Wafer cleaning equipment

Abstract

The utility model discloses wafer cleaning equipment which comprises a rack, a clamping and rotating mechanism used for clamping a wafer and enabling the wafer to rotate horizontally, a wafer edge cleaning device used for cleaning the edge of the wafer and a wafer double-face cleaning device, and the wafer double-face cleaning device is configured to be arranged around the wafer. The wafer double-sided cleaning device comprises two brush assemblies, and the two brush assemblies are arranged up and down to clean the upper surface and the lower surface of a wafer. Each brush assembly comprises a brush head fixing plate and a brush head, and the brush head is arranged on the brush head fixing plate and is configured to be in contact with the upper surface or the lower surface of a wafer; at least one brush assembly further comprises an adjusting air cylinder, and the adjusting air cylinder is connected with one brush head so as to adjust the acting force of the brush head on the upper surface or the lower surface of the wafer. According to the wafer cleaning equipment, the acting force of the brush head on the surface of the wafer can be adjusted, and the cleaning efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor integrated circuit manufacturing equipment and relates to a wafer cleaning device. Background Art

[0002] During the manufacturing process of wafers, there may be some unnecessary residual substances on the wafer surface. These unnecessary residual substances remain on the wafer surface during continuous manufacturing operations, and these residual substances will cause defects such as scratches on the wafer surface and inappropriate interactions between metallization features. In some cases, such defects may also cause the devices on the wafer to become inoperable. To avoid additional costs, after unnecessary residues are left on the wafer surface, the wafer must be cleaned properly and efficiently.

[0003] However, according to the different wafer manufacturing processes and materials, the thicknesses of different types of wafers are different. Moreover, for different cleaning requirements of wafers, the forces exerted by the cleaning brushes on the wafer surface are also different, which requires the cleaning brushes of the cleaning equipment to have an adjustment function. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer cleaning device that can adjust the force exerted by the brush head on the wafer surface and improve the cleaning efficiency.

[0005] The technical solution adopted by the utility model is as follows:

[0006] A wafer cleaning device includes a frame, a clamping and rotating mechanism for clamping the wafer and rotating the wafer horizontally, a wafer edge cleaning device for cleaning the edge of the wafer, and a wafer double-sided cleaning device. The wafer double-sided cleaning device is configured to be arranged around the wafer. The wafer double-sided cleaning device includes two brush assemblies, and the two brush assemblies are arranged up and down to clean the upper surface and the lower surface of the wafer.

[0007] Each of the brush assemblies includes a brush head fixing plate and a brush head. The brush head is arranged on the brush head fixing plate and is configured to contact the upper surface or the lower surface of the wafer.

[0008] At least one of the brush assemblies further includes an adjusting cylinder, and the adjusting cylinder is connected to one of the brush heads to adjust the force exerted by the brush head on the upper surface or the lower surface of the wafer. In a preferred embodiment, at least one of the brush assemblies further includes a first rotating motor and a motor plate. The first rotating motor is arranged on the motor plate, the motor plate is connected to the piston rod of the adjusting cylinder, and the brush head is connected to the output shaft of the first rotating motor.

[0009] In a more preferred embodiment, at least one of the brush assemblies further includes a first sensor for detecting the force exerted by the adjusting cylinder on the motor plate.

[0010] In a preferred embodiment, both of the two brush assemblies include the adjusting cylinder, and the two brush assemblies are mirror-symmetrical.

[0011] In a more preferred embodiment, the wafer double-sided cleaning device further includes a fixing frame, a first arm shaft and a first driving mechanism. The first arm shaft is rotatably arranged on the fixing frame, and the first driving mechanism is used to drive the first arm shaft to rotate. The brush head fixing plates of the two brush assemblies are arranged on the first arm shaft.

[0012] In a more preferred embodiment, the first arm shaft is arranged on the fixing frame through a connecting frame. The connecting frame is movably arranged up and down on the fixing frame, and a locking member for locking the connecting frame and the fixing frame is arranged on the connecting frame and / or the fixing frame.

[0013] In a preferred embodiment, the connecting frame is connected to the fixing frame through a height adjusting mechanism.

[0014] In a preferred embodiment, the clamping and rotating mechanism includes a driving arm, a second arm shaft, an arm shaft seat, a slider, a guide rail and a second driving mechanism. A rotating wheel for contacting the edge of the wafer to clamp the wafer is arranged on the driving arm. The driving arm is connected to the second arm shaft. The second arm shaft is rotatably arranged in the arm shaft seat. The arm shaft seat is connected to or abuts against the slider. The slider is in sliding fit with the guide rail. The guide rail is fixed on the machine frame. The second driving mechanism is configured to drive the arm shaft seat to slide along the guide rail. The clamping and rotating mechanism includes a second sensor, and the second sensor is arranged on the guide rail or the machine frame to detect the force on the arm shaft seat.

[0015] In a preferred embodiment, the clamping and rotating mechanism further includes a floating waterproof cover sleeved on the second arm shaft, and the bottom of the floating waterproof cover is installed on the machine frame.

[0016] In a preferred embodiment, the brush head is internally provided with a cleaning liquid supply assembly, and the supply assembly is used to spray liquid on the wafer or clean the brush head when cleaning the wafer. The present utility model adopts the above scheme and has the following advantages compared with the prior art:

[0017] The wafer cleaning device of the present utility model has an adjusting cylinder connected to the brush head. When the thickness of the wafer is small or a large acting force is required on the surface of the wafer, the adjusting cylinder is used to move the brush head towards the wafer; when the thickness of the wafer is large or a small acting force is required on the surface of the wafer, the adjusting cylinder is used to move the brush head away from the wafer. That is, the acting force of the brush head on the upper or lower surface of the wafer is adjusted by the adjusting cylinder, improving the cleaning efficiency. Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0019] Figure 1 Is a perspective view of the wafer cleaning device according to an embodiment of the present utility model;

[0020] Figure 2 Is a perspective view of the clamping and rotating mechanism;

[0021] Figure 3 Is a top view of the clamping and rotating mechanism;

[0022] Figure 4 Is a perspective view of the wafer cleaning device according to an embodiment of the present utility model;

[0023] Figure 5 Is a partial structural diagram of the wafer cleaning device;

[0024] Figure 6 Is a perspective view of the wafer edge cleaning device;

[0025] Figure 7 Is a partial structural diagram of the wafer edge cleaning device.

[0026] Among them,

[0027] 100, wafer;

[0028] 1, brush assembly; 11, brush head fixing plate; 12, brush head; 13, adjusting cylinder; 131, piston rod; 14, first rotating motor; 15, motor plate; 16, first sensor; 2, fixing frame; 21, kidney-shaped hole; 3, first arm shaft; 4, first driving mechanism; 5, connecting frame; 51, bearing; 6, height adjusting mechanism;

[0029] 8. Wafer cleaning equipment; 81. Frame; 82. Clamping and rotating mechanism; 821. Driving arm; 8211. Rotating wheel; 822. Second arm shaft; 823. Arm shaft seat; 824. Slide block; 825. Guide rail; 826. Second driving mechanism; 827. Floating waterproof cover; 83. Second sensor; 85. Double-sided wafer cleaning device;

[0030] 84. Wafer edge cleaning device; 841. Cleaning brush assembly; 8411. Cleaning brush; 842. Mounting seat; 843. Underframe; 844. Third driving mechanism; 845. Upper nozzle; 846. Lower nozzle; 847. Angle adjusting mechanism. Detailed implementation manners

[0031] The following elaborates on the preferred embodiments of the present utility model in conjunction with the accompanying drawings, so that the advantages and features of the present utility model can be more easily understood by those skilled in the art. It should be noted here that the description of these implementation manners is for helping to understand the present utility model, but does not constitute a limitation to the present utility model.

[0032] This embodiment provides a wafer cleaning equipment, including a frame 81, a clamping and rotating mechanism 82, and a double-sided wafer cleaning device 85. Among them, the clamping and rotating mechanism 82 is used to clamp the wafer 100 and make the wafer 100 rotate horizontally. The double-sided wafer cleaning device 85 and the wafer edge cleaning device 84 are configured to be arranged around the wafer 100. More specifically, the double-sided wafer cleaning device 85 is used to clean the slurry adhered to the upper and lower surfaces of the wafer 100, and the wafer edge cleaning device 84 is used to clean the slurry adhered to the side or edge of the wafer 100.

[0033] Furthermore, the clamping and rotating mechanism 82 includes a driving arm 821, a second arm shaft 822, an arm shaft seat 823, a slide block 824, a guide rail 825, a second sensor 83, and a second driving mechanism 826. The second sensor 83 is a pressure sensor. A rotating wheel 8211 for contacting the edge of the wafer 100 to clamp the wafer 100 is provided on the driving arm 821. The number of the rotating wheels 8211 is four. The wafer 100 is clamped by the combined action of the four rotating wheels 8211. The driving arm 821 internally has a motor to drive the rotating wheel 821 to rotate, thereby driving the wafer 100 to rotate. The number of the driving arms 821 is two. The two driving arms 821 are centrosymmetric. The center of the wafer 100 coincides with the symmetric center of the driving arms 821. The two groups of driving arms 821 move synchronously, so as to ensure that the center of the wafer 100 always coincides with the center of the driving arms 821, and avoid the position of the wafer 100 from shifting during the movement of the driving arms 821.

[0034] Two rotating wheels 8211 are provided on each driving arm 821. The connection line between two opposite rotating wheels 811 on two groups of driving arms 821 passes through the center of the wafer 100. This clamping method can ensure uniform force on the wafer, avoid breakage of the wafer 100 due to uneven force, and at the same time prevent slipping between the wafer 100 and the rotating wheels 8211. The driving arm 821 is connected to the second arm shaft 822. The second arm shaft 822 is rotatably arranged in the arm shaft seat 823 to finely adjust the angle between the second arm shaft 822 and the arm shaft seat 823, reduce the errors such as parallelism between the two groups of driving arms 821 due to assembly and machining, so as to ensure that the forces at each contact point are uniform when the wafer 100 is clamped and rotated by the driving arms 821, and the wafer 100 will not generate other stresses due to contact with the rotating wheels 8211, avoiding breakage of the wafer during the process of clamping the wafer. The arm shaft seat 823 is connected to or abuts against the slider 824. Specifically, the arm shaft seat 823 is connected to the slider 824. The slider 824 is slidably matched with the guide rail 825. The guide rail 825 is fixed on the frame 81. The second driving mechanism 826 is configured to drive the arm shaft seat 823 to slide along the guide rail 825. The entire clamping and rotating mechanism 82 can freely translate under the drive of the second driving mechanism 826 and offset the offset force, and also can avoid breakage of the wafer 100 under the action of external force to a certain extent; The second sensor 83 is arranged on the guide rail 825 or the frame 81 to detect the acting force on the arm shaft seat 823. The second sensor 83 can be used to calculate the acting force on the wafer during the movement. According to the pressure value feedback by the second sensor 83, the stroke of the displacement of the driving arm 821 is adjusted back and forth to ensure that the clamping force will not be too large to crush the wafer 100.

[0035] Specifically, assume that the thrust of the second driving mechanism 826 on the arm shaft seat 823 is F1, and the pressure detected by the second sensor 83 is F2. Then, the acting force of the rotating wheel 811 on the wafer 100 is F1 - F2. By adjusting the stroke of the arm shaft seat 823, the acting force of the rotating wheel 811 on the wafer 100 can be ensured to be within a reasonable range, so as to avoid crushing the wafer 100 while clamping it. When the acting force on the wafer 100 is large, the two second arm shafts 822 move away from each other; when the acting force on the wafer 100 is small, the two second arm shafts 822 move closer to each other. Monitoring and adjusting the acting force of the rotating wheel 811 on the wafer 100 has the following functions: (1) Since the outer peripheral surface of the wafer is not a complete circle (there are notches on the outer peripheral surface of the wafer), when the notch contacts the rotating wheel, the acting force of the rotating wheel at the notch on the wafer will change, which will break the balance state of the wafer and cause the wafer to vibrate, not only affecting the cleaning efficiency of the wafer but also resulting in the breakage of the wafer; (2) The wafer will be eccentric during the rotation and brushing process, which causes the acting forces of the rotating wheels on the wafer at different times to be different. By detecting the acting force of the rotating wheel, it can be ensured that the acting force of the rotating wheel is constant during the cleaning process; (3) Different cleaning processes (such as different types of cleaning agents used and different acting forces of the cleaning brushes for cleaning different types of contaminants) require different acting forces on the wafer. Adjusting the acting force of the rotating wheel can meet the needs of the cleaning process.

[0036] The clamping and rotating mechanism 82 further includes a floating waterproof cover 827. The floating waterproof cover 827 is made of soft material and is installed at the bottom on the frame to block the entry of liquid medicine, water, etc., and protect the mechanism during the process of the whole mechanism clamping the wafer.

[0037] The wafer double-sided cleaning device 85 includes two brush assemblies 1 arranged in mirror symmetry. The two brush assemblies 1 are arranged up and down to clean the upper surface and the lower surface of the wafer 100. Further, each brush assembly 1 respectively includes a brush head fixing plate 11 and a brush head 12. The brush head 12 is arranged on the brush head fixing plate 11 and is configured to contact the upper surface or the lower surface of the wafer 100. The height of the brush head 12 can be individually controlled to meet the different cleaning needs of the upper and lower surfaces. The brush head 12 is internally provided with a cleaning liquid supply assembly, and the supply assembly is used to spray liquid on the wafer 100 when cleaning the wafer 100 or to clean the brush head 12.

[0038] Furthermore, at least one brush assembly 1 further includes an adjusting cylinder 13. Specifically, in this embodiment, both brush assemblies 1 include an adjusting cylinder 13. The adjusting cylinder 13 is connected to a brush head 12 to adjust the acting force of the brush head 12 on the upper surface or the lower surface of the wafer 100. The two brush heads 12 have the same structure, are both mounted on the brush head fixing plate 11 and are mirror-symmetrical. The centers of the upper brush head and the lower brush head are on the same straight line. When brushing the wafer 100, the upper brush head and the lower brush head act on the same point of the wafer, reducing the stress inside the wafer during brushing, and cooperating with the clamping and rotating mechanism 82 to achieve double-sided cleaning.

[0039] The adjusting cylinder 13 is connected to the brush head 12. When the thickness of the wafer 100 is small or a greater acting force is required on the surface of the wafer 100, the brush head 12 is moved towards the direction close to the wafer 100 through the adjusting cylinder 13; when the thickness of the wafer 100 is large or a smaller acting force is required on the surface of the wafer 100, the brush head 12 is moved towards the direction away from the wafer 100 through the adjusting cylinder 13. That is, the acting force of the brush head 12 on the upper surface or the lower surface of the wafer 100 is adjusted by the adjusting cylinder 13, improving the cleaning efficiency.

[0040] Each brush assembly 1 further includes a first rotating motor 14 and a motor plate 15. The first rotating motor 14 is disposed on the motor plate 15. The motor plate 15 is connected to the piston rod 131 of the adjusting cylinder 13. The brush head 12 is connected to the output shaft of the first rotating motor 14. The position relative to the wafer 100 is changed through the action of the first rotating motor 14, so that its cleaning surface can cover the entire surface of the wafer 100. At least one brush assembly 1 further includes a first sensor 16 for detecting the acting force of the adjusting cylinder 13 on the motor plate 15. The value of the acting force of the brush head 12 on the wafer 100 is equal to the thrust output by the adjusting cylinder 13 minus the feedback value of the first sensor 16. Specifically, the wafer double-sided cleaning device 85 further includes a controller, and the controller is used to calculate the input air pressure P of the adjusting cylinder 13 according to the following formula;

[0041] (FW + Δ - F1) / ((S / 2)2*π*β) < P < (F2 + Δ - FW) / (S / 2)2*π*β

[0042] In the above formula, F1 is the minimum acting force required for cleaning the wafer, F2 is the maximum acting force that the wafer can withstand during cleaning, S is the cylinder diameter of the cylinder, β is the load rate of the cylinder, Δ is the correction value of the pressure determined according to the different cleaning liquids and cleaning processes, and FW is the measured value of the first sensor.

[0043] For example, in process A, the acting force of the brush head 12 needs to be controlled between 0.15 N and 4 N, that is, F1 is 0.15 N and F2 is 4 N. The diameter S of the adjusting cylinder 13 is adjusted to 2 cm, the load factor β of the adjusting cylinder 13 is adjusted to 70%, the correction value Δ is 0, and the measured value of the first sensor 16 is 1 N. Substituting these values into the above formula for calculation, the input air pressure P of the cylinder needs to be controlled between 0.387 MPa and 1.36 MPa.

[0044] Controlling the acting force of the brush head 12 has the following effects: (1) It can detect the working state of the brush head 12. When an abnormality occurs to the brush head 12 (such as excessive wear of the bristles), the abnormality can be detected in a timely manner; (2) The acting force of the brush head 12 on the wafer 100 can be adjusted according to the needs of the brushing process to meet the requirements of cleaning different contaminants on the same wafer during the cleaning process; (3) In response to an abnormality on the surface of the wafer (generally, the surface of the wafer is flat, but when there are contaminants on the wafer surface, its surface roughness will change), by adjusting the position of the brush head 12, it can be ensured that the acting force on the wafer 100 always remains unchanged.

[0045] The double-sided wafer cleaning device 85 further includes a fixing frame 2, a first arm shaft 3, and a first driving mechanism 4. The first arm shaft 3 is connected to the brush head fixing plate 11. The first arm shaft 3 is rotatably arranged on the fixing frame 2. The first driving mechanism 4 is used to drive the first arm shaft 3 to rotate. The brush head fixing plates 11 of the two brush assemblies 1 are arranged on the first arm shaft 3.

[0046] The first arm shaft 3 is arranged on the fixing frame 2 through a connecting frame 5. A bearing 51 is provided on the connecting frame 5. The first arm shaft 3 is connected to the connecting frame 5 and the first driving mechanism 4 respectively through the bearing 51. There are two groups of fixing frames 2, which are respectively arranged on both sides of the connecting frame 5. The connecting frame 5 is movably arranged up and down on the fixing frame 2. A locking member for locking the connecting frame 5 and the fixing frame 3 is provided on the connecting frame 5 and / or the fixing frame 2. The locking member is specifically a bolt. The connecting frame 5 is connected to the fixing frame 2 through a height adjusting mechanism 6. A kidney-shaped hole 21 extending in the up and down direction is provided on the fixing frame 2. The connecting frame 5 is connected to the kidney-shaped hole 21 through a bolt. Both between the height adjusting mechanism 6 and the connecting frame 5 and between the kidney-shaped hole 21 and the connecting frame 5 are connected through bolts. By providing the height adjusting mechanism 6 and the kidney-shaped hole 21, the height of the first arm shaft 3 can be adjusted to overcome the problem of asymmetry of the upper brush and the lower brush for wafers caused by processing or assembly, and at the same time, the entire device can also adapt to wafers of different thicknesses.

[0047] The wafer cleaning device 8 further includes a wafer edge cleaning device 84 for cleaning the edge of the wafer 100. The wafer edge cleaning device 84 includes a cleaning brush assembly 841, a mounting seat 842, a chassis 843, and a third driving mechanism 844. The cleaning brush assembly 841 includes a cleaning brush 8411, and the cleaning brush 8411 has an inclined brush surface that contacts and cooperates with the edge of the wafer 100. The number of the cleaning brush surfaces is two, and one of the inclined brush surfaces is configured to contact and cooperate with the edge of the lower surface of the wafer 100, and the other inclined brush surface is configured to contact and cooperate with the edge of the upper surface of the wafer 100. The mounting seat 842 is used to connect the third driving mechanism 844 and the cleaning brush assembly 841; the third driving mechanism 844 is used to drive the mounting seat 842 to rotate around the third driving mechanism 844, so that the cleaning brush assembly 841 approaches the wafer 100. The third driving mechanism 844 is arranged on the chassis 843. As the third driving mechanism 844 rotates, the mounting seat 842 rotates around the third driving mechanism 844, so that the cleaning brush assembly 841 finally rotates around the third driving mechanism 844, so that it can approach the edge of the wafer 100, change the gap between it and the edge of the wafer 100, until the brush surface contacts the edge of the wafer 100 with appropriate pressure to obtain the expected cleaning effect; at the same time, avoid crushing the wafer 100.

[0048] Further, the mounting seat 842 is rotatably connected to the third driving mechanism 844 through an angle adjusting mechanism 847, so that the wafer edge cleaning device has multiple working states, and the contact angles between the brush surfaces of the cleaning brush 8411 and the wafer 100 are different in multiple working states.

[0049] The wafer edge cleaning device 84 further includes an upper nozzle 845 and a lower nozzle 846. The upper nozzle 845 and the lower nozzle 846 are arranged oppositely up and down, and the cleaning brush assembly 841 is located between the upper nozzle 845 and the lower nozzle 846. The upper nozzle 845 and the lower nozzle 846 can also flush the surface of the cleaning brush 8411 while flushing the edge of the wafer 100, improving the cleaning effect. During cleaning, the upper nozzle 845 sprays cleaning liquid onto the upper surface of the wafer 100, and the lower nozzle 846 sprays cleaning liquid onto the lower surface of the wafer 100.

[0050] The cleaning brush assembly 841 further includes a motor for driving the cleaning brush 8411 to rotate and a third sensor for detecting the acting force of the brush surface on the wafer 100, such as a pressure sensor, etc. The third sensor is arranged in the motor or at the connection between the motor and the cleaning brush. By detecting the acting force between the cleaning brush 8411 and the motor, the acting force between the cleaning brush 8411 and the motor is the cleaning force exerted by the cleaning brush 8411 on the surface of the wafer 100, so as to realize the control of the acting force on the surface of the wafer 100.

[0051] The wafer cleaning equipment of this embodiment has at least the following advantages: (1) According to the cleaning requirements of the wafer, the force exerted by the brush head on the wafer is changed by adjusting the cylinder; (2) By setting the third sensor to monitor the force exerted by the brush head on the wafer and controlling the force on the wafer, the cleaning effect is improved while avoiding crushing the wafer by the cleaning brush during cleaning; (3) While cleaning both sides of the wafer, the edge of the wafer is cleaned, realizing the all-round cleaning of the wafer; (4) Since there are notches on the surface of the wafer, by timely adjusting the force of the rotating wheel, the influence of the notches on the wafer cleaning is reduced.

[0052] As shown in this specification and the claims, the terms "including" and "comprising" only imply the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0053] It can be further understood that in this disclosure, "a plurality of" means two or more, and other quantifiers are similar.

[0054] It can be further understood that the terms "first", "second", etc. are used to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not represent a specific order or degree of importance. In fact, the expressions such as "first" and "second" can be used interchangeably. For example, without departing from the scope of this disclosure, the first information can also be called the second information, and similarly, the second information can also be called the first information.

[0055] The above embodiments are only for illustrating the technical concept and characteristics of the present invention, and are a preferred embodiment. The purpose is to enable those who are familiar with this technology to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that, It includes a frame, a clamping and rotating mechanism for clamping the wafer and horizontally rotating the wafer, a wafer edge cleaning device for cleaning the edge of the wafer, and a wafer double-sided cleaning device arranged around the wafer. The wafer double-sided cleaning device includes two brush assemblies, and the two brush assemblies are arranged vertically to clean the upper surface and the lower surface of the wafer. Each of the brush assemblies includes a brush head fixing plate and a brush head. The brush head is arranged on the brush head fixing plate and configured to contact the upper surface or the lower surface of the wafer. At least one of the brush assemblies further includes an adjusting cylinder, and the adjusting cylinder is connected to one of the brush heads to adjust the acting force of the brush head on the upper surface or the lower surface of the wafer.

2. The wafer cleaning equipment according to claim 1, wherein, At least one of the brush assemblies further includes a first rotating motor and a motor plate. The first rotating motor is arranged on the motor plate, the motor plate is connected to the piston rod of the adjusting cylinder, and the brush head is connected to the output shaft of the first rotating motor.

3. The wafer cleaning equipment according to claim 2, characterized in that, At least one of the brush assemblies further includes a first sensor for detecting the acting force of the adjusting cylinder on the motor plate.

4. The wafer cleaning equipment according to any one of claims 1 to 3, characterized in that, Both of the two brush assemblies include the adjusting cylinder, and the two brush assemblies are mirror-symmetrical.

5. The wafer cleaning equipment according to claim 1, wherein, The wafer double-sided cleaning device further includes a fixing frame, a first arm shaft, and a first driving mechanism. The first arm shaft is rotatably arranged on the fixing frame, and the first driving mechanism is configured to drive the first arm shaft to rotate. The brush head fixing plates of the two brush assemblies are arranged on the first arm shaft.

6. The wafer cleaning equipment according to claim 5, wherein, The first arm shaft is arranged on the fixing frame through a connecting frame. The connecting frame is movably arranged up and down on the fixing frame, and a locking member for locking the connecting frame and the fixing frame is arranged on the connecting frame and / or the fixing frame.

7. The wafer cleaning apparatus according to claim 6, wherein The connecting frame is connected to the fixing frame through a height adjusting mechanism.

8. The wafer cleaning equipment according to claim 1, wherein, The clamping and rotating mechanism includes a driving arm, a second arm shaft, an arm shaft seat, a slider, a guide rail, and a second driving mechanism. A rotating wheel for contacting the edge of the wafer to clamp the wafer is arranged on the driving arm. The driving arm is connected to the second arm shaft. The second arm shaft is rotatably arranged in the arm shaft seat. The arm shaft seat is connected to or abuts against the slider. The slider is in sliding fit with the guide rail. The guide rail is fixed on the frame. The second driving mechanism is configured to drive the arm shaft seat to slide along the guide rail. The clamping and rotating mechanism includes a second sensor, and the second sensor is arranged on the guide rail or the frame to detect the acting force on the arm shaft seat.

9. The wafer cleaning equipment according to claim 8, characterized in that, The clamping and rotating mechanism further includes a floating waterproof cover sleeved on the second arm shaft, and the bottom of the floating waterproof cover is installed on the frame.

10. The wafer cleaning equipment according to claim 1, characterized in that, The brush head is internally provided with a cleaning liquid supply assembly, and the supply assembly is configured to spray liquid on the wafer or clean the brush head when cleaning the wafer.

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