Wafer positioning and processing device

Abstract

The utility model discloses a wafer positioning and processing device, which belongs to the technical field of wafer positioning and processing and comprises a processing box, a motor is fixedly connected to the outer side of the processing box, an output shaft is fixedly connected to the output end of the motor, and a first bevel gear is fixedly connected to one end, far away from the motor, of the output shaft. According to the wafer polishing device, the motor is started to drive the output shaft to rotate, so that the rotating shaft and the placing plate can drive a wafer placed above to rotate, the polishing disc can be driven to rotate at the same time, the wafer is polished through the polishing disc, and the polishing efficiency is improved. According to the wafer polishing device, the machining and production cost can be saved, the polishing efficiency is improved, the vertical plate can push the mounting rod and the polishing disc to move by rotating the first threaded rod, polishing is conducted according to wafers of different sizes, and the universality of the wafer polishing device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer positioning and processing, in particular to a wafer positioning and processing device. Background Technique

[0002] In the fields of semiconductor and microelectronics technology, the processing and treatment of wafers are extremely crucial links. As the basic material for manufacturing integrated circuits (ICs), the surface accuracy and geometric dimensions of wafers have a decisive impact on the performance of the final products. Therefore, the positioning and processing accuracy of wafers become the key factors for improving chip quality and production efficiency.

[0003] Traditional wafer processing methods mostly rely on manual or semi-automatic equipment, which have problems such as low positioning accuracy, low processing efficiency, and high costs. Especially for the grinding treatment of the wafer surface, separate processing equipment and steps are usually required, which not only increases the complexity of the process flow but also raises the production cost. In addition, the debris generated during the grinding process by traditional equipment is prone to splashing, posing a potential threat to the working environment and the health of the staff. Content of the Utility Model

[0004] The utility model solves the technical problems in the above background technique and provides a wafer positioning and processing device.

[0005] The technical solution provided by the utility model to solve the above technical problems is as follows:

[0006] A wafer positioning and processing device includes a processing box. A motor is fixedly connected to the outside of the processing box. An output shaft is fixedly connected to the output end of the motor. A first bevel gear is fixedly connected to the end of the output shaft away from the motor. The first bevel gear is meshed with a second bevel gear. A rotating shaft is fixedly connected to the second bevel gear. A placement plate is fixedly connected to the end of the rotating shaft away from the second bevel gear.

[0007] Preferably, a first pulley is fixedly connected to the output shaft. A transmission belt is provided on the first pulley. A second pulley is provided at the end of the transmission belt away from the first pulley. A mounting rod is connected to the second pulley through a flat key. A grinding disc is fixedly connected to one end of the mounting rod. A first threaded rod is rotatably connected to the outside of the processing box. A vertical plate is threadedly connected to the first threaded rod. A limiting rod is fixedly connected to the processing box. The vertical plate slides on the limiting rod.

[0008] Preferably, a second threaded rod is rotatably connected through the processing box. A turning handle is fixedly connected to one end of the second threaded rod. Connecting rods are respectively threadedly connected to both sides of the second threaded rod. A clamping plate is fixedly connected below the connecting rods. A rotating wheel is rotatably connected inside the clamping plate. A limiting groove is provided in the processing box.

[0009] Preferably, the rotating shaft is rotatably connected inside the processing box. The first pulley, the transmission belt, and the second pulley are located inside the processing box. The second pulley is rotatably connected inside the processing box. The mounting rod penetrates through the processing box, and one end of the mounting rod is rotatably connected to the vertical plate.

[0010] Preferably, two sets of opposite thread structures are provided on the second threaded rod, and the rotating handle is located outside the processing box.

[0011] Preferably, the shape of the clamping plate is arc-shaped. The clamping plates are located on both sides of the placement plate, and three rotating wheels are respectively provided on each set of clamping plates.

[0012] Preferably, the connecting rod slides in the limiting groove, and the grinding disc is perpendicular to the placement plate and located on one side of the placement plate.

[0013] With the above structure, the present utility model has the following advantages:

[0014] 1. By starting the motor to drive the output shaft to rotate, the present utility model can not only make the rotating shaft and the placement plate drive the wafer placed above to rotate, but also drive the grinding disc to rotate simultaneously, so that the grinding disc grinds the wafer. This can not only save the processing and production costs, but also improve the grinding efficiency. And by rotating the first threaded rod, the vertical plate can be pushed to move the mounting rod and the grinding disc, so as to grind wafers of different sizes, improving the versatility of the device.

[0015] 2. When the present utility model grinds the wafer, it is located inside the processing box, which can effectively prevent the debris generated during grinding from popping out and avoid harm to the staff. Then, by rotating the second threaded rod, the clamping plate can be driven by the connecting rod to clamp the wafer placed on the placement plate to achieve positioning. And rotating wheels are provided inside the clamping plate, so that the wafer will not be affected during rotation and grinding, improving the practicability and stability of the device.

[0016] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, other aspects, embodiments, and features of the present utility model will be readily apparent by referring to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of a wafer positioning and processing device of the present utility model;

[0019] Figure 2 It is a cross-sectional view of a wafer positioning and processing device of the present utility model;

[0020] Figure 3 It is an exploded view of a partial structure of a wafer positioning and processing device of the present utility model.

[0021] As shown in the figure: 1. Processing box; 2. Motor; 3. Output shaft; 4. First bevel gear; 5. Second bevel gear; 6. Rotating shaft; 7. Placing plate; 8. First pulley; 9. Transmission belt; 10. Second pulley; 11. Flat key; 12. Mounting rod; 13. Grinding disc; 14. First threaded rod; 15. Vertical plate; 16. Limiting rod; 17. Second threaded rod; 18. Turning handle; 19. Connecting rod; 20. Clamping plate; 21. Rotating wheel; 22. Limiting groove. Specific embodiments

[0022] The following details the embodiments of the present application. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application.

[0023] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0024] The following further details the present utility model in combination with the full text:

[0025] Combined with the attached Figures 1 to 3, A wafer positioning and processing device, including a processing box 1. A motor 2 is fixedly connected to the outside of the processing box 1. The output end of the motor 2 is fixedly connected to an output shaft 3. One end of the output shaft 3 away from the motor 2 is fixedly connected to a first bevel gear 4. The first bevel gear 4 is meshed with a second bevel gear 5. A rotating shaft 6 is fixedly connected to the second bevel gear 5. One end of the rotating shaft 6 away from the second bevel gear 5 is fixedly connected to a placement plate 7. By starting the motor 2 to drive the output shaft 3 to rotate, not only can the rotating shaft 6 and the placement plate 7 drive the wafer placed above to rotate, but also the grinding disc 13 can be driven to rotate at the same time, so that the grinding disc 13 grinds the wafer. This can not only save the processing and production costs, but also improve the grinding efficiency. And by rotating the first threaded rod 14, the vertical plate 15 can be made to push the mounting rod 12 and the grinding disc 13 to move, so as to grind wafers of different sizes, improving the versatility of this device.

[0026] Among them, a first pulley 8 is fixedly connected to the output shaft 3. A transmission belt 9 is arranged on the first pulley 8. A second pulley 10 is arranged at one end of the transmission belt 9 away from the first pulley 8. A mounting rod 12 is connected to the second pulley 10 through a flat key 11. One end of the mounting rod 12 is fixedly connected to a grinding disc 13. A first threaded rod 14 is rotatably connected to the outside of the processing box 1. A vertical plate 15 is threadedly connected to the first threaded rod 14. A limiting rod 16 is fixedly connected to the processing box 1. The vertical plate 15 slides on the limiting rod 16. A second threaded rod 17 is rotatably connected through the processing box 1. One end of the second threaded rod 17 is fixedly connected to a turning handle 18. Connecting rods 19 are respectively threadedly connected to both sides of the second threaded rod 17. A clamping plate 20 is fixedly connected below the connecting rod 19. A rotating wheel 21 is rotatably connected inside the clamping plate 20. A limiting groove 22 is arranged inside the processing box 1. The rotating shaft 6 is rotatably connected inside the processing box 1. The first pulley 8, the transmission belt 9, and the second pulley 10 are located inside the processing box 1. The second pulley 10 is rotatably connected inside the processing box 1. The mounting rod 12 penetrates the processing box 1. One end of the mounting rod 12 is rotatably connected to the vertical plate 15. The second threaded rod 17 is provided with two groups of opposite thread structures. The turning handle 18 is located outside the processing box 1. The shape of the clamping plate 20 is arc-shaped. The clamping plate 20 is located on both sides of the placement plate 7. Each group of clamping plates 20 is respectively provided with three rotating wheels 21. The connecting rod 19 slides inside the limiting groove 22. The grinding disc 13 is perpendicular to the placement plate 7 and is located on one side of the placement plate 7. When grinding the wafer, it is located inside the processing box 1, which can effectively prevent the debris generated during grinding from popping out and avoid harm to the staff. Then, by rotating the second threaded rod 17, the clamping plate 20 can be driven through the connecting rod 19 to clamp the wafer placed on the placement plate 7 to achieve positioning. And a rotating wheel 21 is arranged inside the clamping plate 20, which will not be affected when the wafer rotates and is ground, improving the practicability and stability of this device.

[0027] Working principle of the utility model: When in use, the operator first places the wafer to be polished on the placement plate 7, and then manually rotates the turning handle 18 to drive the second threaded rod 17 to rotate. At this time, the two connecting rods 19 slide towards the middle in the limiting grooves 22 at the same time, so that the rotating wheels 21 on the two clamping plates 20 are attached to the wafer, and then the wafer can be in a centered and clamped state. Then, manually rotate the first threaded rod 14 to push the vertical plate 15 to slide on the limiting rod 16, so that the mounting rod 12 drives the grinding disc 13 to move towards the wafer until it is attached to the wafer. Finally, start the motor 2 to drive the output shaft 3 to rotate. The output shaft 3 drives the first bevel gear 4 to rotate, and drives the rotating shaft 6 to rotate on the processing box 1 through the second bevel gear 5. At this time, the placement plate 7 drives the wafer to rotate, and drives the rotating wheel 21 to rotate in the clamping plate 20 under the action of the rotating wheel 21. While the output shaft 3 rotates, it drives the first pulley 8 to rotate. At this time, the second pulley 10 is driven to rotate in the processing box 1 through the transmission belt 9, and the mounting rod 12 is driven to rotate on the vertical plate 15 through the flat key 11, and drives the grinding disc 13 to rotate to polish the side of the wafer.

[0028] The above describes the present utility model and its implementation manners. This description is not restrictive. What is shown throughout the text is only one of the implementation manners of the present utility model, and the actual structure is not limited thereto. All in all, if those of ordinary skill in the art are inspired by it and design similar structural manners and embodiments without creative efforts without departing from the creative purpose of the present utility model, they shall fall within the protection scope of the present utility model.

Claims

1. A wafer positioning and processing device, comprising a processing box (1), characterized in that: A motor (2) is fixedly connected to the outer side of the processing box (1). The output end of the motor (2) is fixedly connected to an output shaft (3). One end of the output shaft (3) away from the motor (2) is fixedly connected to a first bevel gear (4). The first bevel gear (4) is meshed with a second bevel gear (5). A rotating shaft (6) is fixedly connected to the second bevel gear (5). One end of the rotating shaft (6) away from the second bevel gear (5) is fixedly connected to a placement plate (7).

2. A wafer positioning and processing device according to claim 1, characterized in that: A first pulley (8) is fixedly connected to the output shaft (3). A transmission belt (9) is arranged on the first pulley (8). A second pulley (10) is arranged at one end of the transmission belt (9) away from the first pulley (8). A mounting rod (12) is connected to the second pulley (10) through a flat key (11). One end of the mounting rod (12) is fixedly connected to a grinding disc (13). A first threaded rod (14) is rotatably connected to the outer side of the processing box (1). A vertical plate (15) is threadedly connected to the first threaded rod (14). A limiting rod (16) is fixedly connected to the processing box (1). The vertical plate (15) slides on the limiting rod (16).

3. The wafer positioning and processing device according to claim 2, characterized in that: A second threaded rod (17) is rotatably connected through the processing box (1). One end of the second threaded rod (17) is fixedly connected to a turning handle (18). Connecting rods (19) are respectively threadedly connected to both sides of the second threaded rod (17). A clamping plate (20) is fixedly connected below the connecting rod (19). A rotating wheel (21) is rotatably connected inside the clamping plate (20). A limiting groove (22) is arranged inside the processing box (1).

4. A wafer positioning and processing device according to claim 3, characterized in that: The rotating shaft (6) is rotatably connected inside the processing box (1). The first pulley (8), the transmission belt (9), and the second pulley (10) are located inside the processing box (1). The second pulley (10) is rotatably connected inside the processing box (1). The mounting rod (12) penetrates through the processing box (1). One end of the mounting rod (12) is rotatably connected to the vertical plate (15).

5. A wafer positioning and processing device according to claim 4, characterized in that: Two sets of opposite thread structures are arranged on the second threaded rod (17). The turning handle (18) is located outside the processing box (1).

6. A wafer positioning and processing device according to claim 5, wherein: The shape of the clamping plate (20) is arc-shaped. The clamping plate (20) is located on both sides of the placement plate (7). Three rotating wheels (21) are respectively arranged on each group of the clamping plates (20).

7. A wafer positioning and processing device according to claim 6, characterized in that: The connecting rod (19) slides inside the limiting groove (22). The grinding disc (13) is perpendicular to the placement plate (7) and is located on one side of the placement plate (7).

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