Heating device for vapor deposition and coating equipment

Abstract

The utility model relates to a heating device and coating equipment for vapor deposition, which comprises a coating chamber, a heating plate and a heating pipe, a sample table is arranged in the coating chamber, the sample table and a bottom plate of the coating chamber form a heating cavity, the heating plate and the heating pipe are arranged in the heating cavity, the heating pipe is arranged above the heating plate, and the heating plate is arranged above the heating pipe. The heating pipe is used for conducting temperature compensation on the edge position of the heating plate. According to the utility model, a layer of heating pipe is arranged above the heating plate, and after the heating plate is heated, a heating medium is introduced into the heating pipe, so that the heating pipe carries out temperature compensation on the edge position of the heating plate, and the uniform heating of the heating device in the heating chamber on the sample table is improved.

Description

Technical Field

[0001] The utility model relates to the field of coating equipment, in particular to a heating device for vapor deposition and a coating equipment. Background Art

[0002] The MOCVD process refers to using metal organic precursors to carry out chemical reactions at high temperatures to grow the required thin film materials on the surface of a substrate. This deposition method has excellent step coverage, controllability, and uniformity, and has been widely used in the preparation of key materials for epitaxial growth of semiconductor devices. It can precisely control the thickness, composition, doping, and heterojunction interface of the epitaxial layer, and achieve the growth of high-quality thin films at the nanoscale.

[0003] In this process, whether the heating system can uniformly and quickly heat the substrate determines the quality of epitaxial deposition. Therefore, the heating system is one of the important component subsystems of the MOCVD equipment. Different MOCVD products require a matching heating system to ensure that the heating needs of the large-size MOCVD reaction chamber can be met, and by finely designing the heating elements, the uniformity of the heating temperature can be improved.

[0004] The heating elements of the prior art use a heating plate for direct heating. The temperature at the middle position of the heating plate is higher than that at the edge. This method will have the technical problem of uneven heating during actual use. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the technical problem of uneven heating of the heating device of the existing coating equipment, and provides a heating device for vapor deposition. The main idea is to be able to divide the coating area:

[0006] A heating device for vapor deposition includes a coating chamber, a heating plate, and heating tubes. A sample stage is arranged inside the coating chamber. The sample stage and the bottom plate of the coating chamber form a heating cavity. The heating plate and the heating tubes are arranged in the heating cavity. The heating tubes are arranged above the heating plate, and the heating tubes are used to perform temperature compensation on the edge positions of the heating plate. In this solution, a layer of heating tubes is placed above the heating plate. After the heating plate is heated, a heating medium is introduced into the heating tubes, so that the heating tubes perform temperature compensation on the edge positions of the heating plate, and improve the uniform heating of the heating device in the heating cavity to the sample stage.

[0007] Preferably, the heating tube has an S-shaped structure. The heating tube includes a middle heating zone and an edge heating zone. The middle heating zone has a linear structure, and the edge heating zone has an arc-shaped structure. The edge heating zone connects adjacent middle heating zones. The heating tubes are arranged in an S-shape above the heating plate, and the heating tubes form an S-shaped heating path above the heating plate. The S-shaped heating tubes are divided into a middle heating zone with a linear structure and an edge heating zone with an arc-shaped structure. The edge heating zone is bent at the edge position of the heating plate, so as to increase the contact area of the heating tube at the edge of the heating plate, and further improve the heating effect of the heating device at the edge of the sample stage.

[0008] Preferably, a first temperature sensor and a second temperature sensor are arranged in the heating cavity. The first temperature sensor is arranged at the middle position of the sample stage, and the second temperature sensor is arranged at the edge position of the sample stage. The first temperature sensor and the second temperature sensor are installed on the bottom surface of the sample stage for detecting the partition temperature of the sample stage.

[0009] Preferably, it further includes a chamber door. The chamber door is connected to the coating chamber through a hinge structure. The hinge structure includes a support ear plate, a connecting plate, a hinge support and a rotating shaft. The support ear plate is installed on the outside of the coating chamber, and the hinge support is fixedly installed above the support ear plate. The connecting plate is arranged on the outside of the chamber door, and the connecting plate is movably connected to the hinge support through the rotating shaft.

[0010] The purpose of the second aspect of the present invention is to solve the technical problem of poor airtightness of the chamber door of the coating chamber. Further, the connecting plate is provided with a strip-shaped rotating shaft hole for installing the rotating shaft. The height extension direction of the strip-shaped rotating shaft hole is perpendicular to the installation surface of the chamber door. The height of the strip-shaped rotating shaft hole is greater than the outer diameter of the rotating shaft. The strip-shaped rotating shaft hole is provided with an adjusting member for adjusting the installation height of the rotating shaft in the strip-shaped rotating shaft hole.

[0011] Preferably, a sealing gasket is arranged on the surface of the chamber door that cooperates with the coating chamber.

[0012] Preferably, the chamber door further includes a coating structure. The coating structure includes an air inlet structure and a flow equalizing structure. The air inlet structure is connected to a gas source, and the air outlet of the air inlet structure is connected to the flow equalizing structure. The flow equalizing structure is used to evenly input the gas of the air inlet structure into the coating chamber.

[0013] A coating device includes a heating device for chemical vapor deposition.

[0014] The beneficial effects of the present invention are as follows:

[0015] By placing a layer of heating tubes above the heating plate, when the heating plate is heated, a heating medium is then introduced into the heating tubes, so that the heating tubes perform temperature compensation on the edge position of the heating plate, and improve the uniform heating of the heating device in the heating cavity to the sample stage. Brief Description of the Drawings

[0016] Figure 1 This is a schematic structural diagram of the present utility model.

[0017] Figure 2 This is a structural sectional view of the present utility model.

[0018] Figure 3 This is a schematic structural diagram of the hinge structure of the present utility model.

[0019] Figure 4 This is a schematic structural diagram of the coating structure of the present utility model.

[0020] Reference numerals in the drawings include: 1, coating chamber; 11, heating cavity; 12, first temperature sensor; 13, second temperature sensor; 2, heating plate; 3, heating tube; 31, middle heating zone; 32, edge heating zone; 4, sample stage; 5, chamber door; 51, sealing gasket; 6, hinge structure; 61, support ear plate; 62, connecting plate; 63, hinge support; 64, rotating shaft; 65, adjusting member; 7, coating structure; 71, air inlet structure; 72, flow equalizing structure. Detailed Description of the Embodiments

[0021] In order to make the objectives, technical solutions, and advantages of the embodiments more clear and understandable, the present utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. When the following description refers to the drawings, unless otherwise indicated, the same numerals in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0022] It should be noted that all actions of obtaining signals, information, or data in this application are carried out on the premise of complying with the corresponding data protection regulations and policies of the country where it is located and obtaining authorization from the owner of the corresponding device.

[0023] In the present disclosure, unless otherwise stated, the orientation terms such as "inside, outside" are defined according to the own contour of the corresponding component. The terms such as "first, second" used in the present disclosure are used to distinguish one element from another and do not have sequentiality and importance.

[0024] Embodiment 1:

[0025] As Figures 1 - 4As shown in the figure, a heating device for vapor deposition includes a coating chamber 1, a heating plate 2, and a heating tube 3. Inside the coating chamber 1, a sample stage 4 is provided. The sample stage 4 and the bottom plate of the coating chamber 1 form a heating cavity 11. The heating plate 2 and the heating tube 3 are arranged inside the heating cavity 11. The heating tube 3 is disposed above the heating plate 2 and is used to compensate the temperature at the edge position of the heating plate 2. In this solution, a layer of heating tube 3 is placed above the heating plate 2. When the heating plate 2 is heated, a heating medium is introduced into the heating tube 3, so that the heating tube 3 compensates the temperature at the edge position of the heating plate 2, improving the uniform heating of the sample stage 4 by the heating device in the heating cavity 11.

[0026] Preferably, the heating tube 3 is of an S-shaped structure. The heating tube 3 includes a middle heating zone 31 and an edge heating zone 32. The middle heating zone 31 is of a straight-line structure, and the edge heating zone 32 is of an arc-shaped structure. The edge heating zone 32 connects adjacent middle heating zones 31. The heating tubes 3 are arranged in an S-shape above the heating plate 2, forming an S-shaped heating path above the heating plate 2. The S-shaped heating tube 3 is divided into a middle heating zone 31 of a straight-line structure and an edge heating zone 32 of an arc-shaped structure. The edge heating zone 32 is bent at the edge position of the heating plate 2, increasing the contact area of the heating tube 3 at the edge of the heating plate 3 and further improving the heating effect of the heating device at the edge of the sample stage 4.

[0027] Preferably, a first temperature sensor 12 and a second temperature sensor 13 are arranged inside the heating cavity 11. The first temperature sensor 12 is arranged at the middle position of the sample stage 4, and the second temperature sensor 13 is arranged at the edge position of the sample stage 4. The first temperature sensor 12 and the second temperature sensor 13 are installed on the bottom surface of the sample stage 4 to detect the zonal temperature of the sample stage 4.

[0028] Example 2:

[0029] As Figures 2 - 3 shown in the figure, a heating device for vapor deposition in this embodiment further includes a chamber door 5. The chamber door 5 is connected to the coating chamber 1 through a hinge structure 6. The hinge structure 6 includes a support ear plate 61, a connecting plate 62, a hinge support 63, and a rotating shaft 64. The support ear plate 61 is installed on the outside of the coating chamber 1, and the hinge support 63 is fixedly installed above the support ear plate 61. The connecting plate 62 is arranged on the outside of the chamber door 5, and the connecting plate 62 is movably connected to the hinge support 63 through the rotating shaft 64.

[0030] The connecting plate 62 is provided with a strip-shaped rotating shaft hole 621 for installing the rotating shaft 64. The height extension direction of the strip-shaped rotating shaft hole 621 is perpendicular to the installation surface of the chamber door 5. The height of the strip-shaped rotating shaft hole 621 is greater than the outer diameter of the rotating shaft 64. An adjusting member 622 is arranged in the strip-shaped rotating shaft hole 621. The adjusting member 622 is used to adjust the installation height of the rotating shaft 64 in the strip-shaped rotating shaft hole 621, which can solve the technical problem of poor airtightness of the chamber door of the coating chamber.

[0031] Preferably, a sealing gasket 51 is arranged on the surface of the chamber door 5 that cooperates with the coating chamber 1.

[0032] Embodiment 3:

[0033] As Figures 2 - 4 shown, the chamber door 5 further includes a coating structure 7. The coating structure 7 includes an air inlet structure 71 and a flow equalizing structure 72. The air inlet structure 71 is connected to a gas source. The air outlet of the air inlet structure 71 is connected to the flow equalizing structure 72. The flow equalizing structure 72 is used to evenly input the gas of the air inlet structure 71 into the coating chamber 1.

[0034] A coating device includes a heating device for vapor deposition.

[0035] The above are only the embodiments of the present invention. Common knowledge such as specific structures and characteristics in the solutions is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention. These will not affect the implementation effect of the present invention and the practicability of the patent. The protection scope required by this application should be based on the content of its claims, and the specific implementation manners in the specification can be used to interpret the content of the claims.

Claims

1. A heating device for vapor deposition, characterized in that: It includes a coating chamber (1), a heating plate (2) and a heating tube (3). Inside the coating chamber (1), a sample stage (4) is provided. The sample stage (4) and the bottom plate of the coating chamber (1) form a heating cavity (11). The heating plate (2) and the heating tube (3) are arranged in the heating cavity (11). The heating tube (3) is arranged above the heating plate (2), and the heating tube (3) is used to perform temperature compensation on the edge position of the heating plate (2).

2. The heating device for vapor deposition according to claim 1, characterized in that: The heating tube (3) is of an S-shaped structure. The heating tube (3) includes a middle heating area (31) and an edge heating area (32). The middle heating area (31) is of a linear structure, and the edge heating area (32) is of an arc-shaped structure. The edge heating area (32) connects adjacent middle heating areas (31).

3. The heating device for vapor deposition according to claim 1, characterized in that: A first temperature sensor (12) and a second temperature sensor (13) are arranged in the heating cavity (11). The first temperature sensor (12) is arranged at the middle position of the sample stage (4), and the second temperature sensor (13) is arranged at the edge position of the sample stage (4). The first temperature sensor (12) and the second temperature sensor (13) are installed on the bottom surface of the sample stage (4) for detecting the partition temperature of the sample stage (4).

4. A heating device for vapor deposition according to any one of claims 1-3, characterized in that: It further includes a chamber door (5). The chamber door (5) is connected to the coating chamber (1) through a hinge structure (6). The hinge structure (6) includes a support ear plate (61), a connecting plate (62), a hinge support (63) and a rotating shaft (64). The support ear plate (61) is installed on the outside of the coating chamber (1), and the hinge support (63) is fixedly installed above the support ear plate (61). The connecting plate (62) is arranged on the outside of the chamber door (5), and the connecting plate (62) is movably connected to the hinge support (63) through the rotating shaft (64).

5. The heating device for vapor deposition according to claim 4, wherein: The connecting plate (62) is provided with a strip-shaped rotating shaft hole (621) for installing the rotating shaft (64). The height extension direction of the strip-shaped rotating shaft hole (621) is perpendicular to the installation surface of the chamber door (5). The height of the strip-shaped rotating shaft hole (621) is greater than the outer diameter of the rotating shaft (64). The strip-shaped rotating shaft hole (621) is provided with an adjusting member (65), and the adjusting member (65) is used to adjust the installation height of the rotating shaft (64) in the strip-shaped rotating shaft hole (621).

6. The heating device for vapor deposition according to claim 4, wherein: A sealing gasket (51) is arranged on the surface of the chamber door (5) that cooperates with the coating chamber (1).

7. A heating device for vapor deposition according to claim 4, characterized in that: The chamber door (5) further includes a coating structure (7). The coating structure (7) includes an air inlet structure (71) and a flow equalizing structure (72). The air inlet structure (71) is connected to a gas source. The air outlet of the air inlet structure (71) is connected to the flow equalizing structure (72). The flow equalizing structure (72) is used to uniformly input the gas of the air inlet structure (71) into the coating chamber (1).

8. A coating device, characterized in that: It includes the heating device for vapor deposition according to any one of claims 1-7.

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