Wafer clamp

By adopting a detachable fixture structure and using fixed shrapnel and positioning blocks made of SUS304 and Teflon, the problem of easy deformation of existing fixtures is solved, the wafer fixation effect and production yield are improved, and the demand for small batch production of multiple varieties is adapted.

CN223092858UActive Publication Date: 2025-07-11SHENZHEN MICROGATE TECH
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Patent Information

Application Number
CN202421580197.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-05
Publication Date
2025-07-11
Estimated Expiration
2034-07-05

AI Technical Summary

Technical Problem

The fixture material used in the existing chip gold ball welding process is SK5 carbon tool steel, which causes the fixed wafer to be unsolid and prone to deformation, increases the risk of fracturing, affects the yield of production, and is difficult to maintain.

Method used

It adopts a detachable fixture structure. The fixture body is made of SUS304 material, with surface anodized treatment, fixed shrapnel and wafer positioning blocks are made of Teflon material. They can be detached and installed through screw connections, making it easy to replace and repair.

Benefits of technology

It improves the wafer fixation effect, reduces the risk of wafer lobes, improves the working efficiency and yield of the production line, and meets the needs of multiple varieties of small batch production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a wafer clamp, which comprises a clamp main body, a fixed elastic sheet and a wafer positioning block, and the clamp main body is provided with more than one wafer bearing concave platform for bearing wafers. According to the utility model, the elastic sheet is detachably arranged on the clamp main body, so that the clamp main body and the elastic sheet can be made of different materials respectively, and the requirement of fixing a wafer in production is met. According to the utility model, the elastic sheet detachable structure is adopted, replacement can be directly completed, processing and maintenance are facilitated, the clamp fixing block increases the wafer fixing effect and alleviates the risk of wafer cracking, and stress analysis and DOE verification results show that the welding quality can better meet the requirements of customers, and the production efficiency is greatly improved. And after mass production, the field working efficiency and the comprehensive yield are obviously improved.
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Description

Technical Field

[0001] The utility model discloses a wafer fixture, in particular a fixture for fixing a wafer in a chip ball mounting process, belonging to the technical field of chip ball mounting. Background Art

[0002] With the rapid development of the electronics and semiconductor industries, the ever-changing market demands and increasingly fierce commodity competition have shortened the product replacement cycle, and the proportion of multi-variety and small-batch production has become higher. To meet the needs of this situation, it is necessary to research and develop various new types of tooling fixtures and jigs suitable for new products. Tooling fixtures and jigs are indispensable components in the electronics and semiconductor industries. Designing a reasonable and reliable fixture can not only improve work efficiency but also reduce the quality discreteness of products to improve the overall yield of its production line.

[0003] Various fixtures are also used in the production process of filters to meet the production requirements. Among them, the requirements for the fixture in the chip gold stud bump station are even higher. The main function of the fixture in this station is to fix the wafer and complete the gold stud bump welding operation. If the fixture design is unreasonable, the following problems will occur: (1) The wafer is not firmly fixed during welding, resulting in wafer mounting offset or tilt; (2) The fixture material is poor, and it will deform or generate debris after long-term use; (3) The fixture hardness is too high, and the wafer will be extruded and cracked after the wafer expands due to heat; (4) The fixture design is unreasonable, and interference with the wafer causes wafer cracking and other problems.

[0004] Once such problems occur, they will basically cause batch defective products in production, resulting in serious economic losses. Therefore, the design and use method of the fixture in the chip gold stud bump process play an important role in the quality of the entire filter.

[0005] Currently, the fixture used in the chip gold stud bump process is a fixture body and a metal shrapnel, both made of SK5 (carbon tool steel) and surface nickel-plated. After quenching and tempering, the SK5 material has high hardness and wear resistance, but low hot hardness, poor hardenability, easy deformation, and low plasticity and strength. In actual production use, the fixing effect of this fixture on the wafer is poor. The shrapnel of the fixture will deform after long-term use. There are tolerances in the height of the wafer itself, which will cause some wafers to start welding without being fixed; due to the poor elasticity of the fixture fixing shrapnel, the stress on the wafer is very large when the pressing amount increases, increasing the risk of fracturing the wafer and affecting the yield; and the processing difficulty of the fixture is higher and the maintenance is difficult. After long-term use, the surface of the shrapnel is severely worn and can only be directly replaced, which is not conducive to improving the overall yield of the production line. Therefore, it is necessary to improve the current fixture. Summary of the Invention

[0006] In view of the disadvantage that the fixture used in the chip gold ball welding process in the above-mentioned prior art uses carbon tool steel, which easily affects the overall yield of products, the present utility model provides a wafer fixture, which adopts a detachable spring plate structure and can be directly replaced, facilitating processing and maintenance.

[0007] The technical solution adopted by the present utility model to solve its technical problems is: a wafer fixture, which includes a fixture body, a fixed spring plate and a wafer positioning block. One or more wafer bearing concave platforms for bearing wafers are opened on the fixture body. There are six wafer bearing concave platforms, and the six wafer bearing concave platforms are evenly distributed in a circle on the fixture body.

[0008] The technical solution adopted by the present utility model to solve its technical problems further includes:

[0009] The fixed spring plate is detachably mounted on the bottom surface of the fixture body and is located at the edge of the fixture body.

[0010] The wafer positioning block is detachably mounted on the bottom surface of the fixture body and is located at the edge of the fixture body.

[0011] The fixture body is made of SUS304 material.

[0012] The surface of the fixture body is subjected to surface anodic oxidation treatment.

[0013] Positioning holes are opened at the edge of the fixture body.

[0014] Both the fixed spring plate and the wafer positioning block are made of Teflon material.

[0015] The fixed spring plate is a flat spring plate with a thickness of 0.2 mm.

[0016] A spring plate fixing hole is opened on the fixed spring plate, and a spring plate slot hole is opened on the fixture body. A spring plate fixing screw passes through the spring plate fixing hole and is fixedly connected to the spring plate slot hole on the fixture body.

[0017] A positioning block fixing hole is opened on the wafer positioning block, and a positioning block slot hole is opened on the fixture body. A positioning block fixing screw passes through the positioning block fixing hole and is fixedly connected to the positioning block slot hole on the fixture body.

[0018] The beneficial effects of the present utility model are as follows: By detachably mounting the elastic piece on the fixture body, the fixture body and the elastic piece can be made of different materials respectively, so as to meet the requirements for fixing the wafer in production. The present utility model adopts a detachable and installable structure for the elastic piece, which can be directly replaced, facilitating processing and maintenance. The fixture fixing block enhances the wafer fixing function and reduces the risk of chipping. Moreover, the stress analysis and DOE verification results show that its welding quality can better meet the requirements of customers. After mass production, the on-site work efficiency and overall yield are significantly improved.

[0019] The following will further illustrate the present utility model in conjunction with the drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a top view structural schematic diagram of a wafer fixing fixture in a preferred embodiment of the present utility model.

[0021] Figure 2 It is a side view structural schematic diagram of a wafer fixing fixture in a preferred embodiment of the present utility model.

[0022] Figure 3 It is an enlarged structural schematic diagram of the elastic piece in a preferred embodiment of the present utility model.

[0023] Figure 4 It is an enlarged structural schematic diagram of the fixing block in a preferred embodiment of the present utility model.

[0024] In the figure, 10 - boss, 20 - fixture positioning hole, 30 - fixing elastic piece, 401 - elastic piece fixing hole, 402 - elastic piece slot hole, 701 - positioning block fixing hole, 702 - positioning block slot hole, 50 - fixture body, 60 - wafer positioning block, 70 - positioning block fixing screw, 80 - wafer bearing concave platform. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0025] This embodiment is the preferred embodiment of the present utility model. All those with the same or similar principles and basic structures as this embodiment are within the protection scope of the present utility model.

[0026] Please refer to the attached Figure 1 to Figure 4 As shown, the present utility model protects a wafer fixture, which mainly includes a fixture body 50, a fixing elastic piece 30 and a wafer positioning block 60. One or more wafer bearing concave platforms 80 for bearing wafers are provided on the fixture body 50. Preferably, six wafer bearing concave platforms 80 are provided, and the six wafer bearing concave platforms 80 are evenly distributed in a circle on the fixture body 50.

[0027] In this embodiment, the fixing spring piece 30 and the wafer positioning block 60 are respectively arranged at the edge positions of the fixture body 50. The fixing spring piece 30 and the wafer positioning block 60 are both installed on the bottom surface of the fixture body 50 in a detachable mounting manner and are located at the edge of the fixture body 50.

[0028] In this embodiment, the fixture body 50 is made of SUS304 material. The main characteristics of SUS304 material are low manufacturing cost, strong corrosion resistance and toughness, long service life, good aging resistance, and tensile strength, which are suitable for use as the fixture body 50. In this embodiment, the surface of the fixture body 50 is subjected to surface anodic oxidation treatment, which is more convenient for processing. At the same time, the probability of generating debris during production and use is also greatly reduced, improving the yield.

[0029] In this embodiment, positioning holes 20 are provided at the edge of the fixture body 50 to facilitate positioning with the actual equipment in use. There are three positioning holes 20. Specifically in implementation, the number and positions of the positioning holes can also be specifically selected according to actual requirements.

[0030] In this embodiment, both the fixing spring piece 30 and the wafer positioning block 60 are made of Teflon. The main characteristics of Teflon are anti-fatigue, low friction coefficient, good corrosion resistance and forgeability, good moisture resistance, and little deformation at high temperatures. At 240°C to 260°C, it has good thermal stability during continuous use and still has good plastic properties, which are suitable for use as spring pieces.

[0031] In this embodiment, the fixing spring piece 30 is a flat spring piece with a thickness of 0.2 mm. Since the fixing spring piece 30 will deform every time a wafer is loaded, and the fixing spring piece 30 is made of Teflon material, it is not easy to deform after long-term use, and its service life and applicability are stronger. A spring piece fixing hole 401 is provided on the fixing spring piece 30, and a spring piece slot hole 402 is provided on the fixture body 50. The spring piece fixing screw passes through the spring piece fixing hole 401 and is fixedly connected to the spring piece slot hole 402 on the fixture body 50. The fixing spring piece 30 is fixed to the fixture body 50 through the spring piece fixing screw. The fixing spring piece 30 that is deformed or abnormal after long-term use can be replaced at any time, improving the production efficiency.

[0032] In this embodiment, a positioning block fixing hole 701 is provided on the wafer positioning block 60, and a positioning block slot hole 702 is provided on the fixture body 50. The positioning block fixing screw passes through the positioning block fixing hole 701 and is fixedly connected to the positioning block slot hole 702 on the fixture body 50. The wafer positioning block 60 is fixed to the fixture body 50 through the positioning block fixing screw. The wafer positioning block 60 that is deformed or abnormal after long-term use can be replaced at any time, improving the production efficiency.

[0033] The working principle of the present utility model is as follows:

[0034] Installation of the fixed spring clip 30: First, place the fixed spring clip 30 at the position of the clamp body 50 corresponding to the spring clip slot hole 402, and align the spring clip fixing hole 401 with the hole position of the clamp body 50, and use the spring clip fixing screw to fix it. Each slot hole 401 corresponds to one fixed spring clip 30. After the fixed spring clip 30 is fixed, it is necessary to check whether the fixed spring clip 30 has any abnormalities such as deformation. The abnormal fixed spring clip 30 can be directly replaced. In subsequent production, regular maintenance is performed, and only the fixed spring clip 30 needs to be replaced. The operation is convenient and efficient.

[0035] When in use, firstly, place the wafer on the wafer supporting recess 80, then align the wafer positioning block 60 and adjust the fixing spring piece 30, and finally fix the wafer. After no abnormality is found, the wafer gold ball bonding operation can be started.

[0036] By detachably mounting the fixing spring clip 30 on the fixture body, the fixture body 50 and the fixing spring clip 30 can be made of different materials, respectively, so that the requirements for fixing the wafer during production can be met. The fixing spring clip 30 is detachable and can be directly replaced, which facilitates processing and maintenance. The stress analysis and DOE verification results show that the welding quality can better meet the customer's requirements. After mass production, the on-site work efficiency and overall yield rate will be significantly improved.

[0037] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A wafer fixture, characterized in that: The described fixture includes a fixture body (50), a fixed elastic piece (30), and a wafer positioning block (60). The fixture body (50) is provided with more than one wafer carrying concave platform (80) for carrying wafers. There are six wafer carrying concave platforms (80), and the six wafer carrying concave platforms (80) are evenly distributed in a circle on the fixture body (50). The fixed elastic piece (30) is detachably mounted on the bottom surface of the fixture body (50) and is located at the edge of the fixture body (50). The wafer positioning block (60) is detachably mounted on the bottom surface of the fixture body (50) and is located at the edge of the fixture body (50).

2. The wafer chuck according to claim 1, characterized in that: The fixture body (50) is made of SUS304 material.

3. The wafer chuck according to claim 1, characterized in that: The surface of the fixture body (50) is subjected to surface anodic oxidation treatment.

4. The wafer chuck according to claim 1, wherein: Positioning holes (20) are provided at the edge of the fixture body (50).

5. The wafer chuck according to claim 1, characterized in that: Both the fixed elastic piece (30) and the wafer positioning block (60) are made of Teflon material.

6. The wafer chuck according to claim 1, wherein: The fixed elastic piece (30) is a flat elastic piece with a thickness of 0.2 mm.

7. The wafer chuck according to claim 1, characterized in that: Elastic piece fixing holes (401) are provided on the fixed elastic piece (30), and elastic piece slot holes (402) are provided on the fixture body (50). The elastic piece fixing screws pass through the elastic piece fixing holes (401) and are fixedly connected to the elastic piece slot holes (402) on the fixture body (50).

8. The wafer chuck according to claim 1, characterized in that: Positioning block fixing holes (701) are provided on the wafer positioning block (60), and positioning block slot holes (702) are provided on the fixture body (50). The positioning block fixing screws pass through the positioning block fixing holes (701) and are fixedly connected to the positioning block slot holes (702) on the fixture body (50).