Wafer grinding device
By designing a wafer grinding device for fixed plates and bevel gear mechanisms, the shaking wear and discharge problems during the grinding process are solved, stable grinding and convenient removal are achieved, and the practicality and efficiency of the equipment are improved.
Patent Information
- Application Number
- CN202422191590.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-07
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-07
AI Technical Summary
Existing wafer grinding equipment is prone to shaking during the grinding process, causing wear, and the abrasive liquid overflow affects the environment, and it is inconvenient to remove the wafer.
A wafer grinding device including a base, a grinding bucket, a fixing plate, a spring and a bevel gear mechanism is designed. The wafer grinding bucket is fixed by a spring and a wedge plate, and the position of the grinding plate is adjusted by bevel gears to achieve stable grinding and convenient removal.
It improves the stability and efficiency of wafer grinding, prevents the abrasive liquid from splashing, simplifies the wafer removal process, and improves the convenience of operation and the practicality of the equipment.
Smart Images
Figure CN223084479U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer grinding, in particular to a wafer grinding device. Background Art
[0002] A wafer is a carrier of silicon semiconductor circuits, which is processed from a silicon ingot. After the silicon ingot undergoes processes such as grinding, polishing, and slicing, a silicon wafer, that is, a wafer, can be initially made. However, the initially made wafer usually cannot be directly used. Therefore, a grinding device needs to be used to further polish the wafer first. Wafer grinding is the work of polishing the wafer components, so that the surface of the wafer can be polished or the thickness of the wafer can be adjusted, and then other processing can be performed on the wafer.
[0003] When the existing wafer grinding equipment grinds, the grinding disc directly contacts the wafer. During the grinding process, the container in which the wafer is placed will shake, and when shaking, it is easy to produce extrusion, resulting in serious wear. And it is inconvenient to take out the ground wafer after grinding, and during the grinding process, the grinding liquid may overflow, affecting the surrounding working environment. Therefore, it is more inconvenient to use. Summary of the Utility Model
[0004] The utility model solves the technical problems in the above background art and provides a wafer grinding device.
[0005] The technical solution provided by the utility model to solve the above technical problems is as follows:
[0006] A wafer grinding device includes a base, a placement groove is provided on the base, a grinding barrel slides in the placement groove, fixing plates are respectively fixedly connected to both ends of the grinding barrel, slots are provided on the fixing plates, a limiting plate is fixedly connected to the base, a first spring is fixedly connected to the base, a vertical plate is fixedly connected to the base, a sliding rod penetrates and is slidably connected in the vertical plate, a pulling plate is fixedly connected to one end of the sliding rod, a wedge-shaped plate is fixedly connected to the other end of the sliding rod, and a second spring is sleeved on the sliding rod.
[0007] Preferably, a fixed sleeve is fixedly connected to the base, a threaded rod is rotatably connected to the base, a first bevel gear is fixedly connected to the threaded rod, the first bevel gear is meshed with a second bevel gear, a rotating handle is fixedly connected to the second bevel gear, a threaded connecting plate is threadedly connected to the threaded rod, a mounting plate is fixedly connected to one end of the threaded connecting plate, a motor is fixedly connected to the mounting plate, a grinding plate is fixedly connected to the output end of the motor, and a limiting groove is provided on the fixed sleeve.
[0008] Preferably, a fixing block is fixedly connected to the base, the rotating handle passes through and is rotatably connected to the fixing block, and mounting holes are provided on the base. There are four groups of the mounting holes and they are evenly distributed.
[0009] Preferably, there are two groups of the limiting plates, the limiting plates penetrate and slide in the slot, there are four groups of the first springs, the first springs are attached to the bottom of the fixing plate, and the first springs are located on both sides of the limiting plates.
[0010] Preferably, the wedge-shaped plate is attached to the fixing plate, there are two groups of the vertical plates and they are respectively located on both sides of the placing groove. Two sliding rods are respectively provided on each group of the vertical plates. One end of the second spring is fixedly connected to the wedge-shaped plate, and the other end of the second spring is fixedly connected to the second spring.
[0011] Preferably, the threaded rod is located in the fixed sleeve, the shape of the limiting groove is L-shaped, and the threaded connecting plate slides in the limiting groove.
[0012] Preferably, the grinding plate is located in the grinding barrel, the diameter of the grinding plate is smaller than the diameter of the grinding barrel, and the motor is located below the mounting plate.
[0013] With the above structure, the utility model has the following advantages:
[0014] 1. The utility model can first place the wafer to be ground in the grinding barrel and place the grinding barrel in the placing groove on the base and then fix it. When the grinding barrel is placed in the placing groove, it will push the second spring to move outward. When the fixing plate is located below the wedge-shaped plate, the second spring drives the wedge-shaped plate to reset to fix the grinding barrel, and the device is fixed through the four mounting holes, further ensuring the stability during wafer grinding.
[0015] 2. After grinding, the utility model only needs to pull the two pull plates to slide outward, and the grinding barrel will be automatically ejected under the action of the four first springs, so as to facilitate taking out the grinding barrel from the placing groove. The operation is simple and convenient, improving the work efficiency. And the grinding process is carried out in the grinding barrel, so the internal grinding liquid will not splash. By rotating the second bevel gear, the threaded connecting plate can be driven to slide in the limiting groove to adjust the height and position, which not only improves the practicability of the device, but also improves the grinding efficiency of the device.
[0016] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments and features, further aspects, embodiments and features of the utility model will be readily apparent by reference to the drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.
[0018] Figure 1 is a schematic structural view of a wafer grinding device of the present utility model Figure 1 ;
[0019] Figure 2 is a schematic structural view of a wafer grinding device of the present utility model Figure 2 ;
[0020] Figure 3 is an exploded view of the structure of a wafer grinding device of the present utility model;
[0021] Figure 4 is Figure 3 the enlarged view of part A in
[0022] As shown in the figure: 1. Base; 2. Placing groove; 3. Grinding barrel; 4. Fixed plate; 5. Slot; 6. Limiting plate; 7. First spring; 8. Vertical plate; 9. Sliding rod; 10. Pulling plate; 11. Wedge-shaped plate; 12. Second spring; 13. Fixed sleeve; 14. Threaded rod; 15. First bevel gear; 16. Second bevel gear; 17. Rotating handle; 18. Threaded connecting plate; 19. Mounting plate; 20. Motor; 21. Grinding plate; 22. Limiting groove; 23. Fixed block; 24. Mounting hole. Detailed implementation manners
[0023] The following will describe in detail the embodiments of the present application. The examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as a limitation to the present application.
[0024] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.
[0025] The following will further elaborate on the present utility model in detail in combination with the full text:
[0026] Combined with the attached Figures 1 to 4 , a wafer grinding device includes a base 1. A placement groove 2 is provided on the base 1. A grinding barrel 3 slides in the placement groove 2. Fixing plates 4 are respectively fixedly connected to both ends of the grinding barrel 3. A slot 5 is provided on the fixing plate 4. A limiting plate 6 is fixedly connected to the base 1. A first spring 7 is fixedly connected to the base 1. A vertical plate 8 is fixedly connected to the base 1. A sliding rod 9 is slidably connected through the vertical plate 8. One end of the sliding rod 9 is fixedly connected to a pulling plate 10. The other end of the sliding rod 9 is fixedly connected to a wedge-shaped plate 11. A second spring 12 is sleeved on the sliding rod 9. The wafer to be ground can be placed in the grinding barrel 3 first and the grinding barrel 3 can be placed in the placement groove 2 on the base 1 and then fixed. When the grinding barrel 3 is placed in the placement groove 2, it will push the second spring 12 to move outward. When the fixing plate 4 is located below the wedge-shaped plate 11, the second spring 12 drives the wedge-shaped plate 11 to reset to fix the grinding barrel 3, and the device is fixed through four sets of mounting holes 24, further ensuring the stability during wafer grinding.
[0027] Among them, a fixed sleeve 13 is fixedly connected to the base 1, a threaded rod 14 is rotatably connected to the base 1, a first bevel gear 15 is fixedly connected to the threaded rod 14, the first bevel gear 15 is meshed with a second bevel gear 16, a rotating handle 17 is fixedly connected to the second bevel gear 16, a threaded connecting plate 18 is threadedly connected to the threaded rod 14, one end of the threaded connecting plate 18 is fixedly connected to a mounting plate 19, a motor 20 is fixedly connected to the mounting plate 19, an output end of the motor 20 is fixedly connected to a grinding plate 21, a limiting groove 22 is provided on the fixed sleeve 13, a fixed block 23 is fixedly connected to the base 1, the rotating handle 17 passes through and is rotatably connected to the fixed block 23, a mounting hole 24 is provided on the base 1, there are four groups of mounting holes 24 and they are evenly distributed, there are two groups of limiting plates 6, the limiting plates 6 pass through and slide in the slot 5, there are four groups of first springs 7, the first springs 7 are attached to the bottom of the fixing plate 4, the first springs 7 are located on both sides of the limiting plate 6, a wedge plate 11 is attached to the fixing plate 4, there are two groups of vertical plates 8 and they are respectively located on both sides of the placing groove 2, two sliding rods 9 are respectively provided on each group of vertical plates 8, one end of a second spring 12 is fixedly connected to the wedge plate 11, the other end of the second spring 12 is fixedly connected to the second spring 12, the threaded rod 14 is located inside the fixed sleeve 13, the shape of the limiting groove 22 is L-shaped, the threaded connecting plate 18 slides in the limiting groove 22, the grinding plate 21 is located inside the grinding barrel 3, the diameter of the grinding plate 21 is smaller than the diameter of the grinding barrel 3, the motor 20 is located below the mounting plate 19. After grinding, only need to pull the two pull plates 10 to slide outwards, and under the action of the four groups of first springs 7, the grinding barrel 3 will be driven to pop out automatically, so as to facilitate taking out the grinding barrel 3 from the placing groove 2. The operation is simple and convenient, which improves the work efficiency. And the grinding process is carried out inside the grinding barrel 3, so the internal grinding liquid will not splash. By rotating the second bevel gear 16, the threaded connecting plate 18 can be driven to slide in the limiting groove 22 to adjust the height and position, which not only improves the practicability of the device, but also improves the grinding efficiency of the device.
[0028] Working principle of the utility model: When in use, use screws to fixedly install the device on the desktop through four groups of mounting holes 24. First, add the wafer to be ground and the grinding liquid into the grinding barrel 3, and then place the grinding barrel 3 in the placement groove 2, and make the limiting plate 6 located in the slot 5. During the process of inserting the grinding barrel 3 into the placement groove 2, it first contacts the wedge plate 11. At this time, it will simultaneously push the two wedge plates 11 to drive the sliding rod 9 and the pulling plate 10 to slide towards both sides and compress the second spring 12. Then, the bottom of the fixing plate 4 fits onto the first spring 7 and compresses it. When the fixing plate 4 is completely below the wedge plate 11, under the action of the second spring 12, it drives the wedge plate 11 to reset and fit onto the top of the fixing plate 4 to fix the grinding barrel 3. Then, manually rotate the handle 17 to drive the second bevel gear 16 to rotate, and drive the threaded rod 14 to rotate on the base 1 through the first bevel gear 15, so as to drive the threaded rod 14 to move from the horizontal limiting groove 22 to the vertical limiting groove 22 and move downward. At this time, the mounting plate 19 drives the motor 20 and the grinding plate 21 to move until the grinding plate 21 fits onto the top of the wafer in the grinding barrel 3. At this time, start the motor 20 to drive the grinding plate 21 to rotate and grind the wafer. After grinding, rotate the handle 17 in the reverse direction to drive the grinding plate 21 to reset and make the mounting plate 19 located in the horizontal limiting groove 22. Then, simultaneously pull the two pulling plates 10 outward to drive the sliding rod 9 and the wedge plate 11 to move and compress the second spring 12. At this time, under the action of the four first springs 7, it pushes the fixing plate 4 to drive the grinding barrel 3 to move upward, and makes the fixing plate 4 located above the wedge plate 11. At this time, the grinding barrel 3 can be taken out.
[0029] The above describes the utility model and its implementation manners. This description is not restrictive. What is shown throughout the text is only one of the implementation manners of the utility model, and the actual structure is not limited thereto. Generally speaking, if those of ordinary skill in the art are inspired by it and, without departing from the creative purpose of the utility model, design similar structural manners and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the utility model.
Claims
1. A wafer grinding device, comprising a base (1), characterized in that: A placing groove (2) is provided on the base (1), a grinding barrel (3) slides in the placing groove (2), fixing plates (4) are fixedly connected to both ends of the grinding barrel (3), a slot (5) is provided on the fixing plates (4), a limiting plate (6) is fixedly connected to the base (1), a first spring (7) is fixedly connected to the base (1), a vertical plate (8) is fixedly connected to the base (1), a sliding rod (9) is slidably connected through the vertical plate (8), a pulling plate (10) is fixedly connected to one end of the sliding rod (9), a wedge-shaped plate (11) is fixedly connected to the other end of the sliding rod (9), and a second spring (12) is sleeved on the sliding rod (9).
2. The wafer grinding device according to claim 1, wherein: A fixed sleeve (13) is fixedly connected to the base (1), a threaded rod (14) is rotatably connected to the base (1), a first bevel gear (15) is fixedly connected to the threaded rod (14), the first bevel gear (15) is meshed with a second bevel gear (16), a rotating handle (17) is fixedly connected to the second bevel gear (16), a threaded connecting plate (18) is threadedly connected to the threaded rod (14), a mounting plate (19) is fixedly connected to one end of the threaded connecting plate (18), a motor (20) is fixedly connected to the mounting plate (19), a grinding plate (21) is fixedly connected to the output end of the motor (20), and a limiting groove (22) is provided on the fixed sleeve (13).
3. A wafer grinding device according to claim 2, wherein: A fixed block (23) is fixedly connected to the base (1), the rotating handle (17) is rotatably connected through the fixed block (23), a mounting hole (24) is provided on the base (1), and there are four groups of the mounting holes (24) which are evenly distributed.
4. A wafer grinding device according to claim 3, characterized in that: There are two groups of the limiting plates (6), the limiting plates (6) slide through the slots (5), there are four groups of the first springs (7), the first springs (7) are attached to the bottom of the fixing plates (4), and the first springs (7) are located on both sides of the limiting plates (6).
5. A wafer grinding device according to claim 4, characterized in that: The wedge-shaped plate (11) is attached to the fixing plate (4), there are two groups of the vertical plates (8) which are respectively located on both sides of the placing groove (2), there are two sliding rods (9) on each group of the vertical plates (8), one end of the second spring (12) is fixedly connected to the wedge-shaped plate (11), and the other end of the second spring (12) is fixedly connected to the second spring (12).
6. A wafer grinding device according to claim 5, characterized in that: The threaded rod (14) is located in the fixed sleeve (13), the shape of the limiting groove (22) is L-shaped, and the threaded connecting plate (18) slides in the limiting groove (22).
7. A wafer grinding device according to claim 6, characterized in that: The grinding plate (21) is located in the grinding barrel (3), the diameter of the grinding plate (21) is smaller than the diameter of the grinding barrel (3), and the motor (20) is located below the mounting plate (19).