Ultrahigh-temperature glue bonding device for electronic packaging
By designing an adjustable fixing mechanism, the problem that existing ultra-high temperature adhesive devices cannot fix electronic devices of various shapes is solved, and stable clamping and protection of devices with different shapes is achieved, thereby improving the applicability and operating efficiency of the device.
Patent Information
- Application Number
- CN202422169258.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-05
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-05
AI Technical Summary
The existing ultra-high temperature adhesive device for electronic packaging can only fix electronic devices with fixed shapes and cannot adapt to electronic devices with diverse shapes, resulting in limitations during use.
An ultra-high temperature adhesive device including a base and a fixing mechanism is designed. The fixing mechanism is composed of a motor, a bidirectional screw, a guide block and a clamp. The bidirectional screw drives the clamp and arc clamp adjustment through the motor to adapt to electronic devices of different shapes, combining limit and magnetic fixation to ensure stable clamping.
The stable fixation of electronic devices of different shapes is achieved, the applicability and operation convenience of the device are improved, the fixing effect is enhanced and the device surface is protected.
Smart Images
Figure CN223083157U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic device packaging, and particularly relates to an ultra-high temperature glue bonding device for electronic packaging. Background Art
[0002] Electronic packaging refers to the potting of metal casting products such as power electrical appliances and motors. After potting, a glue bonding device is required for heating to improve the bonding effect and efficiency between the glue and the electronic device. To improve the operation convenience, the glue bonding device is often set together with the packaging device, and heating can be immediately carried out after potting.
[0003] For the existing ultra-high temperature glue bonding device for electronic packaging, in order to ensure the stability of the electronic device during potting and the glue bonding process, a fixing component is required to clamp and fix the electronic device. However, the existing fixing components can often only fix electronic devices with a fixed shape, and the shapes of electronic devices are diverse, which leads to certain limitations in the use of the existing ultra-high temperature glue bonding device for electronic packaging. Therefore, we propose an ultra-high temperature glue bonding device for electronic packaging. Summary of the Utility Model
[0004] In view of the problems existing in the above-mentioned existing ultra-high temperature glue bonding device for electronic packaging, the present utility model is proposed.
[0005] Therefore, the purpose of the present utility model is to provide an ultra-high temperature glue bonding device for electronic packaging, which solves the problem that for the existing ultra-high temperature glue bonding device for electronic packaging, in order to ensure the stability of the electronic device during potting and the glue bonding process, a fixing component is required to clamp and fix the electronic device. However, the existing fixing components can often only fix electronic devices with a fixed shape, and the shapes of electronic devices are diverse, which leads to certain limitations in the use of the existing ultra-high temperature glue bonding device for electronic packaging.
[0006] In order to achieve the above purpose, the present utility model provides the following technical solutions:
[0007] An ultra-high temperature adhesive bonding device for electronic packaging, comprising a base and a fixing mechanism. A box body is provided on the base. A box door is hinged to the box body through a hinge. A heating plate is installed on the box body. A glue storage box is provided on the outer wall of the top of the box body. A glue filling head is installed on the inner wall of the top of the box body. The glue filling head is communicated with the glue storage box. A guiding groove is opened on the base. The fixing mechanism includes a motor, a bidirectional screw, a guiding block and a clamping plate. The motor is installed on the outer wall of the base. One end of the bidirectional screw is rotatably connected to the inner wall of the guiding groove. The other end of the bidirectional screw is fixedly connected to the output end of the motor. The number of the guiding blocks is two. The two guiding blocks are symmetrically arranged on the bidirectional screw and are threadedly connected with the bidirectional screw. A slot is opened on the guiding block. An insertion block is provided on the outer wall of the bottom of the clamping plate. The clamping plate is connected with the slot through the insertion block in an embedded manner. An arc-shaped clamping plate is provided on the outer wall of the clamping plate.
[0008] Preferably, an observation window is opened on the box door, and a transparent glass is embedded in the observation window.
[0009] Preferably, a plurality of supporting seats are installed on the outer wall of the bottom of the base, and the plurality of supporting seats are evenly distributed at the four corners of the bottom of the base.
[0010] Preferably, a limiting groove is opened on the inner wall of the guiding groove, and a limiting block is provided on the outer wall of the guiding block. The guiding block is connected with the limiting groove through the limiting block in an embedded manner.
[0011] Furthermore, a first magnetic block is installed on the inner wall of the bottom of the slot, and a second magnetic block is provided on the outer wall of the bottom of the insertion block. The positions of the first magnetic block and the second magnetic block correspond to each other and have opposite magnetic polarities.
[0012] Preferably, rubber gaskets are bonded on the outer walls of the clamping plate and the arc-shaped clamping plate, and the rubber gaskets match the clamping plate and the arc-shaped clamping plate in terms of size and structure.
[0013] In the above technical solution, the technical effects and advantages provided by the present utility model are as follows:
[0014] 1. In the present utility model, during the use process, by adjusting the directions of the clamping plate and the arc-shaped clamping plate, the device can provide a good fixing effect for electronic components of different shapes, effectively improving the applicability of the device during the use process, and the overall practicality is strong. Description of the Drawings
[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings.
[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;
[0017] Figure 2 is a schematic diagram of the cross-sectional structure of the box body of the present utility model;
[0018] Figure 3 is a schematic diagram of the base structure of the present utility model;
[0019] Figure 4 is a schematic diagram of the fixing mechanism structure of the present utility model;
[0020] Figure 5 is a schematic diagram of the guide block structure of the present utility model;
[0021] Figure 6 is a schematic diagram of the clamping plate structure of the present utility model.
[0022] Explanation of reference numerals:
[0023] 1. Base; 2. Box body; 3. Box door; 4. Heating plate; 5. Glue storage box; 6. Fixing mechanism; 7. Observation window; 8. Support seat; 9. Glue filling head; 10. Guide groove; 11. Motor; 12. Bi-directional screw; 13. Guide block; 14. Clamping plate; 15. Slot; 16. Limit block; 17. Insert block; 18. Arc-shaped clamping plate. Specific implementation manners
[0024] In order to enable those skilled in the art to better understand the technical solution of the present utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0025] An ultra-high temperature glue bonding device for electronic packaging is disclosed in an embodiment of the present utility model.
[0026] The present utility model provides as Figure 1-6An ultra-high temperature glue bonding device for electronic packaging as shown, including a base 1 and a fixing mechanism 6. A box body 2 is provided on the base 1. A box door 3 is hinged to the box body 2 through a hinge. A heating plate 4 is installed on the box body 2. A glue storage box 5 is provided on the outer wall of the top of the box body 2. A glue filling head 9 is installed on the inner wall of the top of the box body 2. The glue filling head 9 is communicated with the glue storage box 5. A guide groove 10 is opened on the base 1. The fixing mechanism 6 includes a motor 11, a bidirectional screw 12, a guide block 13 and a clamping plate 14. The motor 11 is installed on the outer wall of the base 1. One end of the bidirectional screw 12 is rotatably connected to the inner wall of the guide groove 10. The other end of the bidirectional screw 12 is fixedly connected to the output end of the motor 11. The number of the guide blocks 13 is two. The two guide blocks 13 are symmetrically arranged on the bidirectional screw 12 and are threadedly connected to the bidirectional screw 12. A slot 15 is opened on the guide block 13. An insertion block 17 is provided on the outer wall of the bottom of the clamping plate 14. The clamping plate 14 is connected to the slot 15 through the insertion block 17 in an embedded manner. An arc-shaped clamping plate 18 is provided on the outer wall of the clamping plate 14.
[0027] For an ultra-high temperature glue bonding device for electronic packaging of the present utility model, an observation window 7 is opened on the box door 3. A transparent glass is inlaid in the observation window 7, which can facilitate observing the situation inside the box body 2.
[0028] For an ultra-high temperature glue bonding device for electronic packaging of the present utility model, a plurality of support seats 8 are installed on the outer wall of the bottom of the base 1. The plurality of support seats 8 are evenly distributed at the four corners of the bottom of the base 1, which can provide a stable supporting effect and ensure the stability of the whole device during use.
[0029] For an ultra-high temperature glue bonding device for electronic packaging of the present utility model, a limiting groove is opened on the inner wall of the guide groove 10. A limiting block 16 is provided on the outer wall of the guide block 13. The guide block 13 is connected to the limiting groove through the limiting block 16 in an embedded manner, which can provide a limiting and guiding effect for the guide block 13 and prevent the guide block 13 from rotating with the rotation of the bidirectional screw 12.
[0030] For an ultra-high temperature glue bonding device for electronic packaging of the present utility model, a first magnet is installed on the inner wall of the bottom of the slot 15. A second magnet is provided on the outer wall of the bottom of the insertion block 17. The positions of the first magnet and the second magnet correspond and are opposite in magnetism, which can facilitate providing a fixing effect for the clamping plate 14 and prevent the insertion block 17 from separating from the slot 15 during use, affecting the use effect.
[0031] For an ultra-high temperature glue bonding device for electronic packaging of the present utility model, rubber gaskets are bonded to the outer walls of the clamping plate 14 and the arc-shaped clamping plate 18. The rubber gaskets match the sizes and structures of the clamping plate 14 and the arc-shaped clamping plate 18. It can not only improve the friction with the electronic device and enhance the fixing effect, but also protect the appearance of the electronic device and prevent it from being damaged.
[0032] During use, place the electronic component to be encapsulated in the middle of the base 1. Then, select the corresponding clamping surface according to the shape of the electronic component. When the clamping surface needs to be adjusted, simply pull the clamping plate 14 with an external force to disengage the insertion block 17 from the slot 15. Then, after adjusting the clamping surface to correspond to the electronic component, insert the insertion block 17 into the slot 15. Then, start the motor 11 to drive the rotation of the bidirectional screw 12. Since the guide block 13 is threadedly connected to the bidirectional screw 12 and is limited by the limit block 16, it can drive the clamping plate 14 to move towards each other, thereby clamping and fixing the electronic component. Then, perform glue filling and encapsulation on it through the glue filling head 9. After the filling is completed, start the heating plate 4 to heat the inside of the box body 2 to ensure the encapsulation effect and efficiency.
[0033] Only some exemplary embodiments of the present invention have been described by way of illustration. Undoubtedly, for those of ordinary skill in the art, the described embodiments can be modified in various different ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of the claims of the present invention.
Claims
1. An ultra-high temperature adhesive bonding device for electronic packaging, comprising a base (1) and a fixing mechanism (6), characterized in that, A box body (2) is provided on the base (1). A box door (3) is hinged to the box body (2) through a hinge. A heating plate (4) is installed on the box body (2). A glue storage box (5) is provided on the outer wall of the top of the box body (2). A glue filling head (9) is installed on the inner wall of the top of the box body (2). The glue filling head (9) is communicated with the glue storage box (5). A guiding groove (10) is formed on the base (1). The fixing mechanism (6) includes a motor (11), a bidirectional screw (12), a guiding block (13) and a clamping plate (14). The motor (11) is installed on the outer wall of the base (1). One end of the bidirectional screw (12) is rotatably connected to the inner wall of the guiding groove (10). The other end of the bidirectional screw (12) is fixedly connected to the output end of the motor (11). The number of the guiding blocks (13) is two. The two guiding blocks (13) are symmetrically arranged on the bidirectional screw (12) and are in threaded connection with the bidirectional screw (12). A slot (15) is formed on the guiding block (13). An inserting block (17) is provided on the outer wall of the bottom of the clamping plate (14). The clamping plate (14) is in interference fit connection with the slot (15) through the inserting block (17). An arc-shaped clamping plate (18) is provided on the outer wall of the clamping plate (14).
2. The ultra-high temperature adhesive bonding device for electronic packaging according to claim 1, characterized in that, An observation window (7) is formed on the box door (3), and a transparent glass is inlaid in the observation window (7).
3. The ultra-high temperature adhesive bonding device for electronic packaging according to claim 1, characterized in that, A plurality of supporting seats (8) are installed on the outer wall of the bottom of the base (1). The plurality of supporting seats (8) are evenly distributed at the four corners of the bottom of the base (1).
4. The ultra-high temperature adhesive bonding device for electronic packaging according to claim 1, characterized in that, A limiting groove is formed on the inner wall of the guiding groove (10). A limiting block (16) is provided on the outer wall of the guiding block (13). The guiding block (13) is in interference fit connection with the limiting groove through the limiting block (16).
5. The ultra-high temperature adhesive bonding device for electronic packaging according to claim 1, wherein, A first magnet is installed on the inner wall of the bottom of the slot (15). A second magnet is provided on the outer wall of the bottom of the inserting block (17). The positions of the first magnet and the second magnet correspond to each other and have opposite magnetic polarities.
6. The ultra-high temperature adhesive bonding device for electronic packaging according to claim 1, wherein Rubber gaskets are adhered to the outer walls of the clamping plate (14) and the arc-shaped clamping plate (18). The rubber gaskets match the clamping plate (14) and the arc-shaped clamping plate (18) in size and structure.