Detection equipment and wafer dispergation system
The degree of degreasing of the wafer cutting film is determined by a vacuum pen and a vacuum recorder, which solves the problem of difficult to judge the degreasing effect in the existing technology, and achieves accurate quantization and process optimization to avoid rework damage.
Patent Information
- Application Number
- CN202422032093.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-21
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-21
AI Technical Summary
The prior art is difficult to accurately judge the degluing effect of the wafer cutting film, resulting in frequent rework, affecting the process and possibly damaging the wafer.
A vacuum suction pen is used to absorb the grains and characterize the degree of degreasing by vacuum value. Combined with a vacuum recorder and a comparator, a threshold is set to output the degreasing state, and the process parameters of the degreasing machine are optimized through the feedback unit.
It realizes accurate quantification of the degree of degluing, simplifies operations, improves process efficiency, optimizes the degluing effect and early warning of the degluing machine aging.
Smart Images
Figure CN223092851U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a detection device and a wafer de-gluing system. Background Art
[0002] In the process of semiconductor chip preparation, a wafer fab needs to cut the wafers that have completed integrated circuit preparation, and transfer the cut wafers to a packaging and testing factory. The packaging and testing factory mounts and tests each die cut from the wafers, and finally completes the chip products. Among them, before wafer cutting, a cutting film, such as a UV film, needs to be attached to the back of the wafer. The UV film has strong adhesiveness, which can not only fix the wafer, but also prevent the wafer from cracking, improve the cutting accuracy and increase safety. Moreover, under the irradiation of an ultraviolet lamp, the adhesiveness of the UV film will be greatly reduced, which is beneficial to taking the die in the packaging process.
[0003] However, before and after ultraviolet light irradiation of the cut wafer, its appearance does not change significantly, so it is difficult to determine whether the wafer has been irradiated with ultraviolet light. And the existing de-gluing machines can only monitor the energy of the ultraviolet light, cannot confirm whether ultraviolet light de-gluing is carried out, and even less can confirm the de-gluing effect after ultraviolet light irradiation. For this, the existing solution is to send the wafer to the packaging and testing factory to indirectly estimate whether the wafer has been irradiated with ultraviolet light and its de-gluing effect by using the die picking effect of a die bonder. If the die bonder in the packaging and testing factory cannot pick up the die, the wafer needs to be returned to the wafer fab, and then reworked by the wafer fab. Such back-and-forth transfer not only wastes time costs and affects the process, but also easily damages the wafer. And for the detection of the de-gluing effect of the UV film, some manufacturers use the pulling force of a manual tensile test to characterize the de-gluing effect and the adhesiveness after de-gluing. However, this detection method not only has a large sample preparation difficulty, a long test time, but also has a relatively low test result accuracy.
[0004] Therefore, there is an urgent need for a new detection device to solve the above technical problems. Summary of the Utility Model
[0005] The purpose of the utility model is to provide a detection device and a wafer de-gluing system to solve the problem of how to improve the accuracy of detecting the de-gluing degree of the cutting film.
[0006] To solve the above technical problems, the utility model provides a detection device for detecting the de-gluing degree of a cutting film by a de-gluing machine, and the cutting film is attached to the surface of a wafer. The detection device includes: a suction unit and a detection unit;
[0007] The suction unit includes a vacuum suction pen for sucking the die on the cut wafer;
[0008] The detection unit includes a vacuum recorder; the vacuum recorder is connected to the vacuum pen and is at least used to obtain the vacuum value when the vacuum pen sucks the crystal grain; and the vacuum value is used to characterize the degree of glue removal.
[0009] Optionally, in the detection device, the vacuum recorder includes a detector, a memory, and a comparator that are connected; where
[0010] The detector is at least used to obtain the vacuum value when the vacuum pen sucks the crystal grain;
[0011] The memory is at least used to store the vacuum value;
[0012] The comparator is used to compare the vacuum value with a set threshold to obtain the degree of glue removal.
[0013] Optionally, in the detection device, the degree of glue removal includes fully removed glue, insufficiently removed glue, and unremoved glue; the set threshold includes a first threshold and a second threshold, and the second threshold is greater than the first threshold;
[0014] When the vacuum value when the vacuum pen sucks the crystal grain is less than or equal to the first threshold, the degree of glue removal output by the comparator is fully removed glue;
[0015] When the vacuum value when the vacuum pen sucks the crystal grain is greater than the first threshold and less than or equal to the second threshold, the degree of glue removal output by the comparator is insufficiently removed glue;
[0016] When the vacuum value when the vacuum pen sucks the crystal grain is greater than the second threshold, the degree of glue removal output by the comparator is unremoved glue.
[0017] Optionally, in the detection device, the detection unit further includes an alarm; the alarm is connected to the comparator to issue an alarm when the degree of glue removal is insufficiently removed glue or unremoved glue.
[0018] Optionally, in the detection device, the detection device further includes a feedback unit; the feedback unit is respectively connected to the vacuum recorder and the glue remover, and at least when the degree of glue removal is insufficiently removed glue, the feedback unit provides the vacuum value to the glue remover so that the glue remover adjusts the process parameters according to the vacuum value.
[0019] Optionally, in the detection device, the suction unit further includes a vacuum generator; the vacuum generator is connected to the vacuum pen so that the vacuum pen is in a vacuum state when sucking the crystal grain.
[0020] Optionally, in the detection device, the vacuum generator is also connected to the vacuum recorder, and the vacuum generator has a first working state and a second working state;
[0021] In the first working state, the vacuum generator evacuates the vacuum suction pen until the vacuum suction pen picks up the crystal grain, and the vacuum value when the vacuum suction pen picks up the crystal grain is less than or equal to the second threshold value;
[0022] In the second working state, the vacuum generator evacuates the vacuum suction pen, and when the instantaneous vacuum value of the vacuum suction pen is greater than the second threshold value, the vacuum generator stops evacuating the vacuum suction pen.
[0023] Optionally, in the detection device, the vacuum recorder further includes a display; the display is at least connected to the comparator to display the degree of debonding.
[0024] Based on the same concept, the present invention further provides a wafer debonding system, including the detection device and a debonder; the debonder is connected to the detection device, and the debonder is used to perform debonding on the wafer with a cutting film attached; the detection device is used to detect the degree of debonding of the debonder and at least feedback the degree of debonding to the debonder.
[0025] Optionally, in the wafer debonding system, when the cutting film is a UV film, the debonder is a UV machine.
[0026] In summary, the present invention provides a detection device and a wafer debonding system. Compared with the prior art, the detection device uses the vacuum suction pen in the suction unit to pick up the crystal grains on the wafer and uses the suction vacuum value to characterize the degree of debonding of the cutting film by the debonder. It can not only effectively judge whether the wafer has been debonded, but also accurately quantify the degree of debonding, and the operation is simple, which is beneficial to improving the process efficiency. Moreover, in the wafer debonding system, the detection device at least feedbacks the degree of debonding to the debonder. On the one hand, it is beneficial for the debonder to optimize its process parameters according to the degree of debonding and improve the debonding effect; on the other hand, it is beneficial to long-term monitor the aging state of the devices in the debonder and warn of the failure of the machine. Description of the Drawings
[0027] Those of ordinary skill in the art will understand that the provided drawings are used to better understand the present invention and do not constitute any limitation to the scope of the present invention.
[0028] Figure 1 It is a schematic structural diagram of the detection device in the embodiment of the present invention.
[0029] Figure 2 It is a schematic structural diagram of a wafer de-gluing system in an embodiment of the present utility model.
[0030] Figure 3 It is a schematic structural diagram of a vacuum recorder in an embodiment of the present utility model.
[0031] Figure 4 It is a schematic connection diagram of a de-gluing machine and a detection device in an embodiment of the present utility model.
[0032] And, in the drawings:
[0033] 1 - Detection device; 10 - Suction unit; 100 - Vacuum suction pen; 101 - Vacuum generator; 11 - Detection unit; 110 - Vacuum recorder; 1100 - Detector; 1101 - Memory; 1102 - Comparator; 1103 - Display; 12 - Feedback unit; 13 - Carrying unit; 2 - De-gluing machine;
[0034] W - Wafer; D - Chip; T - Inner cavity. Detailed implementation manners
[0035] To make the objectives, advantages and features of the present utility model clearer, the present utility model will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and not drawn to scale, and are only used to conveniently and clearly assist in explaining the objectives of the embodiments of the present utility model. In addition, the structures shown in the drawings are often part of the actual structures. In particular, the focus to be shown in each drawing is different, and sometimes different scales are used. It should also be understood that unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are only used to distinguish each component, element, step, etc. in the specification, rather than to represent the logical relationship or sequential relationship, etc. between each component, element, step. And, the X-axis direction, Y-axis direction and Z-axis direction referred to in the specification of this application are three mutually perpendicular directions in three-dimensional space.
[0036] Please refer to Figure 1 , this embodiment provides a detection device 1 for detecting the de-gluing degree of a de-gluing machine on a cutting film, and the cutting film is attached to the surface of a wafer W. The detection device 1 includes: a suction unit 10 and a detection unit 11; the suction unit 10 includes a vacuum suction pen 100 for sucking the chips D on the wafer W after cutting; the detection unit 11 includes a vacuum recorder 110; the vacuum recorder 110 is connected to the vacuum suction pen 100 and is at least used to obtain the vacuum value when the vacuum suction pen 100 sucks the chip D; and the vacuum value is used to characterize the de-gluing degree.
[0037] Based on this, the detection device 1 provided in this embodiment uses a vacuum suction pen 100 to suck the die D on the wafer W to determine the degree of debonding of the cutting film by the debonder, and characterizes the degree of debonding by the vacuum value when sucking the die D. It can not only accurately quantify the degree of debonding, but also is easy to operate, which is beneficial to improving the process efficiency.
[0038] The following combines with the attached Figures 1 to 4 , and specifically describes the detection device 1 provided in this embodiment.
[0039] Please refer to Figure 1 and Figure 2 , the detection device 1 includes a suction unit 10, a detection unit 11, a feedback unit 12 and a carrying unit 13. Among them, the suction unit 10, the detection unit 11 and the feedback unit 12 are connected in sequence; and the suction unit 10 is used to suck the die D on the wafer W by using the vacuum pressure difference; the detection unit 11 is used to obtain the vacuum value when the suction unit 10 sucks the die D, and obtain the degree of debonding accordingly; and, the feedback unit 12 is also connected to the debonder 2, and is used to feedback the degree of debonding to the debonder 2, so that the debonder 2 can adjust its own process parameters according to the degree of debonding, thereby optimizing the debonding effect. The carrying unit 13 is a carrying platform for carrying the wafer W, so as to facilitate the suction unit 10 to suck the die D. Among them, the connection referred to in this embodiment can be a wired electrical connection or a wireless communication connection.
[0040] Specifically, the suction unit 10 includes a vacuum suction pen 100 and a vacuum generator 101 which are connected to each other. In this embodiment, the vacuum suction pen 100 and the vacuum generator 101 can be two separate devices; alternatively, the vacuum suction pen 100 and the vacuum generator 101 are integrated into the same device. The vacuum suction pen 100 is used to directly suck the die D; the vacuum generator 101 is used to evacuate the vacuum suction pen 100 to make it in a vacuum state when sucking the die D. Further, the vacuum suction pen 100 has an inner cavity T, and the side of the inner cavity T away from the wafer W is connected to the vacuum generator 101, and the side of the inner cavity T close to the wafer W is connected to the external environment through the holes at the pen tip. And the vacuum generator 101 is a vacuum pump. After the vacuum pump is started, it will evacuate the air in the inner cavity T to make the inner cavity T close to the vacuum state, thereby generating a suction force on the die D in the direction of the pen tip. And in view of the viscosity of the dicing film, when each die D is sucked by the vacuum suction pen 100, it is necessary to overcome the viscosity. Therefore, when the degumming degree of the dicing film is more sufficient, the viscosity of the dicing film to the die D is lower, and the smaller the vacuum value of the vacuum suction pen 100 sucking the die D is. Based on this, the detection device 1 provided in this embodiment quantifies the degumming degree by using the vacuum value according to the relationship between the degumming degree, the viscosity and the vacuum value.
[0041] Please refer to Figure 2 and Figure 3 , the detection unit 11 includes a vacuum recorder 110 and an alarm 111. The vacuum recorder 110 is used to obtain the vacuum value when the vacuum suction pen 100 sucks the die D, and output the degumming degree accordingly; the alarm 111 is used to give an alarm when there is no degumming or insufficient degumming. Specifically, the vacuum recorder 110 includes a detector 1100, a memory 1101, a comparator 1102 and a display 1103 which are connected to each other in pairs. The detector 1100 is connected to the vacuum suction pen 100, and is used to detect the vacuum value of the vacuum suction pen 100, obtain the vacuum value when the vacuum suction pen 100 sucks the die D, and obtain the instantaneous vacuum value when the vacuum suction pen 100 sucks the die D when the dicing film is not degummed. The memory 1101 is used to store the vacuum value and the instantaneous vacuum value obtained by the detector 1100. The comparator 1102 is used to compare the vacuum value or the instantaneous vacuum value with a set threshold value, and obtain the degumming degree according to the comparison result. The display 1103 is used to display the degumming degree, the vacuum value and / or the instantaneous vacuum value. And, the alarm 111 includes, but is not limited to, a buzzer and / or a warning light.
[0042] Preferably, the degree of debinding can be divided into sufficient debinding, insufficient debinding, and non-debinding. The set thresholds include a first threshold and a second threshold, and the second threshold is greater than the first threshold. When the vacuum value when the vacuum pen 100 sucks the die D is less than or equal to the first threshold, it indicates that the vacuum pen 100 can suck the die D with a relatively small suction force, so the degree of debinding output by the comparator 1102 is sufficient debinding. When the vacuum value when the vacuum pen 100 sucks the die D is greater than the first threshold and less than or equal to the second threshold, it indicates that the vacuum pen 100 needs to use a relatively large suction force to suck the die D, so the degree of debinding output by the comparator 1102 is insufficient debinding. When the vacuum value when the vacuum pen 100 sucks the die D is greater than the second threshold, it indicates that the vacuum pen 100 needs to use a very large suction force to suck the die D, or even if a very large suction force is used, it cannot suck the die D. The degree of debinding output by the comparator 1102 is non-debinding.
[0043] It can be seen from this that the first threshold and the second threshold are the judgment bases for the degree of debinding. And the second threshold is the upper limit value of the vacuum value for sucking the die D. When the vacuum value is greater than the second threshold, the suction force generated by the vacuum pen 100 is relatively large, which is likely to damage the die D. Therefore, the vacuum recorder 110 provided in this embodiment is also connected to the vacuum generator 101. And during the process of detecting the degree of debinding, the vacuum generator 101 has a first working state and a second working state. In the first working state, the vacuum generator 101 evacuates the vacuum pen 100 until the vacuum pen 100 sucks the die D, and the vacuum value when the vacuum pen 100 sucks the die D is less than or equal to the second threshold. Preferably, in this state, the vacuum generator 101 controls the vacuum value of the vacuum pen 100 to gradually increase from less than the first threshold, so as to accurately determine the vacuum value for sucking the die D, thereby improving the judgment of the degree of debinding. When the vacuum value of the vacuum pen 100 increases to the second threshold and the vacuum pen 100 still does not suck the die D, the vacuum generator 101 is in the second working state. In this state, after the instantaneous vacuum value of the vacuum generator 101 evacuating the vacuum pen 100 is greater than the second threshold, that is, when it is determined that the degree of debinding is non-debinding, the vacuum generator 101 stops evacuating the vacuum pen 100 to avoid damaging the die D.
[0044] It should be noted that the specific values of the first threshold and the second threshold are not limited in this embodiment, nor is the unit vacuum value for the vacuum generator 101 to adjust the vacuum pen 100 specifically defined. In this regard, it can be specifically set according to factors such as the size and material of different grains D.
[0045] Further, the feedback unit 12 is a communication transmission device or a connecting wire, which is respectively connected to the vacuum recorder 110 and the debonding machine 2. And when the debonding degree is insufficient debonding, the feedback unit 12 provides the vacuum value when the vacuum pen 100 sucks the grain D to the debonding machine 2, so that the debonding machine 2 adjusts the process parameters according to the vacuum value, thereby improving the debonding effect on the cutting film. Exemplarily, when the cutting film is a UV film, the debonding machine 1 is a UV machine, then the process parameters include but are not limited to UV irradiation energy and irradiation time.
[0046] Based on the same concept, this embodiment also provides a wafer debonding system. Please refer to Figure 2 and Figure 4 , the wafer debonding system includes the above-mentioned detection device 1 and debonding machine 2. The detection device 1 and the debonding machine 2 can be two separate devices and are connected to each other, or can be integrated in the same device and connected. Among them, the debonding machine 2 is used to perform debonding on the wafer W with the cutting film attached. The detection device 1 is used to detect the debonding degree of the debonding machine 2 and feedback the debonding degree and the sucked vacuum value to the debonding machine 2, so as to facilitate the debonding machine 2 to optimize its process parameters and improve the debonding effect. Further, the feedback unit 12 in the detection device 1 can also long-term monitor the working state of the debonding machine 2 through the feedback of data information, so as to realize the failure warning of the debonding machine 2 before it reaches the service life and avoid affecting the process. It should be noted that according to the different materials of the cutting film, the types of the debonding machine 2 are also different. For example, when the cutting film is a UV film, the debonding machine 2 is a UV machine to achieve debonding through the irradiation of ultraviolet light.
[0047] In summary, in the detection device and the wafer debonding system provided in this embodiment, the vacuum pen 100 is used to suck the grain D on the wafer W, and the sucked vacuum value is used to characterize the debonding degree of the debonding machine 2 on the cutting film. It can not only judge whether the wafer W has been debonded, but also accurately quantify the debonding degree, and the operation is simple, which is beneficial to improving the process efficiency. In addition, the feedback unit 12 is also provided in the detection device 1. On the one hand, it can timely feedback the debonding degree to the debonding machine 2, which is beneficial to the debonding machine 2 to optimize its process parameters and improve the debonding effect; on the other hand, it can also monitor the aging state of the components in the debonding machine 2 for a long time and realize the warning of the machine failure.
[0048] In addition, it should be recognized that although the present utility model has been disclosed above with preferred embodiments, the above embodiments are not intended to limit the present utility model. For any person skilled in the art, without departing from the scope of the technical solution of the present utility model, many possible changes and modifications can be made to the technical solution of the present utility model by using the technical content disclosed above, or it can be modified into equivalent embodiments with equivalent changes. Therefore, all content that does not depart from the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present utility model still fall within the scope of protection of the technical solution of the present utility model.
Claims
1. A detection device for detecting the degree of debonding of a cutting film by a debonding machine, and the cutting film is attached to the surface of a wafer, characterized in that, The detection device includes: a suction unit and a detection unit; The suction unit includes a vacuum suction pen for sucking the die on the wafer after cutting; The detection unit includes a vacuum recorder; the vacuum recorder is connected to the vacuum suction pen and is at least used to obtain the vacuum value when the vacuum suction pen sucks the die; and the vacuum value is used to characterize the degumming degree.
2. The detection device according to claim 1, wherein The vacuum recorder includes a detector, a memory and a comparator connected to each other; wherein, The detector is at least used to obtain the vacuum value when the vacuum suction pen sucks the die; The memory is at least used to store the vacuum value; The comparator is used to compare the vacuum value with a set threshold value to obtain the degumming degree.
3. The detection device according to claim 2, characterized in that, The degumming degree includes complete degumming, insufficient degumming and no degumming; the set threshold values include a first threshold value and a second threshold value, and the second threshold value is greater than the first threshold value; When the vacuum value when the vacuum suction pen sucks the die is less than or equal to the first threshold value, the degumming degree output by the comparator is complete degumming; When the vacuum value when the vacuum suction pen sucks the die is greater than the first threshold value and less than or equal to the second threshold value, the degumming degree output by the comparator is insufficient degumming; When the vacuum value of the vacuum suction pen sucking the die is greater than the second threshold value, the degumming degree output by the comparator is no degumming.
4. The detection device according to claim 3, wherein, The detection unit further includes an alarm; the alarm is connected to the comparator to issue an alarm when the degumming degree is insufficient degumming or no degumming.
5. The detection device according to claim 3, characterized in that, The detection device further includes a feedback unit; the feedback unit is respectively connected to the vacuum recorder and the degumming machine, and at least when the degumming degree is insufficient degumming, the feedback unit provides the vacuum value to the degumming machine so that the degumming machine adjusts the process parameters according to the vacuum value.
6. The detection device according to claim 3, characterized in that, The suction unit further includes a vacuum generator; the vacuum generator is connected to the vacuum suction pen to make the vacuum suction pen in a vacuum state when sucking the die.
7. The detection device according to claim 6, characterized in that, The vacuum generator is also connected to the vacuum recorder, and the vacuum generator has a first working state and a second working state; In the first working state, the vacuum generator evacuates the vacuum suction pen until the vacuum suction pen sucks the die, and the vacuum value when the vacuum suction pen sucks the die is less than or equal to the second threshold value; In the second working state, the vacuum generator evacuates the vacuum suction pen, and when the instantaneous vacuum value of the vacuum suction pen is greater than the second threshold value, the vacuum generator stops evacuating the vacuum suction pen.
8. The detection device according to claim 2, wherein The vacuum recorder further includes a display; the display is at least connected to the comparator to display the degumming degree.
9. A wafer de-gluing system, characterized in that, Including the detection device and the degumming machine according to any one of claims 1 to 8; the degumming machine is connected to the detection device, and the degumming machine is used to perform degumming on the wafer attached with a cutting film; the detection device is used to detect the degumming degree of the degumming machine and at least feedback the degumming degree to the degumming machine.
10. The wafer de-bonding system according to claim 9, wherein When the cutting film is a UV film, the glue removing machine is a UV machine.