Laser power supply water cooling radiator

Abstract

The utility model discloses a laser power supply water-cooling radiator, which comprises a shell, a first processing assembly is arranged in the middle of the shell, a second processing assembly is arranged at one end of the shell, the first processing assembly is matched with the second processing assembly, and the first processing assembly is matched with the second processing assembly. When the laser power supply is used, uniform water-cooling heat dissipation can be carried out on the inside and outside of the laser power supply shell, the heat dissipation uniformity can be ensured, meanwhile, a cooling solution can be continuously recycled, and the problems of resource waste and environmental pollution caused by frequent replacement of the solution are avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of laser power supplies, and more specifically, to a water-cooled radiator for a laser power supply. Background Art

[0002] A laser is a device that can emit laser light. When a laser is working, a large amount of heat will be generated, so it is necessary to dissipate heat from the laser. For the heat dissipation mechanism of the power supply module in the laser, water-cooled heat dissipation is mainly used in the prior art.

[0003] For example, by retrieving a water-cooled radiator for a laser power supply disclosed in Chinese Patent Publication No. CN219718896U, in this water-cooled radiator for a laser power supply, by pulling the movable shells on both sides away from the baffle, the limit on both ends of the baffle is released, and then the baffle is rotated 90 degrees around the rotating rod, so that the baffle leaves the installation groove and the circulation pipe, that is, the limit on the circulation pipe is released, and then the circulation pipe can be taken out of the installation groove, that is, the circulation pipe can be disassembled and assembled efficiently, conveniently, time-saving and labor-saving.

[0004] However, the above device has certain deficiencies in actual use. Although it can disassemble and assemble the circulation pipe efficiently, conveniently, time-saving and labor-saving during use, when dissipating heat from the laser power supply, the cooling only dissipates heat from the shell of the laser power supply and cannot dissipate heat from the inside of the laser power supply, resulting in poor heat dissipation effect. And when performing water-cooled heat dissipation, the cooling water cannot be recycled, resulting in waste of resources. Summary of the Utility Model

[0005] In view of the problems in the related art, the utility model proposes a water-cooled radiator for a laser power supply to overcome the above technical problems existing in the prior related art.

[0006] Therefore, the specific technical solution adopted by the utility model is as follows:

[0007] A water-cooled radiator for a laser power supply includes a housing, a first processing component is arranged in the middle of the housing, and a second processing component is arranged at one end of the housing.

[0008] Further, in order to better ensure the heat dissipation effect outside the housing, the first processing component includes a heat dissipation cavity, the heat dissipation cavity is opened in the middle of the housing, a storage box is arranged on one side of the housing, a plurality of semiconductor refrigerators are embedded in the storage box, and a plurality of cooling plates are arranged on one side of the semiconductor refrigerators located inside the storage box.

[0009] Further, in order to better ensure the uniform heat dissipation effect of the housing, one end of the storage box is connected to a first input pipe, one end of the first input pipe is connected to a micro transfer pump, the output end of the micro transfer pump is connected to a second input pipe, one end of the second input pipe extends from the outside of the housing to the inside of the heat dissipation chamber, one end of the second input pipe located inside the heat dissipation chamber is connected to a first heat dissipation pipe, one end of the first heat dissipation pipe is connected to a first output pipe, one end of the first output pipe extends from the inside of the heat dissipation chamber to the outside of the housing, and the first output pipe located outside the housing is connected to one end of the storage box.

[0010] Further, in order to better ensure the effect of recycling cooling water, the first processing component includes a mixing cylinder, the mixing cylinder is connected to the first input pipe, a plurality of mounting brackets are arranged inside the mixing cylinder, a rotating rod is connected to the mounting brackets, driving blades are arranged at both ends of the rotating rod, and a plurality of mixing blades are arranged on the rotating rod.

[0011] Further, in order to better ensure the heat dissipation effect inside the housing, the second processing component includes a third input pipe, the third input pipe is connected to the second input pipe, one end of the third input pipe extends from the outside of the housing to the inside of the housing, a second heat dissipation pipe is arranged at one end of the third input pipe located inside the housing, and one end of the second heat dissipation pipe is connected to a second output pipe.

[0012] Further, in order to better cooperate with the first processing component, one end of the second output pipe extends from the inside of the housing to the outside of the housing, and one end of the second output pipe located outside the housing is connected to the first output pipe.

[0013] Further, in order to better ensure the diffusion effect of the cooling gas, the second processing component further includes a plurality of first input ports, the first input ports are opened at the upper end of the housing, a mounting cover is arranged at one end of the housing, a collection hole is opened at one end of the mounting cover, and a filter screen and a delivery fan are arranged inside the mounting cover.

[0014] Further, in order to better ensure the heat dissipation diffusion effect, a plurality of second input ports are opened inside the housing, and the second input ports communicate with the heat dissipation chamber.

[0015] The beneficial effects of the present utility model: Through the good cooperation between the first processing component and the second processing component, it is possible to uniformly cool and dissipate heat from the inside and outside of the laser power supply housing when the laser power supply is in use, and it is also possible to ensure the uniformity of heat dissipation. At the same time, the cooling solution can be continuously recycled, avoiding the problems of resource waste and environmental pollution caused by frequent solution replacement. Description of the Drawings

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0017] Figure 1 is a schematic diagram of the structure of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 1 ;

[0018] Figure 2 is a schematic diagram of the structure of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 2 ;

[0019] Figure 3 is a schematic diagram of the structure of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 3 ;

[0020] Figure 4 is a schematic diagram of the structure of the first processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 1 ;

[0021] Figure 5 is a schematic diagram of the structure of the first processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 2 ;

[0022] Figure 6 is a schematic diagram of the structure of the first processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 3 ;

[0023] Figure 7 is a schematic diagram of the structure of the second processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 1 ;

[0024] Figure 8 is a schematic diagram of the structure of the second processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 2 ;

[0025] Figure 9 is a schematic diagram of the structure of the second processing component of a water-cooled radiator for a laser power supply according to an embodiment of the present invention Figure 3 .

[0026] Reference numerals:

[0027] 1. Housing; 2. First processing component; 201. Heat dissipation cavity; 202. Storage box; 203. Thermoelectric cooler; 204. Cooling plate; 205. First input pipe; 206. Micro transfer pump; 207. Second input pipe; 208. First heat dissipation pipe; 209. First output pipe; 210. Mixing cylinder; 211. Rotating rod; 212. Driving blade; 213. Mixing blade; 3. Second processing component; 301. Third input pipe; 302. Second heat dissipation pipe; 303. Second output pipe; 304. First input port; 305. Mounting cover; 306. Filter screen; 307. Delivery fan; 4. Mounting rack; 5. Collection hole; 6. Second input port. Detailed implementation mode

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] Please refer to Figure 1 - Figure 9 As shown in the figure, a laser power water-cooled radiator according to an embodiment of the present invention includes a housing 1. The specific dimensions of the housing 1 can be customized according to the used laser power. During actual use, a temperature sensor and a controller are arranged inside the housing 1 for temperature monitoring and control adjustment of the laser power installed on the housing 1. A first processing component 2 is arranged in the middle of the housing 1 for heat dissipation treatment of the housing 1, and a second processing component 3 is arranged at one end of the housing 1 for heat dissipation inside the housing 1.

[0030] As Figure 1 - Figure 9 As shown in the figure, the first processing component 2 includes a heat dissipation cavity 201. The heat dissipation cavity 201 is opened in the middle of the housing 1. A plurality of second input ports 6 are opened inside the housing 1, and the second input ports 6 communicate with the heat dissipation cavity 201. A storage box 202 is arranged on one side of the housing 1. A water inlet pipe is arranged on the storage box 202. Two thermoelectric coolers 203 are embedded on the storage box 202. The thermoelectric cooler 203 is a conventional structure and is not shown in detail. The principle structure of the thermoelectric cooler 203 is the same as the semiconductor structure principle of model A250-48-AA-001. The thermoelectric cooler 203 is provided with a cold end and a hot end. Four cooling plates 204 are arranged on the side of the cold end of the thermoelectric cooler 203 inside the storage box 202;

[0031] A plurality of water-permeable holes are formed in the cooling plate 204, with diameters gradually decreasing. One end of the storage tank 202 is connected to a first input pipe 205. One end of the first input pipe 205 is connected to a micro transfer pump 206, and the micro transfer pump 206 is arranged on one side of the housing 1 through a fixing frame. The output end of the micro transfer pump 206 is connected to a second input pipe 207. One end of the second input pipe 207 extends from the outside of the housing 1 to the inside of the heat dissipation chamber 201. One end of the second input pipe 207 located inside the heat dissipation chamber 201 is connected to an S-shaped first heat dissipation pipe 208. One end of the first heat dissipation pipe 208 is connected to a first output pipe 209. One end of the first output pipe 209 extends from the inside of the heat dissipation chamber 201 to the outside of the housing 1. The first output pipe 209 located outside the housing 1 is connected to one end of the storage tank 202;

[0032] The first processing component 2 includes a mixing cylinder 210. The mixing cylinder 210 is connected to the first input pipe 205. A plurality of mounting brackets 4 are arranged inside the mixing cylinder 210. A rotating rod 211 is rotatably connected to the mounting brackets 4 through bearings. Driving blades 212 are arranged at both ends of the rotating rod 211. A plurality of mixing blades 213 are arranged on the rotating rod 211.

[0033] As Figure 1 - Figure 9 shown, the second processing component 3 includes a third input pipe 301. The third input pipe 301 is connected to the second input pipe 207. One end of the third input pipe 301 extends from the outside of the housing 1 to the inside of the housing 1. One end of the third input pipe 301 located inside the housing 1 is provided with an S-shaped second heat dissipation pipe 302. One end of the second heat dissipation pipe 302 is connected to a second output pipe 303. One end of the second output pipe 303 extends from the inside of the housing 1 to the outside of the housing 1. One end of the second output pipe 303 located outside the housing 1 is connected to the first output pipe 209;

[0034] The second processing component 3 further includes a plurality of first input ports 304. The first input ports 304 are formed in the upper end of the housing 1. One end of the housing 1 is provided with a mounting cover 305. A collection hole 5 is formed in one end of the mounting cover 305. A filter screen 306 and a delivery fan 307 are arranged inside the mounting cover 305.

[0035] When the temperature sensor detects that the temperature of the laser power supply is relatively high, through an external controller, the micro-transfer pump 206 and the semiconductor cooler 203 are started. Then, the cold end of the semiconductor cooler 203 cools the cooling solution in the storage tank 202 through the cooling plate 204. Next, the micro-transfer pump 206 generates suction, and the first input pipe 205 of the suction cylinder transports the cooling solution in the storage tank 202 into the mixing cylinder 210. During the solution transportation process, the solution drives the driving blade 212 to rotate, and then drives the rotating rod 211 to rotate, causing the mixing blade 213 to stir and mix the incoming solution, thus avoiding the existence of incompletely cooled solution. Then, the mixed solution is transported into the second input pipe 207 through the micro-transfer pump 206, and at the same time, a diversion occurs, and part of the cooling solution enters the third input pipe 301. Next, the cooling solutions in the second input pipe 207 and the third input pipe 301 enter the first heat dissipation pipe 208 and the second heat dissipation pipe 302, and are transported in an S shape inside and outside the housing 1 through the first heat dissipation pipe 208 and the second heat dissipation pipe 302. Then, through the first output pipe 209 and the second output pipe 303, the heat-exchanged solution is transported back into the storage tank 202. Then, the semiconductor cooler 203 and the cooling plate 204 cooperate with each other to cool the heat-exchanged solution again, so as to achieve cyclic heat dissipation and cyclic use of the solution. During the transportation process of the cooling solution, the transportation fan 307 is started through the external controller. Then, the transportation fan 307 inhales the external gas into the installation cover 305 through the collection hole 5. Next, the incoming gas is filtered through the filter net 306. Then, the gas is transported into the interior of the housing 1 through the first input port 304 by the transportation fan 307, so that the cooling gas generated by water cooling can be evenly diffused to multiple positions of the housing 1. When the gas diffuses, the gas diffused through the second input port 6 also enters the heat dissipation cavity 201, so as to dissipate heat from multiple positions in the middle of the housing 1, thus better ensuring the heat dissipation effect of the laser power supply.

[0036] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A water-cooled radiator for a laser power supply, comprising a housing (1), characterized in that: A first processing component (2) is arranged in the middle of the housing (1), and a second processing component (3) is arranged at one end of the housing (1).

2. The water-cooled radiator for a laser power supply according to claim 1, characterized in that The first processing component (2) includes a heat dissipation cavity (201), the heat dissipation cavity (201) is opened in the middle of the housing (1), a storage box (202) is arranged on one side of the housing (1), a plurality of semiconductor refrigerators (203) are embedded on the storage box (202), and a plurality of cooling plates (204) are arranged on one side of the semiconductor refrigerator (203) inside the storage box (202).

3. The water-cooled radiator of a laser power supply according to claim 2, wherein One end of the storage box (202) is connected with a first input pipe (205), one end of the first input pipe (205) is connected with a micro transfer pump (206), the output end of the micro transfer pump (206) is connected with a second input pipe (207), one end of the second input pipe (207) extends from the outside of the housing (1) to the inside of the heat dissipation cavity (201), one end of the second input pipe (207) inside the heat dissipation cavity (201) is connected with a first heat dissipation pipe (208), one end of the first heat dissipation pipe (208) is connected with a first output pipe (209), one end of the first output pipe (209) extends from the inside of the heat dissipation cavity (201) to the outside of the housing (1), and one end of the first output pipe (209) outside the housing (1) is connected with one end of the storage box (202).

4. The water-cooled radiator of a laser power supply according to claim 3, characterized in that, The first processing component (2) includes a mixing cylinder (210), the mixing cylinder (210) is connected to the first input pipe (205), a plurality of mounting brackets (4) are arranged inside the mixing cylinder (210), a rotating rod (211) is connected to the mounting bracket (4), driving blades (212) are arranged at both ends of the rotating rod (211), and a plurality of mixing blades (213) are arranged on the rotating rod (211).

5. The water-cooled radiator of a laser power supply according to claim 4, characterized in that The second processing component (3) includes a third input pipe (301), the third input pipe (301) is connected to the second input pipe (207), one end of the third input pipe (301) extends from the outside of the housing (1) to the inside of the housing (1), a second heat dissipation pipe (302) is arranged at one end of the third input pipe (301) inside the housing (1), and one end of the second heat dissipation pipe (302) is connected with a second output pipe (303).

6. The water-cooled radiator for a laser power supply according to claim 5, characterized in that One end of the second output pipe (303) extends from the inside of the housing (1) to the outside of the housing (1), and one end of the second output pipe (303) outside the housing (1) is connected with the first output pipe (209).

7. The water-cooled radiator for a laser power supply according to claim 6, characterized in that, The second processing component (3) further includes a plurality of first input ports (304), the first input ports (304) are opened at the upper end of the housing (1), a mounting cover (305) is arranged at one end of the housing (1), a collection hole (5) is opened at one end of the mounting cover (305), and a filter screen (306) and a conveying fan (307) are arranged inside the mounting cover (305).

8. The water-cooled radiator for a laser power supply according to claim 2, characterized in that, A plurality of second input ports (6) are formed inside the housing (1), and the second input ports (6) communicate with the heat dissipation cavity (201).

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