Wafer adsorption disc

Abstract

The utility model relates to the technical field of adsorption discs, and discloses a wafer adsorption disc, which comprises a base and a mounting plate, a connecting seat is fixedly connected onto the mounting plate, a main adsorption disc body is fixedly connected onto the connecting seat, a first motor is fixedly mounted in the connecting seat, an output end of the first motor is fixedly connected with a rotating disc, and the rotating disc is fixedly connected with a second motor. The connecting rod is fixedly connected with an auxiliary suction disc body, the mounting plate is fixedly provided with a vacuum generator, the flow guide block is fixedly connected with an air guide pipe, the bottom of the main suction disc body is provided with a main suction cup, and the bottom of the auxiliary suction disc body is provided with an auxiliary suction cup. According to the utility model, during use, the first motor is started to drive the rotating disc to rotate, and rapid expansion and contraction of the six groups of auxiliary adsorption disc bodies are realized through cooperation of the sliding grooves and the sliding rods, so that the adsorption area is flexibly adjusted according to the actual size of a wafer, the universality and adaptability of equipment are greatly improved, and the production cost and the maintenance difficulty are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of suction cups, in particular to a wafer suction cup. Background Art

[0002] A wafer, as the basic material in the semiconductor industry, refers to a circular thin slice made of high-purity monocrystalline silicon or other semiconductor materials through complex processes such as slicing, grinding, and polishing. It is widely used in various electronic devices such as computer processors, memories, sensors, and communication devices. The main function of a wafer suction cup is to firmly fix the wafer through vacuum suction or other non-contact methods without touching the surface of the wafer, so as to ensure the accuracy and safety of the wafer in the processes of transmission, positioning, processing, etc., and avoid scratching or contaminating the surface of the wafer.

[0003] However, the current traditional wafer suction cups have certain limitations. They can only adapt to wafers of fixed sizes, cannot adjust the adsorption area according to wafers of different sizes, lack flexibility, and are difficult to meet the production requirements of diverse wafer sizes in semiconductor manufacturing processes. Moreover, the operation steps of the suction cup are often complex during the transfer operation, affecting production efficiency and operation convenience. Therefore, a wafer suction cup is proposed. Summary of the Utility Model

[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a wafer suction cup is proposed.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A wafer suction cup includes a base and a mounting plate. A connecting seat is fixedly connected to the mounting plate, a main suction cup body is fixedly connected to the connecting seat, a first motor is fixedly installed in the connecting seat, an output end of the first motor is fixedly connected to a rotating disk, the rotating disk is rotatably connected to the main suction cup body, a sliding groove is formed in the rotating disk, a sliding rod is slidably connected in the sliding groove, a connecting rod is fixedly connected to the sliding rod, the connecting rod penetrates and slides on the rotating disk, a sub-suction cup body is fixedly connected to the connecting rod, a sub-connecting head is provided on the sub-suction cup body, a main-connecting head is provided on the main suction cup body, a vacuum generator is fixedly installed on the mounting plate, an output end of the vacuum generator is fixedly connected to a diversion block, an air duct is fixedly connected to the diversion block, there are multiple groups of the air ducts, both the sub-connecting head and the main-connecting head are fixedly connected to the air ducts, a main suction cup is provided at the bottom of the main suction cup body, the main suction cup is fixedly connected through penetration with the main-connecting head, a sub-suction cup is provided at the bottom of the sub-suction cup body, and the sub-suction cup is fixedly connected through penetration with the sub-connecting head.

[0006] As a further description of the above technical solution:

[0007] A second motor is fixedly installed on the base. The output end of the second motor is fixedly connected to a driving bevel gear. The driving bevel gear is meshed with a driven bevel gear. A lifting threaded rod is fixedly connected to the driven bevel gear. A threaded sleeve is threadedly connected to the lifting threaded rod. The top of the threaded sleeve is fixedly connected to a support seat. A telescopic rod is fixedly installed on the base. The telescopic end of the telescopic rod is fixedly connected to the support seat.

[0008] As a further description of the above technical solution:

[0009] A third motor is fixedly installed on the support seat. The output end of the third motor is fixedly connected to a driving gear. The driving gear is meshed with a driven gear. A rotating seat is fixedly connected to the driven gear. A connecting column is fixedly connected to the rotating seat. The connecting column is fixedly connected to the mounting plate.

[0010] As a further description of the above technical solution:

[0011] There are multiple groups of the sliding grooves and they are evenly distributed on the rotating disc. The connecting rod penetrates and slides in the main suction disc body. There are multiple groups of the main suction cups and they are evenly distributed at the bottom of the main suction disc body. There are multiple groups of the auxiliary suction cups and they are evenly distributed at the bottom of the auxiliary suction disc body.

[0012] As a further description of the above technical solution:

[0013] There are six groups of the connecting rods and the auxiliary suction disc bodies and they are evenly distributed on the main suction disc body. There are six groups of the auxiliary connection heads and the main connection heads. The vacuum generator is located above the connection seat.

[0014] As a further description of the above technical solution:

[0015] The driven bevel gear and the lifting threaded rod are both rotatably connected to the base. There are two groups of the telescopic rods and they are symmetrically distributed on the base.

[0016] As a further description of the above technical solution:

[0017] The driving gear and the driven gear both rotate inside the support seat. The rotating seat rotates on the support seat.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the present utility model, when using the wafer suction disc, the first motor is started to drive the rotating disc to rotate. By means of the cooperation between the sliding groove and the sliding rod, the rapid expansion and contraction of the six groups of auxiliary suction disc bodies are realized, so as to flexibly adjust the suction area according to the actual size of the wafer, enhance the stability and firmness of wafer suction, greatly improve the versatility and adaptability of the equipment, be able to process wafers of various specifications without replacing suction discs of different sizes, and reduce the production cost and maintenance difficulty.

[0020] 2. In the present utility model, when using the wafer suction disc, the second motor is started. Through the cooperation between the bevel gear and the lifting screw rod, the height adjustment of the wafer suction disc is realized, ensuring the smoothness of the lifting of the main suction disc body, improving the accuracy and efficiency of wafer suction. At the same time, through the setting of the driving gear and the driven gear, the main suction disc body can freely rotate in the horizontal plane to realize the flexible adjustment of the wafer position, greatly simplifying the transfer process of the wafer between different processes and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic three-dimensional structure diagram of a wafer suction disc proposed by the present utility model Figure 1 ;

[0022] Figure 2 is a partial structural cross-section view of a wafer suction disc proposed by the present utility model Figure 1 ;

[0023] Figure 3 is Figure 2 an enlarged view of part A in

[0024] Figure 4 is a schematic three-dimensional structure diagram of a wafer suction disc proposed by the present utility model Figure 2 ;

[0025] Figure 5 is a partial structural cross-section view of a wafer suction disc proposed by the present utility model Figure 2 .

[0026] LEGEND DESCRIPTION:

[0027] 1. Base; 2. Mounting plate; 3. Connecting seat; 4. Main suction disc body; 5. First motor; 6. Rotating disc; 7. Sliding groove; 8. Sliding rod; 9. Connecting rod; 10. Auxiliary suction disc body; 11. Auxiliary connecting head; 12. Main connecting head; 13. Vacuum generator; 14. Flow guiding block; 15. Air duct; 16. Main suction cup; 17. Auxiliary suction cup; 18. Second motor; 19. Driving bevel gear; 20. Driven bevel gear; 21. Lifting screw rod; 22. Thread sleeve; 23. Support seat; 24. Telescopic rod; 25. Third motor; 26. Driving gear; 27. Driven gear; 28. Rotating seat; 29. Connecting column. Detailed implementation manners

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0029] Refer to Figures 1 - 5, An embodiment provided by the present utility model: A wafer suction plate, comprising a base 1 and a mounting plate 2. A connecting seat 3 is fixedly connected to the mounting plate 2, and a main suction plate body 4 is fixedly connected to the connecting seat 3. A first motor 5 is fixedly installed inside the connecting seat 3, and the output end of the first motor 5 is fixedly connected to a rotating disk 6. The rotating disk 6 is rotatably connected to the main suction plate body 4. A chute 7 is formed on the rotating disk 6, and a sliding rod 8 is slidably connected inside the chute 7. A connecting rod 9 is fixedly connected to the sliding rod 8. The connecting rod 9 penetrates and slides on the rotating disk 6. A secondary suction plate body 10 is fixedly connected to the connecting rod 9. A secondary connecting head 11 is provided on the secondary suction plate body 10, and a main connecting head 12 is provided on the main suction plate body 4. A vacuum generator 13 is fixedly installed on the mounting plate 2. The output end of the vacuum generator 13 is fixedly connected to a flow guiding block 14. A gas guiding pipe 15 is fixedly connected to the flow guiding block 14. There are multiple groups of the gas guiding pipes 15. Both the secondary connecting head 11 and the main connecting head 12 are fixedly connected to the gas guiding pipe 15. A main suction cup 16 is provided at the bottom of the main suction plate body 4, and the main suction cup 16 is fixedly connected through penetration with the main connecting head 12. A secondary suction cup 17 is provided at the bottom of the secondary suction plate body 10, and the secondary suction cup 17 is fixedly connected through penetration with the secondary connecting head 11. The operator starts the second motor 18. The second motor 18 drives the driven bevel gear 20 to rotate through the driving bevel gear 19. The driven bevel gear 20 drives the threaded sleeve 22 and the support base 23 to move up and down through the lifting threaded rod 21. At this time, the telescopic rod 24 will expand and contract along with one end of the support base 23. The telescopic rod 24 is used for limiting through expansion and contraction, so as to realize the lifting of the mounting plate 2 and the main suction plate body 4 thereon. By moving the main suction plate body 4 up and down, it is convenient to adsorb and pick up the wafer. Then, the main suction cup 16 and the secondary suction cup 17 are connected to the gas guiding pipe 15 through the secondary connecting head 11 and the main connecting head 12. After placing the wafer below the main suction plate body 4, the vacuum generator 13 is started. Through the main suction cup 16 and the secondary suction cup 17, vacuum is pumped to suck away the air flow inside the flow guiding block 14, so that the air pressure between the wafer and the main suction cup 16 is lower than the external air pressure, thereby adsorbing the wafer. For wafers with larger size specifications, the first motor 5 can be started. The first motor 5 drives the rotating disk 6 to rotate. The sliding rod 8 and the connecting rod 9 are driven to slide on the main suction plate body 4 through the chute 7 on the rotating disk 6, so as to expand the six groups of secondary suction plate bodies 10. Through the rapid expansion and contraction of the six groups of secondary suction plate bodies 10, the adsorption area can be flexibly adjusted according to the actual size of the wafer, enhancing the stability and firmness of wafer adsorption, greatly improving the versatility and adaptability of the equipment, being able to process wafers of various specifications without replacing suction plates of different sizes, and reducing the production cost and maintenance difficulty.

[0030] In addition, a second motor 18 is fixedly installed on the base 1. The output end of the second motor 18 is fixedly connected to a driving bevel gear 19. A driven bevel gear 20 is meshed with the driving bevel gear 19. A lifting threaded rod 21 is fixedly connected to the driven bevel gear 20. A threaded sleeve 22 is threadedly connected to the lifting threaded rod 21. The top of the threaded sleeve 22 is fixedly connected to a support seat 23. A telescopic rod 24 is fixedly installed on the base 1. The telescopic end of the telescopic rod 24 is fixedly connected to the support seat 23. By starting the second motor 18 and cooperating the bevel gears with the lifting threaded rod 21, the height adjustment of the wafer suction disc is realized, ensuring the smoothness of the lifting of the main suction disc body 4 and improving the accuracy and efficiency of wafer suction. A third motor 25 is fixedly installed on the support seat 23. The output end of the third motor 25 is fixedly connected to a driving gear 26. A driven gear 27 is meshed with the driving gear 26. A rotating seat 28 is fixedly connected to the driven gear 27. A connecting column 29 is fixedly connected to the rotating seat 28. The connecting column 29 is fixedly connected to the mounting plate 2. At the same time, through the arrangement of the driving gear 26 and the driven gear 27, the main suction disc body 4 can rotate freely in the horizontal plane, realizing the flexible adjustment of the wafer position, greatly simplifying the transfer process of the wafer between different processes and improving the production efficiency. There are multiple groups of sliding grooves 7 evenly distributed on the rotating disc 6. The connecting rod 9 passes through and slides in the main suction disc body 4. There are multiple groups of main suction cups 16 evenly distributed at the bottom of the main suction disc body 4. There are multiple groups of auxiliary suction cups 17 evenly distributed at the bottom of the auxiliary suction disc body 10. There are six groups of both the connecting rod 9 and the auxiliary suction disc body 10 evenly distributed on the main suction disc body 4. There are six groups of both the auxiliary connecting head 11 and the main connecting head 12. The vacuum generator 13 is located above the connecting seat 3. The driven bevel gear 20 and the lifting threaded rod 21 are both rotatably connected to the base 1. There are two groups of telescopic rods 24 symmetrically distributed on the base 1. The driving gear 26 and the driven gear 27 both rotate in the support seat 23. The rotating seat 28 rotates on the support seat 23.

[0031] Working principle: When using this wafer suction chuck, the operator starts the second motor 18. The second motor 18 drives the driven bevel gear 20 to rotate through the driving bevel gear 19. The driven bevel gear 20 drives the threaded sleeve 22 and the support base 23 to move up and down through the lifting threaded rod 21. At this time, the telescopic rod 24 will expand and contract along with one end of the support base 23, and the expansion and contraction of the telescopic rod 24 is used for limiting, so as to realize the lifting of the mounting plate 2 and the main suction disc body 4 thereon. By the up and down movement of the main suction disc body 4, it is convenient to adsorb and pick up the wafer. Then, the main suction cup 16 and the auxiliary suction cup 17 are connected to the air guide pipe 15 through the auxiliary connection head 11 and the main connection head 12. After placing the wafer under the main suction disc body 4, the vacuum generator 13 is started, and the air in the diversion block 14 is sucked away by pumping vacuum through the main suction cup 16 and the auxiliary suction cup 17, so that the air pressure between the wafer and the main suction cup 16 is lower than the external air pressure, thereby adsorbing the wafer. For wafers with larger size specifications, the first motor 5 can be started. The first motor 5 drives the rotating disc 6 to rotate, and drives the slide rod 8 and the connecting rod 9 to slide on the main suction disc body 4 through the chute 7 on the rotating disc 6, so as to expand the six groups of auxiliary suction disc bodies 10, realizing the expansion of the adsorption area. Then, the main suction cup 16 and the auxiliary suction cup 17 are used to adsorb the larger-sized wafer. After the wafer is adsorbed, the third motor 25 can be started. The third motor 25 drives the driven gear 27 to rotate through the driving gear 26, so that the driven gear 27 drives the connecting column 29 and the mounting plate 2 to rotate through the rotating seat 28, thereby changing the position of the wafer on the main suction disc body 4, facilitating the transfer operation of the wafer.

[0032] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer suction chuck, comprising a base (1) and a mounting plate (2), characterized in that: A connecting seat (3) is fixedly connected to the mounting plate (2), a main suction disc body (4) is fixedly connected to the connecting seat (3), a first motor (5) is fixedly installed in the connecting seat (3), an output end of the first motor (5) is fixedly connected to a rotating disc (6), the rotating disc (6) is rotationally connected to the main suction disc body (4), a sliding groove (7) is formed in the rotating disc (6), a sliding rod (8) is slidably connected in the sliding groove (7), a connecting rod (9) is fixedly connected to the sliding rod (8), the connecting rod (9) penetrates and slides on the rotating disc (6), a sub-suction disc body (10) is fixedly connected to the connecting rod (9), a sub-connecting head (11) is arranged on the sub-suction disc body (10), a main connecting head (12) is arranged on the main suction disc body (4), a vacuum generator (13) is fixedly installed on the mounting plate (2), an output end of the vacuum generator (13) is fixedly connected to a flow guiding block (14), a gas guiding pipe (15) is fixedly connected to the flow guiding block (14), a plurality of groups of the gas guiding pipes (15) are provided, the sub-connecting head (11) and the main connecting head (12) are both fixedly connected to the gas guiding pipe (15), a main suction cup (16) is arranged at the bottom of the main suction disc body (4), the main suction cup (16) is fixedly connected through the main connecting head (12), a sub-suction cup (17) is arranged at the bottom of the sub-suction disc body (10), and the sub-suction cup (17) is fixedly connected through the sub-connecting head (11).

2. The wafer suction chuck according to claim 1, wherein: A second motor (18) is fixedly installed on the base (1), an output end of the second motor (18) is fixedly connected to a driving bevel gear (19), a driven bevel gear (20) is meshed with the driving bevel gear (19), a lifting screw rod (21) is fixedly connected to the driven bevel gear (20), a threaded sleeve (22) is threadedly connected to the lifting screw rod (21), a support seat (23) is fixedly connected to the top of the threaded sleeve (22), a telescopic rod (24) is fixedly installed on the base (1), and a telescopic end of the telescopic rod (24) is fixedly connected to the support seat (23).

3. The wafer suction chuck according to claim 2, wherein: A third motor (25) is fixedly installed on the support seat (23), an output end of the third motor (25) is fixedly connected to a driving gear (26), a driven gear (27) is meshed with the driving gear (26), a rotating seat (28) is fixedly connected to the driven gear (27), a connecting column (29) is fixedly connected to the rotating seat (28), and the connecting column (29) is fixedly connected to the mounting plate (2).

4. The wafer suction chuck according to claim 3, characterized in that: A plurality of groups of the sliding grooves (7) are provided and are evenly distributed on the rotating disc (6), the connecting rod (9) penetrates and slides on the main suction disc body (4), a plurality of groups of the main suction cups (16) are provided and are evenly distributed at the bottom of the main suction disc body (4), and a plurality of groups of the sub-suction cups (17) are provided and are evenly distributed at the bottom of the sub-suction disc body (10).

5. The wafer suction chuck according to claim 4, wherein: The connecting rods (9) and the secondary suction disc bodies (10) are both provided with six groups and are evenly distributed on the main suction disc body (4). The secondary connection heads (11) and the main connection heads (12) are both provided with six groups. The vacuum generator (13) is located above the connection seat (3).

6. The wafer suction chuck according to claim 5, wherein: The driven bevel gear (20) and the lifting threaded rod (21) are both rotatably connected to the base (1). Two sets of telescopic rods (24) are provided and are symmetrically distributed on the base (1).

7. A wafer suction chuck according to claim 6, characterized in that: The driving gear (26) and the driven gear (27) both rotate within the support seat (23). The rotating seat (28) rotates on the support seat (23).

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