application pertains. The terms used in the description of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the description of this application includes any and all combinations of one or more of the related listed items.

[0036] Please refer to Figures 1 to 3 , an embodiment of this application provides an adsorption stage structure 100, which at least includes a fork stage group 10 having a central axis. The fork stage group 10 includes at least two adsorption fork stages 11 arranged at intervals around the central axis; each adsorption fork stage 11 is configured with a limiting step 111, the limiting step 111 has a step surface 1111, and each group of adsorption fork stages 11 is configured with an adsorption groove 112 on the corresponding step surface 1111, and both the limiting step 111 and the adsorption groove 112 are arranged in an arc shape around the central axis.

[0037] Taking the central axis Z-axis of the fork platform group 10 as an example. In actual use, the wafer can be supported on the step surface 1111, and the adsorption grooves 112 on the step surface 1111 are used to adsorb and fix the wafer. In this process, due to the setting of the limiting step 111, which has a limiting surface in the vertical direction and a step surface 1111 in the horizontal direction, the limiting surface can play a role in limiting the edge of the wafer to prevent the wafer from shifting in the horizontal direction. Since both the limiting step 111 and the adsorption grooves 112 are arc-shaped, they can be adapted to the wafer, increasing the limiting range and improving the accuracy. At the same time, a larger area of the wafer can be exposed for detection. Moreover, the setting of at least two spaced adsorption fork platforms 11 can improve the support stability and ensure that the wafer is stressed as evenly as possible.

[0038] In some specific embodiments, two adsorption fork platforms 11 are provided and arranged opposite to each other and spaced along the X-axis direction. Alternatively, the adsorption fork platforms 11 can also be three, four, etc. As long as it can meet the stable support of the wafer and reduce the offset amount.

[0039] Please refer to Figure 1 , Figure 3 and Figure 4 , for example, each adsorption fork platform 11 is configured with at least two adsorption grooves 112 spaced around the central axis. Such a setting is to increase the adsorption and fixation area of each adsorption fork platform 11 relative to the wafer, further improve the fixation effect, and prevent the wafer from being easily offset. For example, each adsorption fork platform 11 is provided with two adsorption grooves 112 spaced around the central axis, and the two adsorption grooves 112 are respectively arranged at both ends of the adsorption fork platform 11 around the central axis, that is, dispersed, so as to meet the stable support in the case of a small number of adsorption fork platforms 11 in each fork platform group 10.

[0040] In some embodiments, at least two adsorption grooves 112 can be connected to the vacuum pump and the air compressor through branch circuits, so as to selectively communicate with the vacuum pump to generate negative pressure, or communicate with the air compressor to generate positive pressure; or, among at least two adsorption grooves 112, at least one adsorption groove 112 is used to generate negative pressure, and at least another adsorption groove 112 is used to generate positive pressure. Such a setting not only facilitates the vacuum negative pressure adsorption of the wafer, but also facilitates the wafer to be suspended by using positive pressure, which is convenient for subsequent handling and reduces the wear on the wafer.

[0041] It should be added that the number of adsorption grooves 112 on each adsorption fork platform 11 should not be too many. If there are too many, it may affect the structural strength of the adsorption fork platform 11 itself, resulting in problems such as unstable support or easy damage due to collision. At the same time, the number of adsorption grooves 112 is also related to the arc length of the adsorption fork platform 11 itself around the central axis and the arc length of a single adsorption groove 112.

[0042] Such asFigure 4 As shown, in an alternative embodiment, the central angle α corresponding to each suction groove 112 is between 8 degrees and 15 degrees. Such a setting is equivalent to limiting the arc length of each suction groove 112 around the central axis. The arc length of each suction groove 112 should not be too small. If it is indeed too small, a safe suction range cannot be guaranteed, and there will be a problem of unstable fixation. Moreover, when the suction groove 112 is too small, the required quantity will increase, and it is also inconvenient for processing. Of course, the arc length of each suction groove 112 should not be too large either. If it is too large, the air suction range required for a single point will increase, increasing the cost. Therefore, it is necessary to limit the arc length of each suction groove 112 to ensure a sufficient and safe suction range to improve the fixation stability; and, it can meet the stable fixation of the wafer under a relatively small suction force, reducing the cost.

[0043] In some specific embodiments, the central angle of each suction groove 112 can be 8 degrees, 10 degrees, 12.5 degrees, or 15 degrees.

[0044] As Figure 4 shown, further, among at least two suction grooves 112 on each suction fork 11, the central angle β corresponding to the arc formed by the opposite ends of the first suction groove 112 at the head end and the last suction groove 112 at the tail end is between 35 degrees and 60 degrees. Among them, taking the suction fork 11 placed horizontally as an example, the first suction groove 112 in the clockwise direction around the central axis is the suction groove 112 at the head end, and the last suction groove 112 is the suction groove 112 at the tail end. Among them, it can be that the suction groove 112 at the head end is under negative pressure suction, and the suction groove 112 at the tail end is under positive pressure.

[0045] Taking two suction grooves 112 as an example, the central angle β of the arc defined by the opposite ends of the two suction grooves 112 around the central axis is between 35 degrees and 60 degrees. Such a setting is equivalent to limiting the total range of the relative fixation of each suction fork 11 to the wafer. If this total range is too large, it is equivalent to the larger the arc length of the suction fork 11 around the central axis. Since each set of fork groups 10 includes at least two suction forks 11, there may be a waste of resources. Of course, if this total range is too small, it also means that the arc length of the suction fork 11 is too small, affecting the fixation and suction range of a single suction fork 11; moreover, too small a total range will result in a relatively short distance between the positive pressure and the negative pressure, making it inconvenient to adjust the action mode. In some specific embodiments, the central angle β corresponding to the arc formed by the opposite ends of the first suction groove 112 at the head end and the last suction groove 112 at the tail end is 35 degrees, 45 degrees, 55 degrees, or 60 degrees.

[0046] Alternatively, if there are three suction grooves 112 provided on each suction fork 11. Taking the suction fork 11 placed horizontally as an example, the first suction groove 112 in the clockwise direction around the central axis is the suction groove 112 at the head end, and the third suction groove 112 is the suction groove 112 at the tail end.

[0047] Please combine with Figure 1 、 Figure 3 、 Figure 4 and Figure 5 ,Exemplarily, air holes 113 are formed in the adsorption fork platform 11 corresponding to each adsorption groove 112, and the adsorption fork platform 11 is provided with an air passage 114. One end of each air hole 113 is correspondingly communicated with an air passage 114, and the other end is communicated with the corresponding adsorption groove 112. The end of the air passage 114 away from the air hole 113 is connected to a gas source (vacuum pump or air compressor). In this way, the air passage 114 and the air holes 113 can be used to meet the adsorption in the arc range at each adsorption groove 112. The air passage 114 can be formed by opening a hole 401 on the adsorption fork platform 11. In actual use, the air holes 113 are arranged on the side of the two adsorption grooves 112 facing away from each other.

[0048] Furthermore, the air passage 114 includes a horizontal section 1141 and a vertical section 1142, which are connected and arranged at an angle. The end of the horizontal section 1141 away from the vertical section 1142 is communicated with the corresponding air hole 113, and the vertical section 1142 is used to connect the gas joint 116. The horizontal section 1141 penetrates along the X-axis direction to the side of the adsorption fork platform 11 away from the limit step 111, which is convenient for processing. A plug can be installed at the end of the horizontal section 1141 away from the air hole 113 to ensure the sealing performance and avoid air leakage. The vertical section 1142 is connected to the gas joint 116, which is convenient for connecting to the gas source. The gas source can be a vacuum pump and / or an air compressor. Among them, the vertical section 1142 extends upward along the vertical direction, which is convenient for connecting the gas joint 116 from above the adsorption fork platform 11. The setting of the vertical section 1142 transfers the access point of the air passage 114 to the vertical direction, avoiding the interference between the assembly of the gas joint 116 and the subsequent driving acting on the adsorption fork platform 11.

[0049] As Figure 1 、 Figure 2 、 Figure 6 、 Figure 7 and Figure 8 shown, in an alternative embodiment, the adsorption carrier structure 100 further includes a driving group 20. The driving group 20 includes at least two driving mechanisms 21, and each driving mechanism 21 is connected to an adsorption fork platform 11 for driving the corresponding adsorption fork platform 11 to move. By using the setting of the driving group 20, the respective adsorption fork platforms 11 arranged at intervals move closer to or away from the central axis. When moving closer, at least two adsorption fork platforms 11 can be used to carry and fix the wafer; when moving away, the carrying of the wafer is cancelled to avoid other structures acting on the wafer.

[0050] Please combine with Figure 1 、 Figure 2 、 Figure 9 and Figure 10In actual use, the fork stage group 10 is surrounded by a limiting space for carrying and adsorbing and fixing the wafer. The adsorption platform structure 100 includes at least two groups of fork stage groups 10, and each group of fork stage groups 10 is surrounded by a limiting space, and the size of each limiting space is different. Such a setting can also meet the requirements of carrying and adsorbing and fixing wafers of different sizes. At least two groups of fork stage groups 10 can be selected to cooperate with the driving group 20, and each driving mechanism 21 can be detachably connected to an adsorption fork stage 11 in any group of fork stage groups 10 to drive the corresponding adsorption fork stage 11 to move. For example, screws can be used to connect to the adsorption fork stage 11 in each group of fork stage groups 10 to achieve a detachable connection. Of course, snap-fitting can also be used. As long as it can meet the replacement and assembly of each group of fork stage groups 10 relative to the driving group 20, it is only used as an example here.

[0051] Please combine Figure 1 , Figure 6 and Figure 9 , illustratively, each driving mechanism 21 includes a driving member 211, an adapter seat 212 and a fixed platform 213. The driving member 211 and the fixed platform 213 are arranged on opposite sides of the adapter seat 212 along the driving direction, the driving end of the driving member 211 passes through the adapter seat 212 and is connected to the fixed platform 213, a guide member 214 is provided between the fixed platform 213 and the adapter seat 212, and can move under the action of the driving member 211, and the fixed platform 213 is connected to the corresponding adsorption fork platform 11.

[0052] It can be understood that the fixed platform 213 is mainly used for detachably connecting the adsorption fork platform 11, and the adapter 212 is used as the installation reference of the driving mechanism 21, and it can be installed on the structure supporting the adsorption fork platform 11. At the same time, the setting of the guide member 214 satisfies the mobile guidance, ensuring that each adsorption fork platform 11 in each fork platform group 10 can move linearly. If the projection of the limiting space corresponding to each fork platform group 10 along the vertical direction is a circle as an example, each adsorption fork platform 11 in each fork platform group 10 reciprocates along the radial direction of the limiting space to achieve the bearing and avoidance of the wafer.

[0053] Please combine Figure 1 , Figure 2 , Figure 6 , Figure 9 and Figure 10, during actual use, the adsorption stage structure 100 further includes a support platform 40, and each driving mechanism 21 in the driving group 20 is installed on the support platform 40 corresponding to the adapter base 212. The driving member 211 is installed on the side of the corresponding adapter base 212 radially outward along the limiting space, and the fixed platform 213 is located on the radially inward side. A floating head 217 is installed between the driving member 211 and the fixed platform 213 to improve the use safety. The adapter base 212 is configured with an installation hole along the radial direction of the limiting space. The driving member 211 uses a cylinder, and the piston rod of the cylinder passes through the installation hole and is connected to the fixed platform 213 through the floating head 217. The fixed platform 213 is connected with two connecting columns 218 arranged at intervals. The adsorption fork platform 11 is configured with two assembly holes 1101 arranged at intervals. The connecting columns 218 are threadedly connected to the hole walls of the assembly holes 1101 to achieve detachable connection with the fixed platform 213.

[0054] Alternatively, the driving member 211 can also use an electric push rod, as long as it can satisfy the linear driving of the fixed platform 213. This is only an example here.

[0055] Such as Figures 9 to 11 shown, in some embodiments, when the limiting space corresponding to the fork platform group 10 is small, the corresponding adsorption fork platform 11 extends an extension portion 117 along the radial direction of the limiting space toward the side of the corresponding driving mechanism 21 to make up for the radial connection length and meet the detachable connection with the fixed platform 213.

[0056] Such as Figures 6 to 8 shown, optionally, the adapter base 212 is configured with a through hole, and the guiding member 214 is inserted through the through hole and can move along the axial direction of the through hole; each driving mechanism 21 further includes a limiting baffle 215, and the limiting baffle 215 is arranged on the side of the adapter base 212 facing away from the fixed platform 213 and is connected to one end of the guiding member 214 facing away from the fixed platform 213; at least one side of the adapter base 212 along the axial direction of the through hole is provided with a buffer member 216, and the buffer member 216 is used to abut against the fixed platform 213 or the limiting baffle 215. That is to say, by setting the limiting baffle 215, it can play a role in limiting the driving of the driving member 211 radially inward along the limiting space, ensuring that the extension is not too long to affect the wafer. In this process, by setting the buffer member 216, the collision between the limiting baffle 215 and the fixed platform 213 relative to the adapter base 212 is reduced, and the driving stability is improved.

[0057] The first buffer 216a is connected between the fixed platform 213 and the adapter 212, and the second buffer 216b is connected between the limit baffle 215 and the adapter 212. The first buffer 216a can be a buffer sleeve, made of rubber or other materials. The first buffer 216a is sleeved on the outside of the guide 214 and connected to the side of the fixed platform 213 away from the adsorption fork platform 11; or, the first buffer 216a is connected to the side of the adapter 212 facing the fixed platform 213. The second buffer 216b includes a stop pin connected to the adapter 212, and a limit screw and a limit nut connected to the limit baffle 215, the limit nut is connected to the limit baffle 215, and the limit screw is threadedly connected to the limit nut. The end of the limit screw away from the limit baffle 215 can abut against the stop pin for limiting; and the limit screw can be rotated to adjust the length relative to the limit baffle 215, thereby adjusting the limit length with the stop pin, thereby satisfying the forward and backward movement stroke adjustment of the driving member 211.

[0058] Furthermore, the guide member 214 is an optical axis, and a linear bearing is installed in the through hole to cooperate with the guide member 214 to achieve movement and guidance. The linear bearing is installed on the adapter 212 using a C-shaped retaining spring.

[0059] like Figures 6 to 8 As shown, another option is that the adsorption platform structure 100 also includes a detection component 30 for detecting the model of the fork platform group 10. The detection component 30 includes a proximity switch 31 and a trigger piece 32. The trigger piece 32 is connected to the side of the corresponding adsorption fork platform 11 in the fork platform group 10 away from the limit step 111, and the proximity switch 31 is installed on the side of the adapter 212 away from the fixed platform 213. The trigger piece 32 can move with the corresponding adsorption fork platform 11 to trigger the proximity switch 31. Among them, two proximity switches 31 are provided and arranged at intervals along the arc length direction of the adsorption fork platform 11, one proximity switch 31 corresponds to one model of the fork platform group 10, and the other proximity switch 31 corresponds to another model of the fork platform group 10. Taking each group of fork platform groups 10 including two adsorption forks 11 as an example, when the trigger pieces 32 corresponding to the two adsorption forks 11 respectively trigger the corresponding proximity switches 31 at the same time, the model detection of the corresponding fork platform group 10 can be satisfied.

[0060] by Figure 7For example, the proximity switch 31 on the left corresponds to the small-sized fork platform group 10, and the proximity switch 31 on the right corresponds to the large-sized fork platform group 10. When the trigger piece 32 corresponding to the large-sized fork platform group 10 is triggered, the proximity switch 31 on the left cannot be triggered, that is, there is no trigger piece 32 at the proximity switch 31 on the left. Among them, the trigger piece 32 corresponding to each adsorption fork platform 11 can be in an L shape, with the horizontal side being the connecting portion 321 to connect with the corresponding adsorption fork platform 11, and the vertical side being the triggering portion 322 to cooperate with the corresponding proximity switch 31. Alternatively, the trigger piece 32 can also be in a U shape. At this time, the middle horizontal side of the U shape serves as the connecting portion 321, and the two vertical sides are one short and one long, with the long side serving as the triggering portion 322.

[0061] During actual use, the adapter base 212 is provided with an avoidance notch 2121 at the position corresponding to the proximity switch 31, which facilitates the triggering portion 322 to pass through the adapter base 212 to cooperate with the proximity switch 31. Such a setting is equivalent to making full use of the space of the adapter base 212 in the vertical direction, and the bottom of the proximity switch 31 can be set not to protrude from the bottom of the adapter base 212, reducing assembly interference.

[0062] In other embodiments, the detection component 30 can be used to detect the initial position of each fork platform group 10. At this time, the two proximity switches 31 in the detection component 30 can be triggered simultaneously, and the trigger piece 32 is in a U shape, corresponding to two triggering portions 322. Such a setting can improve the position detection accuracy of a single adsorption fork platform 11. This is only an example for illustration here.

[0063] In still another other embodiment, a magnetic switch is connected to the driving member 211 to detect whether the telescopic movement of the cylinder rod in the driving member 211 is in place.

[0064] Please refer to Figure 1 , Figure 2 , Figure 9 and Figure 10 , in some of these embodiments, the fork platform group 10 is surrounded by a limiting space penetrating along the central axis, the support platform 40 is configured with an opening 401 corresponding to the limiting space and penetrating the support platform 40, and the fork platform group 10 is installed on the support platform 40 through the driving group 20. Such a setting, while satisfying the stable support for each adsorption fork platform 11, facilitates exposing the bottom of the wafer for detection from the bottom of the wafer. In this way, the front and back (i.e., the aforementioned bottom) of the wafer can be detected, the operation is more convenient, there is no need to replace the wafer detection mounting structure, and the detection efficiency and accuracy are improved.

[0065] Please refer to Figure 1 , Figure 2 , Figure 9 and Figure 10, Exemplarily, the adsorption stage structure 100 further includes a leveling mechanism 50 connected to the support platform 40; the leveling mechanism 50 includes a reference component 51 and an adjustment component 52, both of which are connected to the support platform 40 and arranged at intervals, and the adjustment component 52 is used to drive the support platform 40 to generate an offset along the central axis direction. That is to say, the setting of the leveling mechanism 50 can meet the leveling adjustment of the support platform 40 to adapt to the installation angle of the vision installation platform and improve the accuracy of optical imaging and detection.

[0066] Specifically, by using the setting of the adjustment component 52, the support platform 40 generates a certain offset in the vertical direction to achieve the leveling adjustment of the support platform 40; in this process, due to the connection between the reference component 51 and the support platform 40, the installation reference of the support platform 40 can be maintained. Whether the support platform 40 offsets upward or downward relative to the original position in the vertical direction under the action of the adjustment component 52, the connection between the support platform 40 and the reference component 51 maintains the original reference. And because of the spaced arrangement of the reference component 51 and the adjustment component 52, the two can not interfere with each other, ensuring both the reference and facilitating the flatness adjustment. In this way, it can be ensured that the support platform 40 can maintain its original position on the X-axis and Y-axis during the leveling process, so that the overall position after leveling is not prone to offset.

[0067] Optionally, the reference component 51 includes a reference post and a locking seat. The reference post is stepped to form a limiting portion to support on the lower surface of the support platform 40, and the locking seat is threadedly connected to the reference post to press on the upper surface of the support platform 40. In this way, the assembly of the reference component 51 and the support platform 40 can be realized. The adjustment component 52 includes an adjustment post, a base, and an adjustment seat. One end of the adjustment seat is connected to the base, and the other end passes through the support platform 40. The adjustment seat is threadedly connected to the adjustment post and supports on the lower surface of the support platform 40. Rotating the adjustment seat can make it move along the axial direction (i.e., the vertical direction) of the adjustment post to achieve the leveling adjustment of the support platform 40. The base is configured with an insertion hole, and one end of the adjustment post is inserted into the insertion hole and has a spherical fit with the hole wall of the insertion hole, facilitating the adjustment post to generate a small-angle yaw.

[0068] Another embodiment of the present application provides a wafer detection device, including the above-mentioned adsorption stage structure, which is used to adsorb and carry wafers to realize the detection of the front and back sides of wafers.

[0069] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combinations of these technical features do not conflict, they should all be considered as the scope recorded in this specification.

[0070] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patented application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several variations and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the patent protection scope of the present application shall be subject to the appended claims.

Claims

1. An adsorption stage structure, characterized in that, The adsorption platform structure (100) comprises at least a fork platform group (10), wherein the fork platform group (10) has a central axis and comprises at least two adsorption fork platforms (11) arranged at intervals around the central axis; Each of the adsorption fork platforms (11) is configured with a limiting step (111), the limiting step (111) having a step surface (1111), each group of the adsorption fork platforms (11) is configured with an adsorption groove (112) on the corresponding step surface (1111), and the limiting step (111) and the adsorption groove (112) are both arranged in an arc shape around the central axis.

2. The adsorption stage structure according to claim 1, wherein Each of the adsorption fork platforms (11) is configured with at least two adsorption grooves (112) spaced apart around the central axis; The center angle α corresponding to each of the adsorption grooves (112) is between 8 degrees and 15 degrees; and / or, among at least two of the adsorption grooves (112), the center angle β corresponding to the arc formed by the adsorption groove (112) at the head end and the adsorption groove (112) at the tail end opposite to each other is between 35 degrees and 60 degrees.

3. The adsorption stage structure according to claim 1, characterized in that, The adsorption fork platform (11) is provided with an air hole (113) corresponding to each of the adsorption grooves (112), and the adsorption fork platform (11) is provided with an air channel (114), one end of each of the air holes (113) is connected to a corresponding air channel (114), and the other end is connected to the corresponding adsorption groove (112).

4. The adsorption stage structure according to claim 3, wherein, The air channel (114) comprises a horizontal section (1141) and a vertical section (1142), which are connected and arranged at an angle, and one end of the horizontal section (1141) away from the vertical section (1142) is connected to the corresponding air hole (113), and the vertical section (1142) is used to connect to the gas connector (116).

5. The adsorption stage structure according to claim 1, characterized in that The adsorption platform structure (100) further comprises a driving group (20), wherein the driving group (20) comprises at least two driving mechanisms (21), each of the driving mechanisms (21) being connected to one of the adsorption fork platforms (11) and being used to drive the corresponding adsorption fork platform (11) to move towards or away from the central axis.

6. The adsorption stage structure according to claim 5, wherein, Each of the driving mechanisms (21) comprises a driving member (211), an adapter seat (212) and a fixing platform (213); The driving member (211) and the fixing platform (213) are arranged on opposite sides of the adapter seat (212) along the driving direction, and the driving end of the driving member (211) passes through the adapter seat (212) and is connected to the fixing platform (213); A guide member (214) is provided between the fixed platform (213) and the transfer seat (212), and is capable of moving under the action of the driving member (211); the fixed platform (213) is connected to the corresponding adsorption fork platform (11).

7. The adsorption stage structure according to claim 6, wherein The adapter seat (212) is configured with a through hole, and the guide member (214) is penetrated through the through hole and is capable of moving along the axial direction of the through hole; Each of the driving mechanisms (21) further includes a limit baffle (215). The limit baffle (215) is disposed on a side of the adapter base (212) facing away from the fixed base (213) and is connected to one end of the guiding member (214) facing away from the fixed base (213). The adapter base (212) is provided with a buffer member (216) on at least one side along the axial direction of the through hole. The buffer member (216) is configured to abut against the fixed base (213) or the limit baffle (215).

8. The adsorption stage structure according to claim 1, characterized in that The adsorption carrier structure (100) includes at least two sets of fork base groups (10). Each set of fork base groups (10) defines a limit space, and the sizes of the respective limit spaces are different; The adsorption carrier structure (100) further includes a driving group (20). At least two sets of the fork base groups (10) can be selectively matched with the driving group (20); The driving group (20) includes at least two driving mechanisms (21). Each driving mechanism (21) is detachably connected to one adsorption fork base (11) in any one set of the fork base groups (10) and is configured to drive the corresponding adsorption fork base (11) to move.

9. The adsorption stage structure according to any one of claims 1 to 8, characterized in that, The fork base group (10) defines a limit space that penetrates along the central axis; The adsorption carrier structure (100) further includes a support platform (40). The support platform (40) is configured with an opening (401) corresponding to the limit space and penetrating through the support platform (40). The fork base group (10) is movably connected to the support platform (40).

10. The adsorption stage structure according to claim 9, wherein, The adsorption carrier structure (100) further includes a leveling mechanism (50) connected to the support platform (40); The leveling mechanism (50) includes a reference component (51) and an adjustment component (52). Both are connected to the support platform (40) and are arranged at intervals. The adjustment component (52) is configured to drive the support platform (40) to generate an offset along the direction of the central axis.

11. A wafer inspection device, characterized in that, Including the adsorption carrier structure according to any one of claims 1 to 10, the adsorption carrier structure is configured to adsorb and carry a wafer.

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