Wafer PI layer removing device

Abstract

The utility model relates to the technical field of wafers, in particular to a wafer PI layer removing device which comprises a supporting table, a first sliding groove is formed in the supporting table, a working table is connected in the first sliding groove in a sliding mode, a placing plate is fixedly connected to the working table, a second sliding groove is formed in the working table, a first motor is fixedly connected to the lower portion of the working table, and a second motor is fixedly connected to the lower portion of the working table. The output end of the first motor is fixedly connected with a rotating plate, and the rotating plate is rotationally connected with a first connecting rod. According to the utility model, a wafer is placed above the placing plate, then the motor I is started, and the output end of the motor I drives the rotating plate to rotate, so that the four groups of connecting rods I are driven to rotate below the rotating plate, the connecting rods II are driven to rotate at the same time, the sliding blocks slide in the sliding chutes II, and the clamping blocks are driven to slide inwards on the workbench from four directions; therefore, the wafer can be clamped from the periphery, the wafer can keep certain stability in the process of removing the PI layer, and the PI layer on the surface of the wafer can be removed more comprehensively.

Description

Technical Field

[0001] The utility model relates to the technical field of wafers, in particular to a device for removing the PI layer of a wafer. Background Technique

[0002] The technical background of removing the PI (polyimide) layer of a wafer mainly involves the cleaning and degumming steps in the semiconductor manufacturing process. These steps are crucial for ensuring the cleanliness and impurity-free surface of the wafer and the smooth progress of subsequent processing steps. In some process steps, the PI layer needs to be removed to expose the underlying material layers, such as metal layers, insulating layers, etc., for subsequent processing or testing.

[0003] At present, when the existing device for removing the PI layer of a wafer is in use, the following defects still exist: when removing the PI layer of the wafer by grinding, the surface of the wafer cannot be cleaned, which easily generates more impurities, and the wafer cannot be accurately fixed, affecting the stability of the wafer during grinding. Content of the Utility Model

[0004] The purpose of the utility model is to solve the defects existing in the prior art, and to propose a device for removing the PI layer of a wafer.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: a device for removing the PI layer of a wafer, including a support table, a first chute is arranged on the support table, a workbench is slidably connected in the first chute, a placement plate is fixedly connected to the workbench, a second chute is arranged on the workbench, a first motor is fixedly connected below the workbench, the output end of the first motor is fixedly connected with a rotating plate, a first connecting rod is rotatably connected to the rotating plate, one end of the first connecting rod is rotatably connected with a second connecting rod, one end of the second connecting rod is rotatably connected with a slider, a clamping block is fixedly connected to the slider, and a hand push rod is fixedly connected to one end of the workbench.

[0006] As a further description of the above technical scheme:

[0007] One end of the support table is rotatably connected with a handle, one end of the handle is fixedly connected with a first threaded rod, a first auxiliary block is threadedly connected to the first threaded rod, one end of the first auxiliary block is rotatably connected with a second threaded rod, a second auxiliary block is threadedly connected to the second threaded rod, a third connecting rod is rotatably connected to the first auxiliary block, a fourth connecting rod is rotatably connected to the second auxiliary block, one end of the fourth connecting rod is rotatably connected with a support plate, and a second motor is fixedly connected to the support plate, and the output end of the second motor is fixedly connected with a grinding head.

[0008] As a further description of the above technical scheme:

[0009] One end of the support platform is fixedly connected with a material box, one end of the material box is fixedly connected with a discharge valve, a water pipe 1 is fixedly connected to the discharge valve, one end of the water pipe 1 is fixedly connected with a material pump, the output end of the material pump is fixedly connected with a water pipe 2, one end of the water pipe 2 is fixedly connected with a spray head, the support legs are fixedly connected below the support platform, and a feed valve is fixedly connected to one side of the material box.

[0010] As a further description of the above technical solution:

[0011] Four groups of the first connecting rod, the second connecting rod and the slider are respectively provided and evenly distributed below the workbench. The slider slides in the second chute, and the clamping block slides above the second chute.

[0012] As a further description of the above technical solution:

[0013] The first threaded rod and the second threaded rod are rotatably connected to the support platform. The first threaded rod and the second threaded rod are arranged in a mirror image of each other. One end of the third connecting rod is rotatably connected to the support plate.

[0014] As a further description of the above technical solution:

[0015] The grinding head is located above the placement plate. Four groups of the support legs are provided, and two groups of the first chutes are provided and respectively located at both ends of the support platform.

[0016] As a further description of the above technical solution:

[0017] The material pump is fixedly connected to the material box. The spray head penetrates and is fixedly connected to the support platform and is located on one side of the workbench.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the utility model, the wafer is placed above the placement plate, and then the first motor is started, so that the output end of the first motor drives the rotating plate to rotate, thereby driving the four first connecting rods to rotate below the rotating plate, and at the same time driving the second connecting rod to rotate, so that the slider slides in the second chute, thereby driving the clamping block to slide inward from four directions on the workbench, so as to realize the clamping of the wafer from all around, so that the wafer maintains a certain stability during the process of removing the PI layer, and the PI layer on the surface of the wafer is removed more comprehensively.

[0020] 2. In the utility model, the grinding fluid is injected into the material box through the feed valve, and then the discharge valve and the material pump are started, so that the grinding fluid is sprayed out from the spray head after passing through the discharge valve, the water pipe 1, the material pump and the water pipe 2 from the material box, so as to realize the cleaning of the wafer surface, wash away the impurities generated during the grinding process, ensure the cleanliness of the wafer surface, and at the same time play a certain cooling role, so as to avoid affecting the quality of the wafer after grinding due to too high temperature. Description of the Drawings

[0021] Figure 1 Structural schematic of a wafer PI layer removing device proposed by the present utility model Figure 1 ;

[0022] Figure 2 Structural schematic of a wafer PI layer removing device proposed by the present utility model Figure 2 ;

[0023] Figure 3 Partial structural schematic of a wafer PI layer removing device proposed by the present utility model Figure 1 ;

[0024] Figure 4 Partial structural schematic of a wafer PI layer removing device proposed by the present utility model Figure 2 。

[0025] Legend description:

[0026] 1. Support table; 2. First chute; 3. Workbench; 4. Placing plate; 5. Second chute; 6. First motor; 7. Rotating plate; 8. First connecting rod; 9. Second connecting rod; 10. Slide block; 11. Clamping block; 12. Hand push rod; 13. Handle; 14. First threaded rod; 15. First auxiliary block; 16. Second threaded rod; 17. Second auxiliary block; 18. Third connecting rod; 19. Fourth connecting rod; 20. Support plate; 21. Second motor; 22. Grinding head; 23. Material box; 24. Discharge valve; 25. First water pipe; 26. Material pump; 27. Second water pipe; 28. Sprayer; 29. Support leg; 30. Feed valve. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] Refer to Figures 1 - 4, an embodiment provided by the present utility model: a wafer PI layer removing device, including a support table 1, characterized in that: a first chute 2 is provided on the support table 1, a workbench 3 is slidably connected in the first chute 2, a placement plate 4 is fixedly connected to the workbench 3, a second chute 5 is provided on the workbench 3, a first motor 6 is fixedly connected below the workbench 3, an output end of the first motor 6 is fixedly connected to a rotating plate 7, a first connecting rod 8 is rotatably connected to the rotating plate 7, one end of the first connecting rod 8 is rotatably connected to a second connecting rod 9, one end of the second connecting rod 9 is rotatably connected to a slider 10, a clamping block 11 is fixedly connected to the slider 10, a hand push rod 12 is fixedly connected to one end of the workbench 3. Place the wafer above the placement plate 4, then turn on the first motor 6, so that the output end of the first motor 6 drives the rotating plate 7 to rotate, thereby driving the four first connecting rods 8 to rotate below the rotating plate 7, and at the same time driving the second connecting rod 9 to rotate, so that the slider 10 slides in the second chute 5, thereby driving the clamping block 11 to slide inwards from four directions on the workbench 3, so as to realize clamping the wafer from all around, keeping the wafer stable during the process of removing the PI layer, and making the PI layer on the surface of the wafer removed more comprehensively.

[0029] One end of the support table 1 is rotatably connected to a handle 13. One end of the handle 13 is fixedly connected to a first threaded rod 14. A first auxiliary block 15 is threadedly connected to the first threaded rod 14. One end of the first auxiliary block 15 is rotatably connected to a second threaded rod 16. A second auxiliary block 17 is threadedly connected to the second threaded rod 16. A third connecting rod 18 is rotatably connected to the first auxiliary block 15. A fourth connecting rod 19 is rotatably connected to the second auxiliary block 17. One end of the fourth connecting rod 19 is rotatably connected to a support plate 20. A second motor 21 is fixedly connected to the support plate 20. The output end of the second motor 21 is fixedly connected to a grinding head 22. One end of the support table 1 is fixedly connected to a material box 23. One end of the material box 23 is fixedly connected to a discharge valve 24. A first water pipe 25 is fixedly connected to the discharge valve 24. One end of the first water pipe 25 is fixedly connected to a material pump 26. The output end of the material pump 26 is fixedly connected to a second water pipe 27. One end of the second water pipe 27 is fixedly connected to a spray head 28. Support legs 29 are fixedly connected to the lower part of the support table 1. A feed valve 30 is fixedly connected to one side of the material box 23. There are four sets of the first connecting rod 8, the second connecting rod 9 and the slider 10, which are evenly distributed under the workbench 3. The slider 10 slides in the second chute 5. The clamping block 11 slides above the second chute 5. The first threaded rod 14 and the second threaded rod 16 are rotatably connected to the support table 1. The first threaded rod 14 and the second threaded rod 16 are arranged in a mirror image of each other. One end of the third connecting rod 18 is rotatably connected to the support plate 20. The grinding head 22 is located above the placing plate 4. There are four sets of support legs 29 and two sets of the first chutes 2, which are respectively located at both ends of the support table 1. The material pump 26 is fixedly connected to the material box 23. The spray head 28 is fixedly connected through the support table 1 and is located on one side of the workbench 3. The grinding fluid is injected into the material box 23 through the feed valve 30. Then, the discharge valve 24 and the material pump 26 are opened, so that the grinding fluid is sprayed out from the spray head 28 after passing through the discharge valve 24, the first water pipe 25, the material pump 26 and the second water pipe 27 from the material box 23, thereby realizing the cleaning of the surface of the wafer, flushing away the impurities generated during the grinding process, ensuring the cleanliness of the surface of the wafer, and at the same time playing a certain cooling role to avoid affecting the quality of the wafer after grinding due to excessive temperature.

[0030] Working principle: Before starting the work, first open the feeding valve 30 to inject the grinding fluid into the material box 23. Then place the wafer that needs to remove the PI layer above the placing plate 4. Subsequently, turn on the first motor 6, and the output end of the first motor 6 drives the rotating plate 7 to rotate under the workbench 3, thereby driving the first connecting rod 8 to rotate under the rotating plate 7. At the same time, it drives one end of the second connecting rod 9 to rotate under the first connecting rod 8, and the other end drives the slider 10 to slide in the second chute 5, thereby driving the clamping block 11 on the slider 10 to slide on the support table 1, so that the four clamping blocks 11 move inward simultaneously to clamp the wafer on the placing plate 4, making the four clamping blocks 11 fit around the wafer, and fixing the wafer completely above the placing plate 4. Subsequently, rotate the material box 23, so that the material box 23 drives the first threaded rod 14 and the second threaded rod 16 to rotate, thereby driving the first auxiliary block 15 and the second auxiliary block 17 to move in opposite directions, and at the same time driving the lower third connecting rod 18 to rotate. When the third connecting rod 18 and the fourth connecting rod 19 rotate, they drive the support plate 20 to move downward, thereby adjusting the height of the grinding head 22. After adjusting to the appropriate height, turn on the second motor 21, and the output end of the second motor 21 drives the grinding head 22 to rotate to realize the grinding of the wafer surface. Subsequently, pull the hand push rod 12 to slide the workbench 3 on the support table 1, thereby adjusting the position of the wafer grinding, so as to completely remove the PI layer on the wafer surface. Then open the discharge valve 24, so that the grinding fluid sprays out from the nozzle 28 after passing through the discharge valve 24, the first water pipe 25, the material pump 26, and the second water pipe 27 from the material box 23, thereby realizing the cleaning of the wafer surface, flushing away the impurities generated during the grinding process, ensuring the cleanliness of the wafer surface, and at the same time playing a certain cooling role to avoid affecting the grinding quality due to excessive temperature. Subsequently, reverse the first motor 6 to drive the clamping block 11 to slide away from the wafer, and then the staff can take out the wafer after removing the PI layer.

[0031] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer PI layer removing device, comprising a support table (1), characterized in that: A chute one (2) is provided on the support table (1), a workbench (3) is slidably connected in the chute one (2), a placement plate (4) is fixedly connected to the workbench (3), a chute two (5) is provided on the workbench (3), a motor one (6) is fixedly connected below the workbench (3), the output end of the motor one (6) is fixedly connected to a rotating plate (7), a connecting rod one (8) is rotatably connected to the rotating plate (7), one end of the connecting rod one (8) is rotatably connected to a connecting rod two (9), one end of the connecting rod two (9) is rotatably connected to a slider (10), a clamping block (11) is fixedly connected to the slider (10), and a hand push rod (12) is fixedly connected to one end of the workbench (3).

2. The wafer PI layer removing device according to claim 1, characterized in that: A handle (13) is rotatably connected to one end of the support table (1), a threaded rod one (14) is fixedly connected to one end of the handle (13), an auxiliary block one (15) is threadedly connected to the threaded rod one (14), a threaded rod two (16) is rotatably connected to one end of the auxiliary block one (15), an auxiliary block two (17) is threadedly connected to the threaded rod two (16), a connecting rod three (18) is rotatably connected to the auxiliary block one (15), a connecting rod four (19) is rotatably connected to the auxiliary block two (17), one end of the connecting rod four (19) is rotatably connected to a support plate (20), and a motor two (21) is fixedly connected to the support plate (20), and a grinding head (22) is fixedly connected to the output end of the motor two (21).

3. The wafer PI layer removing device according to claim 2, characterized in that: A material box (23) is fixedly connected to one end of the support table (1), a discharge valve (24) is fixedly connected to one end of the material box (23), a water pipe one (25) is fixedly connected to the discharge valve (24), a material pump (26) is fixedly connected to one end of the water pipe one (25), a water pipe two (27) is fixedly connected to the output end of the material pump (26), a spray head (28) is fixedly connected to one end of the water pipe two (27), support legs (29) are fixedly connected below the support table (1), and a feed valve (30) is fixedly connected to one side of the material box (23).

4. A wafer PI layer removing device according to claim 3, characterized in that: Four groups of the connecting rod one (8), the connecting rod two (9), and the slider (10) are respectively provided and evenly distributed below the workbench (3), the slider (10) slides in the chute two (5), and the clamping block (11) slides above the chute two (5).

5. The wafer PI layer removing device according to claim 4, characterized in that: The threaded rod one (14) and the threaded rod two (16) are rotatably connected to the support table (1), the threaded rod one (14) and the threaded rod two (16) are arranged in a mirror image of each other, and one end of the connecting rod three (18) is rotatably connected to the support plate (20).

6. The wafer PI layer removing device according to claim 5, wherein: The grinding head (22) is located above the placement plate (4), four groups of the support legs (29) are provided, and two groups of the chutes one (2) are provided and are respectively located at both ends of the support table (1).

7. A wafer PI layer removing device according to claim 6, characterized in that: The material pump (26) is fixedly connected to the material box (23), and the spray head (28) is fixedly connected through the support table (1) and is located on one side of the workbench (3).

Images