High-stability solder ball

By coating an antioxidant layer and an electrostatic layer on the surface of the hot balls, and installing round holes inside to coat low-melting glass powder, the problems of oxidation and electrostatic of the hot balls are solved, the oxidation resistance and welding stability of the hot balls are improved, the melting rate is increased, and the welding effect is improved.

CN223083961UActive Publication Date: 2025-07-11SUZHOU JIELIAN MICRO SEMICON MATERIALS CO LTD
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Patent Information

Application Number
CN202422213379.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-10
Publication Date
2025-07-11
Estimated Expiration
2034-09-10

AI Technical Summary

Technical Problem

The existing hot balls are oxidized before use, affecting stability, and generate static electricity and slow melting rate during heating and melting, affecting the welding effect.

Method used

The antioxidant layer is coated on the surface of the hot ball and an electrostatic layer is installed inside. The electrostatic layer is made of carbon fiber composite material, with round holes inside and low-melting glass powder to enhance oxidation resistance and electrostatic conduction ability.

Benefits of technology

It improves the oxidation resistance and welding stability of the hot balls, speeds up the melting rate, and improves the welding effect.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223083961U_ABST
Patent Text Reader

Abstract

The utility model provides a solder ball with high stability, which relates to the field of solder balls with high stability and comprises a first tin layer, an anti-oxidation layer is coated on the surface of the first tin layer, an electrostatic layer is fixedly mounted in the first tin layer, and a second tin layer is fixedly mounted in the electrostatic layer. The anti-oxidation layer coated on the surface of the first tin layer is made of a nickel coating, so that the oxidation resistance of the tin ball is improved, the static electricity generated in the fusion welding process is dissipated through the static electricity layer between the first tin layer and the second tin layer which is made of a carbon fiber composite material, the welding stability is improved, and the service life of the tin ball is prolonged. The contact area is increased when the solder ball is heated through the multiple round holes formed in the first tin layer, the electrostatic layer and the second tin layer, the solder ball is better melted, the oxidation resistance of the solder ball is improved through the protective layer fixedly installed on the surface of the inner wall of each round hole and made of low-melting-point glass powder, meanwhile, fluxing is conducted on melting of the solder ball, and the melting welding effect of the solder ball is more stable.
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Description

Technical Field

[0001] The utility model relates to the technical field of high-stability solder balls, in particular to a solder ball with high stability. Background Art

[0002] Solder balls are widely used in tinplate, fluxes, organic synthesis, chemical production, alloy manufacturing, and the assembly of multiple integrated circuits in the electronics industry. They are also used as reagents for determining arsenic and phosphates, reducing agents, and tin-plated products.

[0003] In the prior art, the surface of the solder ball will be oxidized by oxygen in the air before use, affecting the subsequent use and stability of the solder ball. Static electricity will be generated during the heating and melting process, affecting the welding stability of the solder ball, and the melting rate is slow during the heating and melting process of the solder ball, and the efficiency is not fast enough. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a solder ball with high stability to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A solder ball with high stability, including: a first tin layer, an antioxidant layer is coated on the surface of the first tin layer, an electrostatic layer is fixedly installed inside the first tin layer, and a second tin layer is fixedly installed inside the electrostatic layer.

[0006] As a preferred embodiment, the material of the antioxidant layer is a nickel coating.

[0007] As a preferred embodiment, the surface of the electrostatic layer is fixedly installed on the inner wall of the first tin layer, the inside of the electrostatic layer is fixedly installed on the surface of the second tin layer, and the material of the electrostatic layer is a carbon fiber composite material.

[0008] As a preferred embodiment, circular holes are equidistantly opened inside the first tin layer, circular holes are equidistantly opened inside the electrostatic layer, and circular holes are equidistantly opened inside the second tin layer.

[0009] As a preferred embodiment, a protective layer is fixedly installed on the surface of the inner wall of the circular hole, and the material of the protective layer is low-melting glass powder.

[0010] Compared with the prior art, the advantages and positive effects of the utility model are as follows:

[0011] 1. In this utility model, the anti-oxidation layer coated on the surface of the first tin layer is made of nickel coating, which makes the anti-oxidation performance of the solder ball better. The static electricity layer fixed between the first tin layer and the second tin layer is made of carbon fiber composite material, which can conduct and dissipate the static electricity generated during the melting welding process of the solder ball, reduce damage, and make the welding effect more stable through the carbon fiber composite material.

[0012] 2. In this utility model, multiple round holes are provided inside the first tin layer, the static electricity layer and the second tin layer, which increases the contact area between the solder ball and heat during use, enabling the solder ball to melt faster and better. The protective layer fixed on the surface of the round holes is made of low-melting-point glass powder, which improves the anti-oxidation property of the solder ball, helps in the melting during the welding process, and makes the welding effect better. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a side view of a highly stable solder ball provided by this utility model;

[0014] Figure 2 It is a cut-away view of a highly stable solder ball provided by this utility model;

[0015] Figure 3 It is a cut-away view of the protective layer of a highly stable solder ball provided by this utility model.

[0016] LEGEND DESCRIPTION:

[0017] 1. First tin layer; 2. Anti-oxidation layer; 3. Static electricity layer; 4. Second tin layer; 5. Round hole; 6. Protective layer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of this utility model will be clearly and completely described in conjunction with the drawings in the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, rather than all of the embodiments. Based on the embodiments in this utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this utility model.

[0019] Please refer to Figures 1 - 3 , this utility model provides a technical solution: a highly stable solder ball, including: a first tin layer 1, an anti-oxidation layer 2 is coated on the surface of the first tin layer 1, a static electricity layer 3 is fixedly installed inside the first tin layer 1, and a second tin layer 4 is fixedly installed inside the static electricity layer 3.

[0020] Specifically: the anti-oxidation layer 2 coated on the surface of the first tin layer 1 makes the entire solder ball have good anti-oxidation performance, making the solder ball more perfect. The static electricity layer 3 absorbs the static electricity generated during the use of the solder ball, making the welding effect better.

[0021] In one embodiment, the material of the antioxidant layer 2 is a nickel coating.

[0022] Specifically: The antioxidant layer 2 coated on the surface of the first tin layer 1 is made of a nickel coating. Plating nickel on the surface of the first tin layer 1 can provide it with good antioxidant properties. Nickel is relatively stable in the air and can effectively prevent the underlying metal from being oxidized. At the same time, nickel has good solderability and can be well combined with the solder during the welding process, without having a negative impact on the welding effect, enabling the solder balls to have better antioxidant properties when not in use. During use, due to the solderability of nickel, the solder balls can be welded better, making the welding more stable.

[0023] In one embodiment, the surface of the static electricity layer 3 is fixedly installed on the inner wall of the first tin layer 1, and the inside of the static electricity layer 3 is fixedly installed on the surface of the second tin layer 4. The material of the static electricity layer 3 is a carbon fiber composite material.

[0024] Specifically: During the process of using the solder balls for welding, since the material of the static electricity layer 3 is a carbon fiber composite material, carbon fiber itself has good electrical conductivity. The carbon fiber composite material formed by combining it with a suitable resin matrix can help the heat to be evenly distributed during welding, improving the quality and efficiency of welding. According to the carbon fiber composite material, static electricity can be effectively conducted and dissipated, reducing the impact of static electricity during welding and minimizing the harm to the welded components, making the welding of the solder balls more stable.

[0025] In one embodiment, circular holes 5 are equidistantly opened inside the first tin layer 1, circular holes 5 are equidistantly opened inside the static electricity layer 3, and circular holes 5 are equidistantly opened inside the second tin layer 4.

[0026] Specifically: Through the multiple circular holes 5 opened inside the first tin layer 1, the static electricity layer 3, and the second tin layer 4, when the solder balls are heated and melted, the contact area between the solder balls and the heat is increased, enabling the solder balls to melt more quickly and facilitating the welding process more rapidly, making the welding of the solder balls more convenient and faster.

[0027] In one embodiment, a protective layer 6 is fixedly installed on the surface of the inner wall of the circular hole 5, and the material of the protective layer 6 is low-melting-point glass powder.

[0028] Specifically: While the circular hole 5 expands the heating area, due to the material of the protective layer 6 fixedly installed on the surface of the inner wall of the circular hole 5 being low-melting-point glass powder, it has good antioxidant properties. During the process of using the solder balls for welding, the low-melting-point glass powder melts at a certain temperature and fuses with the solder, reducing the surface tension of the solder and promoting the spreading and wetting of the solder on the metal surface to achieve fluxing. At the same time, after the low-melting-point glass powder is fluxed, the glass layer can isolate the air, further preventing the oxidation of the welded area, making the welding effect of the solder balls faster and better, and making the solder balls more perfect.

[0029] Working principle: When the solder ball is in use, the antioxidant layer 2 coated on the surface of the first tin layer 1 is made of nickel coating. Plating nickel on the surface of the first tin layer 1 can provide good antioxidant performance. Nickel is relatively stable in the air and can effectively prevent the first tin layer 1 inside the antioxidant layer 2 from being oxidized. At the same time, nickel has good solderability and can be well combined with the solder during the welding process without having a negative impact on the welding effect, enabling the solder ball to have better antioxidant properties when not in use. During use, the solderability of nickel enables the solder ball to be welded better, making the welding more stable. The electrostatic layer 3 fixed between the first tin layer 1 and the second tin layer 4 is made of carbon fiber composite material. Carbon fiber itself has good electrical conductivity. The carbon fiber composite material formed by compounding it with a suitable resin matrix can help the heat be evenly distributed during welding, improving the quality and efficiency of welding, effectively conducting and dissipating static electricity according to the carbon fiber composite material, reducing the impact of static electricity during welding, reducing the harm to the welded components, making the welding of the solder ball more stable, thereby enabling the solder ball to have better antioxidant properties and being able to dissipate static electricity during the welding process, making the welding effect of the solder ball more stable; during welding, through the multiple circular holes 5 opened inside the first tin layer 1, the electrostatic layer 3 and the second tin layer 4, when the solder ball is heated and melted, by increasing the contact area between the solder ball and the heat, the solder ball can be melted and welded faster, making the use of the solder ball more convenient and fast. The protective layer 6 fixed on the surface of the circular hole 5 is made of low melting point glass powder. According to its good antioxidant property, during welding, the low melting point glass powder melts at a certain temperature and fuses with the solder, reducing the surface tension of the solder, promoting the spreading and wetting of the solder on the metal surface, achieving fluxing, and making the welding effect of the solder ball better and more perfect.

[0030] The above is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, as long as it does not depart from the technical solution content of the present invention, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the protection scope of the technical solution of the present invention.

Claims

1. A highly stable solder ball, characterized in that, Including: A first tin layer (1), on the surface of the first tin layer (1) there is provided an antioxidant layer (2), inside the first tin layer (1) there is fixedly installed an electrostatic layer (3), and inside the electrostatic layer (3) there is fixedly installed a second tin layer (4).

2. The high-stability solder ball according to claim 1, characterized in that: The antioxidant layer (2) is made of a nickel coating.

3. A highly stable solder ball according to claim 1, wherein: The surface of the electrostatic layer (3) is fixedly installed on the inner wall of the first tin layer (1), and the inside of the electrostatic layer (3) is fixedly installed on the surface of the second tin layer (4). The electrostatic layer (3) is made of a carbon fiber composite material.

4. A highly stable solder ball according to claim 1, characterized in that: Inside the first tin layer (1), circular holes (5) are equidistantly provided. Inside the electrostatic layer (3), circular holes (5) are equidistantly provided. Inside the second tin layer (4), circular holes (5) are equidistantly provided.

5. The high-stability solder ball according to claim 4, wherein: On the surface of the inner wall of the circular hole (5), there is fixedly installed a protective layer (6), and the protective layer (6) is made of low-melting-point glass powder.