Wafer bearing and adsorbing device

Abstract

The utility model provides a wafer bearing adsorption device which is characterized in that three adjusting columns penetrate through the top end and the bottom end of an adsorption head, an adsorption mechanism is arranged on the outer surface of each adjusting column, a connecting plate is fixedly installed at the tail end of the adsorption head, an adjusting cavity is formed in the left end of the interior of the connecting plate, and a locking mechanism is arranged in the adjusting cavity; the adsorption mechanism comprises a fixed plate fixedly mounted on the outer surface of the adjusting column, an adsorption plate fixedly mounted on the outer side of the fixed plate, and suction cups uniformly distributed on the inner side of the adsorption plate; the locking mechanism comprises an electric push rod installed at the left end in the adjusting cavity, a cross rod penetrating through the right end in the adjusting cavity and connected with the electric push rod, a pull rope fixedly installed at the right end of the cross rod, a ball shaft located at the other end of the pull rope and a soft rod movably connected with the ball shaft. According to the wafer bearing and adsorption device, the adsorption mechanism ensures that the wafers are firmly fixed in the carrying process by enhancing stable adsorption of the wafers; and the locking mechanism enables the clamping of the wafer to be safer and more stable in the carrying process by increasing the clamping force.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer handling devices, and more specifically, to a wafer carrying and adsorbing device. Background Art

[0002] A wafer is a thin slice of semiconductor material used to manufacture integrated circuits and other microelectronic components. It is usually made of silicon and is precisely processed to form circuits and electronic components. A wafer carrying and adsorbing device is used to stabilize and move wafers during the semiconductor manufacturing process. It uses adsorption technology to firmly fix the wafers on the carrier, ensuring that the wafers will not be damaged or moved during processing, cleaning, or transportation. This is crucial for improving manufacturing accuracy and production efficiency. In traditional vacuum adsorption dental forks, the adsorption points are not elastic, resulting in the dental forks being able to only pick up and adsorb wafers with a standard low warpage amount. When using traditional vacuum adsorption dental forks to handle wafers with a high warpage amount, usually a large suction force is used to ensure sufficient adsorption force, but this easily increases the possibility of wafer fragmentation.

[0003] Regarding the above problems, for the technical problem of insufficiently firm and safe curved surface adsorption of wafers, after a large amount of retrieval, a wafer carrying and adsorbing device with a patent number of 202323259885.0 was found, which relates to the technical field of wafer handling devices and includes a dental fork. A vacuum channel is opened in the dental fork. The dental fork includes a connecting portion and a fork head portion provided at one end of the connecting portion. A plurality of rubber suction nozzles are installed on the fork head portion. Each rubber suction nozzle includes an air pipe and a suction head provided at the top end of the air pipe in a circular horn shape. The bottom end of the air pipe is communicated with the vacuum channel, enabling the suction head to elastically deform itself to closely adhere to the wafer, achieving the adsorption of wafers with a high warpage amount (crying / smiling face shape); however, the technical solution provided by this patent has the following problems:

[0004] (1) When adsorbing a wafer, a single-sided adsorption device only applies an adsorption force on one side of the wafer. If there is no support on the other side of the wafer, it may cause the wafer to shake or fall off during handling or processing;

[0005] (2) When adsorbing a wafer, it is usually fixed only by a single vacuum adsorption method, lacking an auxiliary fixing structure. Vacuum adsorption may not be able to evenly apply force on the entire surface of the wafer, especially at the edge part of the wafer, which may cause uneven local stress on the wafer, increasing the risk of cracking or deformation.

[0006] The present utility model can adsorb and fix the left and right sides of the wafer through a two-way adsorption mechanism, and can also apply an additional clamping force while adsorbing the wafer through a locking mechanism, making wafer handling safer. Summary of the Utility Model

[0007] The purpose of the present utility model is to solve the technical problems raised in the above-mentioned background technology and provide a wafer carrying and adsorbing device.

[0008] To achieve the above object, the present utility model provides the following technical solution: A wafer carrying and adsorbing device, comprising: an adsorption head; three adjustment columns penetrate through the top and bottom ends of the adsorption head, an adsorption mechanism is arranged on the outer surface of the adjustment column, a connecting plate is fixedly installed at the tail end of the adsorption head, an adjustment cavity is opened at the left end inside the connecting plate, and a locking mechanism is arranged inside the adjustment cavity;

[0009] The adsorption mechanism includes a fixing plate fixedly installed on the outer surface of the adjustment column, an adsorption plate fixedly installed on the outside of the fixing plate, and suction cups evenly distributed on the inner side of the adsorption plate;

[0010] The locking mechanism includes an electric push rod installed at the left end inside the adjustment cavity, a cross bar penetrating through the right end inside the adjustment cavity and connected to the electric push rod, a pull rope fixedly installed at the right end of the cross bar, a ball shaft located at the other end of the pull rope, and a flexible rod movably connected to the ball shaft.

[0011] Further preferred scheme: The cross bar is slidably matched with the adjustment cavity, and the length of the cross bar is the same as the width of the adsorption head.

[0012] Further preferred scheme: Channels adapted to the pull rope penetrate through the adsorption head and the connecting plate.

[0013] Further preferred scheme: One end of the flexible rod is rotatably connected to the pull rope through the ball shaft, and the other end of the flexible rod penetrates into the adsorption head and is fixedly connected to the adjustment column.

[0014] Further preferred scheme: The adjustment column, the fixing plate and the adsorption plate are integrally arranged, and the adjustment column is slidably matched with the inside of the adsorption head.

[0015] Further preferred scheme: The adsorption plate is arranged in a curved surface shape and is made of rubber.

[0016] Further preferred scheme: The front end of the adsorption head is in an arc shape and adsorbs a wafer, and the wafer is located at the middle position of the adsorption mechanism.

[0017] Beneficial effects:

[0018] 1. By setting the adsorption mechanism, after the adjustment column is subjected to traction, the connected adsorption mechanism will approach the wafer, so that the fixing plate fixedly installed on the outer surface of the adjustment column, the adsorption plate fixedly installed on the outside of the fixing plate, and the suction cups evenly distributed on the inner side of the adsorption plate adsorb the wafer. And because the adsorption plate is arranged in a curved surface shape and is made of rubber, it can be bent at a certain angle to adapt to the surface of the wafer and further increase the fitting area with the wafer, making the wafer more stable during adsorption;

[0019] 2. By setting up a locking mechanism, when the electric push rod contracts, it can pull the cross bar to slide leftward along the adjustment cavity, thereby pulling the pull rope, ball shaft, and soft rod. Further, the two adjustment columns connected to the soft rod can be moved closer to the middle inside of the suction head, locking the suction mechanism. When the wafer is adsorbed and fixed by the suction mechanism, the clamping force can be further increased, making the wafer handling safer.

[0020] 3. In summary, for this kind of wafer carrying and suction device, the suction mechanism ensures the firm fixation of the wafer during handling by enhancing the stable suction of the wafer and adapting to different surface shapes; the locking mechanism makes the clamping of the wafer during handling safer and more stable by increasing the clamping force and automatic adjustment. Brief Description of the Drawings

[0021] Figure 1 It is a schematic diagram of the overall structure of the present utility model.

[0022] Figure 2 It is a schematic diagram of the internal structure of the suction head of the present utility model

[0023] Figure 3 It is a schematic diagram of the structure of the suction mechanism of the present utility model.

[0024] Figure 4 For the present utility model Figure 2 The enlarged view at A in it.

[0025] Figures 1-4 In the figure: 1. Suction head; 2. Connecting plate; 3. Adjustment cavity; 301. Electric push rod; 302. Cross bar; 303. Pull rope; 304. Ball shaft; 305. Soft rod; 4. Adjustment column; 401. Fixed plate; 402. Suction plate; 403. Suction cup; 5. Wafer. Detailed Embodiment

[0026] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the attached Figures 1-4 drawings in the embodiments of the present utility model.

[0027] Please refer to Figures 1-4, in the embodiment of the present utility model, a wafer carrying and adsorbing device includes: The adsorption head 1 is the core part of the entire device. Its arc-shaped front end is designed to fit the surface of the wafer 5 and make contact with and fix the wafer 5 through the adsorption mechanism. The adjusting columns 4 at the top and bottom of the adsorption head 1 penetrate the entire adsorption head and are used to install and adjust the position of the adsorption mechanism; The adjusting column 4 is a columnar structure that passes through the top and bottom of the adsorption head 1, connecting the adsorption mechanism and the locking mechanism. The outer surface of the adjusting column 4 is provided with an adsorption mechanism, which is responsible for the actual adsorption function. Through the adjusting column 4, the user can adjust the position and force of the adsorption mechanism to adapt to wafers of different sizes; The adsorption mechanism is installed on the adjusting column 4 and is responsible for applying the adsorption force to the wafer 5 to achieve the fixation and carrying of the wafer 5. The symmetric arrangement of multiple adsorption mechanisms can evenly distribute the adsorption force and improve the fixation stability; The connecting plate 2 is fixed at the tail end of the adsorption head 1 and contains an adjusting cavity 3 and a locking mechanism inside; The adjusting cavity 3 houses the locking mechanism and provides a space where the position of the adsorption mechanism can be adjusted. Through the adjustment of the locking mechanism, the adsorption mechanism can move and be accurately positioned to ensure the clamping effect of the wafer 5; The locking mechanism is located inside the adjusting cavity 3 and directly interacts with the adjusting column 4 and the adsorption mechanism. By locking the position of the adsorption mechanism, the wafer 5 is further clamped to prevent position changes during handling; The wafer 5 is the object to be clamped by the device and is fixed on the adsorption head 1 through the action of the adsorption mechanism.

[0028] , in the embodiment of the present utility model, the adsorption mechanism includes: The fixing plate 401 serves as the basic component of the adsorption mechanism, playing a role in stabilizing and supporting; The adsorption plate 402 is fixed on the outside of the fixing plate 401 and is made of a curved surface design and rubber material. Due to its curved surface design and the flexibility of the rubber material, the adsorption plate 402 can bend at a certain angle to adapt to the curved surface of the wafer 5. This adaptability enables the adsorption plate 402 to closely fit the surface of the wafer 5, increasing the contact area. By increasing the fitting area, the adsorption plate 402 further improves the contact stability with the wafer 5, thereby enhancing the overall adsorption effect; The suction cups 403 are evenly distributed on the inner side of the adsorption plate 402, and their main function is to directly apply the adsorption force. Since the suction cups 403 are evenly distributed, this helps to avoid uneven force distribution during the adsorption process, thereby improving the stability and reliability of the adsorption.

[0029] , in the embodiment of the present utility model, the structure in which the adjusting column 4, the fixing plate 401, and the adsorption plate 402 are integrally arranged realizes the precise adjustment of the adjusting column 4, the fixing plate 401, and the adsorption plate 402 by using the sliding fit between the adjusting column 4 and the inside of the adsorption head 1.

[0030] , in the embodiment of the present utility model, the combination of the curved surface design and the rubber material endows the adsorption plate 402 with high adaptability, uniform contact pressure, enhanced adsorption force, and excellent buffering ability

[0031] In the embodiment of the present utility model, the locking mechanism includes: The electric push rod 301 is located at the left end of the adjustment cavity 3 and is responsible for providing driving force. Its contraction action pushes the cross bar 302 to slide to the left, transmitting the movement to other components; The cross bar 302 penetrates the inside of the adjustment cavity 3 and is connected to the electric push rod 301. Its function is to convert the linear motion of the electric push rod into the pulling of the pulling rope 303; The pulling rope 303 is fixedly installed at the right end of the cross bar 302 and is pulled by the movement of the cross bar 302. It transmits the movement of the cross bar 302 to the ball shaft 304; The ball shaft 304 is connected to the pulling rope 303 and allows for flexible connection with the soft rod 305 through a spherical structure, driving the movement of the soft rod 305; The soft rod 305 is movably connected to the ball shaft 304, and the other end is connected to the adjustment column 4. Its function is to transmit the movement of the ball shaft 304 to the adjustment column 4. The soft rod 305 ensures that the adjustment column 4 can move without being restricted during the movement process, enabling the adjustment column to move towards the middle direction of the suction head 1 to complete the locking process.

[0032] In the embodiment of the present utility model, the cross bar 302 is slidably matched with the adjustment cavity 3, and its length is consistent with the width of the suction head 1. The cross bar 302 that is slidably matched with the adjustment cavity 3 will not generate excessive swinging or vibration during the movement process, thereby providing a stable operating environment.

[0033] In the embodiment of the present utility model, both the inside of the suction head 1 and the connecting plate 2 are penetrated with channels adapted to the pulling rope 303, ensuring that the pulling rope 303 will not deviate during the transmission of movement. The channel design can prevent the pulling rope 303 from interfering with the internal structure of the suction head 1 and the connecting plate 2, thereby reducing friction and wear. The existence of the channel enables the pulling rope 303 to distribute force evenly when transmitting force.

[0034] Working principle: First, when the device transports the wafer 5, the user can place the wafer 5 at the right end of the suction head 1 and make the wafer 5 exactly located between multiple groups of suction mechanisms arranged symmetrically; Then, when the electric push rod 301 contracts, it can pull the cross bar 302 to slide along the adjustment cavity 3 to the left end, thereby pulling the pulling rope 303, the ball shaft 304, and the soft rod 305. Furthermore, the two adjustment columns 4 connected to the soft rod 305 can be moved closer to the middle direction inside the suction head 1; Subsequently, after the adjustment column 4 is subjected to the traction force, it will cause the suction mechanism connected to it to approach the wafer 5, so that the fixing plate 401 fixedly installed on the outer surface of the adjustment column 4, the suction plate 402 fixedly installed on the outside of the fixing plate 401, and the suction cups 403 evenly distributed on the inner side of the suction plate 402 adsorb the wafer 5; And because the suction plate 402 is arranged in a curved shape and made of rubber, it can be bent at a certain angle to adapt to the surface of the wafer 5, and further increase the fitting area with the wafer 5, making the wafer 5 more stable during adsorption; Finally, the transportation of the wafer 5 is made safer.

Claims

1. A wafer carrier adsorption device, comprising: Adsorption head (1), characterized in that: Three adjusting columns (4) penetrate through the top and bottom of the adsorption head (1). An adsorption mechanism is arranged on the outer surface of the adjusting column (4). A connecting plate (2) is fixedly installed at the tail end of the adsorption head (1). An adjusting cavity (3) is opened at the left end inside the connecting plate (2), and a locking mechanism is arranged inside the adjusting cavity (3); The adsorption mechanism includes a fixing plate (401) fixedly installed on the outer surface of the adjusting column (4), an adsorption plate (402) fixedly installed on the outside of the fixing plate (401), and suction cups (403) evenly distributed on the inner side of the adsorption plate (402); The locking mechanism includes an electric push rod (301) installed at the left end inside the adjusting cavity (3), a cross bar (302) penetrating through the right end inside the adjusting cavity (3) and connected to the electric push rod (301), a pull rope (303) fixedly installed at the right end of the cross bar (302), a ball shaft (304) at the other end of the pull rope (303), and a flexible rod (305) movably connected to the ball shaft (304).

2. The wafer carrier adsorption device according to claim 1, wherein: The cross bar (302) is in sliding fit with the adjusting cavity (3), and the length of the cross bar (302) is the same as the width of the adsorption head (1).

3. A wafer carrier adsorption device according to claim 1, characterized in that: Channels adapted to the pull rope (303) penetrate through the adsorption head (1) and the connecting plate (2).

4. A wafer carrier adsorption device according to claim 1, characterized in that: One end of the flexible rod (305) is rotatably connected to the pull rope (303) through the ball shaft (304), and the other end of the flexible rod (305) penetrates into the adsorption head (1) and is fixedly connected to the adjusting column (4).

5. A wafer carrier adsorption device according to claim 1, characterized in that: The adjusting column (4), the fixing plate (401) and the adsorption plate (402) are integrally arranged, and the adjusting column (4) is in sliding fit with the inside of the adsorption head (1).

6. The wafer carrier adsorption device according to claim 1, characterized in that: The adsorption plate (402) is arranged in a curved surface shape and is made of rubber.

7. A wafer carrier adsorption device according to claim 1, characterized in that: The front end of the adsorption head (1) is in an arc shape and adsorbs a wafer (5), and the wafer (5) is located at the middle position of the adsorption mechanism.

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