Wafer bearing substrate
Through the motor-driven gear and worm gear system, adjustable clamping and smooth removal of the wafer carrier substrate are achieved, solving the problems of poor generality and removal damage of traditional substrates, and improving adaptability and safety.
Patent Information
- Application Number
- CN202422199349.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-09
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-09
AI Technical Summary
Traditional wafer carrier substrates have poor general use, making them difficult to adapt to wafers of multiple diameters, and are easily damaged when removing wafers.
The motor drive gear system and worm gear system are adopted, and the adjustable diameter clamping of the clamping plate and the smooth removal of the wafer are achieved through the gear transmission and the threaded rod lifting mechanism. The clamping plate is made of rubber.
It improves the universality of the carrier substrate, can adapt to wafers of different diameters, and avoids wafer damage when taken out.
Smart Images
Figure CN223092860U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of carrier substrates, in particular to a wafer carrier substrate. Background Art
[0002] A wafer carrier substrate is an indispensable key component in semiconductor manufacturing. In practical applications, wafer carrier substrates are widely used in the manufacturing processes of electronic devices such as integrated circuits, microprocessors, flash memory chips, DRAM, and CPUs. For example, in processes such as wafer dicing, grinding, and polishing, wafer carrier substrates play an indispensable role. With the continuous development of semiconductor technology, the demand for wafer carrier substrates is also increasing.
[0003] Traditional wafer carrier substrates still have defects during use. For example, they cannot be used for wafers of multiple diameters, have poor versatility, are prone to damaging the wafers when removing the wafers, and are inconvenient to remove, etc., which urgently need to be solved. Summary of the Utility Model
[0004] The purpose of the utility model is to solve the deficiencies existing in the prior art, and a wafer carrier substrate is proposed.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme: A wafer carrier substrate includes a box body, a first motor is fixedly connected inside the box body, the output end of the first motor is fixedly connected with a driving gear, both ends of the driving gear are meshed with driven gears, the diameter of the driven gear is larger than that of the driving gear, one side of the driven gear is fixedly connected with a connecting shaft, the end of the connecting shaft far from the driven gear is rotatably connected inside the box body, a first sliding groove is arranged on the driven gear, a sliding shaft is slidably connected inside the first sliding groove, the end of the connecting shaft far from the sliding shaft is fixedly connected with a sliding rod, a second sliding groove is arranged on the box body, the sliding rod penetrates and is slidably connected inside the second sliding groove, and the end of the sliding rod far from the sliding shaft is fixedly connected with a clamping plate.
[0006] As a further description of the above technical solution:
[0007] A support plate is fixedly connected inside the box body, a second motor is fixedly connected on the support plate, the output end of the second motor is fixedly connected with a worm, the worm is rotatably connected with a worm gear, the worm gear is fixedly connected with a threaded rod in a penetrating manner, the threaded rod is rotatably connected inside the box body, the end of the threaded rod far from the threaded sleeve rod penetrates and is threadedly connected with a threaded sleeve rod, the end of the threaded sleeve rod far from the threaded rod is fixedly connected with a first connecting rod, both ends of the first connecting rod are fixedly connected with second connecting rods, and the end of the second connecting rod far from the first connecting rod is fixedly connected with a jacking rod.
[0008] As a further description of the above technical solution:
[0009] Both ends of the box body are provided with third sliding grooves, and the jacking rod passes through and is slidably connected in the third sliding grooves.
[0010] As a further description of the above technical solution:
[0011] Six groups of the first sliding grooves are provided, and the six groups of the first sliding grooves are evenly distributed on the driven gear.
[0012] As a further description of the above technical solution:
[0013] A number of clamping plates are provided, and the number of clamping plates is located above the box body.
[0014] As a further description of the above technical solution:
[0015] A number of the second sliding grooves are provided, and the number of the second sliding grooves is evenly distributed on the box body.
[0016] As a further description of the above technical solution:
[0017] The driving gear, the driven gear, the threaded sleeve rod, the first connecting rod, and the second connecting rod are located inside the box body, and the clamping plates and the jacking rod are made of rubber.
[0018] With the above structure, the utility model has the following advantages:
[0019] 1. In the utility model, the driving gear is driven by the first motor to rotate, so that the driven gear rotates. The sliding shaft slides in the first sliding groove driven by the rotation of the driven gear. The sliding rod slides in the second sliding groove driven by the sliding of the sliding shaft. The clamping plate clamps the wafer driven by the sliding of the sliding rod. The clamping diameter is adjustable, so that the carrier substrate can clamp wafers of various diameters, and the versatility of the carrier substrate is improved.
[0020] 2. In the utility model, when the wafer needs to be taken out, the first motor is started in reverse to loosen the wafer by the clamping plate, and the unlocking is completed. The threaded rod is driven by the second motor to rotate, so that the threaded sleeve rod rises. The second connecting rod rises driven by the rising of the threaded sleeve rod, so that the jacking rod slides in the third sliding groove. The wafer is pushed to rise on one side by the sliding of the jacking rod in the third sliding groove, which is convenient for taking out the wafer and avoiding damage to the wafer during taking out. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 is a three-dimensional structure diagram of a wafer carrier substrate proposed by the utility model;
[0022] Figure 2 is a partial three-dimensional structure of a wafer carrier substrate proposed by the utility model Figure 1 ;
[0023] Figure 3 A partial three-dimensional structure of a wafer carrier substrate proposed by the present utility model Figure 2 ;
[0024] Figure 4 A top view of a partial three-dimensional structure of a wafer carrier substrate proposed by the present utility model;
[0025] Figure 5 is Figure 2 an enlarged view of part A in
[0026] Legend description:
[0027] 1. Box body; 2. First motor; 3. Driving gear; 4. Driven gear; 5. First chute; 6. Coupling shaft; 7. Sliding shaft; 8. Sliding rod; 9. Clamping plate; 10. Second chute; 11. Support plate; 12. Second motor; 13. Worm; 14. Worm gear; 15. Threaded rod; 16. Threaded sleeve rod; 17. First connecting rod; 18. Second connecting rod; 19. Lifting rod; 20. Third chute. Specific implementation manner
[0028] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present utility model.
[0029] Referring to Figures 1-5 , an embodiment provided by the present utility model: A wafer carrier substrate includes a box body 1, a first motor 2 is fixedly connected inside the box body 1, an output end of the first motor 2 is fixedly connected with a driving gear 3, two ends of the driving gear 3 are meshed and connected with a driven gear 4, a diameter of the driven gear 4 is larger than a diameter of the driving gear 3, a coupling shaft 6 is fixedly connected to one side of the driven gear 4, one end of the coupling shaft 6 away from the driven gear 4 is rotatably connected inside the box body 1, a first chute 5 is provided on the driven gear 4, a sliding shaft 7 is slidably connected inside the first chute 5, a sliding rod 8 is fixedly connected to one end of the coupling shaft 6 away from the sliding shaft 7, a second chute 10 is provided on the box body 1, the sliding rod 8 is slidably connected through the second chute 10, and a clamping plate 9 is fixedly connected to one end of the sliding rod 8 away from the sliding shaft 7. By driving the driving gear 3 to rotate by the first motor 2, the driven gear 4 is driven to rotate. By rotating the driven gear 4, the sliding shaft 7 is driven to slide inside the first chute 5. By sliding the sliding shaft 7, the sliding rod 8 is driven to slide inside the second chute 10. By sliding the sliding rod 8, the clamping plate 9 is driven to clamp the wafer. The clamping diameter is adjustable, so that the carrier substrate can clamp wafers of various diameters, improving the versatility of the carrier substrate.
[0030] A support plate 11 is fixedly connected inside the box body 1. A second motor 12 is fixedly connected to the support plate 11. An output end of the second motor 12 is fixedly connected with a worm 13. The worm 13 is rotatably connected with a worm gear 14. The worm gear 14 is fixedly connected through a threaded rod 15. The threaded rod 15 is rotatably connected inside the box body 1. One end of the threaded rod 15 away from the threaded sleeve rod 16 is threadedly connected through the threaded sleeve rod 16. One end of the threaded sleeve rod 16 away from the threaded rod 15 is fixedly connected with a first connecting rod 17. Both ends of the first connecting rod 17 are fixedly connected with second connecting rods 18. One end of the second connecting rod 18 away from the first connecting rod 17 is fixedly connected with a jacking rod 19. Third chutes 20 are arranged at both ends of the box body 1. The jacking rod 19 is slidably connected through the third chutes 20. There are six groups of first chutes 5, and the six groups of first chutes 5 are evenly distributed on the driven gear 4. There are several groups of clamping plates 9, and the several groups of clamping plates 9 are located above the box body 1. There are several groups of second chutes 10, and the several groups of second chutes 10 are evenly distributed on the box body 1. The driving gear 3, the driven gear 4, the threaded sleeve rod 16, the first connecting rod 17, and the second connecting rod 18 are located inside the box body 1. The materials of the clamping plate 9 and the jacking rod 19 are rubber. When it is necessary to take out the wafer, by reversely starting the first motor 2, the clamping plate 9 loosens the wafer to complete unlocking. By driving the threaded rod 15 to rotate through the second motor 12, the threaded sleeve rod 16 rises. By the rise of the threaded sleeve rod 16, the second connecting rod 18 rises, so that the jacking rod 19 slides in the third chute 20. By the sliding of the jacking rod 19 in the third chute 20, one side of the wafer is pushed up, which is convenient for taking out the wafer and avoids damaging the wafer when taking it out.
[0031] Working principle: Place the wafer in the middle of the clamping plate 9. By starting the first motor 2 to drive the driving gear 3 to rotate, by the rotation of the driving gear 3, the driven gear 4 is driven to rotate. By the rotation of the driven gear 4, the sliding shaft 7 slides in the first chute 5. By the sliding of the sliding shaft 7, the sliding rod 8 slides in the second chute 10. By the sliding of the sliding rod 8, the clamping plate 9 clamps the wafer. The clamping diameter is adjustable, so that the carrier substrate can clamp wafers of various diameters, improving the versatility of the carrier substrate. When it is necessary to take out the wafer, by reversely starting the first motor 2, the clamping plate 9 loosens the wafer to complete unlocking. By starting the second motor 12 to drive the worm 13 to rotate, by the rotation of the worm 13, the worm gear 14 is driven to rotate. By the rotation of the worm gear 14, the threaded rod 15 is driven to rotate. By the rotation of the threaded rod 15, the threaded sleeve rod 16 rises. By the rise of the threaded sleeve rod 16, the first connecting rod 17 rises. By the rise of the first connecting rod 17, the second connecting rod 18 rises. By the rise of the second connecting rod 18, the jacking rod 19 slides in the third chute 20. By the sliding of the jacking rod 19 in the third chute 20, one side of the wafer is pushed up, which is convenient for taking out the wafer and avoids damaging the wafer when taking it out.
[0032] Finally, it should be noted that the above are only the preferred embodiments of the present utility model and are not used to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A wafer carrier substrate, comprising a box body (1), characterized in that: A first motor (2) is fixedly connected inside the box body (1). The output end of the first motor (2) is fixedly connected with a driving gear (3). Both ends of the driving gear (3) are meshed with driven gears (4). The diameter of the driven gear (4) is larger than that of the driving gear (3). One side of the driven gear (4) is fixedly connected with a connecting shaft (6). The end of the connecting shaft (6) far from the driven gear (4) is rotatably connected inside the box body (1). A first sliding groove (5) is provided on the driven gear (4). A sliding shaft (7) is slidably connected inside the first sliding groove (5). The end of the connecting shaft (6) far from the sliding shaft (7) is fixedly connected with a sliding rod (8). A second sliding groove (10) is provided on the box body (1). The sliding rod (8) is slidably connected through the second sliding groove (10). The end of the sliding rod (8) far from the sliding shaft (7) is fixedly connected with a clamping plate (9).
2. The wafer carrier substrate according to claim 1, wherein: A support plate (11) is fixedly connected inside the box body (1). A second motor (12) is fixedly connected to the support plate (11). The output end of the second motor (12) is fixedly connected with a worm (13). The worm (13) is rotatably connected with a worm gear (14). A threaded rod (15) is fixedly connected through the worm gear (14). The threaded rod (15) is rotatably connected inside the box body (1). The end of the threaded rod (15) far from the threaded sleeve rod (16) is threadedly connected through a threaded sleeve rod (16). The end of the threaded sleeve rod (16) far from the threaded rod (15) is fixedly connected with a first connecting rod (17). Both ends of the first connecting rod (17) are fixedly connected with second connecting rods (18). The end of the second connecting rod (18) far from the first connecting rod (17) is fixedly connected with a jacking rod (19).
3. The wafer carrier substrate according to claim 2, wherein: Third sliding grooves (20) are provided at both ends of the box body (1). The jacking rod (19) is slidably connected through the third sliding grooves (20).
4. A wafer carrier substrate according to claim 3, characterized in that: Six groups of the first sliding grooves (5) are provided. The six groups of the first sliding grooves (5) are evenly distributed on the driven gear (4).
5. The wafer carrier substrate according to claim 4, wherein: A number of the clamping plates (9) are provided. The number of the clamping plates (9) is located above the box body (1).
6. A wafer carrier substrate according to claim 5, wherein: A number of the second sliding grooves (10) are provided. The number of the second sliding grooves (10) is evenly distributed on the box body (1).
7. The wafer carrier substrate according to claim 6, wherein: The driving gear (3), the driven gears (4), the threaded sleeve rod (16), the first connecting rod (17), and the second connecting rods (18) are located inside the box body (1). The clamping plates (9) and the jacking rods (19) are made of rubber.